CN112908938A

CN112908938A - Optical sensing package module

Info

Publication number: CN112908938A
Application number: CN202010661667.1A
Authority: CN
Inventors: 沈启智
Original assignee: Pixart Imaging Inc
Current assignee: Pixart Imaging Inc
Priority date: 2019-12-03
Filing date: 2020-07-10
Publication date: 2021-06-04
Anticipated expiration: 2040-07-10
Also published as: CN112908938B

Abstract

The invention discloses an optical sensing packaging module. The optical sensing packaging module comprises a carrier plate, a sensing chip and a shielding component. The sensing chip is arranged on the carrier plate and comprises a pixel array for sensing the light beam, and the pixel array is positioned at the top of the sensing chip. The shielding component is arranged on the carrier plate and surrounds the sensing chip. The shielding component comprises a frame body and a shielding piece. The frame body is arranged on the carrier plate and is provided with a light receiving opening, and the shielding piece is arranged above the sensing chip and is provided with a first light transmitting area and a light shading area surrounding the first light transmitting area. The first light-transmitting area is positioned above a first pixel group for receiving the first light beam in the pixel array and is exposed by the light receiving opening. The wavelength of the first light beam falls within a first predetermined wavelength range, and the first light-transmitting region allows the first light beam to penetrate therethrough. The shielding piece is provided with a clamping structure and is combined with the frame body. Therefore, most of the ambient light can be shielded by the shielding component and can not be received by the sensing chip, and the signal-to-noise ratio can be improved.

Description

Optical sensing package module

Technical Field

The present invention relates to an optical sensing package module and a method for manufacturing the same, and more particularly, to an optical sensing package module having a sensing chip and a method for manufacturing the same.

Background

The existing optical sensing chip is designed to receive or sense light having a specific wavelength band according to different application domains. For example, when the optical sensor chip is applied to a fingerprint recognition device or an iris recognition device, the optical sensor chip receives infrared light reflected by an object (such as a finger or an iris), and performs fingerprint recognition or iris recognition according to the received infrared light to determine the identity of the user.

However, when such a device having an optical sensing chip is used outdoors, ambient light including other wavelength bands may be received by the optical sensing chip, which may generate noise. Particularly, in sunlight, the incident light quantity of the ambient light entering the optical sensing chip is much larger than the incident light quantity of the signal light entering the optical sensing chip, which results in a reduction in signal-to-noise ratio (signal-to-noise ratio), thereby affecting the accuracy of the detection.

Disclosure of Invention

The present invention provides an optical sensing module, which is configured to dispose a shielding component having an opening on a sensing chip during packaging, so as to expose only one pixel group of the sensing chip. Therefore, the light incident quantity of the ambient light entering the sensing chip can be reduced, and the signal to noise ratio is improved.

In order to achieve the above objective, one of the technical solutions of the present invention is to provide an optical sensing package module, which includes a carrier, a sensing chip and a shielding assembly. The sensing chip is arranged on the carrier plate and comprises a pixel array for sensing the light beam, and the pixel array is positioned at the top of the sensing chip. The shielding component is arranged on the carrier plate and surrounds the sensing chip, wherein the shielding component comprises a frame body and a shielding piece. The frame body is arranged on the carrier plate and provided with a light receiving opening, and the shielding piece is arranged above the sensing chip and provided with a first light transmitting area and a shading area surrounding the first light transmitting area. The first light-transmitting area is located above a first pixel group in the pixel array and used for receiving a first light beam, the first light-transmitting area is exposed by the light receiving opening, the wavelength of the first light beam falls within a first preset wavelength range, and the first light-transmitting area allows the first light beam to penetrate through. The shielding piece is provided with a clamping structure and is combined with the frame body through the clamping structure.

Furthermore, the shielding member includes a cover plate for closing the light receiving opening, and the cover plate has a first light-transmitting area and a light-shielding area.

Furthermore, the shielding member includes a cover plate and a patterned light shielding layer, the patterned light shielding layer is disposed on one side of the cover plate and has a first opening, and the first opening overlaps the light receiving opening in a thickness direction of the cover plate to define a first light-transmitting region.

Preferably, the shielding member further includes a band-pass filter layer provided on the cover plate and overlapping the first opening in a thickness direction of the cover plate to filter a light beam having a wavelength falling outside the first predetermined wavelength range.

Preferably, the material of the cover plate allows the first light beam to penetrate.

Preferably, the cover plate is of a material that allows the first light beam to pass through, but filters light beams having wavelengths outside the first predetermined wavelength range.

Furthermore, the shielding member has a second light-transmitting region located above a second pixel group of the pixel array for receiving a second light beam having a wavelength within a second predetermined wavelength range.

Further, the first predetermined wavelength range may partially overlap or not overlap at all with the second predetermined wavelength range.

Furthermore, the area of the first light-transmitting area is different from the area of the second light-transmitting area.

Still further, the optical sensing package module further includes: the first light-emitting element and the second light-emitting element are arranged on the carrier plate and are separated from the sensing chip.

Accordingly, in the optical sensing package module provided by the embodiment of the invention, the ratio between the incident light quantity of the signal light with the wavelength falling in the specific wavelength range and the incident light quantity of the ambient light can be controlled by arranging the shielding member. The shielding member is provided with a light-transmitting area so that a part of the pixel group can be used for receiving the signal light. Accordingly, most of the ambient light can be filtered by the shielding component, and the signal-to-noise ratio of the optical sensing package module can be significantly increased.

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.

Drawings

Fig. 1 is a schematic top view of an optical sensing package module according to an embodiment of the invention.

FIG. 2 is a cross-sectional view of the optical sensing package module of FIG. 1 at line II-II.

Fig. 3 is a partially enlarged cross-sectional view of an optical sensing package module without a display frame according to another embodiment of the invention.

Fig. 4 is a partially enlarged cross-sectional view of an optical sensing package module without a display frame according to another embodiment of the invention.

FIG. 5 is a schematic top view of an optical sensing package module according to another embodiment of the invention.

FIG. 6 is a schematic top view of an optical sensing package module according to another embodiment of the invention.

Fig. 7 is a cross-sectional view of the optical sensing package module of fig. 6 on line VII-VII.

Fig. 8 is a schematic cross-sectional view of a masking element according to another embodiment of the present invention.

FIG. 9 is a cross-sectional view of an optical sensing package module according to another embodiment of the invention.

Fig. 10 is a schematic top view of a shielding member according to an embodiment of the invention.

Fig. 11 is a schematic top view of a covering according to another embodiment of the invention.

Fig. 12 is a schematic top view of a covering according to another embodiment of the invention.

Fig. 13 is a schematic top view of a covering according to another embodiment of the invention.

Fig. 14 is a schematic cross-sectional view of a shielding assembly according to another embodiment of the present invention.

Fig. 15 is a schematic cross-sectional view of a masking element according to another embodiment of the present invention.

FIG. 16 is a schematic top view of an optical sensing package module according to another embodiment of the invention.

Fig. 17 is a cross-sectional view of the optical sensing package module of fig. 16 at lines XVII-XVII.

FIG. 18 is a schematic top view of an optical sensing package module according to another embodiment of the invention.

FIG. 19 is a cross-sectional view of the optical sensing package module of FIG. 18 on line XIX-XIX.

FIG. 20 is a cross-sectional view of an optical sensing package module according to another embodiment of the invention.

FIG. 21 is a cross-sectional view of an optical sensing package module according to another embodiment of the invention.

Detailed Description

Please refer to fig. 1 and fig. 2. Fig. 1 is a schematic top view of an optical sensing package module according to an embodiment of the invention. FIG. 2 is a cross-sectional view of the optical sensing package module of FIG. 1 at line II-II.

The optical sensing package module 1 of the embodiment of the invention can be applied to different kinds of components or devices, such as a fingerprint recognition device, a sweat pore recognition device, a blood oxygen concentration detector, a heartbeat sensor, an ambient light sensor or a proximity sensor. In the embodiment of the invention, the optical sensing package module 1 includes a carrier 10, a sensing chip 11 and a shielding component 12.

The carrier 10 may be a metal plate, an insulating plate, or a composite plate, wherein the composite plate is, for example, a hard Printed Circuit Board (PCB) or a flexible printed circuit board (FPC). In the present embodiment, the carrier 10 is a printed circuit board, and the carrier 10 includes a plurality of circuits (not shown in fig. 1) and a plurality of

pads

100 and 101 embedded therein, wherein the positions of the plurality of pads 100 can be set according to the configuration requirement of the sensing chip 11.

In addition, in the embodiment shown in fig. 1, the top view of the carrier plate 10 is square, but the shape of the carrier plate 10 is not limited in the present invention. In other embodiments, the top view shape of the carrier plate 10 may also be other geometric shapes, such as: circular, oval, square, rectangular, triangular, etc.

The sensing chip 11 is disposed on the carrier 10 and electrically connected to the carrier 10 through at least one bonding wire. In detail, the sensing chip 11 has a top side 11a and a bottom side 11b opposite to the top side 11 a. The sensing chip 11 includes a pixel array 110 for receiving the light beam and a wiring region 113 surrounding the pixel array 110. In addition, the pixel array 110 and the wiring region 113 are located on the top side 11a of the sensing chip 11. A control circuit (not shown in fig. 1) electrically connected to the pixel array 110 is disposed in the wiring region 113 for receiving signals sensed by the pixel array 110.

In the present embodiment, the optical sensing package module 1 may further include a plurality of bonding wires 13, and the bonding wires 13 are respectively connected between the wiring region 113 and the plurality of bonding pads 100 of the carrier 10 to establish electrical connection between the sensing chip 11 and the carrier 10. In another embodiment, the sensing chip 11 may be electrically connected to the carrier 10 by flip chip bonding. That is, the manner for electrically connecting the sensing chip 11 to the carrier 10 is not limited in the present invention as long as the sensing chip 11 can be electrically connected to the carrier 10.

In the present embodiment, the pixel array 110 can be designed to detect light beams with different wavelengths, such as visible light, or monochromatic light, such as infrared light, ultraviolet light, green light, or blue light. In one embodiment, the pixel array 110 may include a plurality of pixel groups, and the pixel groups are respectively configured to receive light beams having different wavelengths. When the sensing chip 11 is applied to a specific device, the sensing chip 11 is mainly used for receiving a light beam having a specific wavelength band. For example, the sensing chip 11 applied in the heart beat sensor mainly detects green light or infrared light reflected by an object. In the present embodiment, the shielding element 12 having at least one opening is disposed on the carrier 10, so as to limit the incident light amount of the ambient light entering the pixel array 110, and suppress the interference of the ambient light. Various embodiments of the shutter assembly 12 and their structure will be further described later.

In the embodiment of fig. 1 and 2, the shielding assembly 12 includes a shielding member 120 and a frame 121. The shield 120 is disposed on the sensing chip 11. In addition, the shielding member 120 has a first opening h1 to expose at least a first pixel group 110a for receiving the corresponding light beam (first light beam). Specifically, the wavelength of the first light beam received by the first pixel group 110a falls within the first predetermined wavelength range. For example, if the optical sensing package module 1 is to be applied to a heart sensor, the first pixel group 110a for receiving green light or infrared light is exposed from the first opening h 1. In one embodiment, the first openings h1 have a pore size between 20 micrometers (μm) and 500 micrometers (μm). The diameter of the first opening h1 can be determined according to actual requirements.

In addition, in the sensing chip 11, the pixels for receiving the light with the wavelength falling outside the first predetermined wavelength range are covered by the shielding member 120. Accordingly, most of the ambient light is blocked by the shielding member 120, thereby reducing signal interference.

In one embodiment, the shield 120 may be manufactured by performing a punch forming process or an etching process on a metal sheet, wherein the metal sheet may be a copper sheet, an aluminum sheet, or a stainless steel sheet. In another embodiment, the shielding member 120 may be made of other materials as long as the effect of shielding the ambient light can be achieved, and the invention is not limited thereto. In addition, the thickness of the shielding member 120 is between 20 micrometers (μm) and 250 micrometers (μm) for both convenience of manufacturing and light shielding effect. In another embodiment, the shield 120 may be made of Polycarbonate (PC) plastic.

The shielding member 120 can be disposed on the sensing chip 11 through an adhesive structure 14. The adhesive structure 14 may be a continuous adhesive layer or have a plurality of sub-structures separated from each other. Specifically, in the embodiment of fig. 1 and 2, the adhesion structure 14 is a continuous adhesion layer, and the adhesion layer covers the first pixel group 110a, and the adhesion layer can be penetrated by the first light beam with the wavelength falling within the first predetermined wavelength range.

In detail, a liquid adhesive material may be formed on the pixel array 110 or on an inner surface of the shielding member 120 opposite to the sensing chip 11, and then the liquid adhesive material is cured, so that the shielding member 120 is fixed on the sensing chip 11. The adhesive material may exert stress on the sensing chip 11 due to its own hardness during the curing process, and thus cracks may be generated on the sensing chip 11. Accordingly, in the present embodiment, the material of the adhesive structure 14 has a Shore Hardness (Shore Hardness) not lower than 60 and a Young's modulus not higher than 2000MPa, so as to avoid cracks on the sensing chip 11. In another embodiment, the liquid adhesive material may be replaced with an adhesive tape.

In the present embodiment, the thickness of the adhesion structure 14 is less than 50 micrometers (μm), so that the first light beam configured to be received by the first pixel group 110a can pass through the adhesion structure 14. In other words, the material of the adhesive structure 14 has a transmittance of at least 90% for a first light beam having a wavelength falling within a first predetermined wavelength range.

Fig. 3 is a partially enlarged cross-sectional view of an optical sensing package module without a display frame according to another embodiment of the invention. In the embodiment shown in fig. 3, the adhesive structure 14 may also be an adhesive layer sandwiched between the sensing chip 11 and the shielding member 120. In the present embodiment, the adhesive layer has a through hole 14h disposed corresponding to the first opening h1 to expose the first pixel group 110 a. That is, the aperture of the through hole 14h is at least equal to or larger than the aperture of the first opening h1, so that the first pixel group 110a is not covered by the adhesion structure 14. In this embodiment, the adhesive structure 14 does not need to be made of a material that is transparent to the first light beam, wherein the wavelength of the first light beam falls within the first predetermined wavelength range.

Fig. 4 is a partially enlarged cross-sectional view of an optical sensing package module without a display frame according to another embodiment of the invention. In the present embodiment, the adhesion structure 14 disposed between the shielding member 120 and the sensing chip 11 has a plurality of sub-structures 140 separated from each other. In addition, the substructures 140 do not cover the first pixel group 110 a. As shown in fig. 4, the plurality of substructures 140 may be in the form of discrete particles and are respectively located at four corners of the shield 120. In another embodiment, the plurality of substructures 140 may be disposed between the shield 120 and the sensing chip 11 in other forms. The shape of each substructure 140 need not be the same, and the shape of each substructure 140 is not limited to the embodiments provided herein.

Please refer to fig. 1 and fig. 2 again. In the embodiment of the invention, the optical sensing package module 1 further includes a filter layer 15 covering the first pixel group 110 a. As shown in fig. 2, the filter layer 15 is disposed between the adhesive structure 14 and the sensing chip 11. In another embodiment, the filter layer 15 may also be disposed on the shielding member 120 and cover the first opening h 1. By providing the filter layer 15, light beams having wavelengths outside the first predetermined wavelength range may be filtered to further increase the signal-to-noise ratio (snr). In one embodiment, filter layer 15 may include a glass (not shown in fig. 2) and a filter layer (not shown in fig. 2) disposed on the glass. However, in other embodiments, the filter layer 15 may be omitted according to actual requirements.

In addition, the shielding assembly 12 may also include a frame 121 and a shielding structure 122, and the frame 121 and the shielding structure 122 are disposed on the carrier 10. The frame 121 includes a top plate 121a and a sidewall 121b extending downward from the top plate 121 a. Specifically, the frame 121 surrounds the sensing chip 11 and the bonding wires 13 to protect the sensing chip 11 and the bonding wires 13 from being damaged. In addition, the top plate 121a has a light receiving opening 121h aligned with the sensing chip 11 so that the light beam can enter the first pixel group 110a of the sensing chip 11. Accordingly, the aperture of the light receiving opening 121h is larger than that of the first opening h 1.

The shielding structure 122 and a portion of the sidewall 121b form an accommodating space S1, and the accommodating space S1 can accommodate a passive chip (e.g., a light emitting device). In the embodiment shown in fig. 2, the optical sensing package module 1 further includes a first light emitting element 16 for generating a first light beam having a wavelength within a first predetermined wavelength range. The first light emitting module 16 is disposed on the carrier 10 and located in the accommodating space S1. The first light emitting device 16 can be a Light Emitting Diode (LED) or a laser diode, which is used to generate monochromatic light or polychromatic light (e.g., visible light, ultraviolet light, or infrared light).

In addition, the first light emitting device 16 is electrically connected to the carrier 10. In detail, in the present embodiment, the carrier 10 includes a switch control circuit. The first light emitting device 16 can be electrically connected to the switch control circuit through the voltage input terminal at the top thereof, another bonding wire and the bonding pad 101, so that the switch control circuit can control the first light emitting device 16 to be turned on or off.

The sidewall 121b and the shielding structure 122 can isolate the sensing chip 11 and the first light emitting element 16 from each other. In detail, the accommodating space S1 defined by a portion of the sidewall 121b can limit the light emitting angle of the first light emitting element, so as to prevent the light beam (not projected to the object) generated by the first light emitting element 16 from being directly received by the sensing chip 11. Accordingly, in the present embodiment, only the light beam generated by the first light-emitting device 16 is projected onto an object (e.g., a finger or a wrist of a user) and reflected by the object, and then received by the first pixel group 110 a. Thus, the incident light quantity of the stray light (including the ambient light and the light beam not reflected by the object) irradiated to the sensing chip 11 can be reduced, so that the signal-to-noise ratio can be significantly increased.

Fig. 5 is a schematic top view illustrating an optical sensing package module according to another embodiment of the invention. In the present embodiment, the optical sensing package module 1 further includes a second light emitting element 17 for generating a second light beam having a wavelength falling within a second predetermined wavelength range. In one embodiment, the second predetermined wavelength range may partially overlap or not overlap at all with the first predetermined wavelength range. That is, the median value of the first predetermined wavelength range may be different from the median value of the second predetermined wavelength range. For example, the first light emitting element 16 may be used to generate green light and the second light emitting element 17 may be used to generate infrared light.

As shown in fig. 5, the second light emitting device 17 is disposed on the carrier 10, and the second light emitting device 17 is electrically connected to the carrier 10. In the present embodiment, the first light emitting element 16 and the second light emitting element 17 are both located in the accommodating space S1.

In addition, the shielding member 120 has a second opening h2 for exposing a second pixel group 110b, wherein the second pixel group 110b is adapted to receive a second light beam having a wavelength falling within a second predetermined wavelength range. The size of the second opening h2 may be the same as or different from that of the first opening h1, depending on the circumstances. In one embodiment, the aperture of the second opening h2 is smaller than that of the first opening h1, so that the incident light quantity of the second light beam generated by the second light-emitting device 17 entering the sensor chip 11 is less than the incident light quantity of the first light beam generated by the first light-emitting device 16 entering the sensor chip 11.

In other words, the incident light amount of the first light beam generated by the first light emitting element 16 and the incident light amount of the second light beam generated by the second light emitting element 17 can be controlled by changing the aperture of the first opening h1 and the aperture of the second opening h2 according to actual requirements. Accordingly, by adjusting the number, position and aperture of the openings of the shielding member 120, the incident light amount and wavelength of the light beam received by the sensing chip 11 can be adjusted.

Please refer to fig. 6 and fig. 7. FIG. 6 is a schematic top view of an optical sensing package module according to another embodiment of the invention. Fig. 7 is a cross-sectional view of the optical sensing package module of fig. 6 on line VII-VII. In the optical sensing package module 1' of the present embodiment, the shielding member 120 and the frame 121 of the shielding component 12 can be integrated into a same component (integrally molded). In detail, the shielding member 120 may have a main body portion 120a and a protrusion portion 120b connected to the main body portion 120 a. The body 120a is embedded in the top plate 121a of the housing 121.

In addition, the protrusion 120b protrudes from one edge of the frame 121, and the edge is used to define the light receiving opening 121h, so that the light entering amount of the light beam entering the sensing chip 11 is limited by the protrusion 120 b. Further, the protrusion 121b is annular and extends radially from the edge of the frame 121 toward the geometric center of the light receiving opening 121h, thereby defining a first opening h1, as shown in fig. 6 and 7.

It is noted that when the thickness of the shield 120 is less than 200 micrometers (μm), the mechanical strength of the shield 120 may not be strong enough. Accordingly, in the present embodiment, the shielding member 120 and the frame 121 are combined with each other to enhance the mechanical strength of the shielding assembly 12.

In one embodiment, the masking assembly 12 may be prepared by the following steps. The shield 120 having the first opening h1 may be formed by performing an etching process or a press-molding process on a metal sheet. Subsequently, a frame 121 is formed by an insert molding process, and the shielding member 120 is used as an insert in the insert molding process. It should be noted that, in the optical sensing package module 1, the requirement for the machining accuracy of the first opening h1 is high. Therefore, by forming the masking member 12 through the above steps, it is possible to form the masking member 120 having the first opening h1 with high precision in processing. The smaller the deviation between the hole size of the first hole h1 and the position of the first hole h1 and the predetermined hole size and position, the higher the machining accuracy.

Referring to fig. 8, fig. 8 is a cross-sectional view of a shielding assembly 12 according to another embodiment of the present invention. The shutter assembly 12 shown in fig. 7 may also be replaced with the shutter assembly 12 shown in fig. 8. In one embodiment, the thickness of the protrusion 120b at one end connected to the main body 120a is greater than the thickness of the other end (defining the first opening h1) of the protrusion 120 b. That is, in the embodiment shown in fig. 8, the thickness of the projection 120b is decreased inward in the radial direction.

Please refer to fig. 9 and 10. Fig. 9 is a cross-sectional view of an optical sensing package module according to another embodiment of the invention, and fig. 10 is a top view of a shielding member according to an embodiment of the invention. In the present invention, the same or similar elements have the same reference numerals.

The shielding assembly 12 of the present embodiment includes a shielding member 120, a frame 121 and a shielding structure 122. In the present embodiment, the shielding member 120 having the first opening h1 is disposed above the sensing chip 11 and is engaged with the frame 121.

As described above, the shielding member 120 includes the main body portion 120a and the protrusion portion 120b, and the main body portion 120a is embedded in the frame 121. In the present embodiment, the main body portion 120a further includes an engaging structure E1 formed thereon. The engaging structure E1 may include at least one of an opening, a groove, a recess and a step, but the present invention is not limited to the foregoing examples.

As shown in fig. 9 and 10, the engaging structure E1 may include at least one opening (two are shown in fig. 10 for example), and the opening may be a through opening or a blind opening. In the embodiment shown in fig. 9, the openings are through openings. That is, the opening would extend from the upper surface to the lower surface of the shield 120. However, in another embodiment, the opening may be an opening that is recessed from an upper surface or a lower surface of the shield 120 but does not penetrate the shield 120.

It should be noted that since the frame body 121 can be formed by an insert injection molding process, a portion of the frame body 121 is filled into the opening after the insert injection molding process is performed. In this way, the main body 120a of the shield 120 can be tightly coupled to the frame 121 by the engaging structure E1.

In addition, the position of the opening is not limited to the illustrated example of the present invention. In other words, the engaging structure E1 may be formed on at least one of the upper surface and the lower surface of the main body 120 a.

In the present invention, not all of the openings are necessarily through openings. In one embodiment, one of the openings is a through opening and the other opening is a blind or blind hole that does not pass through. Accordingly, the allowable tolerance (tolerance) for manufacturing the engaging structure E1 is relatively high when forming the shielding member 120.

It should be noted that, when the opening is a through opening, the light receiving opening 121h of the frame 121 and the engaging structure E1 do not overlap in the vertical direction. That is, the through opening is not located at the boundary between the main body portion 120a and the protrusion portion 120b, so as to prevent the sensing chip 11 from receiving the light beam leaking from the through opening. However, when the opening is a blind hole or an opening that does not pass through, the position of the opening is not limited.

Fig. 11 is a schematic top view of a shielding member according to another embodiment of the invention. In the present embodiment, the engaging structure E1 includes a plurality of holes E11 separated from each other, and a plurality of holes E11 are disposed on the main body 120a in a distributed manner. In the present embodiment, the plurality of holes E11 may have different apertures. In another embodiment, the plurality of holes E11 have the same aperture. Therefore, the size of the aperture E11 is not limited to the embodiments provided by the present invention.

In the embodiment of fig. 11, a plurality of holes E11 surround the first opening h1 (or the light receiving opening 121 h). Similar to the embodiment of fig. 10, when the holes E11 are through holes, the light receiving opening 121h of the frame 121 does not overlap with any of the holes E11. That is, the holes E11 are not located at the boundary of the main body 120a and the protrusion 120b, so as to prevent the sensor chip 11 from receiving the light beam leaking from the hole E11.

In one embodiment, in the manufacturing process of the shielding member 120, a plurality of holes E11 may be formed on a side of the main body portion 120a away from the first opening h 1. That is, a plurality of apertures E11 are shown in the surrounding area of the shield 120. In this way, when the frame 121 is formed, it is easier to prevent the hole E11 from being exposed from the light receiving opening 121h of the frame 121.

The shape of the engaging structure E1 is not limited to the above embodiment. Fig. 12 is a schematic top view of a shielding member according to another embodiment of the invention. In this embodiment, the engaging structure E1 includes two openings, one of which is substantially C-shaped in a top view, and the other of which is substantially reverse C-shaped in a top view.

Referring to fig. 13, a schematic top view of a shielding member according to another embodiment of the invention is shown. In this embodiment, the engaging structure E1 includes only one opening, and the shape of the opening is substantially U-shaped or C-shaped in a plan view. In the present embodiment, the opening surrounds the first opening h 1. In one embodiment, the opening is a through opening and does not overlap with the light receiving opening 121h, so as to prevent the sensing chip 11 from receiving the light beam leaking from the opening.

Fig. 14 is a schematic cross-sectional view of a shielding assembly according to another embodiment of the invention. In the present embodiment, a portion of the protrusion 120b is connected to the main body 120a and has a larger thickness, and the end of the protrusion 120b defining the first opening h1 has a smaller thickness.

In addition, the engaging structure E1 includes a step portion formed on the lower surface of the main body portion 120a and located on the side away from the protruding portion 120 b. In other words, the step portion is located at the edge portion of the shielding member 120, so that the main body portion 120a can be tightly combined with the top plate 121a of the frame 121.

In another embodiment, the step portion may be formed on the upper surface of the body portion 120 a. Accordingly, the position of the step portion is not limited to the embodiment shown in fig. 14. In this embodiment, the step portion may be located at the boundary of the main body portion 120a and the protrusion portion 120 b. In addition, a stepped portion may be formed at each edge portion of the body portion 120a to surround the first opening h 1. In another embodiment, the step portion may be formed only on one edge portion of the body portion 120 a.

Referring to fig. 15, a cross-sectional view of a shielding assembly according to another embodiment of the invention is shown. In the present embodiment, the engaging structure E1 includes a recessed portion formed on the lower surface of the main body portion 120 a. However, the number and position of the recesses are not limited to the foregoing examples. In another embodiment, a recess may be formed on an upper surface of the body portion 120 a.

In addition, the engaging structure E1 may include a plurality of recessed portions formed on the main body portion 120a, wherein a portion of the recessed portions may be formed on the upper surface of the main body portion 120a, and another portion of the recessed portions may be formed on the lower surface of the main body portion 120 a. Each depression formed in the upper surface may be aligned with or offset from the depression formed in the lower surface, and the present invention is not limited thereto.

It should be noted that when the insert injection molding process is performed, a portion of the frame 121 is formed in the recess, so that the main body 120a of the shielding member 120 can be more tightly combined with the frame 121. Accordingly, the engaging structure E1 is not limited to the above example. In other words, the engaging structure E1 may include an opening, a groove, a recess, a step and any combination thereof.

Please refer to fig. 16 and 17. FIG. 16 is a schematic top view of an optical sensing package module according to another embodiment of the invention. Fig. 17 is a cross-sectional view of the optical sensing package module of fig. 16 at lines XVII-XVII. Elements of this embodiment that are the same or similar to elements of the embodiment of fig. 7 have the same or similar reference numerals.

The shielding member 12 is disposed on the carrier 10 and surrounds the sensing chip 11 to limit the amount of incident light entering the sensing chip 11. The shielding element 12 includes a first light-transmitting area a1 located above a first pixel group 110a, wherein the first pixel group 110a is used for receiving a first light beam having a wavelength falling within a first predetermined wavelength range.

Specifically, the shield assembly 12 includes a shield 120 and a frame 121. The shield 120 includes a first light-transmitting region a1 and a light-shielding region B1. As described above, the first light-transmitting area a1 is located corresponding to the first pixel group 110a, so that the first light beam passes through the first light-transmitting area a1 and can be received by the first pixel group 110 a. The light shielding region B1 surrounds the first light transmitting region a1 to limit the amount of incident light entering the sensor chip 11.

The frame 121 is disposed on the carrier 10 and includes a top plate 121a and a sidewall 121b extending downward from the top plate 121 a. Specifically, the frame 121 surrounds the sensing chip 11 and the bonding wires 13 to protect the sensing chip 11 and the bonding wires 13 from being damaged. In addition, the top plate 121a has a light receiving opening 121h aligned with the sensing chip 11, so that the light beam is irradiated to the sensing chip 11 after passing through the light receiving opening 121 h.

In the present embodiment, the shielding member 120 and the frame 121 of the shielding assembly 12 are integrally formed. Specifically, a portion of the shielding member 120 is embedded in the top plate 121a of the frame 121, and another portion is exposed from the light receiving opening 121 h.

It is noted that, similar to the embodiment of fig. 9 to 15, the shielding member 120 may further have a snap-fit structure (not shown in fig. 17) formed thereon at a portion embedded in the frame 121. In this way, the shielding member 120 can be more tightly coupled to the frame 121 by the engaging structure. In addition, the engaging structure may be located in the light shielding region B1. Specifically, the engaging structure may be located in the light shielding region B1 and embedded in the frame 121. The engaging structure may be formed on one surface or an edge of the light shielding region B1, and at least includes one of an opening, a groove, a recess or a step, but the invention is not limited thereto. In another embodiment, the shielding member 120 may have an uneven or irregular profile to form the aforementioned engaging structure. Since the mask 120 may have an uneven or irregular profile, further machining of the mask 120 is not required, and the mask 120 may be relatively easier to manufacture.

In the present embodiment, the shielding member 120 includes a cover plate 1201 and a patterned light shielding layer 1202. The cover plate 1201 completely closes the light receiving opening 121 h. That is, the sensing chip 11 is surrounded by the shielding component 12 and isolated from the external environment, so as to prevent the sensing chip 11 from being contaminated by dust.

The cover plate 1201 is made of a material that allows the first light beam to penetrate therethrough, and the wavelength of the first light beam falls within a first predetermined wavelength range. It is noted that, in one embodiment, the cover plate 1201 not only allows the first light beam to penetrate, but also allows the light beam with a wavelength outside the first predetermined wavelength range to penetrate.

However, in another embodiment, the material of the cover plate 1201 may allow the first light beam to penetrate therethrough, but filter light beams having wavelengths outside the first predetermined wavelength range, but the invention is not limited thereto.

The patterned light-shielding layer 1202 is disposed on one side of the cover plate to define a light-shielding region B1. In the embodiment of fig. 17, a patterned light-shielding layer 1202 is disposed on the upper surface of the cap plate 1201. In another embodiment, the patterned light-shielding layer 1202 may be disposed on the lower surface of the cap plate 1201. The material of the patterned light-shielding layer 1202 has a low transmittance to ambient light, e.g., less than 20%. In addition, the material of the patterned light-shielding layer 1202 may be metal or ink.

Since other pixels in the sensor chip 11 for receiving other light beams (whose wavelengths fall outside the first predetermined wavelength range) are covered by the patterned light-shielding layer 1202, most of the ambient light can be blocked by the patterned light-shielding layer 1202 to reduce signal interference.

In the present embodiment, the patterned light-shielding layer 1202 has a first opening h1 to expose a portion of the cover plate 1201 and define a first light-transmitting region a 1. Accordingly, the first opening h1 is aligned with the light receiving opening 121h and corresponds to the first pixel group 110 a. The aperture of the first opening h1 can be adjusted according to actual requirements. In one embodiment, the aperture of the first opening h1 is smaller than the aperture of the light receiving opening 121 h.

In the present embodiment, the shielding assembly 12 includes a shielding structure 122 disposed on the carrier 10. As described above, the shielding structure 122 and a portion of the sidewall 121b of the frame 121 together form an accommodating space S1, and the accommodating space S1 can be used to accommodate a passive chip (e.g., a light emitting device).

In the embodiment shown in fig. 17, the optical sensing package module 1 ″ further includes a first light emitting element 16 for generating a first light beam having a wavelength within a first predetermined wavelength range. The first light emitting module 16 is disposed on the carrier 10 and located in the accommodating space S1. The first light emitting device 16 is electrically connected to a switching control unit (not shown in fig. 17) of the carrier 10 and is controlled by the switching control unit.

In addition, the sidewall 121b may separate the first light emitting element 16 from the sensing chip 11. Specifically, the portion of the sidewall 121b defining the accommodating space S1 can limit the light emitting angle of the first light emitting element 16, so as to prevent the light beam generated by the first light emitting element 16 from being directly received by the sensing chip 11.

Please refer to fig. 18 and fig. 19. FIG. 18 is a schematic top view of an optical sensing package module according to another embodiment of the invention. FIG. 19 is a cross-sectional view of the optical sensing package module of FIG. 18 on line XIX-XIX. The same or similar elements in this embodiment as those in the embodiment of fig. 16 and 17 have the same or similar reference numerals, and the description of the same parts is omitted.

As shown in fig. 18 and 19, the shielding member 120 further includes a second light-transmitting area a2 for allowing the second pixel group 110b to receive the second light beam with the wavelength falling within the second predetermined wavelength range. It is to be noted that the first predetermined wavelength range and the second predetermined wavelength range do not necessarily have to completely overlap. That is, the second predetermined wavelength range may partially overlap or not overlap at all with the first predetermined wavelength range.

In addition, the area of the second light-transmitting region a2 may be the same as or different from the area of the first light-transmitting region a 1. In the present embodiment, the area of the second light-transmitting region a2 is smaller than the area of the first light-transmitting region a 1.

Accordingly, in the present embodiment, the material constituting the cover plate 1201 may be a material that allows the first light beam (whose wavelength falls within a first predetermined wavelength range) and the second light beam (whose wavelength falls within a second predetermined wavelength range) to penetrate therethrough.

In addition, the patterned light-shielding layer 1202 on the cover plate 1201 has a first opening h1 and a second opening h 2. The first opening h1 exposes a portion of the cover plate 1201 to define a first light transmission region a1, and the second opening h2 exposes another portion of the cover plate 1201 to define a second light transmission region a 2.

The positions of the first opening h1 and the second opening h2 may correspond to the first pixel group 110a and the second pixel group 110b, respectively. Accordingly, a first light beam (having a wavelength within a first predetermined wavelength range) and a second light beam (having a wavelength within a second predetermined wavelength range) can be received by the first pixel group 110a and the second pixel group 110b, respectively.

In the present embodiment, the optical sensing package module 1 ″ further includes a second light emitting element 17 for generating a second light beam (the wavelength of which falls within a second predetermined wavelength range). In addition, the first and second

light emitting elements

16 and 17 are disposed on the carrier 10 together, and are located in the accommodating space S1 defined by a portion of the sidewall 121b and the shielding structure 122. For example, the first light emitting element 16 may be configured to generate green light, and the second light emitting element 17 may be configured to generate infrared light.

Referring to fig. 20, fig. 20 is a cross-sectional view of an optical sensing package module according to another embodiment of the invention. The same or similar elements in this embodiment as those in the embodiment of fig. 17 have the same or similar reference numerals, and the description of the same parts is omitted. In the optical sensing package module 1 ″ of the embodiment, the shielding member 120 further includes a band-pass filter layer 1203, and the band-pass filter layer 1203 is disposed on the cover plate 1201.

Specifically, in the present embodiment, the band-pass filter layer 1203 and the patterned light-shielding layer 1202 are respectively disposed on two opposite sides of the cover plate 1201. As shown in fig. 20, the bandpass filter layer 1203 is disposed on the lower surface of the cap plate 1201, and the patterned light-shielding layer 1202 is disposed on the upper surface of the cap plate 1201. However, the positions of the bandpass filter layer 1203 and the patterned light-shielding layer 1202 may be interchanged. In another embodiment, the bandpass filter layer 1203 and the patterned light-shielding layer 1202 may be located on the same side of the cover plate 1201.

Further, the band-pass filter layer 1203 overlaps the first opening h1 in the thickness direction of the cover plate 1201 to filter a light beam whose wavelength falls outside the first predetermined wavelength range.

Accordingly, by providing the band-pass filter layer 1203, the signal-to-noise ratio can be improved. In an embodiment, the band-pass filter layer 1203 may be a metal oxide layer, a blue filter layer, a red filter layer, or any combination thereof.

Referring to fig. 21, fig. 21 is a cross-sectional view of an optical sensing package module according to another embodiment of the invention. The same or similar elements in this embodiment as those in the embodiment of fig. 17 have the same or similar reference numerals, and the description of the same parts is omitted.

As shown in fig. 21, the mask 120 further includes a cover plate 1201 and a patterned light-shielding layer 1202. The portion of the cover plate 1201 embedded in the frame body 121 and the portion exposed to the light receiving opening 121h may be formed of different materials. The patterned light shielding layer 1202 with the first opening h1 is located at the portion of the cover plate 1201 exposed to the light receiving opening 121h to limit the amount of incident light entering the sensing chip 11.

In another embodiment, the shielding member 120 may include a cover plate 1201 covering the light receiving opening 121h, and the cover plate 1201 itself has a first light transmitting region a1 and a light shielding region B1.

Further, the cover plate 1201 may be made of different materials to define the first light-transmitting area a1 and the light-shielding area B1. In other words, the first light transmission region a1 and the light shielding region B1 of the cover plate 1201 may be respectively composed of different materials. In one embodiment, the material of the opaque region B1 is opaque, and the material of the first transparent region a1 is transparent to the first light beam.

That is, the first light beam (the wavelength of which falls within the first predetermined wavelength range) can penetrate the first light-transmitting area a1 but cannot penetrate the light-shielding area B1. In this embodiment, the patterned light-shielding layer 1202 may be omitted.

It should be noted that, in the present embodiment, a portion of the light shielding region B1 is embedded in the top plate 121a of the frame 121, and another portion of the light shielding region B1 protrudes from the edge of the frame 121 (the light receiving opening 121h) and surrounds the first light transmitting region a 1. Accordingly, the present invention is not limited to the foregoing example as long as the position of the first light-transmitting region a1 can be defined.

In summary, the optical sensing package module 1 provided in the embodiment of the invention is provided with the shielding element 12 having at least one opening, so that only the pixel group for receiving the signal light is exposed, and the ratio between the incident light amount of the signal light (the wavelength of which falls within the predetermined wavelength range) and the incident light amount of the stray light can be controlled. Thus, most of the stray light, such as ambient light, can be shielded by the shielding component 12 and will not enter the sensing chip 11, so that the signal-to-noise ratio of the optical sensing package module 1, 1' can be increased.

In another embodiment, the same or similar effect can be achieved by disposing the shielding element 12 having at least one transparent region corresponding to at least one pixel group 110 a. In addition, the cover plate 1201 of the shielding member 120 closes the light receiving opening 121h of the frame 121 to isolate the sensing chip 11 from the external environment. Thus, the sensing chip 11 can be prevented from being contaminated by the dust in the external environment.

In addition, the shielding member 120 is not formed on the sensing chip 11 during the wafer preparation process for manufacturing the sensing chip 11. Specifically, the shielding member 120 of the shielding assembly 12 is disposed on the sensing chip 11 after the wafer dicing step. It should be noted that if the sensing chip 11 is directly covered by a Chemical Vapor Deposition (CVD) process or a Physical Vapor Deposition (PVD) process during the wafer preparation process for manufacturing the sensing chip 11, the shielding layer having a function similar to that of the shielding member 120 of the present invention is not necessary, but the manufacturing cost is high. Accordingly, the shielding member 120 of the shielding assembly 12 is disposed on the sensing chip 11 after the wafer dicing step, so as to further reduce the manufacturing cost. In addition, the wavelength range of the light beam to be detected by the sensing chip 11 and the pixel group to be exposed according to the wavelength range can be determined according to the subsequent application and the actual requirement. Thus, the manufacturing method of the optical sensing module of the embodiment of the invention provides flexibility in selection and convenience.

The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.

Claims

1. An optical sensing package module, comprising:

a carrier plate;

the sensing chip is arranged on the carrier plate and comprises a pixel array for sensing the light beam, and the pixel array is positioned at the top of the sensing chip; and

a shielding assembly disposed on the carrier and surrounding the sensing chip, wherein the shielding assembly comprises:

a frame body arranged on the carrier plate and provided with a light receiving opening; and

a shielding member disposed above the sensing chip and having a first light-transmitting area and a light-shielding area surrounding the first light-transmitting area, wherein the first light-transmitting area is located above a first pixel group in the pixel array for receiving a first light beam, and is exposed by the light-receiving opening, the wavelength of the first light beam falls within a first predetermined wavelength range, and the first light-transmitting area allows the first light beam to pass through;

the shielding piece is provided with a clamping structure, and the shielding piece is combined with the frame body through the clamping structure.

2. The optical sensing package module as claimed in claim 1, wherein the shielding member comprises a cover plate enclosing the light receiving opening, and the cover plate has the first light-transmitting region and the light-shielding region.

3. The optical sensing package module as claimed in claim 1, wherein the shielding member comprises a cover plate and a patterned light shielding layer, the patterned light shielding layer is disposed on one side of the cover plate and has a first opening, and the first opening overlaps the light receiving opening in a thickness direction of the cover plate to define the first light-transmitting region.

4. The optical sensing package module of claim 3, wherein the mask further comprises a band-pass filter layer disposed on the cover plate and overlapping the first opening in the thickness direction of the cover plate to filter light beams having wavelengths outside the first predetermined wavelength range.

5. The optical sensing package module of claim 3, wherein the cover plate is of a material that allows the first light beam to penetrate therethrough.

6. The optical sensing package module of claim 3, wherein the cover plate is of a material that allows the first light beam to pass through, but filters light beams having wavelengths outside the first predetermined range of wavelengths.

7. The optical sensing package module of claim 1, wherein the mask has a second light transmissive region over a second group of pixels of the pixel array for receiving a second light beam having a wavelength within a second predetermined wavelength range.

8. The optical sensing package module of claim 7, wherein the first predetermined wavelength range partially overlaps or does not overlap at all with the second predetermined wavelength range.

9. The optical sensing package module of claim 7, wherein the area of the first light transmissive region is different from the area of the second light transmissive region.

10. The optical sensing package module of claim 7, further comprising: the first light-emitting element is used for generating the first light beam, and the second light-emitting element is used for generating the second light beam, wherein the first light-emitting element and the second light-emitting element are arranged on the carrier plate and are separated from the sensing chip.