CN209914349U

CN209914349U - Water cooling plate for punch forming electronic element

Info

Publication number: CN209914349U
Application number: CN201920035304.XU
Authority: CN
Inventors: 黄万鹏; 魏远海; 苏永权
Original assignee: NANJING BALING TECHNOLOGY Co Ltd
Current assignee: NANJING BALING TECHNOLOGY Co Ltd
Priority date: 2019-01-09
Filing date: 2019-01-09
Publication date: 2020-01-07
Anticipated expiration: 2029-01-09

Abstract

The utility model provides a stamping forming electronic component water-cooling board, includes bottom plate, apron, inner fin and inlet outlet, and concrete structure and relation of connection are: the bottom plate and the cover plate form a sealed cavity, the edge of the cavity is provided with a water inlet and a water outlet for cooling media to enter and exit the cavity, fins are arranged in the cavity, a boss is punched at the bottom of the bottom plate to serve as a thermal contact surface of the electronic element, ribs are punched on the bottom plate and play a role in forming a flow channel flow guide and reinforcing structure, the cover plate is of a flat plate type or a punching structure, the bottom plate, the inner fins and the cover plate are in a brazing type or a combined type, and the water cooling plate is provided with mounting holes for fixing the electronic element. The utility model discloses have than current technology product quality light 40% -65%, the stamping die expense is lower than current technology mould, stamping process efficiency is higher than current technology, manufacturing cost is less than the advantage of current technology.

Description

Water cooling plate for punch forming electronic element

Technical Field

The utility model relates to an electronic component heat abstractor, in particular to cooling part of high power electronic equipment such as computer, server, network equipment specifically is a stamping forming electronic component water-cooling board.

Background

With the appearance of high-power electronic components and the development of ultrahigh-integration electronic components towards high speed, high frequency and high power, the heat productivity of the electronic components is larger and larger, the heat flux density and the surface temperature are higher and higher, the reliability and the service life of the components are influenced, and higher requirements are provided for heat dissipation. The application of the water-cooling heat dissipation technology as an efficient heat dissipation mode in electronic equipment is more and more extensive, the water-cooling plate is a key component of a water-cooling heat dissipation system, and the design and manufacturing process of the water-cooling plate determines the indexes of heat dissipation efficiency, reliability, economy and the like. The existing water-cooling plate processing technology mainly comprises extrusion molding, casting molding and milling molding, and the water-cooling plate manufactured by the three processing technologies has the defects of large wall thickness, heavy mass, more material consumption and high cost; and the extrusion die and the casting die have high cost and long milling time.

Chinese patent 201721171741.1 discloses an extrusion aluminium alloy water-cooling board, uses the section bar as water-cooling board, though processing manufacturing is convenient, but is limited to extrusion process, and the section bar wall thickness is very big, causes the water-cooling plate volume big, and the quality is heavy, is unfavorable for lightweight design.

Disclosure of Invention

An object of the utility model is to solve the big, with high costs problem of quality of current electronic component water-cooling board, provide a stamping forming electronic component water-cooling board.

In order to achieve the above purpose, the utility model adopts the technical scheme that: the utility model provides a stamping forming electronic component water-cooling board, includes bottom plate, apron, inner fin and inlet outlet, and concrete structure and relation of connection are: the bottom plate and the cover plate form a sealed cavity, a water inlet and a water outlet are formed in the edge of the cavity, cooling media can enter and exit the cavity, fins are arranged inside the cavity to increase the heat exchange area and enhance the cooling capacity, a boss is punched at the bottom of the bottom plate and serves as a thermal contact surface of an electronic element, in order to reduce the weight of the water cooling plate, the bottom plate is of a punch forming structure, ribs are punched on the bottom plate and play a role in forming a flow channel flow guide and reinforcing structure, and in order to fix the electronic element, mounting holes for fixing the electronic element are formed in the water cooling plate.

The cover plate is of a flat plate type or a stamping structure.

The inner fins are rectangular waves, sine waves and triangular waves.

The bottom plate and the inner fin are in a brazing structure or a combined structure.

The bottom plate, the inner fins and the cover plate are in a brazing type or combined type structure.

The bottom plate and the inner fins are made of copper or aluminum or a combination thereof.

The cover plate is made of copper, aluminum or plastic or a combination thereof.

The working principle and the process are as follows:

the bottom heat contact surface of the bottom plate of the punch forming electronic element water cooling plate absorbs heat emitted by the electronic element, the heat is transferred to the inside of the bottom plate of the water cooling plate, the inner fins and the cover plate, low-temperature cooling medium in the cavity is heated and heated, and high-temperature cooling medium is taken away through circulation of the water pump, so that the effect of cooling the electronic element is realized, and the normal operation of the electronic element in a certain temperature is ensured.

The utility model has the advantages that: the utility model has the advantages that the weight of the product is 40-65% lighter than that of the product manufactured by the prior art under the condition of realizing the same function; the cost of the stamping die is lower than that of the prior art; the stamping efficiency is higher than that of the prior art; the manufacturing cost is lower than that of the prior art.

Drawings

Fig. 1 is a schematic structural view of a water-cooling plate of a stamping forming electronic component of the present invention.

Fig. 2 is a schematic view of the bottom structure of the bottom plate of the water-cooling plate of the stamping forming electronic component of the present invention.

Fig. 3 is a schematic diagram of the internal structure of the bottom plate of the water-cooling plate of the stamping forming electronic component of the present invention.

Labeled as: bottom plate 1, apron 2, water inlet 3, delivery port 4, first thermal contact boss 5, second thermal contact boss 6, third thermal contact boss 7, fourth thermal contact boss 8, fifth thermal contact boss 9, sixth thermal contact boss 10, mounting hole 11, first rib 12, first inner fin 13, second inner fin 14, second rib 15.

Detailed Description

The technical constitution of the present invention will be described in further detail below with reference to examples.

As shown in fig. 1 to fig. 3, stamping forming electronic component water-cooling board, fin 14, water inlet 3 and delivery port 4 in bottom plate 1, apron 2, first interior fin 13, the second, concrete structure and connection are: the bottom plate 1 and the cover plate 2 form a sealed cavity, the edge of the cavity is provided with a water inlet 3 and a water outlet 4, a cooling medium enters and exits the cavity, the cooling medium flows into the inner cavity from the water inlet 3, absorbs heat from the electronic element and flows out from the water outlet 4, and therefore the effect of cooling the electronic element is achieved, and the electronic element is guaranteed to work within a normal temperature range.

The sealed cavity is internally provided with a first inner fin 13 and a second inner fin 14 to increase the heat exchange area and strengthen the cooling capacity, the bottom of the bottom plate 1 is punched with a first thermal contact surface boss 5, a second thermal contact surface boss 6, a third thermal contact surface boss 7, a fourth thermal contact surface boss 8, a fifth thermal contact surface boss 9 and a sixth thermal contact surface boss 10 as the thermal contact surfaces of the electronic element, in order to reduce the weight of the water-cooled plate, the bottom plate 1 adopts a punch forming structure, meanwhile, the bottom plate 1 is punched with a first rib 12 and a second rib 15, the ribs play a role in forming a flow channel flow guide and reinforcing structure, and in order to fix the electronic element, the water-cooled plate is provided with a mounting hole 11 for fixing the electronic element.

The connection form of the base plate 1 and the cover plate 2 is not limited to brazing, and can also be combined by bolts or fasteners, and at this time, an additional sealing ring is required to prevent the cooling medium from leaking from the connection. The cover plate material connected by non-brazing is copper, aluminum or non-metal material.

As shown in fig. 2, the base plate 1 is manufactured by a press-forming process. Considering that different electronic elements share one water cooling plate and the thermal contact surfaces of the electronic elements are not on the same horizontal plane, a first thermal contact surface boss 5, a second thermal contact surface boss 6, a third thermal contact surface boss 7, a fourth thermal contact surface boss 8, a fifth thermal contact surface boss 9 and a sixth thermal contact surface boss 10 with different heights can be conveniently punched on the bottom plate through a punching forming process, and the first thermal contact surface boss, the second thermal contact surface boss, the third thermal contact surface boss, the fourth thermal contact surface boss, the fifth thermal contact surface boss and the sixth thermal contact surface boss correspond to the thermal contact surfaces of the electronic; meanwhile, in order to take account of the low material thickness and strength of the bottom plate and other design requirements, corresponding first ribs 12 are punched on the bottom plate 1. Corresponding mounting holes 11 are provided for mounting purposes. And the edge of the bottom plate 1 is provided with a water inlet hole 3 and a water outlet 4. Through the punch forming process, complex surfaces with different heights and shapes are easily obtained, the forming material is thin, the production rate is high, and the processing cost is low. The stamping process is far superior to other processing and forming processes such as an extrusion process, a casting process, a milling process and the like.

As shown in fig. 3, the inner part of the bottom plate 1 mainly serves to provide a high-efficiency heat exchange space for the cooling medium. The bottom plate 1 is internally provided with a first inner fin 13, a second inner fin 14 and a second rib 15. The first inner fins 13 correspond to the second thermal contact surface bosses 6, the second inner fins 14 correspond to the fourth thermal contact surface bosses 8, the inner fins mainly play a role in increasing the heat exchange surface area and strengthening heat exchange, heat from electronic elements can be quickly and efficiently conducted to a cooling medium, meanwhile, the effect of improving the structural strength of the water cooling plate is played, and particularly, the water cooling plate is integrally brazed with the cover plate. The structure of the inner fin is but not limited to rectangular wave, sine wave and triangular wave; according to the heat dissipation requirement, the inner cavities of some water cooling plates are not provided with inner fins, and some water cooling plates are only arranged on the back of the thermal contact surface of the high-heat-dissipation electronic component, such as the second thermal contact surface boss 6 and the fourth thermal contact surface boss 8, and the whole inner cavities of some water cooling plates are all full of the inner fins. The second ribs 15 are designed for optimizing the water flow distribution uniformity, the number of the second ribs is increased or decreased according to the water flow distribution condition, and the tops of the second ribs are attached to the cover plate, so that the second ribs simultaneously play a role in bearing pressure, and are particularly integrally brazed with the cover plate.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; those of ordinary skill in the art will understand that: modifications and equivalents of the above-described embodiments may be made, and are considered to be within the scope of the present invention.

Claims

1. The utility model provides a stamping forming electronic component water-cooling board, includes bottom plate, apron, inner fin and inlet outlet, its characterized in that, concrete structure and relation of connection are: the bottom plate and the cover plate form a sealed cavity, the edge of the cavity is provided with a water inlet and a water outlet, fins are arranged in the cavity, the bottom of the bottom plate is punched with a boss as a thermal contact surface of the electronic element, the bottom plate is punched with ribs, and the water cooling plate is provided with a mounting hole for fixing the electronic element.

2. The stamped electronic component water-cooled plate of claim 1, wherein the cover plate is of flat or stamped construction.

3. The stamped electronic component water cooled plate of claim 1, wherein the inner fins are rectangular, sinusoidal, triangular.

4. The stamped electronic component water cooled plate of claim 1, wherein the base plate and the inner fins are of brazed or composite construction.

5. The stamped electronic component water-cooling plate as recited in claim 1, wherein the base plate, the inner fins, and the cover plate are of brazed or composite construction.

6. The stamped electronic component water cooling plate of claim 1, wherein first, second, third, fourth, fifth, and sixth thermal contact surface bosses of different heights are stamped on said base plate.

7. The stamped electronic component water cooled plate of claim 1, wherein the base plate has first and second inner fins and second ribs, the first inner fin corresponding to the second thermal interface projection and the second inner fin corresponding to the fourth thermal interface projection.

8. The punch forming electronic component water-cooling plate of claim 1, wherein the bottom plate and the inner fins are made of copper or aluminum, and the cover plate is made of copper, aluminum or plastic.