CN112888167A - Processing method and application of RFPC circuit board - Google Patents
Processing method and application of RFPC circuit board Download PDFInfo
- Publication number
- CN112888167A CN112888167A CN202011572056.6A CN202011572056A CN112888167A CN 112888167 A CN112888167 A CN 112888167A CN 202011572056 A CN202011572056 A CN 202011572056A CN 112888167 A CN112888167 A CN 112888167A
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- Prior art keywords
- area
- board area
- hard
- rfpc
- hard board
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- 238000003672 processing method Methods 0.000 title claims abstract description 14
- 239000002699 waste material Substances 0.000 claims abstract description 47
- 238000004080 punching Methods 0.000 claims abstract description 35
- 238000012545 processing Methods 0.000 claims abstract description 33
- 238000003801 milling Methods 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000005336 cracking Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005520 cutting process Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 238000005553 drilling Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Abstract
The invention provides a processing method of an RFPC circuit board and application thereof, wherein the RFPC circuit board consists of a hard board area and a soft board area, the processing method comprises the steps of removing waste materials in the soft board area by adopting die punching, and removing waste materials in the hard board area by adopting a gong cutter feed, wherein the waste materials in the hard board area and the soft board area are removed by adopting die punching which expands a certain size towards the waste materials in the hard board area. According to the invention, the waste materials of the soft board area and the hard board area are removed by specifically selecting die punching and milling cutter feeding, and the die punching with a certain size is adopted to outwardly expand the waste materials of the hard board area, so that the hard board area-soft board area junction area is removed, the burr problem of the hard board area-soft board area junction area is solved, and the problem of easy cracking of the hard board area ink caused by die punching is solved; the equipment used in the method selected by the invention is common equipment in the field, other processing equipment with high cost is not added, the processing effect is good, and the practical application prospect is excellent.
Description
Technical Field
The invention belongs to the technical field of printed circuit board processing, and particularly relates to a processing method and application of an RFPC circuit board.
Background
RFPC (flexible-rigid connection circuit board) is a flexible printed circuit board which is formed by laminating a polyimide or a polyvinyl acetate film serving as a soft board base material and a prepreg, has high reliability and is excellent, and has the characteristics of high wiring density, light weight and good bending property.
In the production process, in order to prevent the problems of RFPC board scrap and material supplement caused by too many open/short circuits and low yield or reduced rough process problems such as drilling, punching and routing, and evaluate how to select a soft-hard cross-connection circuit board (RFPC) with the best effect for customers, the pre-production pretreatment is particularly important and comprises the following three aspects, one is RFPC board engineering evaluation, which mainly evaluates whether the RFPC board of a client can be produced, whether the production capacity of a company can meet the board making requirement and unit cost of the client, if the engineering evaluation is passed, then the materials need to be prepared immediately to meet the raw material supply of each production link, and finally, engineering files such as layout documents of clients are processed to be suitable for the production environment and the production specification of production equipment, and then production data are transferred to enter a conventional production flow.
Specifically, the production process comprises the steps of cutting, drilling, attaching a dry film, aligning, exposing, developing, etching, demoulding, micro-etching, attaching a covering film, pressing, curing, browning, compounding a base material, cutting edges, punching a target, drilling a second bit, cutting edges, removing glue, cleaning plasma, PTH, electroplating, pretreating, attaching a dry film, aligning, exposing, developing, etching, AOI, pretreating, printing ink, aligning, exposing, developing, baking, cleaning plasma, printing nickel palladium gold, printing characters, milling, punching, electrically testing, finally testing, packaging and shipping, and is widely used for mobile phones, functional wear, tablet computer, etc.
RFPC has obvious hard board area and soft board area due to the complexity of the process, the particularity of the material determines the difference of the forming process, the whole hard board area cannot be formed by a mould, and the soft board area cannot be formed by a milling cutter.
Therefore, there is a need to develop a method for processing an RFPC circuit board that can remove burrs at the interface area between the hard board area and the soft board area, maintain high precision of the external dimensions, achieve low cost, and avoid material waste.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a processing method and application of an RFPC circuit board.
In order to achieve the purpose, the invention adopts the following technical scheme:
a processing method of an RFPC circuit board is disclosed, wherein the RFPC circuit board is composed of a hard board area and a soft board area; the processing method comprises the steps of removing waste materials in the soft board area by adopting die punching, and removing waste materials in the hard board area by adopting milling and feeding.
In the technical scheme, the waste materials in the hard board area and the soft board area are removed by punching by a die which expands a certain size towards the waste materials in the hard board area.
Specifically, in a preferred embodiment of the invention, the scraps in the hard board area-soft board area junction area and the soft board area are removed by punching by a die which expands 0.9-1.2mm towards the scraps in the hard board area.
Further, in the above technical solution, in the joint area between the hard board area and the soft board area, the cutting feed of the gong cutter in the hard board area shrinks a certain size inward toward the waste material in the hard board area.
Specifically, in a preferred embodiment of the invention, a gong cutter feed which retracts 0.45-0.55mm into the waste material of the hard board area is adopted, and the cutter feed processes the waste material of the hard board area.
In detail, in the above technical solution, in the joint area between the hard board area and the soft board area, the die cutting overlaps the processing area of the routing cutter by 0.4-0.6 mm.
Specifically, in a preferred embodiment of the present invention, in a joint area between the hard board area and the soft board area, the die cutting overlaps a processing area of the routing cutter by 0.5 mm.
In detail, in an embodiment of the present invention, the processing method of the RFPC circuit board includes:
s1, pin nails of a positioning hole sleeve mold on the RFPC circuit board are used, wherein the positioning hole on the RFPC circuit board is designed to be 2.0mm, the pin nails of the mold are designed to be 1.97mm, and the wastes of a hard board area-soft board area junction area and a soft board area are removed by punching with the mold which expands 0.9-1.0mm outwards to the wastes of the hard board area;
s2, setting a processing path of the milling cutter feed, mechanically applying pin nails of the positioning hole sleeve die, and processing the waste material of the hard board area by adopting the milling cutter feed which is retracted by 0.5mm towards the waste material of the hard board area.
Specifically, in the above technical solution, in the connecting area between the hard board area and the soft board area, the die punching in step S1 overlaps the processing area of the routing tool in step S2 by 0.5 mm.
The invention also provides the application of the processing method of the RFPC circuit board in the processing of the circuit board.
Compared with the prior art, the invention has the beneficial effects that:
(1) according to the invention, the die punching and the milling cutter feeding are respectively selected to remove the waste materials of the soft board area and the hard board area specifically, and the die punching with a certain size is adopted to extend the waste materials of the hard board area outwards to remove the hard board area-soft board area junction area, so that the burr problem of the hard board area-soft board area junction area is solved, and the problem of cracking of the hard board area ink caused by die punching is solved;
(2) the equipment used in the method selected by the invention is common equipment in the field, other processing equipment with high cost is not added, the processing effect is good, and the practical application prospect is excellent.
Drawings
Fig. 1 is a schematic structural diagram of a processing method of an RFPC circuit board according to an embodiment of the present invention;
in the figure:
a-hard board area, B-soft board area, 1-routing path and 2-die cutting area.
Detailed Description
The present invention is further described in detail below with reference to specific examples so that those skilled in the art can more clearly understand the present invention.
The following examples are provided only for illustrating the present invention and are not intended to limit the scope of the present invention.
Unless otherwise specified, the technical means used in the examples of the present invention are conventional means well known to those skilled in the art.
All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative effort shall fall within the protection scope of the present invention.
As shown in fig. 1, a processing method of an RFPC circuit board includes processing a hard board area a and a soft board area B constituting the RFPC circuit board, respectively, wherein a scrap in the soft board area is removed by die cutting (where 2 is a die cutting area), and a scrap in the hard board area is removed by routing (where 1 is a routing route).
It is important to emphasize that the scrap at the hard-board area-soft-board area interface area is die-cut by a die expanding a certain size towards the scrap of the hard-board area.
In the specific implementation mode of the invention, the waste material of the hard board area-soft board area junction area and the soft board area is removed by punching by a die which expands 0.9-1.2mm towards the waste material of the hard board area.
The die punching outward expansion extends to the hard board waste area by 0.9-1.2mm, so that burrs in the hard board area-soft board area connecting area can be conveniently punched and removed, if the outward expansion extends too much, edge ink cracking or poor step position can be caused, if the outward expansion extends insufficiently, punching cannot be performed, and a large amount of burrs are generated in the hard board area-soft board area connecting area.
In an embodiment of the present invention, the milling cutter is used for milling in a hard board area, and in particular, in a joint area between the hard board area and the soft board area, the milling cutter is retracted to a certain size towards the waste material in the hard board area.
In the specific implementation mode of the invention, a milling cutter feed which retracts 0.45-0.55mm towards the waste material in the hard board area is adopted, and the milling cutter feed processes the waste material in the hard board area.
The milling cutter feeding is contracted by 0.45-0.55mm, so that burrs are prevented from being generated in a hard board area-soft board area handover area or a soft board area, if the milling cutter feeding is too much in the waste material of the hard board area, die cutting and milling cutter feeding cannot be connected possibly, a large amount of burrs are generated in the hard board area-soft board area handover area, and if the milling cutter feeding is too little in the waste material of the hard board area, the milling cutter feeding is too much in the soft board area to influence the size of the soft board area.
Wherein, it needs to be emphasized that, in the joint area of the hard board area and the soft board area, the die punching and the processing area of the routing cutter are overlapped by 0.4-0.6 mm.
The overlap of the die punching and the processing area of the milling cutter feed is 0.4-0.6mm, so that burrs at the overlapped position can be cleaned conveniently. Specifically, if the overlapping position is too large, the die punches the hard plate area to cause edge ink cracking or poor step position; if the overlapping position is smaller, the connection is not in place, and burrs on the edge of the product are not easy to wash off.
In one embodiment of the present invention, in a joint area between the hard board area and the soft board area, the die punching overlaps a processing area of the routing tool by 0.5 mm.
In detail, in a preferred embodiment of the present invention, a method for processing an RFPC board includes:
s1, pin nails of a positioning hole sleeve mold on the RFPC circuit board are used, wherein the positioning hole on the RFPC circuit board is designed to be 2.0mm, the pin nails of the mold are designed to be 1.97mm, and the wastes of a hard board area-soft board area junction area and a soft board area are removed by punching with the mold which expands 0.9-1.0mm outwards to the wastes of the hard board area;
s2, setting a processing path of the milling cutter feed, mechanically applying pin nails of the positioning hole sleeve die, and processing the waste material of the hard board area by adopting the milling cutter feed which is retracted by 0.5mm towards the waste material of the hard board area.
In the connecting area between the hard board area and the soft board area, the outward expansion size of the die punching in the step S1 is within 0.9-1.0mm, and the inward contraction size of the milling cutter feed in the step S2 is within 0.5mm, so that the die punching in the step S1 is only required to be overlapped with the processing area of the milling cutter feed in the step S2 by 0.5 mm.
According to the embodiment of the invention, the die punching and the milling cutter feeding are respectively selected to remove the waste materials of the soft board area and the hard board area, and the die punching with a certain size is expanded to the waste materials of the hard board area to remove the hard board area-soft board area junction area, so that the burr problem of the hard board area-soft board area junction area is solved, and the problem of cracking of the hard board area ink caused by die punching is solved; the equipment used in the method selected by the embodiment of the invention is common equipment in the field, other processing equipment with high cost is not added, the processing effect is good, and the practical application prospect is excellent.
Finally, the method of the present invention is only a preferred embodiment and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A processing method of an RFPC circuit board is characterized in that,
the RFPC circuit board consists of a hard board area and a soft board area;
the processing method comprises the steps of removing waste materials in the soft board area by adopting die punching, and removing waste materials in the hard board area by adopting milling and feeding.
2. The method of claim 1, wherein the RFPC board is processed by a processing tool,
and punching by adopting a die which expands a certain size towards the waste material in the hard board area, and removing the waste material in the hard board area-soft board area junction area and the soft board area.
3. The method of claim 2, wherein the RFPC board is processed by a processing tool,
and punching by adopting a die which expands 0.9-1.2mm towards the waste material of the hard board area, and removing the waste material of the hard board area-soft board area junction area and the soft board area.
4. The method of manufacturing an RFPC board according to claim 1 or 2, wherein,
and in the joint area of the hard board area and the soft board area, the milling cutter feed is processed in the hard board area and shrinks a certain size towards the waste material in the hard board area.
5. The method of claim 4, wherein the RFPC board is processed by a processing tool,
and (3) performing routing processing on the waste material in the hard board area by adopting a routing cutter which retracts 0.45-0.55mm into the waste material in the hard board area.
6. The method of manufacturing an RFPC board of any one of claims 2-5, wherein,
and in the joint area of the hard board area and the soft board area, the die punching and the processing area of the milling cutter feed are overlapped by 0.4-0.6 mm.
7. The method of claim 6, wherein the RFPC board is processed by a processing tool,
and in the joint area of the hard board area and the soft board area, the die punching and the processing area of the milling cutter feed are overlapped by 0.5 mm.
8. The method of manufacturing an RFPC board of any one of claims 1-7, wherein,
the method comprises the following steps:
s1, pin nails of a positioning hole sleeve mold on the RFPC circuit board are used, wherein the positioning hole on the RFPC circuit board is designed to be 2.0mm, the pin nails of the mold are designed to be 1.97mm, and the wastes of a hard board area-soft board area junction area and a soft board area are removed by punching with the mold which expands 0.9-1.0mm outwards to the wastes of the hard board area;
s2, setting a processing path of the milling cutter feed, mechanically applying pin nails of the positioning hole sleeve die, and processing the waste material of the hard board area by adopting the milling cutter feed which is retracted by 0.5mm towards the waste material of the hard board area.
9. The method of claim 8, wherein the RFPC board is processed by a processing tool,
in the joint area between the hard board area and the soft board area, the die punching in step S1 overlaps the processing area of the routing cutter in step S2 by 0.5 mm.
10. Use of the method of any one of claims 1-9 for the manufacture of an RFPC circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011572056.6A CN112888167A (en) | 2020-12-27 | 2020-12-27 | Processing method and application of RFPC circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011572056.6A CN112888167A (en) | 2020-12-27 | 2020-12-27 | Processing method and application of RFPC circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112888167A true CN112888167A (en) | 2021-06-01 |
Family
ID=76043696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011572056.6A Pending CN112888167A (en) | 2020-12-27 | 2020-12-27 | Processing method and application of RFPC circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112888167A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101494956A (en) * | 2008-01-23 | 2009-07-29 | 富葵精密组件(深圳)有限公司 | Method for preparing soft hard combined board |
| CN105025661A (en) * | 2015-07-17 | 2015-11-04 | 深圳崇达多层线路板有限公司 | Manufacturing method of flexible-rigid printed circuit board |
| CN106658970A (en) * | 2016-12-16 | 2017-05-10 | 深圳崇达多层线路板有限公司 | Processing method for removing burrs from flexible printed circuit board region of rigid-flexible printed circuit board |
| CN108156758A (en) * | 2017-12-28 | 2018-06-12 | 信利光电股份有限公司 | A kind of soft or hard junction burr ameliorative way of Rigid Flex |
-
2020
- 2020-12-27 CN CN202011572056.6A patent/CN112888167A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101494956A (en) * | 2008-01-23 | 2009-07-29 | 富葵精密组件(深圳)有限公司 | Method for preparing soft hard combined board |
| CN105025661A (en) * | 2015-07-17 | 2015-11-04 | 深圳崇达多层线路板有限公司 | Manufacturing method of flexible-rigid printed circuit board |
| CN106658970A (en) * | 2016-12-16 | 2017-05-10 | 深圳崇达多层线路板有限公司 | Processing method for removing burrs from flexible printed circuit board region of rigid-flexible printed circuit board |
| CN108156758A (en) * | 2017-12-28 | 2018-06-12 | 信利光电股份有限公司 | A kind of soft or hard junction burr ameliorative way of Rigid Flex |
Non-Patent Citations (1)
| Title |
|---|
| 何凯等: "刚挠板先冲后铣配合成型毛刺问题的研究", 《印制电路信息》 * |
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Application publication date: 20210601 |