CN112909145A - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
- Publication number
- CN112909145A CN112909145A CN202110077243.5A CN202110077243A CN112909145A CN 112909145 A CN112909145 A CN 112909145A CN 202110077243 A CN202110077243 A CN 202110077243A CN 112909145 A CN112909145 A CN 112909145A
- Authority
- CN
- China
- Prior art keywords
- layer
- display panel
- stress buffer
- passivation layer
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 238000002161 passivation Methods 0.000 claims abstract description 75
- 239000002184 metal Substances 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 abstract description 13
- 238000010586 diagram Methods 0.000 description 11
- 238000007639 printing Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a display panel and a preparation method thereof, wherein the display panel comprises: a first metal layer; the insulating layer is arranged on the first metal layer; the second metal layer is arranged on the insulating layer; a passivation layer disposed on the second metal layer; the first stress buffer layer is arranged on the passivation layer; and the white ink layer is arranged on the first stress buffer layer. According to the invention, the stress buffer layer is additionally arranged on the surface of the passivation layer, so that short circuit caused by local stress concentration caused by foreign matters in a silk-screen printing process and breakage of the film layer is avoided.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a preparation method of the display panel.
Background
With the development of science and technology, display devices such as mobile phones and tablet computers have become indispensable electronic products in people's lives due to their rich functions.
Because the OLED (Organic Light-Emitting Diode) continuously eats the high-end market of Liquid Crystal Display, the LCD (Liquid Crystal Display) needs to make a new way and find a way, and the AM Mini-LED (Active-matrix Mini-LED) should be produced; the white oil process is an indispensable process of the Mini-LED, and mainly plays roles in improving reflectivity, improving optical quality and reducing energy consumption, and the white oil process needs to be manufactured by adopting a screen printing machine due to the influence of the characteristics of a white oil material. In order to ensure good screen printing effect (poor pattern accuracy, no blurring, no burr and the like), the screen printing plate and the printing stock need to be in linear contact in the printing process. As shown in fig. 1 and 2, fig. 1 is a schematic structural diagram of a display panel in the prior art, and fig. 2 is a schematic screen printing operation diagram of the display panel in the prior art. The display panel includes a first metal layer 11, a Gate Insulator (GI) 12, a second metal layer 13, and a passivation layer 14, which are sequentially stacked from bottom to top. If foreign matters 15 exist on the surface of the passivation layer 14 or the surface of a printing table bearing the display panel in the silk-screen printing process, the display panel is slightly deformed, local stress is concentrated when the scraper 16 contacts the display panel, the grid insulation layer 12 is damaged, the first metal layer 11 and the second metal layer 13 both overflow a preset film layer interval, and the first metal layer 11 and the second metal layer 13 are in contact to cause poor short circuit. If because foreign matter 15 can lead to the fragment even short circuit, strengthen the requirement and the dustless requirement of grade to display panel surface and ink pad surface depth of parallelism, can increase manufacturing cost on the one hand, also can lead to production efficiency not high on the one hand, be difficult to satisfy the volume production demand.
In summary, in the prior art, if there is a foreign object on the surface of the display panel or the surface of the pad supporting the display panel during the screen printing process, the display panel is slightly deformed, and when the scraper contacts the display panel, local stress is concentrated, the gate insulating layer is damaged, and the first metal layer contacts the second metal layer, which results in a poor short circuit.
Disclosure of Invention
The embodiment of the invention provides a display panel and a preparation method of the display panel, and aims to solve the technical problems that in the prior art, if foreign matters exist on the surface of the display panel or the surface of a printing table bearing the display panel in the silk-screen process, the display panel is slightly deformed, local stress is concentrated when a scraper contacts the display panel, a grid insulating layer is damaged, and a first metal layer is in contact with a second metal layer, so that short circuit is poor.
In order to solve the above problem, a first aspect of the present invention provides a display panel, including:
a first metal layer;
the insulating layer is arranged on the first metal layer;
the second metal layer is arranged on the insulating layer;
a passivation layer disposed on the second metal layer;
the first stress buffer layer is arranged on the passivation layer;
and the white ink layer is arranged on the first stress buffer layer.
In some embodiments of the present invention, the white ink layer includes a pattern region and a hollowed-out region, and an orthographic projection of the pattern region of the white ink layer on the passivation layer is within an orthographic projection of the first stress buffer layer on the passivation layer.
In some embodiments of the present invention, a surface of the passivation layer opposite to the first stress buffer layer includes a concave-convex structure, and the concave-convex structure is wavy and zigzag.
In some embodiments of the present invention, the passivation layer includes a plurality of grooves or a plurality of through holes, and the first stress buffer layer is filled in the grooves or the through holes and covers a surface of the passivation layer.
In some embodiments of the present invention, further comprising a second stress buffer layer disposed between the passivation layer and the second metal layer.
In some embodiments of the present invention, the passivation layer is made of silicon oxide or silicon nitride, and the first stress buffer layer is made of acrylic, epoxy, or acrylic material.
In some embodiments of the present invention, a material of the first stress buffer layer is the same as a material of at least one organic film layer in the display panel.
In a second aspect, the present invention provides a method for manufacturing a display panel, the method being used for manufacturing the display panel according to any one of the first aspect, including the steps of:
providing a first metal layer, and preparing an insulating layer on the first metal layer;
preparing a second metal layer on the insulating layer, and preparing a passivation layer on the second metal layer;
and preparing a stress buffer layer on the passivation layer, and preparing a white ink layer on the stress buffer layer.
In some embodiments of the present invention, the step after the preparing the passivation layer on the second metal layer further comprises: preparing patterned photoresist on the upper surface of the passivation layer, and etching the passivation layer which is not covered by the photoresist to form a concave-convex structure, a plurality of grooves or a plurality of through holes on the passivation layer.
In some embodiments of the present invention, the step of preparing the passivation layer on the second metal layer further comprises: and preparing the second stress buffer layer on the second metal layer, and preparing the passivation layer on the stress buffer layer.
Compared with the existing display panel and the preparation method of the display panel, the stress buffer layer is additionally arranged on the surface of the passivation layer of the display panel, so that the short circuit caused by the fact that the film layer is broken due to local stress concentration caused by foreign matters in the silk-screen printing process is avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a display panel in the prior art;
FIG. 2 is a schematic diagram of a short circuit of a display panel in the prior art;
FIG. 3 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
FIG. 6 is a schematic diagram of a screen printing process for a display panel according to an embodiment of the present invention;
FIG. 7 is a flow chart of a method of making in one embodiment of the invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.
In the prior art, if foreign matters exist on the surface of a display panel or the surface of a printing table bearing the display panel in the silk-screen printing process, the display panel is slightly deformed, local stress is concentrated when a scraper contacts the display panel, a grid insulating layer is damaged, and a first metal layer and a second metal layer are contacted to cause poor short circuit.
Accordingly, the embodiment of the invention provides a display panel and a preparation method of the display panel. The following are detailed below.
First, an embodiment of the invention provides a display panel, as shown in fig. 3, and fig. 3 is a schematic structural diagram of the display panel in an embodiment of the invention. The display panel includes: a first metal layer 21; an insulating layer 22 disposed on the first metal layer 21; a second metal layer 23 disposed on the insulating layer 22; a passivation layer 24 disposed on the second metal layer 23; a first stress buffer layer 27 disposed on the passivation layer 20; and a white ink layer 28 disposed on the first stress buffer layer 27.
Compared with the existing display panel, the stress buffer layer 27 is additionally arranged on the surface of the passivation layer 20 of the display panel, so that short circuit caused by the fact that a film layer is broken due to local stress concentration caused by foreign matters in a silk-screen printing process is avoided.
In some embodiments of the present invention, the white ink layer 28 includes a pattern area and a hollow area, and an orthographic projection of the pattern area of the white ink layer 28 on the passivation layer 24 is within an orthographic projection of the first stress buffer layer 27 on the passivation layer 24. In one embodiment, the first stress buffer layer 27 also includes a pattern region and a hollow region, the first stress buffer layer 27 only covers a partial region of the passivation layer 24, an orthographic projection area of the pattern region of the first stress buffer layer 27 on the passivation layer 24 is greater than or equal to an orthographic projection area of the pattern region of the white ink layer 28 on the passivation layer 24, and an orthographic projection of the white ink layer 28 is located within the orthographic projection of the first stress buffer layer 27. In this embodiment, the hollow-out area is disposed in the first stress buffer layer 27, so that the first stress buffer layer 27 includes a plurality of mutually independent pattern regions, and a certain gap exists between the pattern regions, so that when the display panel is subjected to an external force, a stretching or shrinking gap is provided for the pattern regions, thereby reducing stress accumulation and transmission between films of the display panel, and reducing the possibility of failure of the display panel due to cracks generated by stress accumulation and transmission of the display panel.
In another embodiment, the first stress buffer layer 27 has no hollow area, and the first stress buffer layer 27 completely covers the entire area of the passivation layer 24, at this time, it can still be satisfied that the orthographic projection area of the pattern area of the first stress buffer layer 27 on the passivation layer 24 is greater than or equal to the orthographic projection area of the pattern area of the white ink layer 28 on the passivation layer 24, and the orthographic projection of the white ink layer 28 is located within the orthographic projection of the first stress buffer layer 27. In this embodiment, since the first stress buffer layer 27 does not need to be patterned and etched after the first stress buffer layer 27 is prepared, a photo-mask process can be saved and the process can be simplified.
On the basis of the above embodiments, as shown in fig. 4, fig. 4 is a schematic structural diagram of a display panel in another embodiment of the present invention. The surface of the passivation layer 24 opposite to the first stress buffer layer 27 includes a concave-convex structure, which is wavy and zigzag. That is, under the condition that the smoothness of the upper surface of the first stress buffer layer 27 is not affected, in the figure, the upper surface of the passivation layer 24 and the lower surface of the first stress buffer layer 27 include the concave-convex structure, and the cross-sectional shape of the concave-convex structure includes arcs, triangles or rectangles which are staggered with each other, in this embodiment, the arc distance is used, that is, the concave-convex structure is wavy. When the stress enters the first stress buffer layer 27 from top to bottom, the stress can be dispersed into stresses conducted in different directions due to the wavy lower surface of the first buffer layer 27, the stress intensity in a single direction can be greatly reduced, and the risk of breakage and fracture of the first stress buffer layer 27 is effectively reduced due to the concave-convex structure. It is understood that, only the surface of the passivation layer 24 opposite to the first stress buffer layer 27 is taken as an example of a concave-convex structure, and actually, a concave-convex structure is formed on the interface of any other two adjacent film layers, which all have the effect of relieving stress; in order to prevent the second metal layer 23 from being damaged, a concave-convex structure may be formed on a surface of the passivation layer 24 opposite to the second metal layer 23 and a surface of the second metal layer 23 opposite to the insulating layer 22; the first metal layer 21 may be prevented from being damaged, and a concave-convex structure may be formed on a surface of the insulating layer 22 facing the first metal layer 21.
As shown in fig. 5, fig. 5 is a schematic structural view of a display panel according to another embodiment of the present invention, in which the passivation layer 24 includes a plurality of grooves or a plurality of through holes, and the first stress buffer layer 27 is filled in the grooves or the through holes and covers the surface of the passivation layer 24. Through stress analysis of the display panel, it is found that in the above embodiment, as the strength of the stress is higher, the thickness of the first stress buffer layer 27 is larger, which affects the light and thin performance of the display panel. In this embodiment, the thickness of the first stress buffer layer 27 is optimized, a stress analysis is performed on the passivation layer 24, a plurality of grooves or a plurality of through holes are formed in the fragile position of the passivation layer 24, and then the first stress buffer layer 27 is filled in the grooves or the through holes and covers the surface of the passivation layer 24, so as to further reduce the stress intensity applied to the passivation layer 24. In the embodiment and the above embodiments with the same thickness, the technical solution of the embodiment can bear higher stress strength.
In some embodiments, to further prevent the second metal layer 23 from being damaged, the display panel further includes a second stress buffer layer disposed between the passivation layer 24 and the second metal layer 23. In this embodiment, the display panel includes two stress buffer layers, the effect of buffering stress is further enhanced, and the thickness of each stress buffer layer is smaller than the thickness of only one stress buffer layer. It is understood that, by combining this embodiment with the above embodiment, the concave-convex structure may be prepared on the upper and lower surfaces of the second stress buffer layer, and a plurality of downward grooves or through holes may also be provided in the passivation layer 24. The second stress buffer layer is filled in the groove or the through hole.
The passivation layer 24 is provided to prevent contamination of the device surface by harmful impurities for a long period of time; the thermal expansion coefficient is matched with that of the silicon substrate; the growth temperature of the film is low; the component and thickness uniformity of the passivation film is good; the pinhole density is low, and a slowly changing step is easily obtained after photoetching. The passivation layer 24 needs to be made of a material with high chemical stability, preferably silicon oxide or silicon nitride, and the first stress buffer layer 27 needs to be made of an organic material with better stress absorption, preferably acrylic, epoxy or acrylic material.
In another embodiment, the material of the first stress buffer layer 27 is the same as the material of at least one organic film layer in the display panel. The first stress buffer layer 27 can be prepared by using existing equipment, a film forming process and redundant materials, so that the purpose of capacity removal is achieved, the cost is saved, and waste is prevented.
On the basis of the foregoing embodiment, as shown in fig. 6, fig. 6 is a schematic screen printing diagram of a display panel in an embodiment of the present invention. If foreign matters 25 exist on the surface of the passivation layer 24 or the surface of a printing pad bearing the display panel in the process of screen printing the white ink layer 27, so that the display panel is slightly deformed, even if local stress is concentrated when the scraper 26 contacts the display panel, due to the arrangement of the first stress buffer layer 27 and the related structure, the stress can be dispersed and absorbed, the insulating layer 22, the first metal layer 11 and the second metal layer 13 are not easily damaged or broken, and the phenomenon that the first metal layer 11 and the second metal layer 13 overflow a preset film layer interval and contact with each other to cause bad short circuit is avoided. Therefore, the requirements on the parallelism degree of the surface of the display panel and the surface of the printing platform and the requirements on the dust-free grade are reduced, on one hand, the production cost is reduced, on the other hand, the production efficiency is improved, and the product quality is improved.
In order to better manufacture the display panel in the embodiment of the present invention, on the basis of the display panel, the embodiment of the present invention further provides a manufacturing method of the display panel, which is used for manufacturing the display panel as described in the above embodiment.
As shown in fig. 7, fig. 7 is a flow chart of a manufacturing method in one embodiment of the invention. The preparation method of the display panel comprises the following steps:
s1, providing a first metal layer 21, and preparing an insulating layer 22 on the first metal layer 21;
s2, preparing a second metal layer 23 on the insulating layer 22, and preparing a passivation layer 24 on the second metal layer 23;
s3, preparing a stress buffer layer 27 on the passivation layer 24, and preparing a white ink layer 28 on the stress buffer layer 27.
Specifically, the steps after preparing the passivation layer 24 on the second metal layer 23 further include: preparing a patterned photoresist on the upper surface of the passivation layer 23, and etching the passivation layer 24 not covered by the photoresist, wherein the passivation layer 24 forms a concave-convex structure, a plurality of grooves or a plurality of through holes.
Specifically, the steps before preparing the passivation layer 24 on the second metal layer 23 further include: the second stress buffer layer is prepared on the second metal layer 23, and the passivation layer 24 is prepared on the second stress buffer layer.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and parts that are not described in detail in a certain embodiment may refer to the above detailed descriptions of other embodiments, and are not described herein again. In a specific implementation, each unit or structure may be implemented as an independent entity, or may be combined arbitrarily to be implemented as one or several entities, and specific implementations of each unit, structure, or operation may refer to the foregoing method embodiments, which are not described herein again.
The above embodiments of the present invention are described in detail, and the principle and the implementation of the present invention are explained by applying specific embodiments, and the above description of the embodiments is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A display panel, comprising:
a first metal layer;
the insulating layer is arranged on the first metal layer;
the second metal layer is arranged on the insulating layer;
a passivation layer disposed on the second metal layer;
the first stress buffer layer is arranged on the passivation layer;
and the white ink layer is arranged on the first stress buffer layer.
2. The display panel of claim 1, wherein the white ink layer comprises a pattern area and a hollowed-out area, and an orthographic projection of the pattern area of the white ink layer on the passivation layer is within an orthographic projection of the first stress buffer layer on the passivation layer.
3. The display panel according to claim 1, wherein a surface of the passivation layer opposite to the first stress buffer layer comprises a concave-convex structure, and the concave-convex structure is wavy and zigzag.
4. The display panel according to claim 1, wherein the passivation layer comprises a plurality of grooves or a plurality of through holes, and the first stress buffer layer is filled in the grooves or the through holes and covers the surface of the passivation layer.
5. The display panel of claim 1, further comprising a second stress buffer layer disposed between the passivation layer and the second metal layer.
6. The display panel according to claim 1, wherein the passivation layer is made of silicon oxide or silicon nitride, and the first stress buffer layer is made of acrylic, epoxy or acrylic material.
7. The display panel of claim 1, wherein the first stress buffer layer is made of the same material as at least one organic film layer in the display panel.
8. A method for manufacturing a display panel, comprising:
providing a first metal layer, and preparing an insulating layer on the first metal layer;
preparing a second metal layer on the insulating layer, and preparing a passivation layer on the second metal layer;
and preparing a stress buffer layer on the passivation layer, and preparing a white ink layer on the stress buffer layer.
9. The method according to claim 8, wherein the step after the passivation layer is formed on the second metal layer further comprises: preparing patterned photoresist on the upper surface of the passivation layer, and etching the passivation layer which is not covered by the photoresist to form a concave-convex structure, a plurality of grooves or a plurality of through holes on the passivation layer.
10. The method according to claim 8, further comprising, in the step before the step of forming the passivation layer on the second metal layer: and preparing the second stress buffer layer on the second metal layer, and preparing the passivation layer on the stress buffer layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110077243.5A CN112909145B (en) | 2021-01-20 | 2021-01-20 | Display panel and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110077243.5A CN112909145B (en) | 2021-01-20 | 2021-01-20 | Display panel and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112909145A true CN112909145A (en) | 2021-06-04 |
| CN112909145B CN112909145B (en) | 2022-03-08 |
Family
ID=76117814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110077243.5A Active CN112909145B (en) | 2021-01-20 | 2021-01-20 | Display panel and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112909145B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012059921A (en) * | 2010-09-09 | 2012-03-22 | Citizen Holdings Co Ltd | Semiconductor light-emitting device and manufacturing method of the same |
| CN210940916U (en) * | 2019-09-11 | 2020-07-07 | 仓和精密制造(苏州)有限公司 | Screen plate structure capable of reducing ink overflow and providing buffer |
| CN111477653A (en) * | 2020-04-22 | 2020-07-31 | 京东方科技集团股份有限公司 | Display panel, display device and manufacturing method of display panel |
| CN111740030A (en) * | 2020-06-30 | 2020-10-02 | 上海天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN211879404U (en) * | 2020-03-27 | 2020-11-06 | 京东方科技集团股份有限公司 | Display substrate and display device |
| CN111993768A (en) * | 2020-08-10 | 2020-11-27 | 深圳市华星光电半导体显示技术有限公司 | Steel mesh for printing solder paste, display panel and preparation method thereof |
| CN112116878A (en) * | 2020-09-24 | 2020-12-22 | Tcl华星光电技术有限公司 | Display panel, manufacturing method thereof and display device |
| CN112130690A (en) * | 2019-06-25 | 2020-12-25 | 陕西坤同半导体科技有限公司 | Touch display panel and touch display device |
| CN112382206A (en) * | 2020-11-13 | 2021-02-19 | Tcl华星光电技术有限公司 | Back plate and LED panel |
| CN112396979A (en) * | 2020-11-13 | 2021-02-23 | Tcl华星光电技术有限公司 | Back plate and LED panel |
-
2021
- 2021-01-20 CN CN202110077243.5A patent/CN112909145B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012059921A (en) * | 2010-09-09 | 2012-03-22 | Citizen Holdings Co Ltd | Semiconductor light-emitting device and manufacturing method of the same |
| CN112130690A (en) * | 2019-06-25 | 2020-12-25 | 陕西坤同半导体科技有限公司 | Touch display panel and touch display device |
| CN210940916U (en) * | 2019-09-11 | 2020-07-07 | 仓和精密制造(苏州)有限公司 | Screen plate structure capable of reducing ink overflow and providing buffer |
| CN211879404U (en) * | 2020-03-27 | 2020-11-06 | 京东方科技集团股份有限公司 | Display substrate and display device |
| CN111477653A (en) * | 2020-04-22 | 2020-07-31 | 京东方科技集团股份有限公司 | Display panel, display device and manufacturing method of display panel |
| CN111740030A (en) * | 2020-06-30 | 2020-10-02 | 上海天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN111993768A (en) * | 2020-08-10 | 2020-11-27 | 深圳市华星光电半导体显示技术有限公司 | Steel mesh for printing solder paste, display panel and preparation method thereof |
| CN112116878A (en) * | 2020-09-24 | 2020-12-22 | Tcl华星光电技术有限公司 | Display panel, manufacturing method thereof and display device |
| CN112382206A (en) * | 2020-11-13 | 2021-02-19 | Tcl华星光电技术有限公司 | Back plate and LED panel |
| CN112396979A (en) * | 2020-11-13 | 2021-02-23 | Tcl华星光电技术有限公司 | Back plate and LED panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112909145B (en) | 2022-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2018157606A1 (en) | Flexible display panel and manufacturing method therefor, and display device | |
| KR102017155B1 (en) | Touch screen panel and method for manufacturing the same | |
| JP2023510055A (en) | Support plate and folding display | |
| US9465256B2 (en) | Liquid crystal display panel and manufacturing method thereof | |
| CN106997883B (en) | Array substrate and display panel | |
| JP2008268471A (en) | Liquid crystal display device and manufacturing method thereof | |
| WO2021068805A1 (en) | Display panel, manufacturing method therefor, and display device | |
| WO2021223279A1 (en) | Display panel and display device | |
| CN111463243A (en) | Array substrate and preparation method thereof | |
| US20210175313A1 (en) | Organic light-emitting diode display panel | |
| JP2008040467A (en) | Color filter substrate and method of fabricating the same | |
| CN112909145B (en) | Display panel and preparation method thereof | |
| US11967599B2 (en) | Array substrate and display panel | |
| CN113325636B (en) | Display panel, display device and manufacturing method of display panel | |
| US20220350187A1 (en) | Array substrate and liquid crystal display panel | |
| WO2014075354A1 (en) | Liquid crystal display apparatus and manufacturing method thereof | |
| CN220855415U (en) | Display panel and display device | |
| TWI404181B (en) | Pixel array substrate and liquid crystal display | |
| JPH11287989A (en) | Reflection type liquid crystal display device and its manufacture | |
| WO2021027017A1 (en) | Display panel and fabrication method therefor | |
| CN113156714B (en) | Array substrate and liquid crystal display panel | |
| TWI798888B (en) | Touch module and method of manufacturing the same | |
| US20220350192A1 (en) | Display device and manufacturing method thereof | |
| TWI491964B (en) | Display device | |
| WO2023142014A1 (en) | Touch display panel, touch display device, and touch display motherboard |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |