TWM581727U - Image capturing device - Google Patents
Image capturing device Download PDFInfo
- Publication number
- TWM581727U TWM581727U TW108204291U TW108204291U TWM581727U TW M581727 U TWM581727 U TW M581727U TW 108204291 U TW108204291 U TW 108204291U TW 108204291 U TW108204291 U TW 108204291U TW M581727 U TWM581727 U TW M581727U
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive layer
- image capturing
- frame
- cover
- support member
- Prior art date
Links
- 239000012790 adhesive layer Substances 0.000 claims abstract description 84
- 239000010410 layer Substances 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 210000003462 vein Anatomy 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 210000000554 iris Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 210000001525 retina Anatomy 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Landscapes
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
Description
本新型創作是有關於一種電子裝置,且特別是有關於一種取像裝置。The present invention relates to an electronic device, and more particularly to an image capturing device.
生物辨識的種類包括臉部、聲音、虹膜、視網膜、靜脈、掌紋和指紋辨識等。依照感測方式的不同,生物特徵辨識裝置可分為光學式、電容式、超音波式及熱感應式。The types of biometrics include face, sound, iris, retina, veins, palmprint, and fingerprint recognition. According to the different sensing methods, the biometric identification device can be divided into optical, capacitive, ultrasonic and thermal sensing.
光學式生物特徵辨識裝置主要是透過取像模組截取生物特徵的影像,來進行生物特徵辨識。在習知的光學式生物特徵辨識裝置中,取像模組經由黏著層而貼附至蓋板(或顯示面板),且所述貼合是部分貼合而非全面貼合。在此架構下,在設置有黏著層的區域中,蓋板與取像模組之間的光傳遞介質是黏著層,而在未設置有黏著層的區域中,蓋板與取像模組之間的光傳遞介質不是黏著層(例如是空氣)。由於不同的光傳遞介質存在折射率差異,因此使用者在操作生物特徵辨識裝置時容易察覺到取像模組的外觀。The optical biometric identification device mainly performs biometric identification by capturing an image of a biometric image through an image capturing module. In a conventional optical biometric device, the image taking module is attached to the cover (or display panel) via an adhesive layer, and the fit is partially adhered rather than fully conformed. Under this structure, in the area where the adhesive layer is disposed, the light transmission medium between the cover and the image capturing module is an adhesive layer, and in the area where the adhesive layer is not provided, the cover and the image capturing module are The intermediate light transfer medium is not an adhesive layer (for example, air). Since different light transmission media have refractive index differences, the user can easily perceive the appearance of the image capturing module when operating the biometric device.
本新型創作提供一種取像裝置,其取像模組不易被使用者察覺。The novel creation provides an image capturing device, and the image capturing module is not easily perceived by a user.
本新型創作的一種取像裝置包括蓋板、取像模組、框體、第一黏著層以及第二黏著層。框體與取像模組位於蓋板的同一側。框體經由第一黏著層而與蓋板接合。取像模組經由第二黏著層而與框體接合。第二黏著層在蓋板上的正投影落在框體在蓋板上的正投影內。An image capturing device created by the present invention comprises a cover plate, an image taking module, a frame body, a first adhesive layer and a second adhesive layer. The frame and the image capturing module are located on the same side of the cover. The frame is joined to the cover plate via the first adhesive layer. The image taking module is joined to the frame via the second adhesive layer. The orthographic projection of the second adhesive layer on the cover plate falls within the orthographic projection of the frame on the cover.
在本新型創作的一實施例中,蓋板包括透光蓋板、有機發光顯示面板、觸控面板或至少上述兩個的組合In an embodiment of the present invention, the cover comprises a transparent cover, an organic light emitting display panel, a touch panel or a combination of at least two of the above
在本新型創作的一實施例中,蓋板與取像模組之間存在空氣間隙。In an embodiment of the present invention, there is an air gap between the cover and the image taking module.
在本新型創作的一實施例中,取像模組包括載板、感測器、帶通濾光元件、準直器以及至少一支撐件。感測器設置在載板上。帶通濾光元件設置在感測器上。準直器設置在帶通濾光元件上,且準直器與蓋板之間存在空氣間隙。所述至少一支撐件設置在載板上且位於感測器的周邊。In an embodiment of the present invention, the image taking module includes a carrier, a sensor, a band pass filter element, a collimator, and at least one support. The sensor is placed on the carrier board. The band pass filter element is disposed on the sensor. The collimator is disposed on the band pass filter element with an air gap between the collimator and the cover. The at least one support member is disposed on the carrier and located at a periphery of the sensor.
在本新型創作的一實施例中,帶通濾光元件是紅外濾光片。In an embodiment of the novel creation, the band pass filter element is an infrared filter.
在本新型創作的一實施例中,第二黏著層位於載板與框體之間。In an embodiment of the present invention, the second adhesive layer is located between the carrier and the frame.
在本新型創作的一實施例中,第二黏著層將載板與框體接合。所述至少一支撐件位於第二黏著層與感測器之間,且所述至少一支撐件與蓋板之間存在空氣間隙。In an embodiment of the novel creation, the second adhesive layer engages the carrier with the frame. The at least one support member is located between the second adhesive layer and the sensor, and an air gap exists between the at least one support member and the cover plate.
在本新型創作的一實施例中,所述至少一支撐件與感測器之間保持距離。In an embodiment of the novel creation, the at least one support member and the sensor maintain a distance therebetween.
在本新型創作的一實施例中,所述至少一支撐件接觸載板、感測器、帶通濾光元件以及準直器,且所述至少一支撐件將感測器、帶通濾光元件以及準直器固定在載板上。In an embodiment of the present invention, the at least one support contacts the carrier, the sensor, the band pass filter, and the collimator, and the at least one support filters the sensor and the band pass The component and the collimator are attached to the carrier.
在本新型創作的一實施例中,所述至少一支撐件位於載板與框體之間。所述至少一支撐件經由第二黏著層而與框體接合。所述至少一支撐件在蓋板上的正投影的至少部分落在框體在蓋板上的正投影內。In an embodiment of the present invention, the at least one support member is located between the carrier and the frame. The at least one support member is engaged with the frame via the second adhesive layer. At least a portion of the orthographic projection of the at least one support member on the cover plate falls within an orthographic projection of the frame on the cover plate.
基於上述,在本新型創作實施例的取像裝置中,框體經由第一黏著層貼附至蓋板,取像模組經由第二黏著層貼附至框體,且第二黏著層在蓋板上的正投影落在框體在蓋板上的正投影內。因此,當從蓋板側觀看時,第二黏著層被框體覆蓋住。藉由將第二黏著層藏於框體下,可避免第二黏著層影響視覺效果。此外,由於取像模組經由第二黏著層、框體以及第一黏著層而與蓋板間接接合,因此蓋板與未被框體覆蓋住的取像模組之間可以不用再設置黏著層。在此設計下,蓋板與未被框體覆蓋住的取像模組之間可以只有一種光傳遞介質(例如空氣),因此取像模組不易被使用者察覺。In the image capture device of the present invention, the frame is attached to the cover via the first adhesive layer, the image capture module is attached to the frame via the second adhesive layer, and the second adhesive layer is on the cover. The orthographic projection on the board falls within the orthographic projection of the frame on the cover. Therefore, the second adhesive layer is covered by the frame when viewed from the side of the cover. By hiding the second adhesive layer under the frame, the second adhesive layer can be prevented from affecting the visual effect. In addition, since the image capturing module is indirectly joined to the cover plate via the second adhesive layer, the frame body and the first adhesive layer, the adhesive layer can be disposed between the cover plate and the image capturing module not covered by the frame body. . Under this design, there is only one light transmission medium (for example, air) between the cover and the image capturing module that is not covered by the frame, so that the image capturing module is not easily perceived by the user.
為讓本新型創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will become more apparent and understood from the following description.
實施方式中所提到的方向用語,例如:「上」、「下」、「前」、「後」、「左」、「右」等,僅是參考附圖的方向。因此,使用的方向用語是用來說明,而並非用來限制本新型創作。在附圖中,各圖式繪示的是特定示範實施例中所使用的方法、結構及/或材料的通常性特徵。然而,這些圖式不應被解釋為界定或限制由這些示範實施例所涵蓋的範圍或性質。舉例來說,為了清楚起見,各膜層、區域及/或結構的相對尺寸、厚度及位置可能縮小或放大。The directional terms mentioned in the embodiments, such as "upper", "lower", "before", "after", "left", "right", etc., are only referring to the directions of the drawings. Therefore, the directional terminology used is for illustrative purposes and is not intended to limit the novel creation. In the drawings, the drawings depict typical features of the methods, structures, and/or materials used in the particular exemplary embodiments. However, the drawings are not to be interpreted as limiting or limiting the scope or nature of the embodiments disclosed. For example, the relative size, thickness, and location of layers, regions, and/or structures may be reduced or enlarged for clarity.
在實施方式中,相同或相似的元件將採用相同或相似的標號,且將省略其贅述。此外,不同示範實施例中的特徵在沒有衝突的情況下可相互組合,且依本說明書或申請專利範圍所作之簡單的等效變化與修飾,皆仍屬本專利涵蓋之範圍內。另外,本說明書或申請專利範圍中提及的「第一」、「第二」等用語僅用以命名分立(discrete)的元件或區別不同實施例或範圍,而並非用來限制元件數量上的上限或下限,也並非用以限定元件的製造順序或設置順序。In the embodiments, the same or similar elements will be designated by the same or similar numerals, and the description thereof will be omitted. In addition, the features of the different exemplary embodiments can be combined with each other without conflict, and the simple equivalent changes and modifications made by the present specification or the scope of the patent application are still within the scope of the patent. In addition, the terms "first", "second" and the like mentioned in the specification or the scope of the claims are only used to identify discrete elements or to distinguish different embodiments or ranges, and are not intended to limit the number of components. The upper or lower limits are also not intended to limit the order of manufacture or order of the components.
圖1至圖4分別是依照本新型創作的第一至第四實施例的取像裝置1至4的剖面示意圖。取像裝置1至4的每一個適於擷取待測物(未繪示)的生物特徵。舉例來說,待測物可為手指,且生物特徵可為指紋或靜脈,但不以此為限。在一實施例中,待測物可為手掌,且生物特徵可為掌紋。1 to 4 are schematic cross-sectional views of the image taking devices 1 to 4 according to the first to fourth embodiments of the present invention, respectively. Each of the image taking devices 1 to 4 is adapted to capture biometric features of the object to be tested (not shown). For example, the object to be tested may be a finger, and the biometric feature may be a fingerprint or a vein, but is not limited thereto. In an embodiment, the object to be tested may be a palm and the biometric feature may be a palm print.
請參照圖1,第一實施例的取像裝置1包括蓋板10、取像模組11、框體12、第一黏著層13以及第二黏著層14。Referring to FIG. 1 , the image capturing apparatus 1 of the first embodiment includes a cover 10 , an image capturing module 11 , a frame 12 , a first adhesive layer 13 , and a second adhesive layer 14 .
蓋板10可包括透光蓋板、有機發光顯示面板、觸控面板或至少上述兩個的組合。當蓋板10為有機發光顯示面板時,蓋板10可提供用於取像之光束。另當蓋板10為透光蓋板時,蓋板10可用於保護位於其下的元件。舉例來說,透光蓋板可為玻璃蓋板或塑膠蓋板。玻璃蓋板可以是經化學強化或物理強化的玻璃基板,也可以是未經強化的玻璃基板。塑膠蓋板可以是由聚碳酸酯(polycarbonate,PC)、聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚甲基丙烯酸甲酯(polymethylmethacrylate,PMMA)或聚醯亞胺(polyimide,PI)等材料形成的基板,但不以此為限。當蓋板10為有機發光顯示面板時,取像裝置1可進一步具有顯示功能。The cover 10 may include a light transmissive cover, an organic light emitting display panel, a touch panel, or a combination of at least two of the above. When the cover 10 is an organic light emitting display panel, the cover 10 can provide a light beam for image taking. In addition, when the cover 10 is a light transmissive cover, the cover 10 can be used to protect the components located thereunder. For example, the transparent cover can be a glass cover or a plastic cover. The glass cover plate may be a chemically strengthened or physically strengthened glass substrate or an unreinforced glass substrate. The plastic cover can be made of polycarbonate (PC), polyethylene terephthalate (PET), polymethylmethacrylate (PMMA) or polyimide (PI). A substrate formed of a material, but not limited thereto. When the cover 10 is an organic light emitting display panel, the image taking device 1 can further have a display function.
蓋板10具有內表面SI以及外表面SO。內表面SI為蓋板10面向取像模組11的表面。外表面SO與內表面相對,且外表面SO為蓋板10面向待測物的表面。在進行生物特徵辨識時,待測物按壓在外表面SO上。換句話說,外表面SO為待測物的按壓面。The cover plate 10 has an inner surface SI and an outer surface SO. The inner surface SI is a surface of the cover 10 facing the image taking module 11. The outer surface SO is opposed to the inner surface, and the outer surface SO is a surface of the cover plate 10 facing the object to be tested. When biometric identification is performed, the object to be tested is pressed against the outer surface SO. In other words, the outer surface SO is the pressing surface of the object to be tested.
取像模組11面向蓋板10的內表面SI,並鄰近蓋板10的內表面SI設置。取像模組11用於截取生物特徵的影像,以進行生物特徵辨識。在本實施例中,取像模組11可以是已知的任一種光學式生物特徵辨識模組。圖1示意性繪示出取像模組11的其中一種實施態樣,其中取像模組11包括載板110、感測器111、帶通濾光元件112、準直器113以及至少一支撐件114,但取像模組11的可實施態樣不以此為限。The image taking module 11 faces the inner surface SI of the cover 10 and is disposed adjacent to the inner surface SI of the cover 10. The image capturing module 11 is configured to intercept an image of the biometric feature for biometric identification. In this embodiment, the image capturing module 11 can be any known optical biometric module. FIG. 1 schematically illustrates an embodiment of the image capturing module 11 , wherein the image capturing module 11 includes a carrier 110 , a sensor 111 , a band pass filter element 112 , a collimator 113 , and at least one support The device 114, but the implementation of the image capturing module 11 is not limited thereto.
載板110用於承載元件,如上述的感測器111、帶通濾光元件112、準直器113以及支撐件114。此外,載板110還可具有電路,以將設置於其上的電子元件與外部線路電性連接。舉例來說,載板110可包括軟性印刷電路板(Flexible Printed Circuit,FPC)或電路板(Printed Circuit Board,PCB)。當載板110包括軟性印刷電路板時,載板110可進一步包括補強板(stiffener)。也就是說,載板110可以是單層板,也可以是複合板。The carrier 110 is used for carrying components such as the sensor 111, the band pass filter element 112, the collimator 113, and the support 114 described above. In addition, the carrier 110 may further have circuitry to electrically connect the electronic components disposed thereon with external circuitry. For example, the carrier board 110 may include a Flexible Printed Circuit (FPC) or a Printed Circuit Board (PCB). When the carrier board 110 includes a flexible printed circuit board, the carrier board 110 may further include a stiffener. That is to say, the carrier 110 may be a single layer or a composite board.
感測器111設置在載板110上。感測器111的感測面S111面向蓋板10,以接收被待測物反射的光束(帶有生物特徵資訊的光束)。舉例來說,感測器111可包括電荷耦合元件(Charge Coupled Device, CCD)、互補式金屬氧化物半導體元件(Complementary Metal-Oxide Semiconductor, CMOS)或其他適當種類的影像感測元件。在本實施例中,取像模組11還包括導線115以及封裝層116。感測器111經由導線115而與載板110上的電路電性連接。封裝層116設置在載板110上並包覆住導線115,以保護導線115。The sensor 111 is disposed on the carrier 110. The sensing surface S111 of the sensor 111 faces the cover 10 to receive a light beam (a beam with biometric information) reflected by the object to be tested. For example, the sensor 111 may include a Charge Coupled Device (CCD), a Complementary Metal-Oxide Semiconductor (CMOS), or other suitable kinds of image sensing elements. In the embodiment, the image capturing module 11 further includes a wire 115 and an encapsulation layer 116. The sensor 111 is electrically connected to a circuit on the carrier 110 via a wire 115. The encapsulation layer 116 is disposed on the carrier 110 and covers the wires 115 to protect the wires 115.
帶通濾光元件112設置在感測器111上,以過濾雜散光,降低雜散光對於生物特徵辨識的干擾。舉例來說,帶通濾光元件112可為紅外濾光片,其過濾紅外光並讓紅外光以外的光通過。然而,帶通濾光元件112過濾的波段可依需求改變,而不以此為限。The band pass filter element 112 is disposed on the sensor 111 to filter stray light and reduce the interference of stray light on biometric identification. For example, the band pass filter element 112 can be an infrared filter that filters infrared light and allows light other than infrared light to pass. However, the band filtered by the band pass filter element 112 can be changed as needed, and is not limited thereto.
準直器113設置在帶通濾光元件112上,以將朝感測器111傳遞的光束準直化。準直器113可以是已知的任一種準直元件,於此不加以限制。A collimator 113 is disposed on the band pass filter element 112 to collimate the beam transmitted toward the sensor 111. The collimator 113 can be any known collimating element and is not limited herein.
支撐件114設置在載板110上且位於感測器111的周邊。當待測物按壓蓋板10的外表面SO時,蓋板10被下壓,此時支撐件114可支撐住被下壓的蓋板10,避免取像模組11中的其他元件被損毀。支撐件114的形狀可為柱狀或環狀。當支撐件114的形狀為柱狀時,可將多個支撐件114間隔排列在感測器111的周邊。當支撐件114的形狀為環狀時,可將所述環狀支撐件114環繞住感測器111。The support member 114 is disposed on the carrier 110 and located at the periphery of the sensor 111. When the object to be tested presses the outer surface SO of the cover 10, the cover 10 is pressed down, and the support member 114 can support the depressed cover 10 to prevent other components in the image taking module 11 from being damaged. The shape of the support member 114 may be columnar or annular. When the shape of the support member 114 is a columnar shape, a plurality of support members 114 may be spaced apart at the periphery of the sensor 111. When the shape of the support member 114 is annular, the annular support member 114 can surround the sensor 111.
框體12與取像模組11位於蓋板10的同一側,且框體12環繞設置在取像模組11的周邊,以提供取像模組11適當的保護。此外,框體可為不透光框體,以遮蔽不欲被使用者看到的元件。The frame 12 and the image capturing module 11 are located on the same side of the cover 10, and the frame 12 is disposed around the periphery of the image capturing module 11 to provide appropriate protection for the image capturing module 11. In addition, the frame may be an opaque frame to shield components that are not intended to be viewed by a user.
框體12經由第一黏著層13而與蓋板10接合。第一黏著層13可以採用與框體12同色系的光學膠,如深色系或黑色光學膠,但不以此為限。The frame 12 is joined to the cover 10 via the first adhesive layer 13. The first adhesive layer 13 may be an optical glue of the same color as the frame 12, such as a dark color or a black optical glue, but is not limited thereto.
取像模組11經由第二黏著層14而與框體12接合。換句話說,取像模組11經由第二黏著層14、框體12以及第一黏著層13而與蓋板10間接接合。The image taking module 11 is joined to the frame 12 via the second adhesive layer 14 . In other words, the image taking module 11 is indirectly joined to the cover 10 via the second adhesive layer 14 , the frame 12 , and the first adhesive layer 13 .
第二黏著層14在蓋板10上的正投影P14落在框體12在蓋板10上的正投影P12內。也就是說,當從蓋板側觀看時,第二黏著層14被框體12覆蓋住。圖1示意性繪示出正投影P14落在正投影P12內的其中一種情況。在圖1中,正投影P14的邊緣不超出正投影P12的邊緣,且正投影P14的邊緣與正投影P12的邊緣切齊。然而,在另一實施例中,正投影P14的邊緣可不與正投影P12的邊緣切齊。舉例來說,正投影P14的邊緣可由正投影P12的邊緣內縮一距離,但不以此為限。The orthographic projection P14 of the second adhesive layer 14 on the cover 10 falls within the orthographic projection P12 of the frame 12 on the cover 10. That is, the second adhesive layer 14 is covered by the frame 12 when viewed from the side of the cover. FIG. 1 schematically illustrates one of the cases where the orthographic projection P14 falls within the orthographic projection P12. In FIG. 1, the edge of the orthographic projection P14 does not extend beyond the edge of the orthographic projection P12, and the edge of the orthographic projection P14 is aligned with the edge of the orthographic projection P12. However, in another embodiment, the edge of the orthographic projection P14 may not be aligned with the edge of the orthographic projection P12. For example, the edge of the orthographic projection P14 may be retracted by the distance of the edge of the orthographic projection P12, but is not limited thereto.
在取像模組經由黏著層而直接貼附至蓋板的情況下,設置有黏著層的區域(例如支撐件上方)與未設置有黏著層的區域(例如準直器上方)會因折射率差異,而導致兩種區域間的反射率及/或穿透率不同,造成使用者在操作生物特徵辨識裝置時容易察覺到取像模組的外觀。In the case where the image taking module is directly attached to the cover via the adhesive layer, the region where the adhesive layer is provided (for example, above the support member) and the region where the adhesive layer is not provided (for example, above the collimator) may be affected by the refractive index. The difference causes the reflectance and/or the transmittance to be different between the two regions, so that the user can easily perceive the appearance of the image capturing module when operating the biometric device.
相較之下,經由第二黏著層14將取像模組11貼附至框體12並將第二黏著層14藏於框體12下,可避免第二黏著層14影響視覺效果。此外,由於取像模組11經由第二黏著層14、框體12以及第一黏著層13而與蓋板10間接接合,因此蓋板10與取像模組11之間可以不用再設置黏著層。也就是說,蓋板10與取像模組11之間可存在空氣間隙AG。由於蓋板10與未被框體12覆蓋住的取像模組11之間可只存在一種光傳遞介質(例如空氣,即準直器113與蓋板10之間以及支撐件114與蓋板10之間皆存在空氣間隙AG而未填充黏著層),而非多種光傳遞介質的組合(例如空氣與黏著層的組合),因此取像模組11不易被使用者察覺。In contrast, attaching the image capturing module 11 to the frame 12 via the second adhesive layer 14 and hiding the second adhesive layer 14 under the frame 12 can prevent the second adhesive layer 14 from affecting the visual effect. In addition, since the image capturing module 11 is indirectly engaged with the cover 10 via the second adhesive layer 14 , the frame 12 , and the first adhesive layer 13 , the adhesive layer can be disposed between the cover 10 and the image capturing module 11 . . That is to say, there may be an air gap AG between the cover 10 and the image capturing module 11. There may be only one light transmission medium (for example, air, that is, between the collimator 113 and the cover 10 and the support member 114 and the cover 10 between the cover 10 and the image capturing module 11 not covered by the frame 12. There is an air gap AG between them without filling the adhesive layer), rather than a combination of multiple light transmitting media (for example, a combination of air and adhesive layers), so the image taking module 11 is not easily perceived by the user.
依據不同的需求,取像裝置1可進一步包括其他元件或膜層。舉例來說,取像裝置1可進一步包括抗反射層(未繪示)。抗反射層可設置在蓋板10的內表面SI上,以減少在內表面SI處發生的介面反射。The image taking device 1 may further include other elements or film layers depending on different needs. For example, the image taking device 1 may further include an anti-reflection layer (not shown). An anti-reflective layer may be disposed on the inner surface SI of the cover 10 to reduce interfacial reflection occurring at the inner surface SI.
請參照圖2,第二實施例的取像裝置2與圖1的取像裝置1的主要差異如下所述。在取像裝置1中,支撐件114與第二黏著層14不重疊設置,且支撐件114與第二黏著層14中只有第二黏著層14被藏於框體12下。詳細而言,第二黏著層14位於載板110與框體12之間,且第二黏著層14將載板110與框體12接合。此外,支撐件114位於第二黏著層14與感測器111之間,且支撐件114與蓋板10之間存在空氣間隙AG。Referring to Fig. 2, the main differences between the image pickup device 2 of the second embodiment and the image pickup device 1 of Fig. 1 are as follows. In the image taking device 1, the support member 114 and the second adhesive layer 14 are not overlapped, and only the second adhesive layer 14 of the support member 114 and the second adhesive layer 14 is hidden under the frame 12. In detail, the second adhesive layer 14 is located between the carrier 110 and the frame 12, and the second adhesive layer 14 bonds the carrier 110 to the frame 12. In addition, the support member 114 is located between the second adhesive layer 14 and the sensor 111, and an air gap AG exists between the support member 114 and the cover plate 10.
另一方面,在取像裝置2中,支撐件214與第二黏著層14重疊設置,且支撐件214與第二黏著層14中共同被藏於框體22下。詳細而言,支撐件214也位於載板110與框體22之間,且支撐件214經由第二黏著層14而與框體22接合。具體地,支撐件214位於載板110與第二黏著層14之間,且第二黏著層14位於支撐件214與框體22之間。此外,支撐件214在蓋板10上的正投影P214的至少部分落在框體22在蓋板10上的正投影P22內。On the other hand, in the image taking device 2, the support member 214 is overlapped with the second adhesive layer 14, and the support member 214 and the second adhesive layer 14 are collectively hidden under the frame 22. In detail, the support member 214 is also located between the carrier 110 and the frame 22, and the support member 214 is engaged with the frame 22 via the second adhesive layer 14. Specifically, the support member 214 is located between the carrier 110 and the second adhesive layer 14 , and the second adhesive layer 14 is located between the support member 214 and the frame 22 . In addition, at least a portion of the orthographic projection P214 of the support member 214 on the cover 10 falls within the orthographic projection P22 of the frame 22 on the cover 10.
藉由將支撐件214與第二黏著層14重疊設置,可有效縮減上述兩者的布局面積,使線路布局空間更充裕,且有助於縮減載板110的面積,使取像模組21的整體面積能夠進一步縮小。By overlapping the support member 214 and the second adhesive layer 14, the layout area of the two can be effectively reduced, the line layout space is more abundant, and the area of the carrier 110 is reduced, so that the image capturing module 21 is The overall area can be further reduced.
請參照圖3,第三實施例的取像裝置3與圖1的取像裝置1的主要差異如下所述。在取像裝置1中,支撐件114與感測器111之間保持距離(兩者未接觸),且取像模組11進一步包括封裝層116,以保護導線115。Referring to Fig. 3, the main differences between the image pickup device 3 of the third embodiment and the image pickup device 1 of Fig. 1 are as follows. In the image taking device 1, the distance between the support member 114 and the sensor 111 is maintained (the two are not in contact), and the image taking module 11 further includes an encapsulation layer 116 to protect the wires 115.
另一方面,在取像裝置3中,支撐件314接觸載板110、感測器111、帶通濾光元件112以及準直器113,且支撐件314將感測器111、帶通濾光元件112以及準直器113固定在載板110上。舉例來說,支撐件314可由封裝膠固化形成。因此,取像模組31可省略圖1的封裝層116。On the other hand, in the image taking device 3, the support member 314 contacts the carrier 110, the sensor 111, the band pass filter element 112, and the collimator 113, and the support member 314 filters the sensor 111 and the band pass. The element 112 and the collimator 113 are fixed to the carrier 110. For example, the support 314 can be formed by curing of the encapsulant. Therefore, the imaging module 31 can omit the encapsulation layer 116 of FIG.
請參照圖4,第四實施例的取像裝置4與圖3的取像裝置3的主要差異如下所述。在取像裝置3的取像模組31中,支撐件314不與框體12重疊,且第二黏著層14將載板110與框體12接合。Referring to Fig. 4, the main differences between the image taking device 4 of the fourth embodiment and the image capturing device 3 of Fig. 3 are as follows. In the image capturing module 31 of the image taking device 3, the support member 314 does not overlap the frame 12, and the second adhesive layer 14 joins the carrier 110 to the frame 12.
另一方面,在取像裝置4的取像模組41中,支撐件414進一步延伸至框體12下方並與框體12重疊。此外,第二黏著層14將支撐件414與框體12接合。On the other hand, in the image capturing module 41 of the image taking device 4, the support member 414 further extends below the frame body 12 and overlaps the frame body 12. Further, the second adhesive layer 14 engages the support member 414 with the frame 12.
綜上所述,在本新型創作實施例的取像裝置中,框體經由第一黏著層貼附至蓋板,取像模組經由第二黏著層貼附至框體,且第二黏著層在蓋板上的正投影落在框體在蓋板上的正投影內。因此,當從蓋板側觀看時,第二黏著層被框體覆蓋住。藉由將第二黏著層藏於框體下,可避免第二黏著層影響視覺效果。此外,由於取像模組經由第二黏著層、框體以及第一黏著層而與蓋板間接接合,因此蓋板與未被框體覆蓋住的取像模組之間可以不用再設置黏著層。在此設計下,蓋板與未被框體覆蓋住的取像模組之間可以只有一種光傳遞介質(例如空氣),因此取像模組不易被使用者察覺。在一實施例中,取像模組的支撐件可與第二黏著層重疊設置,以使載板上的線路布局空間更充裕或使取像模組的整體面積能夠進一步縮小。在另一實施例中,支撐件可由封裝膠固化形成。在又一實施例中,由封裝膠固化形成的支撐件可與第二黏著層重疊設置。In summary, in the image capturing device of the present invention, the frame is attached to the cover through the first adhesive layer, and the image capturing module is attached to the frame via the second adhesive layer, and the second adhesive layer The orthographic projection on the cover falls within the orthographic projection of the frame on the cover. Therefore, the second adhesive layer is covered by the frame when viewed from the side of the cover. By hiding the second adhesive layer under the frame, the second adhesive layer can be prevented from affecting the visual effect. In addition, since the image capturing module is indirectly joined to the cover plate via the second adhesive layer, the frame body and the first adhesive layer, the adhesive layer can be disposed between the cover plate and the image capturing module not covered by the frame body. . Under this design, there is only one light transmission medium (for example, air) between the cover and the image capturing module that is not covered by the frame, so that the image capturing module is not easily perceived by the user. In an embodiment, the support member of the image capturing module can be overlapped with the second adhesive layer to make the layout space on the carrier board more abundant or the overall area of the image capturing module can be further reduced. In another embodiment, the support can be formed by curing of the encapsulant. In still another embodiment, the support formed by the curing of the encapsulant may be disposed to overlap the second adhesive layer.
雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作,任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.
1、2、3、4‧‧‧取像裝置 10‧‧‧蓋板 11、21、31、41‧‧‧取像模組 12、22‧‧‧框體 13‧‧‧第一黏著層 14‧‧‧第二黏著層 110‧‧‧載板 111‧‧‧感測器 112‧‧‧帶通濾光元件 113‧‧‧準直器 114、214、314、414‧‧‧支撐件 115‧‧‧導線 116‧‧‧封裝層 AG‧‧‧空氣間隙 P12、P14、P22、P214‧‧‧正投影 S111‧‧‧感測面 SI‧‧‧內表面 SO‧‧‧外表面 1, 2, 3, 4‧‧‧ image capture device 10‧‧‧ Cover 11, 21, 31, 41‧‧‧ image capture module 12, 22‧‧‧ frame 13‧‧‧First adhesive layer 14‧‧‧Second Adhesive Layer 110‧‧‧ Carrier Board 111‧‧‧Sensor 112‧‧‧Bandpass filter 113‧‧‧ collimator 114, 214, 314, 414‧‧‧ support 115‧‧‧ wire 116‧‧‧Encapsulation layer AG‧‧‧Air gap P12, P14, P22, P214‧‧‧ orthographic projection S111‧‧‧Sense surface SI‧‧‧ inner surface SO‧‧‧ outer surface
圖1至圖4分別是依照本新型創作的第一至第四實施例的取像裝置的剖面示意圖。1 to 4 are schematic cross-sectional views of an image taking device according to first to fourth embodiments of the present invention, respectively.
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862784755P | 2018-12-25 | 2018-12-25 | |
US62/784,755 | 2018-12-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM581727U true TWM581727U (en) | 2019-08-01 |
Family
ID=67703536
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108200599U TWM579772U (en) | 2018-12-25 | 2019-01-14 | Fingerprint identification module |
TW108204291U TWM581727U (en) | 2018-12-25 | 2019-04-09 | Image capturing device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108200599U TWM579772U (en) | 2018-12-25 | 2019-01-14 | Fingerprint identification module |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN209343363U (en) |
TW (2) | TWM579772U (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM595259U (en) * | 2019-09-16 | 2020-05-11 | 神盾股份有限公司 | Electronic apparatus having under-display infrared biometrics sensor |
-
2019
- 2019-01-14 TW TW108200599U patent/TWM579772U/en not_active IP Right Cessation
- 2019-01-16 CN CN201920064896.8U patent/CN209343363U/en active Active
- 2019-04-09 TW TW108204291U patent/TWM581727U/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN209343363U (en) | 2019-09-03 |
TWM579772U (en) | 2019-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI582706B (en) | Fingerprint identify apparatus | |
US10936840B2 (en) | Optical sensor with angled reflectors | |
US10628656B2 (en) | Image capture apparatus | |
CN208781246U (en) | The device and electronic equipment of fingerprint recognition | |
US10049257B2 (en) | Fingerprint identification module | |
WO2018040514A1 (en) | Optical fingerprint sensor module | |
WO2017124737A1 (en) | Optical fingerprint sensor module | |
CN214225933U (en) | Fingerprint identification device and electronic equipment | |
WO2020215187A1 (en) | Device for fingerprint recognition and electronic device | |
CN205845065U (en) | Fingeprint distinguisher | |
CN212135452U (en) | Fingerprint identification device and electronic equipment | |
WO2020177032A1 (en) | Fingerprint recognition apparatus and electronic device | |
US20210326557A1 (en) | Electronic device having a fingerprint sensing function | |
WO2019178793A1 (en) | In-display biometric identification device and electronic device | |
WO2020082375A1 (en) | Compound lens structure, fingerprint recognition apparatus, and electronic device | |
US10867198B2 (en) | Image capturing device and image capturing module | |
TWM592604U (en) | Sensing module and image capturing apparatus | |
WO2021051710A1 (en) | Fingerprint sensing module and electronic apparatus | |
WO2018227399A1 (en) | Optical biological recognition module, display device, and electronic equipment | |
TWM575561U (en) | Image capture apparatus | |
US11310402B2 (en) | Image capturing device and fingerprint image capturing device | |
TWM581727U (en) | Image capturing device | |
CN114529954A (en) | Image capturing device | |
KR20200002048A (en) | Electronic apparatus | |
CN210983440U (en) | Image capturing device and electronic device using same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |