CN112921366B - Mask plate manufacturing method, mask plate and display device - Google Patents
Mask plate manufacturing method, mask plate and display device Download PDFInfo
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- CN112921366B CN112921366B CN202110100848.1A CN202110100848A CN112921366B CN 112921366 B CN112921366 B CN 112921366B CN 202110100848 A CN202110100848 A CN 202110100848A CN 112921366 B CN112921366 B CN 112921366B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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Abstract
The invention provides a manufacturing method of a mask plate, the mask plate and a display device, wherein the method comprises the following steps: forming a plurality of mutually independent grooves on one side surface of the conductive substrate; forming a whole graphene coating on one side of the conductive substrate where the groove is formed; forming a patterned insulating structure on the graphene coating in each groove, wherein the orthographic projection of the insulating structure on the conductive substrate is smaller than that of the groove on the conductive substrate; placing the conductive substrate in electroplating solution, electrifying, and then carrying out electroforming process, forming a mask plate body comprising a main body part and a supporting part on the surface of the graphene coating layer which is not shielded by the insulating structure, wherein the main body part covers the region outside the groove, and the supporting part extends to the bottom of the groove from the main body part and is arranged around the edge of the groove; removing the insulation structure, and forming a through hole structure at the position of the mask plate body where the insulation structure is removed; the graphene coating is ultrasonically dispersed in the dispersing agent, so that the mask plate body is peeled from the conductive substrate.
Description
Technical Field
The invention relates to the technical field of display, in particular to a manufacturing method of a mask plate, the mask plate and a display device.
Background
The OLED (Organic Light Emitting Diode) display technology has become a main development direction in the display technology field due to its advantages of lightness, thinness, self-luminescence, wide viewing angle, fast response speed, low brightness, low power consumption, and the like.
A light emitting layer of an existing OLED display device usually uses a Mask evaporation method to evaporate an organic light emitting material onto a back plate, specifically, a Metal Mask is set in front of the back plate, for example, a Fine Metal Mask (FMM) is used as a shielding layer, and the organic light emitting material is evaporated into pixel regions corresponding to a display panel through openings of the Metal Mask. At present, a wet etching process is often adopted to manufacture a mask plate, and specifically, an acid solution and a double-sided etching process are adopted to manufacture the mask plate. In the process of using a mask plate manufactured by a wet etching process to evaporate an organic light-emitting material in an OLED display device, in order to support a metal mask plate and prevent electrostatic adsorption of the metal mask plate and a back plate during evaporation, a columnar spacer is generally arranged between a pixel definition layer and the metal mask plate, and due to the existence of the columnar spacer, the organic light-emitting material can be evaporated to an area outside an opening of the metal mask plate through a gap between the metal mask plate and the pixel definition layer in the evaporation process, so that evaporation shadow is caused, and when the shadow is large, the evaporation is carried out on adjacent sub-pixel units, so that a color mixing phenomenon is caused, and the product yield is reduced.
Therefore, the existing mask plate for evaporation has the technical problem of low evaporation precision.
Disclosure of Invention
The invention provides a manufacturing method of a mask plate, the mask plate and a display device, which are used for improving evaporation precision.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a mask, including:
forming a plurality of mutually independent grooves on one side surface of the conductive substrate;
forming a whole graphene coating on one side of the conductive substrate where the groove is formed;
forming a patterned insulating structure on the graphene coating in each groove, wherein the orthographic projection of the insulating structure on the conductive substrate is smaller than the orthographic projection of the groove on the conductive substrate;
placing the conductive substrate in electroplating solution, electrifying, and then carrying out electroforming process, and forming a mask plate body comprising a main body part and a supporting part on the surface of the graphene coating layer which is not shielded by the insulating structure, wherein the main body part covers the region outside the groove, and the supporting part extends to the bottom of the groove from the main body part and is arranged around the edge of the groove;
removing the insulation structure, and forming a through hole structure at the position of the mask plate body where the insulation structure is removed;
and ultrasonically dispersing the graphene coating in a dispersing agent to strip the mask plate body from the conductive substrate.
In one possible implementation manner, the forming a plurality of mutually independent grooves on one side surface of the conductive substrate includes:
forming a patterned first photoresist on one side surface of the conductive substrate by using a photoetching process;
and etching the conductive substrate by utilizing the shielding of the first photoresist, and forming the groove on the surface of one side of the conductive substrate.
In one possible implementation manner, the forming of the graphene coating on the side of the conductive substrate where the groove is formed includes:
and generating a whole graphene coating on one side of the conductive substrate on which the groove is formed by an in-situ polymerization method.
In one possible implementation, forming a patterned insulating structure on the graphene coating layer in each of the grooves includes:
and forming a patterned second photoresist on the graphene coating in each groove by using a photoetching process, wherein the surface of one side, deviating from the groove, of the second photoresist protrudes out of the groove.
In one possible implementation manner, the performing of the electroforming process after the conducting substrate is placed in the electroplating solution and electrified includes:
and placing the conductive substrate in electroplating solution, and electrifying the negative electricity to carry out electroforming process.
In one possible implementation manner, the peeling the mask body from the conductive substrate by ultrasonically dispersing the graphene coating in a dispersing agent includes:
placing the conductive substrate forming the mask body in a solvent made of dimethylformamide;
and ultrasonically dispersing the graphene coating, and stripping the mask plate body from the conductive substrate.
In a second aspect, an embodiment of the present invention further provides a mask, including:
the mask plate comprises a mask plate body, a mask plate body and a mask plate, wherein the mask plate body is provided with a plurality of through hole structures penetrating through the thickness direction;
the mask plate body comprises a main body part and supporting parts, one side surface of the main body part is located on the same plane, and the supporting parts protrude out of the plane along the side surface of the main body part and are arranged around the edge of each through hole structure.
In one possible implementation, the main body part is integrally formed with the support part.
In one possible implementation, the main body part and the other side surface of the supporting part are in smooth transition.
In a third aspect, an embodiment of the present invention further provides a display device, including:
the mask comprises a substrate, a pixel circuit layer and a light-emitting functional layer, wherein the pixel circuit layer is arranged away from the substrate in sequence, and the light-emitting functional layer is formed by vapor plating of the mask.
The invention has the following beneficial effects:
the embodiment of the invention provides a manufacturing method of a mask plate, the mask plate and a display device, firstly, a plurality of mutually independent grooves are formed on the surface of one side of a conductive substrate, then, an integral graphene coating is formed on the side of the conductive substrate where the grooves are formed, then, a patterned insulating structure is formed on the graphene coating in each groove, then, the conductive substrate is placed in electroplating solution to be electrified and then an electroforming process is carried out, a mask plate body comprising a main body part and a supporting part is formed on the surface, which is not shielded by the insulating structure, of the graphene coating, because the orthographic projection of the insulating structure on the conductive substrate is smaller than the orthographic projection of the grooves on the conductive substrate, the formed main body part covers the area outside the grooves, the supporting part extends to the bottom of the grooves from the main body part and is arranged around the edges of the grooves, then, after the insulating structure is removed, a through hole structure is formed at the position where the insulating structure is removed from the mask plate body, and then, ultrasonically dispersing the graphene coating in the dispersing agent, and stripping the mask plate body from the conductive substrate to obtain the mask plate. Because the edge of the mask plate body surrounding the through hole structure is provided with the supporting part, the evaporation shadow can be effectively avoided in the subsequent process of evaporating the organic light-emitting material through the mask plate, and the evaporation precision of the mask plate is improved.
Drawings
FIG. 1 is a schematic diagram of a mask plate evaporation coating of organic light-emitting materials in an OLED display device manufactured by a wet etching process in the prior art;
fig. 2 is a flowchart of a method for manufacturing a mask according to an embodiment of the present invention;
fig. 3 is a flowchart of a method in step S101 in the mask manufacturing method according to the embodiment of the present invention;
fig. 4 is a process flow diagram corresponding to a manufacturing method of a mask plate according to an embodiment of the present invention;
fig. 5 is a flowchart of a method in step S106 in the mask manufacturing method according to the embodiment of the present invention;
fig. 6 is a schematic structural diagram of a mask according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Description of reference numerals:
1-an array substrate; 2-a pixel defining layer; 3-a mask plate; 4-a columnar spacer; 10-a conductive substrate; 20-a first photoresist; 30-a groove; 40-graphene coating; 50-an insulating structure; an H-via structure; 60-a mask plate body; 601-a body portion; 602-a support; 100-substrate base plate; 200-pixel circuit layer; 300-light emitting functional layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. And the embodiments and features of the embodiments may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of the word "comprise" or "comprises", and the like, in the context of this application, is intended to mean that the elements or items listed before that word, in addition to those listed after that word, do not exclude other elements or items.
It should be noted that the sizes and shapes of the figures in the drawings are not to be considered true scale, but are merely intended to schematically illustrate the present invention. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
Fig. 1 is a schematic diagram of an organic light-emitting material in a mask evaporation OLED display device manufactured by a wet etching process, wherein a reference numeral 1 denotes an array substrate, specifically, a columnar spacer is separately added between a pixel defining layer 2 and a mask 3, and the organic light-emitting material is easily evaporated to an area outside an opening of the mask through a gap between the mask and the pixel defining layer in the whole evaporation process to cause an evaporation shadow, thereby reducing the evaporation precision and affecting the display quality.
In view of this, embodiments of the present invention provide a mask manufacturing method, a mask and a display device, which are used to improve evaporation precision and ensure display quality.
Fig. 2 is a flowchart of a method for manufacturing a mask according to an embodiment of the present invention, specifically, the method includes:
s101: forming a plurality of mutually independent grooves on one side surface of the conductive substrate;
in a specific implementation process, the material of the conductive substrate may be a metal material such as copper, molybdenum, and the like. The shape of the plurality of mutually independent grooves formed on one side surface of the conductive substrate may be a grid shape, or an irregular shape, which is not limited herein.
S102: forming a whole graphene coating on one side of the conductive substrate where the groove is formed;
in a specific implementation process, the graphene coating has good conductivity, and the manufacturing efficiency of the mask plate can be improved.
S103: forming a patterned insulating structure on the graphene coating in each groove, wherein the orthographic projection of the insulating structure on the conductive substrate is smaller than the orthographic projection of the groove on the conductive substrate;
in a specific implementation process, the insulating structure may be a photoresist, an orthogonal projection of the insulating structure on the conductive substrate is smaller than an orthogonal projection of the groove on the conductive substrate, and in practical applications, the patterned insulating structure may be used to define a size of an opening corresponding to a through-hole structure of a mask plate to be manufactured, that is, the size of the opening of the groove is larger than the size of the opening corresponding to the through-hole structure of the mask plate to be manufactured. In addition, the shape of the patterned insulating structure may be set according to the shape of the opening corresponding to the through-hole structure of the mask to be manufactured, and the shape of the through-hole structure of the mask to be manufactured may be manufactured according to the set shape of the patterned insulating structure. For example, if the through hole structure of the mask to be manufactured is in a grid shape, the orthographic projection shape of the patterned insulating structure on the conductive substrate may be in a grid shape; if the shape of the through hole structure of the mask plate to be manufactured is irregular, the shape of the orthographic projection of the patterned insulating structure on the conductive substrate can also be irregular. Of course, the shape of the orthographic projection of the patterned insulating structure on the conductive substrate can be other shapes, and is not described in detail herein.
S104: placing the conductive substrate in electroplating solution, electrifying, and then carrying out electroforming process, and forming a mask plate body comprising a main body part and a supporting part on the surface of the graphene coating layer which is not shielded by the insulating structure, wherein the main body part covers the region outside the groove, and the supporting part extends to the bottom of the groove from the main body part and is arranged around the edge of the groove;
in a specific implementation process, the electroplating solution may be a metal salt solution, and the conductive substrate is placed in the electroplating solution and subjected to an electroforming process after being electrified, so that metal cations in the metal salt solution are displaced and deposited on the surface of the graphene coating layer which is not shielded by the insulating structure to form a mask plate body including a main body portion and a supporting portion, and thus, the main body portion covers an area outside the groove, and the supporting portion extends from the main body portion to the bottom of the groove and is disposed around the edge of the groove.
S105: removing the insulation structure, and forming a through hole structure at the position of the mask plate body where the insulation structure is removed;
in a specific implementation, the shape of the via structure depends on the shape of the patterned insulating structure.
S106: and ultrasonically dispersing the graphene coating in a dispersing agent to strip the mask plate body from the conductive substrate.
In a specific implementation process, the graphene coating is ultrasonically dispersed in the dispersing agent, so that the mask plate body can be peeled from the conductive substrate, and the peeled mask plate body forms a mask plate with a required shape. Because the supporting part is arranged at the edge surrounding the through hole structure in the manufactured mask plate, the vapor deposition shadow can be effectively avoided in the subsequent process of vapor deposition of the organic light-emitting material through the manufactured mask plate, and therefore the vapor deposition precision of the mask plate is improved. In addition, in the subsequent process of evaporating the organic light-emitting material through the manufactured mask plate, the columnar spacer does not need to be additionally arranged, and through the supporting effect of the supporting part, the electrostatic adsorption between the mask plate and the back plate and the sticking risk of the organic light-emitting material are effectively avoided, and the product yield of the display device is ensured.
In the specific implementation process, as shown in fig. 3, step S101: forming a plurality of mutually independent grooves on one side surface of the conductive substrate, including:
s201: forming a patterned first photoresist on one side surface of the conductive substrate by using a photoetching process;
s202: and etching the conductive substrate by utilizing the shielding of the first photoresist, and forming the groove on the surface of one side of the conductive substrate.
In the specific implementation process, the specific implementation process from step S201 to step S202 is as follows:
firstly, forming a first patterned photoresist on one side surface of a conductive substrate by utilizing a photoetching process, then etching the conductive substrate by utilizing the shielding of the first photoresist, and forming the groove on one side surface of the conductive substrate.
With reference to the manufacturing methods shown in fig. 2 and fig. 3, as shown in fig. 4, one of the process flow diagrams corresponding to the mask manufacturing method in the embodiment of the present invention is shown, where reference numeral 10 is a conductive substrate, reference numeral 20 is a first photoresist, reference numeral 30 is a groove, reference numeral 40 is a graphene coating, reference numeral 50 is an insulating structure, reference numeral H is a through-hole structure (a structure shown by a dotted line frame in fig. 4), reference numeral 60 is a mask body, reference numeral 601 is a main body portion, and reference numeral 602 is a supporting portion.
In the embodiment of the present invention, step S102: forming a whole graphene coating on one side of the conductive substrate where the groove is formed, including:
and generating a whole graphene coating on one side of the conductive substrate on which the groove is formed by an in-situ polymerization method.
In a specific implementation process, graphene or functionalized graphene is added into a liquid monomer through an in-situ polymerization method, a suitable initiator is added, the functionalized graphene and the monomer are polymerized together, and a whole layer of graphene coating is generated on one side of the conductive substrate where the groove is formed. In the in-situ polymerization reaction, the graphene is dispersed in the polymer network more uniformly, the stability of the material performance is better, and the conductivity of the graphene coating is better, so that the manufacturing efficiency of the mask plate can be effectively improved in the subsequent process of manufacturing the mask plate.
In addition, in the specific implementation process, an entire graphene coating layer can be generated on one side of the conductive substrate, where the groove is formed, through an in-situ polymerization method, and then the entire graphene coating layer can be directly coated on one side of the conductive substrate, where the groove is formed, so that the manufacturing cost of the mask plate is reduced.
In the embodiment of the present invention, step S103: forming a patterned insulating structure on the graphene coating in each of the recesses, comprising:
and forming a patterned second photoresist on the graphene coating in each groove by using a photoetching process, wherein the surface of one side, deviating from the groove, of the second photoresist protrudes out of the groove.
In a specific implementation process, a whole layer of second photoresist is formed on the surface of one side, away from the conductive substrate, of the graphene coating by using a photoetching process, then the whole layer of second photoresist is etched, and patterned second photoresist is formed on the graphene coating in each groove, wherein the surface, away from the groove, of the patterned second photoresist protrudes out of the groove, and the second photoresist is of an insulating structure. Therefore, when the patterned second photoresist effectively shields the graphene coating in the groove, the deposition precision of metal cations in an area not shielded by the patterned second photoresist in the subsequent electroforming process can be ensured, and further, the manufacturing precision of the mask plate is ensured.
In the embodiment of the present invention, step S104: placing the conductive substrate in electroplating solution, electrifying and then carrying out electroforming process, wherein the electroforming process comprises the following steps:
and placing the conductive substrate in electroplating solution, and electrifying the negative electricity to carry out electroforming process.
In a specific implementation process, the electroforming process on the conductive substrate may be performed by placing the conductive substrate in an electroplating solution, and applying negative electricity to the conductive substrate, so that metal cations in the electroplating solution are displaced and deposited on a surface of the graphene coating layer that is not covered by the second photoresist, thereby forming a mask plate body including a main body portion and a support, wherein due to the existence of the groove and the second photoresist, the main body portion directly covers a region outside the groove, and the support portion is diffracted by the main body portion to the bottom of the groove and is disposed around an edge of the groove.
In the embodiment of the present invention, as shown in fig. 5, step S106: through in the dispersant supersound dispersion the graphite alkene coating, peel off the mask plate body from electrically conductive base plate, include:
s301: placing the conductive substrate forming the mask body in a solvent made of dimethylformamide;
s302: and ultrasonically dispersing the graphene coating, and stripping the mask plate body from the conductive substrate.
In the specific implementation process, the specific implementation process from step S301 to step S302 is as follows:
firstly, the conductive substrate for forming the mask plate body is placed in a solvent made of dimethyl formamide (DMF), then the graphene coating is dispersed through ultrasound, the mask plate body is stripped from the conductive substrate, and therefore, an opening of the mask plate is formed at the position of a through hole structure of the mask plate body.
Based on the same inventive concept, as shown in fig. 6, an embodiment of the present invention further provides a mask plate, including:
the mask plate comprises a mask plate body 60, wherein the mask plate body 60 is provided with a plurality of through hole structures H penetrating in the thickness direction;
the mask body 60 includes a main body 601 and a support 602, wherein one side surface of the main body 601 is located on the same plane, and the support 602 protrudes from the plane along the side surface of the main body 601 and is disposed around the edge of each through-hole structure H.
In the embodiment of the invention, the main body part 601 and the supporting part 602 are integrally formed, so that the manufacturing cost of a mask plate is reduced, in addition, in the process of evaporating an organic light-emitting material through the mask plate, due to the supporting effect of the supporting part 602, no column-shaped spacer is required to be additionally arranged in the whole evaporation process, so that the evaporation of the organic light-emitting material can be realized, and because the supporting part 602 is arranged around the edge of each through hole structure, no other gap exists between the mask plate and the pixel defining layer except for the through hole structure, so that the evaporation shadow is effectively avoided, and the evaporation precision is improved.
In the embodiment of the present invention, the main body 601 smoothly transitions to the other side surface of the supporting portion 602.
In a specific implementation process, the surface of the other side of the main body 601 and the surface of the other side of the supporting portion 602 are in smooth transition, the surface of the other side of the main body 601 and the surface of the other side of the supporting portion 602 can be used as an evaporation surface of the mask, and the smooth evaporation surface further ensures the evaporation precision of the mask.
Based on the same inventive concept, as shown in fig. 7, an embodiment of the present invention further provides a display device, including:
the display panel comprises a substrate 100, a pixel circuit layer 200 and a light-emitting functional layer 300, wherein the pixel circuit layer 200 is arranged to be away from the substrate 100 in sequence, and the light-emitting functional layer is evaporated by using a mask plate as shown in fig. 6.
In a specific implementation process, the light emitting function layer comprises an anode layer, a light emitting layer and a cathode layer which are sequentially arranged to deviate from the substrate. The display device further comprises a packaging layer arranged on one side, away from the substrate base plate, of the light-emitting functional layer, external water and oxygen are effectively isolated through the packaging layer, the use performance of the display device is guaranteed, and other functional film layers such as a polarizer, a color filter and the like can be arranged on one side, away from the substrate base plate, of the packaging layer according to actual application requirements, and are not limited herein.
In a specific implementation, the display device may be an OLED display device. Because the light-emitting functional layer in the display device is manufactured by adopting the mask plate shown in fig. 6, the film layer uniformity of the manufactured display device is better, and the display quality of the display device is ensured.
In a specific implementation process, the display device provided in the embodiment of the present invention may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator. Other essential components of the display device are understood by those skilled in the art, and are not described herein nor should they be construed as limiting the present invention.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A manufacturing method of a mask plate is characterized by comprising the following steps:
forming a plurality of mutually independent grooves on one side surface of the conductive substrate;
forming a whole graphene coating on one side of the conductive substrate where the groove is formed;
forming a patterned insulating structure on the graphene coating in each groove, wherein the orthographic projection of the insulating structure on the conductive substrate is smaller than the orthographic projection of the groove on the conductive substrate;
placing the conductive substrate in electroplating solution, electrifying, and then carrying out electroforming process, and forming a mask plate body comprising a main body part and a supporting part on the surface of the graphene coating layer which is not shielded by the insulating structure, wherein the main body part covers the region outside the groove, and the supporting part extends to the bottom of the groove from the main body part and is arranged around the edge of the groove;
removing the insulation structure, and forming a through hole structure at the position of the mask plate body where the insulation structure is removed;
and ultrasonically dispersing the graphene coating in a dispersing agent to strip the mask plate body from the conductive substrate.
2. The method of claim 1, wherein forming a plurality of independent grooves on a side surface of the conductive substrate comprises:
forming a patterned first photoresist on one side surface of the conductive substrate by using a photoetching process;
and etching the conductive substrate by utilizing the shielding of the first photoresist, and forming the groove on the surface of one side of the conductive substrate.
3. The method of claim 1, wherein forming an entire graphene coating on the side of the conductive substrate where the recess is formed comprises:
and generating a whole graphene coating on one side of the conductive substrate on which the groove is formed by an in-situ polymerization method.
4. The method of claim 1, wherein forming a patterned insulating structure on the graphene coating in each of the recesses comprises:
and forming a patterned second photoresist on the graphene coating in each groove by using a photoetching process, wherein the surface of one side, deviating from the groove, of the second photoresist protrudes out of the groove.
5. The method of claim 1, wherein the electroforming process after the placing the conductive substrate in the plating solution and the energizing comprises:
and placing the conductive substrate in electroplating solution, and electrifying the negative electricity to carry out electroforming process.
6. The method of claim 1, wherein the stripping the masked plate body from the conductive substrate by ultrasonically dispersing the graphene coating in a dispersing agent comprises:
placing the conductive substrate forming the mask body in a solvent made of dimethylformamide;
and ultrasonically dispersing the graphene coating, and stripping the mask plate body from the conductive substrate.
7. A mask manufactured by the method for manufacturing a mask according to any one of claims 1 to 6, comprising:
the mask plate comprises a mask plate body, a mask plate body and a mask plate, wherein the mask plate body is provided with a plurality of through hole structures penetrating through the thickness direction;
the mask plate body comprises a main body part and supporting parts, one side surface of the main body part is located on the same plane, and the supporting parts protrude out of the plane along the side surface of the main body part and are arranged around the edge of each through hole structure.
8. A mask plate according to claim 7, wherein the main body part and the support part are integrally formed.
9. A mask plate according to claim 7, wherein the main body part and the other side surface of the supporting part form a smooth transition.
10. A display device, comprising:
the mask comprises a substrate, a pixel circuit layer and a luminous function layer, wherein the pixel circuit layer is arranged to be deviated from the substrate in sequence, and the luminous function layer is evaporated by adopting the mask according to any one of claims 7 to 9.
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| CN107164788B (en) * | 2017-05-23 | 2019-08-02 | 上海天马有机发光显示技术有限公司 | Mask plate and preparation method thereof |
| CN108796440A (en) * | 2018-07-26 | 2018-11-13 | 京东方科技集团股份有限公司 | A kind of preparation method of mask plate, mask plate, evaporated device |
| CN110453173B (en) * | 2019-07-29 | 2021-09-21 | 京东方科技集团股份有限公司 | Mask plate and manufacturing method thereof, and manufacturing method of OLED display substrate |
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