CN112930026A - Mini-LED lamp high heat dissipation circuit board - Google Patents
Mini-LED lamp high heat dissipation circuit board Download PDFInfo
- Publication number
- CN112930026A CN112930026A CN202110115491.4A CN202110115491A CN112930026A CN 112930026 A CN112930026 A CN 112930026A CN 202110115491 A CN202110115491 A CN 202110115491A CN 112930026 A CN112930026 A CN 112930026A
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- circuit board
- screen
- heat dissipation
- led lamp
- mini
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
Abstract
A kind of mi i-LED lamp high heat dissipation breadboard, including: a base circuit board, an LED and a screen plate; the basic circuit board comprises an FR4 composite fiber double-sided board, an ink layer and a heat dissipation copper foil layer, wherein the FR4 composite fiber double-sided board is arranged between the ink layer and the heat dissipation copper foil layer, and a copper plate circuit connected with the LED is arranged on the end face of the FR4 composite fiber double-sided board; the screen plate comprises a screen frame, a steel sheet and a screen, glue is coated on the front side of the screen frame at the joint of the steel sheet and the screen and the joint of the screen and the screen frame, and a plurality of openings are formed in the surface of the screen plate; the method has the technical key points that the quantity of burrs on the wall of the opening hole is reduced to the minimum by the electroforming process, so that the method is favorable for printing solder paste, effectively reduces the residual amount of tin in the wall of the hole, improves the printing precision, ensures the welding level, and is favorable for the attachment of an LED and a bonding pad.
Description
Technical Field
The invention belongs to the field of design of LED lamp mesh plate openings, and particularly relates to a mini-LED lamp high-heat-dissipation circuit board.
Background
The LED lamp has the advantages of good energy saving performance, long service life, small volume, environmental protection and easy recovery, so the LED lamp is vigorously developed in recent years; the LED lamp has short response time and quick response, so the LED lamp is widely applied to the field of backlight of televisions, and the development and popularization of liquid crystal televisions are promoted.
With the progress of liquid crystal display television technology and the upgrading requirement of the market, the current liquid crystal display television develops towards a larger, thinner and lighter direction; although the current LED tends to develop in the micron and nanometer level, the solder paste printing technology still has problems, and the openings of the screen are required to be dug and improved continuously.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a mini-LED lamp high-heat-dissipation circuit board.
In order to achieve the purpose, the invention adopts the following technical scheme:
a kind of mini-LED lamp high heat dissipating breadboard, including: a base circuit board, an LED and a screen plate;
the basic circuit board comprises an FR4 composite fiber double-sided board, an ink layer and a heat dissipation copper foil layer, wherein the FR4 composite fiber double-sided board is arranged between the ink layer and the heat dissipation copper foil layer, and a copper plate circuit connected with the LED is arranged on the end face of the FR4 composite fiber double-sided board;
the screen plate comprises a screen frame, a steel sheet and a screen, glue is coated on the front side of the screen frame at the joint of the steel sheet and the screen and the joint of the screen and the screen, and a plurality of openings are formed in the surface of the screen plate.
Preferably, the FR4 composite fiber double-sided board is a double-sided copper-clad PCB board laminated by epoxy resin and glass cloth.
Preferably, the screen frame is a hollow aluminum frame.
Preferably, the steel sheet is a stainless steel sheet, and the thickness of the stainless steel sheet is 0.1-0.3 mm.
Preferably, the expanded mesh is made of stainless steel wires, the number of the stainless steel wires is at least 100 meshes, and the yield tension of the expanded mesh is not lower than 45N.
Preferably, the glue used for connecting the screen frame, the steel sheet and the tensioning net does not react with the solvent for cleaning the screen plate.
Preferably, the design of the opening of the screen plate adopts an electroforming process, burrs on the wall of the opening are less than 5 microns, and the number of the burrs per square millimeter is not more than 2-4 on average.
Preferably, basic circuit board pad appearance windowing, the length and width of this windowing are 420um to set up the symmetry pad head about basic circuit board in windowing position department.
Compared with the prior art, the invention provides a mini-LED lamp high-heat-dissipation circuit board, which has the following beneficial effects:
the invention discloses a design of a mini-LED lamp mesh plate opening, which is characterized in that burrs on the wall of the opening hole are minimized by an electroforming process, so that printing of tin paste is facilitated, residual tin in the wall of the hole is effectively reduced, printing precision is improved, welding level is guaranteed, and bonding of an LED and a bonding pad is facilitated.
Drawings
FIG. 1 is a schematic diagram of a base circuit board of the present invention in a board-in direction;
FIG. 2 is a schematic diagram of the basic circuit board dimensional structure of the present invention;
FIG. 3 is a schematic cross-sectional view of a portion of a bond pad of the present invention;
FIG. 4 is a schematic view of a partially open structure of a mesh plate according to the present invention.
Reference numerals: 1. a base circuit board; 2. an LED; 3. a screen plate; 4. a pad head.
Detailed Description
The following further describes a specific embodiment of the high heat dissipation circuit board of the mini-LED lamp in combination with the attached drawing 1. The high heat dissipation circuit board of the mini-LED lamp of the invention is not limited to the description of the following embodiments.
Here, a specific structure of a mini-LED lamp high heat dissipation circuit board is given, as shown in fig. 1 to 4, a mini-LED lamp high heat dissipation circuit board includes: a basic circuit board 1, an LED2 and a screen plate 3;
the basic circuit board 1 comprises an FR4 composite fiber double-sided board, an ink layer and a heat dissipation copper foil layer, wherein the FR4 composite fiber double-sided board is arranged between the ink layer and the heat dissipation copper foil layer, and a copper plate circuit connected with an LED2 is arranged on the end face of the FR4 composite fiber double-sided board;
the plate has good moderate dielectric constant, dielectric loss and TG value.
The screen plate comprises a screen frame, a steel sheet and a screen, glue is coated on the front side of the screen frame at the joint of the steel sheet and the screen and the joint of the screen and the screen frame, and a plurality of openings are formed in the surface of the screen plate.
The FR4 composite fiber double-sided board is a double-sided copper-clad PCB board formed by laminating epoxy resin and glass cloth.
The screen frame adopts a hollow aluminum frame.
The steel sheet is a stainless steel sheet with the thickness of 0.1-0.3 mm.
The net is made of stainless steel wires, the number of the stainless steel wires is at least 100 meshes, and the yield tension of the net is not lower than 45N.
The glue used for connecting the screen frame, the steel sheet and the screen does not react with the solvent for cleaning the screen plate.
As shown in FIG. 4, the design of the openings of the screen plate adopts an electroforming process, the burrs on the walls of the openings are less than 5 μm, and the average number of the burrs per square millimeter is not more than 2-4.
As shown in fig. 3, the basic circuit board 1 is provided with a window in the shape of a pad, the window has a length and a width of 420um, and the upper and lower symmetrical pad heads 4 of the basic circuit board 1 are arranged at the window position.
Example 1
Referring to fig. 2, the high heat dissipation wiring board includes: the external length and width of the basic circuit board 1, the external dimension thickness of the basic circuit board 1, the external dimension formed by positioning and punching points of the basic circuit board 1 and the copper foil point thickness of the basic circuit board 1;
the basic circuit board 1 has the following appearance length: 175.43mm, the tolerance is controlled within plus or minus 0.15 mm; the width of the basic circuit board outline 1 is: 398.10mm, the tolerance is controlled within plus or minus 0.15 mm; the thickness of the base circuit board 1 is: 1.0mm, and the tolerance is controlled within +/-0.1 mm; the length of the rectangular shape formed by the positioning hole points of the basic circuit board 1 is as follows: 146.981mm, the tolerance is controlled within plus or minus 0.15 mm; the width of the rectangle formed by the positioning hole points of the basic circuit board 1 is as follows: 367.20mm, the tolerance is controlled within plus or minus 0.15 mm; the thickness of the positioning hole points of the basic circuit board 1 is as follows: 2.0mm, and the tolerance is controlled within 0.1 mm; the specification of the basic circuit board 1 is defined to facilitate the specification of production operation and the definition of the size of the steel mesh opening.
Example 2 (note: PAD is a PAD and PCB is a base circuit board 1 in this application)
Referring to fig. 3, there is a schematic diagram of a single PAD structure of a high heat dissipation circuit board, including: the length and width of the head parts of the upper PAD and the lower PAD, the length and width of the tail parts of the upper PAD and the lower PAD, and the length and width of the distance window between the upper PAD and the lower PAD;
the PAD shape windowing length of the basic circuit board is as follows: 420 um; the PAD shape windowing width of the basic circuit board is as follows: 420 um; the length of the upper and lower pad heads 4 of the base circuit board 1 is: 220 um; the pad head 4 width of the base circuit board 1 is: 110 um; the distance between the upper PAD tail part and the lower PAD tail part of the basic circuit board 1 and the windowing length is as follows: 180 um; the width of the tail part of the upper PAD and the lower PAD of the basic circuit board 1 from the opening window is as follows: 60 um. The distance length between the upper and lower pad heads 4 of the basic circuit board 1 is as follows: 100 um; the length of the upper and lower pad heads 4 of the basic circuit board 1 from the two sides to the window is as follows: 100 um; the distance between the tail parts of the upper PAD and the lower PAD of the basic circuit board 1 and the windowing length of the two sides is as follows: 120 um;
the PAD windowing solder-resist covering is that all the leads on the PCB are covered with oil, so that short circuit and damage to devices can be prevented; removing the paint layer on the lead to expose the lead for tinning; the tin is scalded in later stage and copper foil thickness is increased, and the convenience is through heavy current to and radiating function.
This kind of PAD design can adopt the notch cuttype, the purpose is the problem of PAD surface tension is not enough, if PAD length is too short, subassembly center and PAD center do not coincide, lead to the pin heel of subassembly outside the PAD, in case take place the paster skew, surface tension's unbalance on the PAD leads to the subassembly perk when welding once, and reduce to minimum volume with the gas pocket in order to solve, when the regional template design of hot bonding PAD, design into right angle corner in this region, the water conservancy diversion of the hot gas flow of being convenient for, the bubble that the high production of heat was concentrated when in order to reduce the welding, with the tin volume that reduces printing process, the event adopts cascaded PAD design.
Example 3
Referring to fig. 4, the present embodiment includes: the specification of the steel mesh outer frame and the specification of the steel mesh printing range.
The length of the outer frame of the mini-LED lamp mesh plate is as follows: 730 + -1 mm. The width of the outer frame of the mini-LED lamp mesh plate is as follows: 730 +/-1 mm; see figure 1 for the internal print dimensions of the screen.
The length and the width of the screen frame are all defined to be 730mm, so that the screen frame is convenient to install and debug and is generally used for MPM series printing machines; the size of the dimension and the tension of the steel mesh meet the requirement of repeated printing for many times, so that the tension of the steel mesh is not reduced to influence the printing quality; in order to meet the requirement of printing precision, the steel mesh is changed from a laser process to an electroforming process, the printing precision is improved, the printing quality is further ensured, and the steel mesh of the electroforming process has higher corrosion resistance and higher durability than the steel meshes of other processes;
in conclusion, the novel design scheme of the mini-LED lamp screen plate opening has the advantages of high printing precision, good printing performance, contribution to controlling the quality of solder paste printing and wide application range.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (8)
1. The utility model provides a mini-LED lamp high heat dissipation circuit board which characterized in that includes: the LED screen comprises a basic circuit board (1), LEDs (2) and a screen plate (3);
the basic circuit board (1) comprises an FR4 composite fiber double-sided board, an ink layer and a heat dissipation copper foil layer, wherein the FR4 composite fiber double-sided board is arranged between the ink layer and the heat dissipation copper foil layer, and a copper plate circuit connected with the LED (2) is arranged on the end face of the FR4 composite fiber double-sided board;
the screen plate comprises a screen frame, a steel sheet and a screen, glue is coated on the front side of the screen frame at the joint of the steel sheet and the screen and the joint of the screen and the screen, and a plurality of openings are formed in the surface of the screen plate.
2. The high heat dissipation circuit board of a mini-LED lamp of claim 1, characterized in that: the FR4 composite fiber double-sided board is a double-sided copper-clad PCB board formed by laminating epoxy resin and glass cloth.
3. The high heat dissipation circuit board of a mini-LED lamp of claim 1, characterized in that: the screen frame adopts a hollow aluminum frame.
4. The high heat dissipation circuit board of a mini-LED lamp of claim 1, characterized in that: the steel sheet is a stainless steel sheet, and the thickness of the stainless steel sheet is 0.1-0.3 mm.
5. The high heat dissipation circuit board of a mini-LED lamp of claim 1, characterized in that: the net is made of stainless steel wires, the number of the stainless steel wires is at least 100 meshes, and the yield tension of the net is not lower than 45N.
6. The high heat dissipation circuit board of a mini-LED lamp of claim 1, characterized in that: the glue used for connecting the screen frame, the steel sheet and the tensioning screen does not react with the solvent for cleaning the screen plate.
7. The high heat dissipation circuit board of a mini-LED lamp of claim 1, characterized in that: the design of the opening of the screen plate adopts an electroforming process, burrs on the wall of the opening are less than 5 microns, and the average number of the burrs per square millimeter is not more than 2-4.
8. The high heat dissipation circuit board of a mini-LED lamp of claim 1, characterized in that: basic circuit board (1) pad appearance windowing, the length and width of this windowing are 420um to set up the longitudinal symmetry pad head (4) of basic circuit board (1) in windowing position department.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110115491.4A CN112930026A (en) | 2021-01-28 | 2021-01-28 | Mini-LED lamp high heat dissipation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110115491.4A CN112930026A (en) | 2021-01-28 | 2021-01-28 | Mini-LED lamp high heat dissipation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112930026A true CN112930026A (en) | 2021-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110115491.4A Pending CN112930026A (en) | 2021-01-28 | 2021-01-28 | Mini-LED lamp high heat dissipation circuit board |
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| Country | Link |
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| CN (1) | CN112930026A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3772160A (en) * | 1971-07-08 | 1973-11-13 | Buckbee Mears Co | Method of electroforming a printing screen |
| CN101100128A (en) * | 2006-07-04 | 2008-01-09 | 正中印刷器材股份有限公司 | Electroforming foiled film screen-board |
| CN101555607A (en) * | 2009-04-20 | 2009-10-14 | 昆山美微电子科技有限公司 | Electroforming metal film mesh plate for printing touch mesh spacing contacts |
| CN202088647U (en) * | 2011-04-13 | 2011-12-28 | 昆山良品丝印器材有限公司 | Crystalline silicon printing steel sheet composite screen |
| CN102615951A (en) * | 2012-03-23 | 2012-08-01 | 昆山允升吉光电科技有限公司 | Wire mesh |
| CN103203973A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A production method for an electroformed stencil with mark points |
| CN104534428A (en) * | 2014-12-02 | 2015-04-22 | 江苏鸿佳电子科技有限公司 | Highly-radiated circuit board of LED lamp |
| CN108327388A (en) * | 2017-01-20 | 2018-07-27 | 维铭有限公司 | Screen printing plate and manufacturing method thereof |
| CN111263533A (en) * | 2020-01-20 | 2020-06-09 | 深圳光韵达光电科技股份有限公司 | SMT steel mesh pasting method and device |
-
2021
- 2021-01-28 CN CN202110115491.4A patent/CN112930026A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3772160A (en) * | 1971-07-08 | 1973-11-13 | Buckbee Mears Co | Method of electroforming a printing screen |
| CN101100128A (en) * | 2006-07-04 | 2008-01-09 | 正中印刷器材股份有限公司 | Electroforming foiled film screen-board |
| CN101555607A (en) * | 2009-04-20 | 2009-10-14 | 昆山美微电子科技有限公司 | Electroforming metal film mesh plate for printing touch mesh spacing contacts |
| CN202088647U (en) * | 2011-04-13 | 2011-12-28 | 昆山良品丝印器材有限公司 | Crystalline silicon printing steel sheet composite screen |
| CN103203973A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A production method for an electroformed stencil with mark points |
| CN102615951A (en) * | 2012-03-23 | 2012-08-01 | 昆山允升吉光电科技有限公司 | Wire mesh |
| CN104534428A (en) * | 2014-12-02 | 2015-04-22 | 江苏鸿佳电子科技有限公司 | Highly-radiated circuit board of LED lamp |
| CN108327388A (en) * | 2017-01-20 | 2018-07-27 | 维铭有限公司 | Screen printing plate and manufacturing method thereof |
| CN111263533A (en) * | 2020-01-20 | 2020-06-09 | 深圳光韵达光电科技股份有限公司 | SMT steel mesh pasting method and device |
Non-Patent Citations (2)
| Title |
|---|
| 蔡建军: "《电子产品工艺与品质管理》", 28 February 2014, 北京：北京理工大学出版社 * |
| 金鸿: "《印制电路技术》", 31 December 2003, 北京：化学工业出版社 * |
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Application publication date: 20210608 |