CN106658970A - Processing method for removing burrs from flexible printed circuit board region of rigid-flexible printed circuit board - Google Patents

Processing method for removing burrs from flexible printed circuit board region of rigid-flexible printed circuit board Download PDF

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Publication number
CN106658970A
CN106658970A CN201611169156.8A CN201611169156A CN106658970A CN 106658970 A CN106658970 A CN 106658970A CN 201611169156 A CN201611169156 A CN 201611169156A CN 106658970 A CN106658970 A CN 106658970A
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China
Prior art keywords
board
flexible
area
processing method
line
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Granted
Application number
CN201611169156.8A
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Chinese (zh)
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CN106658970B (en
Inventor
吴志坚
何淼
覃红秀
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Shenzhen Suntak Multilayer PCB Co Ltd
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Shenzhen Suntak Multilayer PCB Co Ltd
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228Cutting, sawing, milling or shearing

Abstract

The invention relates to a processing method for removing burrs from a flexible printed circuit board region of a rigid-flexible printed circuit board. The processing method comprises the following steps of expanding along the two sides of a flexible printed circuit board in a non-linking position in a flexible region to a waste material region for a certain dimension, and feeding by adopting a shaping milling cutter; and after uncovering, adopting laser cutting along the outline of the flexible printed circuit board in the non-linking position in the flexible region to remove an outward-expansion part. According to the processing method, the step of expanding along the two sides of the flexible printed circuit board in the non-linking position of the flexible region to the waste material region for a certain dimension is performed by the shaping milling cutter in advance; then uncovering is carried out, and by adopting laser cutting, the outward-expansion part is removed along the outline of the flexible printed circuit board in the non-linking position in the flexible region, so that manual repairing is not required; the high precision of the outline precision of the flexible printed circuit board is maintained; the problem of burrs on the two sides of the flexible printed circuit board in the flexible region is solved; and effects of low cost and no waste of material are achieved.

Description

A kind of processing method for removing rigid-flex combined board flexible board area burr
Technical field
The present invention relates to the technical field that rigid-flex combined board makes, more specifically refers to that a kind of removal rigid-flex combined board is soft The processing method of plate area burr.
Background technology
Printed circuit board industry, the preparation method of existing rigid-flex combined board flexible region is as shown in figure 1, by flexible region before pressing Gummosis PP gongs are not empty, make windowing design, removed unbonded hardboard by gong milling after pressing, form flexible region.
The both sides of the soft board of the non-link bit in flexible region need milling cutter gong to break, because soft board is PI materials, made of soft, and nothing Support, milling cutter occurs twining silk during gong milling, and chip removal is not smooth, causes blade cutting not smooth, pulls flexible board substrate, and hair occur in the both sides of soft board Thorn.
Chinese patent 201510985046.8 is open to reduce method that burr is produced during rigid-flex combined board gong plate and just Flex combined board, method includes step:A strata ester film is sticked in the flex plate plate face of rigid-flex combined board;Using gong plate mode into Type, gong knife is used in gong plate, completes to tear polyester film after gong plate.Polyester is sticked in flex plate plate face by elder generation Film, is then molded using gong plate mode, can improve production efficiency, reduces cost, product is not stratified, do not collapse oil and do not produce hair Thorn, improves product yield.
A strata ester film is sticked using the flex plate plate face in rigid-flex combined board in above-mentioned patent, gong plate side is being carried out Formula is molded, and can cause the waste of material of polyester film.
Therefore, it is necessary to the processing method for designing a kind of removal rigid-flex combined board flexible board area burr, soft to solve flexible region The problem of plate Side burrL, keeps the high accuracy of soft board appearance and size, reaches the effect of low cost and non-waste of materials.
The content of the invention
It is an object of the invention to overcome the defect of prior art, there is provided a kind of removal rigid-flex combined board flexible board area burr Processing method.
For achieving the above object, the present invention is employed the following technical solutions:A kind of removal rigid-flex combined board flexible board area burr Processing method, methods described includes:
The lateral garbage area of soft board two along the non-link bit in flexible region extends out certain size, using shaping gong knife feed;
After taking off lid, along the trim line of the soft board of the non-link bit in flexible region, using laser cutting, flared portions are removed.
Its further technical scheme is:The lateral garbage area of soft board two along the non-link bit in flexible region extends out a scale It is very little, using the step of shaping gong knife feed, including step in detail below:
In the position of rigid-flexible combination, shaping gong knife is stretched along the trim line of the soft board of the non-link bit in flexible region in vertical direction Enter the soft board region feed 0.4mm to 0.6mm of the non-link bit in flexible region;
The lateral garbage area of soft board two that shaping gong knife turns round along the non-link bit in flexible region extends out feed.
Its further technical scheme is:The shaping gong knife turns round along the lateral garbage area of soft board two of the non-link bit in flexible region In the step of extending out feed, the lateral garbage area of soft board two specifically along the non-link bit in flexible region extends out 0.3mm to 0.5mm and walks Knife.
Its further technical scheme is:The shaping gong knife turns round along the lateral garbage area of soft board two of the non-link bit in flexible region In the step of extending out feed, the lateral garbage area of soft board two specifically along the non-link bit in flexible region extends out 0.4mm feeds.
Its further technical scheme is:It is described to take off after lid, along the trim line of the soft board of the non-link bit in flexible region, using laser In the step of cutting, removal flared portions, the line of cut top of the laser cutting is provided with overhead kick angle.
Its further technical scheme is:The line of cut top of the laser cutting in arc shaped arrange, arc length be 0.8mm extremely 1mm。
Its further technical scheme is:The line of cut top of the laser cutting overlaps with the line of cut of the shaping gong knife 0.2mm to 0.4mm.
Its further technical scheme is:The line of cut top of the laser cutting overlaps with the line of cut of the shaping gong knife 0.3mm。
Its further technical scheme is:The length at the overhead kick angle at the line of cut top of the laser cutting be 0.8mm extremely 1.2mm。
Its further technical scheme is:The starting point at the overhead kick angle at the line of cut top of the laser cutting is apart from described hard Plate region 0.1mm to 0.3mm.
Compared with the prior art, the invention has the advantages that:The a kind of of the present invention solves rigid-flex combined board soft board deburring Method, by advance using being molded gong knife and extend out certain size along the lateral garbage area of soft board two of the non-link bit in flexible region After walking knife cutting, carry out taking off lid process, then by the way of laser cutting along the non-link bit in flexible region soft board trim line, Flared portions are removed, while the burrs on edges of soft board also cuts off in the lump, without the need for manual repairing, the height of the appearance and size of soft board is kept Precision, solves the problems, such as flexible region soft board Side burrL, reaches the effect of low cost and non-waste of materials.
Below in conjunction with the accompanying drawings the invention will be further described with specific embodiment.
Description of the drawings
Fig. 1 is the making view of existing rigid-flex combined board;
A kind of knot of the processing method of removal rigid-flex combined board flexible board area burr that Fig. 2 is provided for the specific embodiment of the invention Structure schematic diagram;
A kind of stream of the processing method of removal rigid-flex combined board flexible board area burr that Fig. 3 is provided for the specific embodiment of the invention Cheng Tu.
Specific embodiment
In order to more fully understand the technology contents of the present invention, technical scheme is entered with reference to specific embodiment One step introduction and explanation, but it is not limited to this.
Specific embodiment as shown in Fig. 2 to 3, a kind of removal rigid-flex combined board flexible board area burr that the present embodiment is provided Processing method, can be used in the manufacturing process of rigid-flex combined board, and realization solves the problems, such as flexible region soft board Side burrL, soft Plate appearance and size high precision and low cost, not waste of materials.
As shown in figure 3, a kind of processing method for removing rigid-flex combined board flexible board area burr, the method includes:
S1, the lateral garbage area of soft board two along the non-link bit in flexible region extend out certain size, using shaping gong knife feed;
S2, take off after lid, along the trim line of the soft board of the non-link bit in flexible region, using laser cutting, remove flared portions.
As shown in Fig. 2 the dotted line in figure is the feed line for being molded gong knife, that is, it is molded the line of cut of gong knife;Solid line is laser The line of cut of cutting.
It is first using shaping gong knife feed, to along the soft board both sides of the non-link bit in flexible region for above-mentioned S1 steps Certain size is extended out to garbage area to be cut, can quickly cut thicker waste material, while for the laser of follow-up S2 steps Cutting is prepared.
Above-mentioned S2 steps, after taking off lid, along the trim line of the soft board of the non-link bit in flexible region, using laser cutting, remove The step of flared portions, waste material must be carried out first taking off lid process here, it is ensured that thickness during cutting is that laser cutting permits Perhaps in the range of depth of cut, it is to avoid the incomplete phenomenon of cutting occur, using laser along the soft of the non-link bit in flexible region The profile wire cutting of plate, can keep the prototype of the appearance and size of soft board so that the dimensional accuracy of soft board profile is high.
After the completion of shaping gong knife feed, then along the soft board profile of the non-link bit in flexible region by the way of laser cutting Line is cut, and soft board burrs on edges is also cut out, without the need for manual repairing, and soft board appearance and size high precision.
For above-mentioned S2 steps, the lateral garbage area of soft board two along the non-link bit in flexible region extends out certain size, adopts The step of shaping gong knife feed, including step in detail below:
In the position of rigid-flexible combination, shaping gong knife is stretched along the trim line of the soft board of the non-link bit in flexible region in vertical direction Enter the soft board region feed 0.4mm to 0.6mm of the non-link bit in flexible region;
The lateral garbage area of soft board two that shaping gong knife turns round along the non-link bit in flexible region extends out feed.
Specifically, the soft board region feed 0.4mm to 0.6mm of the non-link bit in flexible region is stretched in vertical direction, be in order to It is easy to be molded the feed of gong knife and is easy to keep the smooth of outward appearance.
Shaping gong knife turn round along the lateral garbage area of soft board two of the non-link bit in flexible region extend out feed the step of in, specifically The lateral garbage area of soft board two along the non-link bit in flexible region extends out 0.3mm to 0.5mm feeds, is herein for the ease of post laser Flash removed is removed in cutting.
Preferably, it is molded the lateral garbage area of soft board two after gong knife turns round along the non-link bit in flexible region and extends out 0.4mm feeds.
Certainly, in other embodiment, above-mentioned shaping gong knife is laterally useless along the soft board two of the non-link bit in flexible region after turning round Material area extends out any value feed between 0.3mm to 0.5mm.
Preferably, the above-mentioned position in rigid-flexible combination, is molded trim line of the gong knife along the soft board of the non-link bit in flexible region, The step of vertical direction stretches into the soft board region feed 0.4mm to 0.6mm of the non-link bit in flexible region, specifically in vertical direction Stretch into the soft board region feed 0.5mm of the non-link bit in flexible region, in order to be easy to feed and keep the smooth of outward appearance.
Certainly, in other embodiment, above-mentioned stretches into the soft board region feed of the non-link bit in flexible region in vertical direction Length can also be any value between 0.4mm to 0.6mm.
For above-mentioned S2 steps, after taking off lid, along the trim line of the soft board of the non-link bit in flexible region, using laser cutting, In the step of removing flared portions, the line of cut top of the laser cutting is provided with overhead kick angle.Overhead kick angle is set and causes garbage area Completely disengage from soft board, it is to avoid the situation of marginal portion bonding occur.
Further, the line of cut top of laser cutting arranges that arc length is 0.8mm to 1mm in arc shaped.So can be with It is easy to the feed of laser cutting, also for the ending for being easy to laser cutting.
Specifically, the line of cut top of laser cutting overlaps 0.2mm to 0.4mm with the line of cut of shaping gong knife.Here have That the line of cut of laser cutting overlaps with the line of cut for being molded gong knife near hardboard region part body, be herein in order to Keep the round and smooth, smooth of soft board edge, it is to avoid the phenomenon of layering occurs in the cutting of laser cutting and shaping gong knife.
Preferably, the line of cut top of laser cutting overlaps 0.3mm with the line of cut of shaping gong knife, certainly, in other realities In applying example, the length that the line of cut top of laser cutting overlaps with the line of cut of shaping gong knife can also be 0.2mm's to 0.4mm Any value.
Further, the length at the overhead kick angle at the line of cut top of laser cutting is 0.8mm to 1.2mm.
Preferably, the length at the overhead kick angle at the line of cut top of above-mentioned laser cutting is 1.0mm;Certainly, in other realities Apply example, the length at the overhead kick angle at the line of cut top of above-mentioned laser cutting can be the arbitrary number between 0.8mm to 1.2mm Value.
In addition, the starting point at the overhead kick angle at the line of cut top of above-mentioned laser cutting is apart from the hardboard region 0.1mm To 0.3mm, so, it is to avoid the damage for laser cutting being produced to hardboard region and being caused, the heat being also prevented from around laser cutting Amount causes the damage in hardboard region.
Preferably, the starting point at the overhead kick angle at the line of cut top of laser cutting is apart from the hardboard region 0.2mm.
Certainly, in other embodiment, the starting point at the overhead kick angle at the line of cut top of above-mentioned laser cutting is apart from described Hardboard region can be any value between 0.1mm to 0.3mm.
The feed of above-mentioned laser cutting and shaping gong knife is all perpendicular to the longitudinal direction cutting of steel flex combined board.
The method of above-mentioned a kind of solution rigid-flex combined board soft board deburring, by advance using shaping gong knife along flexibility The lateral garbage area of soft board two of the non-link bit in area extends out certain size to be carried out after feed cutting, carries out taking off lid process, then using sharp The mode of light cutting removes flared portions, while the burrs on edges of soft board along the trim line of the soft board of the non-link bit in flexible region Cut off in the lump, without the need for manual repairing, keep the high accuracy of the appearance and size of soft board, solve asking for flexible region soft board Side burrL Topic, reaches the effect of low cost and non-waste of materials.
The above-mentioned technology contents that the present invention is only further illustrated with embodiment, are easier to understand in order to reader, but not Represent embodiments of the present invention and be only limitted to this, any technology done according to the present invention extends or recreates, by the present invention's Protection.Protection scope of the present invention is defined by claims.

Claims (10)

1. a kind of processing method for removing rigid-flex combined board flexible board area burr, it is characterised in that methods described includes:
The lateral garbage area of soft board two along the non-link bit in flexible region extends out certain size, using shaping gong knife feed;
After taking off lid, along the trim line of the soft board of the non-link bit in flexible region, using laser cutting, flared portions are removed.
2. a kind of processing method for removing rigid-flex combined board flexible board area burr according to claim 1, it is characterised in that institute State the lateral garbage area of soft board two along the non-link bit in flexible region and extend out certain size, using the step of shaping gong knife feed, including Step in detail below:
In the position of rigid-flexible combination, shaping gong knife is stretched in vertical direction and scratched along the trim line of the soft board of the non-link bit in flexible region The soft board region feed 0.4mm to 0.6mm of the non-link bit in property area;
The lateral garbage area of soft board two that shaping gong knife turns round along the non-link bit in flexible region extends out feed.
3. a kind of processing method for removing rigid-flex combined board flexible board area burr according to claim 2, it is characterised in that institute State shaping gong knife turn round along the lateral garbage area of soft board two of the non-link bit in flexible region extend out feed the step of in, specifically along flexible The lateral garbage area of soft board two of the non-link bit in area extends out 0.3mm to 0.5mm feeds.
4. a kind of processing method for removing rigid-flex combined board flexible board area burr according to claim 3, it is characterised in that institute State shaping gong knife turn round along the lateral garbage area of soft board two of the non-link bit in flexible region extend out feed the step of in, specifically along flexible The lateral garbage area of soft board two of the non-link bit in area extends out 0.4mm feeds.
5. the processing method of a kind of removal rigid-flex combined board flexible board area burr according to any one of Claims 1-4, it is special Levy and be, it is described to take off after lid, along the trim line of the soft board of the non-link bit in flexible region, using laser cutting, remove flared portions In step, the line of cut top of the laser cutting is provided with overhead kick angle.
6. a kind of processing method for removing rigid-flex combined board flexible board area burr according to claim 5, it is characterised in that institute The line of cut top for stating laser cutting arranges that arc length is 0.8mm to 1mm in arc shaped.
7. a kind of processing method for removing rigid-flex combined board flexible board area burr according to claim 6, it is characterised in that institute The line of cut at the line of cut top and the shaping gong knife of stating laser cutting overlaps 0.2mm to 0.4mm.
8. a kind of processing method for removing rigid-flex combined board flexible board area burr according to claim 7, it is characterised in that institute The line of cut at the line of cut top and the shaping gong knife of stating laser cutting overlaps 0.3mm.
9. a kind of processing method for removing rigid-flex combined board flexible board area burr according to claim 8, it is characterised in that institute The length for stating the overhead kick angle at the line of cut top of laser cutting is 0.8mm to 1.2mm.
10. a kind of processing method for removing rigid-flex combined board flexible board area burr according to claim 9, it is characterised in that The starting point at the overhead kick angle at the line of cut top of the laser cutting is apart from the hardboard region 0.1mm to 0.3mm.
CN201611169156.8A 2016-12-16 2016-12-16 A kind of processing method removing rigid-flex combined board flexible board area burr Active CN106658970B (en)

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Cited By (6)

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Publication number Priority date Publication date Assignee Title
CN107995800A (en) * 2017-12-28 2018-05-04 信利光电股份有限公司 The soft board and hardboard associated methods of a kind of Rigid Flex
CN108941890A (en) * 2018-08-13 2018-12-07 上海光臻电子科技有限公司 A kind of processing technology and circuit board of circuit board
CN109089381A (en) * 2018-09-29 2018-12-25 珠海杰赛科技有限公司 A kind of contour processing method of microsize pcb board
CN109743841A (en) * 2019-01-08 2019-05-10 博罗县鸿源华辉电子有限公司 A kind of processing technology of the PCB substrate without burr
CN111586982A (en) * 2020-05-28 2020-08-25 遂宁市广天电子有限公司 Processing method for reducing PCB (printed Circuit Board) out-of-tolerance phenomenon
CN112888167A (en) * 2020-12-27 2021-06-01 黄石西普电子科技有限公司 Processing method and application of RFPC circuit board

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107995800A (en) * 2017-12-28 2018-05-04 信利光电股份有限公司 The soft board and hardboard associated methods of a kind of Rigid Flex
CN107995800B (en) * 2017-12-28 2020-01-03 信利光电股份有限公司 Soft board and hard board combination method of soft and hard combination board
CN108941890A (en) * 2018-08-13 2018-12-07 上海光臻电子科技有限公司 A kind of processing technology and circuit board of circuit board
CN109089381A (en) * 2018-09-29 2018-12-25 珠海杰赛科技有限公司 A kind of contour processing method of microsize pcb board
CN109743841A (en) * 2019-01-08 2019-05-10 博罗县鸿源华辉电子有限公司 A kind of processing technology of the PCB substrate without burr
CN111586982A (en) * 2020-05-28 2020-08-25 遂宁市广天电子有限公司 Processing method for reducing PCB (printed Circuit Board) out-of-tolerance phenomenon
CN112888167A (en) * 2020-12-27 2021-06-01 黄石西普电子科技有限公司 Processing method and application of RFPC circuit board

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