CN112889144A - Flexible substrate, flexible panel and electronic device - Google Patents
Flexible substrate, flexible panel and electronic device Download PDFInfo
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- CN112889144A CN112889144A CN201880096022.9A CN201880096022A CN112889144A CN 112889144 A CN112889144 A CN 112889144A CN 201880096022 A CN201880096022 A CN 201880096022A CN 112889144 A CN112889144 A CN 112889144A
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- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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Abstract
The invention discloses a flexible substrate (10), which comprises a first area (11) and a second area (13) connected with the first area (11), wherein the hardness of the part, located on the second area (13), of the flexible substrate (10) is greater than that of the part, located on the first area (11), of the flexible substrate (10), and the second area (13) of the flexible substrate (10) is used for binding and bonding electronic devices, so that when the electronic devices are bound and bonded in the second area (13), the flexible substrate (10) is not easy to damage and deform, the service life of the flexible substrate (10) is prolonged, and the problem that effective binding and bonding cannot be carried out on the flexible substrate is solved. The invention further provides the flexible panel and the electronic equipment.
Description
The invention relates to the technical field of electronics, in particular to a flexible substrate, a flexible panel and electronic equipment.
Flexible electronic devices, such as flexible touch panels, have outstanding features of being easy to bend, convenient to carry, and resistant to bending, and are receiving more and more attention. In the prior art, a portion of a functional layer (for example, a touch electrode layer) disposed on a flexible substrate, which needs to be led out, is bound and bonded with an electronic device on the flexible substrate, however, the flexible substrate is easily damaged due to a high temperature and a high pressure applied during binding and bonding, and thus the flexible substrate cannot meet the process implementation conditions of a binding material and cannot be effectively bound and connected.
Disclosure of Invention
In order to solve the above problems, embodiments of the present invention disclose a flexible substrate, a flexible panel, and an electronic device, which are not easily damaged.
A flexible substrate comprises a first area and a second area connected with the first area, wherein the hardness of the part of the flexible substrate located in the second area is higher than that of the part of the flexible substrate located in the first area, and the second area of the flexible substrate is used for binding and bonding electronic devices.
A flexible panel comprising a flexible substrate as described above.
An electronic device comprising a flexible panel as described above.
According to the flexible substrate, the flexible panel and the electronic equipment, provided by the invention, as the flexible substrate comprises the second area for binding and jointing the electronic device, the flexible substrate is not easy to damage and deform when the electronic device is bound and jointed in the second area, the service life of the flexible substrate is prolonged, and the problem that the flexible substrate cannot be effectively bound and jointed is solved.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic perspective view of a flexible substrate according to a first embodiment of the present invention.
Fig. 2 is a schematic diagram of a hard structure according to an embodiment of the present invention.
Fig. 3 is a schematic perspective view of a flexible substrate according to a second embodiment of the present invention.
Fig. 4 is a schematic perspective view of a flexible substrate according to a third embodiment of the present invention.
Fig. 5 is a schematic perspective view of a flexible substrate according to a fourth embodiment of the invention.
Fig. 6 is a schematic perspective view of a flexible substrate according to a fifth embodiment of the present invention.
Fig. 7 is a schematic perspective view of a flexible panel according to an embodiment of the present invention.
Fig. 8 is a schematic front view of an electronic device according to an embodiment of the present invention.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic perspective view of a flexible substrate according to a first embodiment of the present invention. The flexible substrate 10 includes a first region 11 and a second region 13 connected to the first region 11, wherein the hardness of a portion of the flexible substrate 10 located in the second region 13 is greater than that of a portion located in the first region 11, and the second region 13 is used for bonding an electronic device (not shown). Because the flexible substrate 10 comprises the second region 13 for binding and bonding with the electronic device, when the electronic device is bound and bonded on the second region 13, the flexible substrate 10 is not easy to be damaged and deformed, and the service life of the flexible substrate 10 is prolonged.
The portion of the flexible substrate 10 located in the first region 11 is made of a first material, and the portion of the flexible substrate 10 located in the second region 13 is made of a second material, different from the first material. The second material comprises a hard material. The first material has a hardness less than the hardness of the second material. I.e. the part of the flexible substrate 10 located in the second region 13, comprises a hard material. The flexible substrate 10 is substantially plate-shaped. Specifically, the flexible substrate 10 further includes a flexible body 15 and a hard structure 17, the hard material is combined with the flexible body 15 to form the second region 13 of the flexible substrate 10, the hard material forms the hard structure 17 in the second region, and only the flexible body 15 is disposed in the first region 11 of the flexible substrate 10, so that the hardness of the portion of the flexible substrate 10 located in the second region 13 is greater than that of the portion located in the first region 11. The hard material is used for improving the hardness of the flexible substrate 10 in the second region 13, and further improving the mechanical property and mechanical property of the portion, located in the second region 13, of the flexible substrate 10, so that the portion, located in the second region 13, of the flexible substrate 10 is resistant to high temperature and pressure.
In this embodiment, the hard structure 17 is a three-dimensional network structure, and the flexible body 15 and the hard material segment structure are integrally fitted to each other. The height of the second region 13 is the same as the thickness of the flexible substrate 10, so that the flexible substrate 10 forms a structure with a flat surface and improved surface hardness in the second region 13, and an electronic device can be conveniently bound in the second region 13.
The first material can be thermoplastic elastomer plastic materials such as polyurethane, organic silicon, rubber and the like. The flexible body 15 may be manufactured as a film by blowing, calendering, casting, etc. The hard material comprises an insulation treated metal. The insulation treatment may be an insulation treatment method such as coating an insulating material on a metal surface. It is to be understood that the material of the hard structure 17 is not limited to the insulation-treated metal, and may be at least one of insulation-treated metal, high-strength polyester nylon, glass fiber, and insulation-treated high-strength carbon fiber. In other embodiments, the first material may also be a thermoset plastic material, such as vulcanized rubber.
The second region 13 of the flexible substrate 10 is formed by locally filling in the film forming process of the flexible body 15 with a hard material forming the hard structure 17. Specifically, when the flexible substrate 10 is prepared, the first material may be made to be liquid or semi-liquid under certain heating and pressurizing conditions, and the hard material is mixed and filled in the local region to form the hard structure 17, so as to form the second region 13. Taking Thermoplastic Polyurethanes (TPU) as an example, which is a material for manufacturing the flexible body 15, heating the flexible body 15 to 130-180 ℃, applying pressure of 0.1-5MPa, and keeping the temperature for 10-30 seconds, wherein the material for manufacturing the flexible body 15 is in a flowing liquid state or a semi-liquid state; after cooling, the hard structures 17 formed of hard material are integrated with the flexible body 15 at the location of the second regions 13 as a mechanical skeleton to form the second regions 13 of the flexible substrate 10, in other words, the flexible body 15 and the segment structure of hard material are mutually embedded and integrated.
Since the hardness of the composite material is related to the hardness of each component, and the overall material hardness after the composite is between the hardness of each component, in the present embodiment, when the flexible base material 10 is prepared, the hard material is filled in the predetermined region when the first material with low hardness is in a liquid state or a semi-liquid state, so that the portion of the flexible base material 10 located in the second region 13 with hardness higher than that of the first material is generated.
It is understood that after the material of the flexible body 15 is melted to form a preformed substrate, a local area of the preformed substrate is heated and pressurized to fill or embed the hard structure 17 into the local area for cooling, and finally the flexible substrate 10 with uniform thickness is formed.
In this embodiment, when the electronic device is bonded, the bonding temperature range is usually 150-.
In other embodiments, the hard structures 17 may not be three-dimensional stereo network structures, and the hard structures 17 may be two-dimensional network structures, that is, as shown in fig. 2, the hard structures may also be sheet-like network structures. The rigid structure 17 may be a non-network structure, and the rigid structure 17 may be a sheet, for example, the flexible body 15 forms a receiving groove in the second region 13, and the rigid structure 17 is received in the receiving groove and is combined with the side wall of the receiving groove.
Referring to fig. 3, fig. 3 is a schematic perspective view of a flexible substrate according to a second embodiment of the present invention. The flexible substrate 20 is similar in structure to the flexible substrate 10 provided in the first embodiment. The flexible substrate 20 comprises a first region 21 and a second region 23 connected with the first region 21, the hardness of the portion of the flexible substrate 20 located in the second region 23 is greater than that of the portion of the flexible substrate 20 located in the first region 21, and the second region 23 is used for bonding of electronic devices.
The flexible substrate 20 is different from the flexible substrate 10 provided in the first embodiment in that the hard material in the material of the flexible substrate 20 located in the second region 23 is micro-nano particles. In other words, the flexible substrate 20 disposed in the first region 21 is made of a first material, and the flexible substrate 20 disposed in the second region 23 is made of a second material. The second material is made by doping the first material with a hybrid hard material. In this embodiment, the first material is an organic material, and the micro-nano particles are inorganic particle silica micropowder. When the flexible substrate 20 is prepared, in order to improve the dispersion and mixing compatibility of the inorganic micro-nano particle silicon micro powder and the organic first material, the surface of the inorganic particle powder is modified, such as lipophilic treatment, a polymer dispersant is added to cover the surface of the particle, and a coupling agent is added to treat the particle, so that affinity groups of the organic and inorganic materials are provided, and the fusion effect is improved.
Certainly, the micro-nano particles are not limited, for example, the micro-nano particles include at least one of calcium powder, silicon nitride powder, silica powder, alumina powder, micro-nano-length glass fibers, insulation-treated micro-nano-length carbon fibers, and hard plastic micro-nano particles.
Referring to fig. 4, fig. 4 is a schematic perspective view of a flexible substrate according to a third embodiment of the present invention. The flexible substrate 30 is similar in structure to the flexible substrate 20 provided in the second embodiment, except that the flexible substrate 30 further includes a third region 35, a portion of the flexible substrate 30 located in the third region 35 has a hardness lower than that of a portion of the flexible substrate 30 located in the second region 33, and the hardness located in the third region 35 is higher than that of the flexible substrate 30 located in the first region 31.
The third region 35 is used to reduce the influence of mechanical differences caused by materials in different regions of the flexible base material 30, and to improve the bonding strength between the regions of the flexible base material 30. In the present embodiment, the number of the third regions 35 is two, and the two third regions are respectively located on both sides of the second region 33, and both sides of each third region 35 are respectively combined with the adjacent second region 33 and the adjacent first region 31, so as to connect both sides of the second region 33 and the first regions 31 located on both sides of the second region 33.
The flexible substrate 30 in the second region 33 and the flexible substrate 30 in the third region 35 are made of micro-nano particles. The density of the micro-nano particles in the third area 35 is smaller than that of the micro-nano particles in the second area 33, so that the hardness of the part, located in the third area 35, of the flexible base material 30 is smaller than that of the part, located in the second area 33, of the flexible base material 30. The manufacturing material of the flexible base material 30 in the first area 31 is a first material, the manufacturing material of the flexible base material 30 in the second area 33 is a second material, the manufacturing material of the flexible base material 30 in the third area 35 is a third material, the second material and the third material are formed by doping mixed hard micro-nano particles in the first material, and the proportion of the micro-nano particles mixed and filled in the second area 33 is higher than that of the micro-nano particles mixed and filled in the third area 35.
As illustrated below, when the flexible substrate 30 is prepared, the mass ratio of the first material to the micro-nano particles in the second region 33 is 1: 1; in the third area 35, the filling ratio is reduced, for example, the mass ratio of the first material in the third area 35 to the micro-nano particles is reduced to 1: 0.5, so that the density of the micro-nano particles in the second area 33 is greater than that of the micro-nano particles in the third area 35, and the hardness of the flexible base material 30 in the second area 33 is greater than that in the third area 35.
Referring to fig. 5, fig. 5 is a schematic perspective view of a flexible substrate according to a fourth embodiment of the present invention. The flexible substrate 40 is similar in structure to the flexible substrate 10 provided in the first embodiment. The flexible substrate 40 comprises a first area 41 and a second area 43 connected with the first area 41, the hardness of the flexible substrate 40 at the second area 43 is greater than that of the flexible substrate 40 at the first area 41, and the second area 43 is used for binding and bonding the electronic device.
The flexible substrate 40 disposed in the first region 41 is made of a first material, and the flexible substrate 40 disposed in the second region 43 is made of a second material. The flexible substrate 40 is different from the flexible substrate 10 provided in the first embodiment in that the second material is prepared by adjusting the synthetic formulation of the first material, and the adjustment includes at least one of increasing the cured crosslinking density, increasing the hard functional groups, and increasing the reactive short chain branches, so as to improve the mechanical properties and mechanical properties of the flexible substrate 40 located in the second region 43, such that the hardness of the portion of the flexible substrate 40 located in the second region 43 is greater than the hardness of the portion of the flexible substrate 40 located in the remaining region. For example, an additive including at least one of a high-functionality low-molecular-weight polyether polyol having a functionality of 3 or more, an aromatic polyisocyanate such as an aromatic polyol, a heterocyclic polyol, or diphenylmethane diisocyanate, an aromatic diamine such as 3,3 '-dichloro-4, 4' -dibenzylalkanediamine, and an aromatic polyamine may be added to the formulation for synthesizing the first material. The additive can be used as a cross-linking agent and a chain extender, so that more hard segments exist in a polymer chain segment, and the hardness of the elastomer is improved.
When the first material is formed into a film to form the portion of the flexible substrate 40 located in the first region 41, the second material is filled between the first region 41, and the first material and the second material are melted and cooled to form the flexible substrate 40 which is mixed and spliced.
Referring to fig. 6, fig. 6 is a schematic perspective view of a flexible substrate according to a fifth embodiment of the present invention. The flexible substrate 50 is similar in structure to the flexible substrate 40 provided in the fourth embodiment. The flexible substrate 50 comprises a first area 51 and a second area 53 connected with the first area 51, the hardness of the flexible substrate 50 at the second area 53 is greater than that of the flexible substrate 50 at the first area 51, and the second area 53 is used for binding and bonding the electronic device.
The flexible substrate 50 is different from the flexible substrate 40 provided in the fourth embodiment in that the flexible substrate 50 further includes a third region 55, the third region 55 is located between the first region 51 and the second region 53, the hardness of the portion of the flexible substrate 50 located in the third region 55 is less than that of the portion of the flexible substrate 50 located in the second region 53, and the hardness of the portion of the flexible substrate 50 located in the third region 55 is greater than that of the portion of the flexible substrate 50 located in the first region 51.
The portion of the flexible substrate 50 located in the first region 51 is made of a first material, the portion of the flexible substrate 50 located in the second region 53 is made of a second material, and the portion of the flexible substrate 50 located in the third region 55 is made of a third material.
The first material can be thermoplastic elastomer plastic materials such as polyurethane, organic silicon, rubber and the like.
The second material is prepared by adjusting the synthetic formula of the first material, wherein the adjustment comprises at least one of increasing curing crosslinking density, increasing hard functional groups and increasing reaction short chain branches. For example, an additive including at least one of a high-functionality low-molecular-weight polyether polyol having a functionality of 3 or more, an aromatic polyisocyanate such as an aromatic polyol, a heterocyclic polyol, or diphenylmethane diisocyanate, an aromatic diamine such as 3,3 '-dichloro-4, 4' -dibenzylalkanediamine, and an aromatic polyamine is added to the monomer synthesis formulation of the first material. The additive can be used as a cross-linking agent and a chain extender, so that more hard segments exist in a polymer chain segment, and the hardness of the elastomer is improved.
The third material is the first material mixed with a hard material. In this embodiment, the hard material is micro-nano particles, and the micro-nano particles are inorganic silicon micro powder particles. Certainly, the material of the hard micro-nano particles is not limited, and it is sufficient that the hardness of the flexible substrate 50 in the third region 55 is greater than that in the first region 51, and the hardness of the flexible substrate 50 in the third region 55 is less than that in the second region 53, and the binding is not adversely affected. For example, the hard micro-nano particles comprise at least one of calcium powder, silicon nitride powder, silicon dioxide powder, alumina powder, micro-nano length glass fibers, insulation treatment micro-nano length carbon fibers and hard plastic micro-nano particles. It is understood that the hard materials are not limited to micro-nano particles, and the hard materials may be hard network structures, hard layer structures, and the like.
In other embodiments, the material of the flexible substrate 50 in the second region 53 and the material of the flexible substrate 50 in the third region 55 are not limited, and it is only necessary that the hardness of the flexible substrate 50 in the second region 53 is greater than that of the flexible substrate 50 in the third region 55 and the hardness of the flexible substrate 50 in the third region 55 is greater than that of the flexible substrate 50 in the first region 51, for example, the material of the flexible substrate 50 in the second region 53 may be the third material and the material of the flexible substrate 50 in the third region 55 may be the second material.
Referring to fig. 7, the present invention further provides a flexible panel 100, which includes a flexible substrate 60, a first electronic device 101, and a second electronic device 103, where the flexible substrate 60 may be one of the flexible substrate 10 provided in the first embodiment, the flexible substrate 20 provided in the second embodiment, the flexible substrate 30 provided in the third embodiment, the flexible substrate 40 provided in the fourth embodiment, and the flexible substrate 50 provided in the fifth embodiment. In this embodiment, the flexible panel 100 is a touch panel, the first electronic device 101 is a touch electrode, and the second electronic device 103 is a flexible circuit board. It is understood that the flexible panel 100 may be other structures or functional modules, for example, the flexible panel 100 may be a flexible display panel, the first electronic device 101 may be other devices, and the second electronic device 103 may be other devices.
The flexible substrate 60 includes a first region 61 and a second region 63. Wherein the first electronic device 101 and the second electronic device 103 are bonded in a bonding manner in the second region 63. Furthermore, the first electronic device 101 is disposed on the first region 61 of the flexible substrate 60, and the lead 1011 of the first electronic device 101 is bonded to the second electronic device 103 in the second region 63 in a binding manner, so that the first electronic device 101 and the second electronic device 103 are bonded in the second region 63 in a binding manner. In the present embodiment, the first electronic device 101 and the second electronic device 103 are bonded by Conductive thermocompression bonding through an Anisotropic Conductive Film (ACF). For example, the low bonding temperature anisotropic conductive adhesive, such as anisotropic conductive adhesive composed of Sn, Bi low melting point alloy microparticles, epoxy curing system anisotropic conductive adhesive with low curing temperature, or thermoplastic rubber resin curing system anisotropic conductive adhesive, can be further reduced to 100-130 ℃, the applied pressure range is 1-3MPa, the time is 10-20 seconds, and the post-bonding strength can reach 7-20N/cm.
Because the hardness of the flexible substrate 60 in the second area 63 is higher, the flexible substrate 60 can resist high temperature and pressure, the flexible substrate 60 is prevented from being damaged, the service life of the flexible substrate 60 is prolonged, and the problem that effective binding connection cannot be carried out on the flexible substrate is solved.
Referring to fig. 8, the present invention further provides a front schematic view of an electronic device 200 having the flexible panel 100. The electronic device 200 may be a mobile phone, a tablet computer, a reader, a game console, etc.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (19)
- The flexible substrate is characterized by comprising a first area and a second area connected with the first area, wherein the hardness of the part of the flexible substrate, which is positioned in the second area, is greater than that of the part of the flexible substrate, which is positioned in the first area, and the second area of the flexible substrate is used for binding and bonding electronic devices.
- The flexible substrate of claim 1, wherein the flexible substrate is formed from a first material in a portion of the first region and the flexible substrate is formed from a second material in a portion of the second region, the second material being different from the first material.
- The flexible substrate of claim 2, wherein the second material comprises a hard material.
- The flexible substrate of claim 3, wherein the flexible substrate comprises a flexible body and a rigid structure, wherein the rigid material is bonded to the flexible body to form a second region of the flexible substrate, wherein the rigid material forms the rigid structure in the second region, and wherein only the flexible body is disposed in the first region of the flexible substrate such that the flexible substrate in the second region has a greater stiffness than the flexible substrate in the first region.
- The flexible substrate of claim 4, wherein the hard structure is a network structure, and the flexible body and the hard material segment structure are integrally embedded with each other.
- The flexible substrate of claim 5, wherein the rigid structure is a three-dimensional network structure.
- The flexible substrate of claim 6, wherein the thickness of the rigid structures is the same as the thickness of the flexible substrate.
- The flexible substrate of claim 4, wherein the hard material comprises at least one of an insulation treated metal, a high strength polyester nylon, a glass fiber, and an insulation treated high strength carbon fiber.
- The flexible substrate of claim 3, wherein the hard material is micro-nano particles.
- The flexible substrate according to claim 9, wherein the flexible substrate further comprises a third region, the third region is located between the first region and the second region, the flexible substrate located in the third region is made of a material comprising micro-nano particles, the density of the micro-nano particles in the third region is smaller than that in the second region, the hardness of the flexible substrate located in the third region is smaller than that of the flexible substrate located in the second region, and the hardness of the flexible substrate located in the third region is greater than that of the flexible substrate located in the first region.
- The flexible substrate according to claim 9, wherein the micro-nano particles are at least one of inorganic particles of silicon micropowder, calcium powder, silicon nitride powder, silicon dioxide powder, alumina powder, micro-nano length glass fiber, insulation treatment micro-nano length carbon fiber and hard plastic micro-nano particles.
- The flexible substrate of claim 2, wherein the second material is formed by tailoring a synthetic formulation of the first material, the tailoring comprising at least one of increasing cured crosslink density, increasing hard functionality, increasing reactive short chain branching.
- The flexible substrate of claim 12, further comprising a third region, the third region being located between the first region and the second region, wherein the portion of the flexible substrate located in the third region has a hardness that is less than the hardness of the portion of the flexible substrate located in the second region, and wherein the portion of the flexible substrate located in the third region has a hardness that is greater than the hardness of the portion of the flexible substrate located in the first region.
- The flexible substrate of claim 13, wherein the flexible substrate is made of a third material in the third region, the third material being made by blending a hard material with the first material.
- The flexible substrate of claim 2, wherein the first material is a thermoplastic elastomer plastic.
- A flexible panel comprising the flexible substrate of any one of claims 1-15.
- The flexible panel of claim 16, further comprising a first electronic device and a second electronic device, wherein the first electronic device and the second electronic device are bonded in a bonding manner in the second region.
- The flexible panel of claim 17, wherein the first electronic device is a touch electrode layer, the touch electrode layer is disposed in the first area, the second electronic device is a flexible circuit board, and the first electronic device and the second electronic device are bonded in the second area by bonding a terminal extending from the touch electrode layer to the second area to the flexible circuit board in the second area.
- An electronic device comprising a flexible panel according to any one of claims 16-18.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/111236 WO2020082212A1 (en) | 2018-10-22 | 2018-10-22 | Flexible substrate, flexible panel, and electronic apparatus |
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| CN112889144A true CN112889144A (en) | 2021-06-01 |
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| CN201880096022.9A Pending CN112889144A (en) | 2018-10-22 | 2018-10-22 | Flexible substrate, flexible panel and electronic device |
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| CN (1) | CN112889144A (en) |
| WO (1) | WO2020082212A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107665854A (en) * | 2017-09-21 | 2018-02-06 | 京东方科技集团股份有限公司 | Notacoria structure and preparation method thereof, flexible display screen |
| CN107768415A (en) * | 2017-10-30 | 2018-03-06 | 京东方科技集团股份有限公司 | Flexible display device, display device and manufacture method |
| CN107968154A (en) * | 2016-10-20 | 2018-04-27 | 上海和辉光电有限公司 | A kind of display device |
| CN207303146U (en) * | 2017-10-30 | 2018-05-01 | 京东方科技集团股份有限公司 | Flexible display device and display device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013020133A (en) * | 2011-07-12 | 2013-01-31 | Fujitsu Mobile Communications Ltd | Liquid crystal display device and electronic appliance |
| CN106847871B (en) * | 2017-03-22 | 2020-06-16 | 武汉华星光电技术有限公司 | OLED display panel and display device thereof |
-
2018
- 2018-10-22 CN CN201880096022.9A patent/CN112889144A/en active Pending
- 2018-10-22 WO PCT/CN2018/111236 patent/WO2020082212A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107968154A (en) * | 2016-10-20 | 2018-04-27 | 上海和辉光电有限公司 | A kind of display device |
| CN107665854A (en) * | 2017-09-21 | 2018-02-06 | 京东方科技集团股份有限公司 | Notacoria structure and preparation method thereof, flexible display screen |
| CN107768415A (en) * | 2017-10-30 | 2018-03-06 | 京东方科技集团股份有限公司 | Flexible display device, display device and manufacture method |
| CN207303146U (en) * | 2017-10-30 | 2018-05-01 | 京东方科技集团股份有限公司 | Flexible display device and display device |
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| WO2020082212A1 (en) | 2020-04-30 |
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