CN112885790A - Electronic device sealing sheet and method for manufacturing electronic device package - Google Patents
Electronic device sealing sheet and method for manufacturing electronic device package Download PDFInfo
- Publication number
- CN112885790A CN112885790A CN202110028151.8A CN202110028151A CN112885790A CN 112885790 A CN112885790 A CN 112885790A CN 202110028151 A CN202110028151 A CN 202110028151A CN 112885790 A CN112885790 A CN 112885790A
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- Prior art keywords
- sealing sheet
- electronic device
- inorganic filler
- resin
- group
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title description 26
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- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 74
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- 150000001875 compounds Chemical class 0.000 claims abstract description 10
- 238000003860 storage Methods 0.000 claims description 8
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- 239000002245 particle Substances 0.000 description 25
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- 238000001723 curing Methods 0.000 description 13
- 238000004381 surface treatment Methods 0.000 description 13
- 239000000178 monomer Substances 0.000 description 9
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- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- CVNKFOIOZXAFBO-UHFFFAOYSA-J tin(4+);tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Sn+4] CVNKFOIOZXAFBO-UHFFFAOYSA-J 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
The invention provides an electronic device sealing sheet which has low viscosity and can be highly filled with an inorganic filler. The solution of the present invention is an electronic device sealing sheet using a compound having a methacryloxy group or an acryloxy group as a silane coupling agent, containing an inorganic filler in a range of 69 to 86 vol%, and having a minimum viscosity in a range of 10 to 1000000Pa · s.
Description
The present application is a divisional application of an application filed by the applicant under the name of "electronic device sealing sheet and method for manufacturing electronic device package" under application No. 201510750350.4. The parent application date was 2015, 11, month 06, and the earliest priority date was 2014, 11, month 07.
Technical Field
The present invention relates to an electronic device sealing sheet and a method for manufacturing an electronic device package.
Background
In the fabrication of electronic device packages, typically employed are: the steps of sealing 1 or more electronic devices fixed to a substrate or the like by bumps or the like with a sealing resin and, if necessary, cutting the sealing body so as to become a package of an electronic device unit. As such a sealing resin, a sheet-like sealing resin may be used (for example, see patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2006-19714
Disclosure of Invention
Problems to be solved by the invention
Examples of the method for manufacturing the package include the following methods: the sealing sheet is laminated so as to cover 1 or more electronic devices arranged on the adherend, and then the sealing sheet is thermally cured. In the package manufactured in this way, there is a problem that the package warps at the time of heat curing or the like due to a difference in thermal expansion coefficient between the resin of the sealing sheet and the electronic device.
As a method for suppressing warpage of the package, for example, a method of increasing the content of the inorganic filler in the sealing sheet is considered. Thereby, the thermal expansion coefficient of the sealing sheet can be made close to that of the electronic device.
However, the problem is that the content of the inorganic filler in the sealing sheet is increased, and the viscosity of the sealing sheet is increased, so that the inorganic filler cannot be contained in a certain amount or more.
The present invention has been made in view of the above problems, and an object thereof is to provide an electronic device sealing sheet which has a low viscosity and can be highly filled with an inorganic filler.
Means for solving the problems
The present inventors have found that the above problems can be solved by adopting the following configuration, and have completed the present invention.
That is, the electronic device sealing sheet according to the present invention is characterized in that,
a compound having a methacryloxy group or an acryloxy group is used as a silane coupling agent,
an inorganic filler is contained in a range of 69 to 86 vol%,
the minimum viscosity is in the range of 10 to 1000000Pa · s.
According to the above configuration, a compound having a methacryloxy group or an acryloxy group that is not reactive with the thermosetting resin is used as the silane coupling agent. Therefore, an increase in viscosity due to the reaction with the thermosetting resin can be suppressed. In addition, since an increase in viscosity due to a reaction with the thermosetting resin can be suppressed, the content of the inorganic filler can be increased.
Since the inorganic filler is contained in a range of 69 to 86 vol%, the thermal expansion coefficient can be made close to that of an electronic device. As a result, warpage of the package can be suppressed. Further, since the inorganic filler is contained in a range of 69 to 86 vol%, the water absorption rate can be reduced. In addition, the viscosity rise is suppressed within a range of 10 to 1000000Pa · s as the minimum viscosity. As a result, the reliability of the electronic device package manufactured using the electronic device sealing sheet can be improved.
In the above constitution, when the tensile storage elastic modulus at 50 ℃ is X and the minimum viscosity is Y, the ratio X/Y is preferably in the range of 15 to 100.
As a result of intensive studies based on experimental results and the like, the present inventors have found that when the ratio X/Y is 15 or more, both workability as a sheet and followability to a member at the time of molding can be achieved, and molding can be performed with high yield. On the other hand, it was found that when the ratio X/Y is 100 or less, the sheet is not excessively hard, and therefore, the sheet can be prevented from being broken or chipped at the time of molding.
In the above configuration, the inorganic filler is preferably surface-treated with the silane coupling agent in advance.
When the surface of the inorganic filler is treated with a silane coupling agent, outgas (e.g., methanol) is generated. Therefore, if the surface treatment of the inorganic filler with the silane coupling agent is carried out in advance at a stage before the electronic device sealing sheet is produced, the outgas at this stage can be eliminated. As a result, the amount of outgas sealed in the electronic device sealing sheet can be suppressed when the electronic device sealing sheet is produced, and the occurrence of voids can be reduced.
In the above configuration, the inorganic filler is preferably surface-treated with 0.5 to 2 parts by weight of the silane coupling agent per 100 parts by weight of the inorganic filler.
When the surface treatment of the inorganic filler is performed with a silane coupling agent, the viscosity of the electronic device sealing sheet can be reduced, but when the amount of the silane coupling agent is large, the amount of outgas generated also increases. Therefore, even if the inorganic filler is surface-treated in advance, outgassing occurring when the electronic device sealing sheet is produced may cause a reduction in the performance of the electronic device sealing sheet. On the other hand, if the amount of the silane coupling agent is small, the viscosity cannot be suitably reduced. Therefore, when the inorganic filler is subjected to a surface treatment in advance with 0.5 to 2 parts by weight of the silane coupling agent per 100 parts by weight of the inorganic filler, the viscosity can be suitably reduced and the performance deterioration due to outgassing can be suppressed.
Further, a method for manufacturing an electronic device package according to the present invention includes:
a step of preparing the above-mentioned electronic component sealing sheet,
A laminating step of laminating the electronic component sealing sheet so as to cover 1 or more electronic components arranged on the adherend, and
and a sealing body forming step of curing the electronic device sealing sheet to form a sealing body.
According to the above configuration, since the electronic device sealing sheet is used, the electronic device package manufactured by the method for manufacturing an electronic device package can be suppressed from warping. As a result, the reliability of the manufactured electronic device package can be improved.
Drawings
Fig. 1 is a cross-sectional view schematically showing an electronic device sealing sheet according to an embodiment of the present invention.
Fig. 2A is a view schematically showing one step of the method for manufacturing a hollow package according to the embodiment of the present invention.
Fig. 2B is a view schematically showing one step of the method for manufacturing a hollow package according to the embodiment of the present invention.
Fig. 2C is a view schematically showing one step of the method for manufacturing a hollow package according to the embodiment of the present invention.
Detailed Description
The present invention will be described in detail below with reference to embodiments, but the present invention is not limited to these embodiments.
[ sheet for sealing electronic device ]
Fig. 1 is a cross-sectional view schematically showing an electronic component sealing sheet 11 (hereinafter, also simply referred to as "sealing sheet 11") according to an embodiment of the present invention. The sealing sheet 11 is typically provided in a state of being laminated on a support 11a such as a polyethylene terephthalate (PET) film. In addition, the support 11a may be subjected to a mold release treatment in order to easily peel off the sealing sheet 11.
The sealing sheet 11 uses a compound having a methacryloxy group or an acryloxy group as a silane coupling agent. Since a compound having a methacryloxy group or an acryloxy group that is not reactive with the thermosetting resin is used as the silane coupling agent, an increase in viscosity due to the reaction with the thermosetting resin can be suppressed.
In the present specification, "use of a compound having a methacryloxy group or an acryloxy group as a silane coupling agent" includes:
(1) the case where the inorganic filler is contained in which a compound having a methacryloxy group or an acryloxy group as a silane coupling agent is subjected to a surface treatment in advance, and
(2) in the case where a compound having a methacryloxy group or an acryloxy group is contained as a silane coupling agent in the sealing sheet 11.
The silane coupling agent is not particularly limited as long as it has a methacryloxy group or an acryloxy group and can be subjected to surface treatment of the inorganic filler. Specific examples of the silane coupling agent include 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, methacryloxyoctyltrimethoxysilane and methacryloxyoctyltriethoxysilane. Among them, 3-methacryloxypropyltrimethoxysilane is preferable from the viewpoints of reactivity and cost.
The sealing sheet 11 contains an inorganic filler.
The inorganic filler is not particularly limited, and various conventionally known fillers can be used, and examples thereof include powders of quartz glass, talc, silica (fused silica, crystalline silica, and the like), alumina, aluminum nitride, silicon nitride, and boron nitride. These can be used alone, also can be used in combination of more than 2. Among these, silica and alumina are preferable, and silica is more preferable, because the linear expansion coefficient can be reduced favorably.
The silica is preferably a silica powder, and more preferably a fused silica powder. Examples of the fused silica powder include spherical fused silica powder and crushed fused silica powder, but spherical fused silica powder is preferable from the viewpoint of fluidity.
The sealing sheet 11 preferably contains an inorganic filler in an amount of 69 to 86 vol%. The content is preferably 75% by volume or more, more preferably 78% by volume or more. Since the inorganic filler is contained in a range of 69 to 86% by volume, the thermal expansion coefficient can be made close to that of the SAW chip 13. As a result, warpage of the package can be suppressed. Further, since the inorganic filler is contained in a range of 69 to 86 vol%, the water absorption rate can be reduced.
When the inorganic filler is silica, the content of the inorganic filler can be described in terms of "wt%". The content of silica in the sealing sheet 11 is preferably 80 to 92 wt%, more preferably 85 to 92 wt%.
The inorganic filler preferably has an average particle diameter of 20 μm or less, more preferably 0.1 to 15 μm, and particularly preferably 0.5 to 10 μm.
As the inorganic filler, 2 or more kinds of inorganic fillers having different average particle diameters may be used. When 2 or more types of inorganic fillers having different average particle diameters are used, the above-mentioned "average particle diameter of the inorganic filler is 20 μm or less" means that the average particle diameter of the entire inorganic filler is 20 μm or less.
The shape of the inorganic filler is not particularly limited, and may be any optional shape such as spherical (including ellipsoidal), polyhedral, polygonal columnar, flat, irregular, etc., but spherical is preferable from the viewpoint of achieving a high filling state of a hollow structure and appropriate fluidity.
The inorganic filler contained in the sealing sheet 11 preferably has 2 peaks in the particle size distribution measured by a laser diffraction scattering method. Such an inorganic filler can be obtained by, for example, mixing 2 kinds of inorganic fillers having different average particle diameters. When an inorganic filler having 2 peaks in the particle size distribution is used, the inorganic filler can be filled at a high density. As a result, the content of the inorganic filler can be further increased.
The 2 peaks are not particularly limited, but preferably the peak having a larger particle size is in the range of 3 to 30 μm, and the peak having a smaller particle size is in the range of 0.1 to 1 μm. When the 2 peaks are within the above numerical range, the content of the inorganic filler can be further increased.
Specifically, the particle size distribution can be obtained by the following method.
(a) The sealing sheet 11 was placed in a crucible and was ashed by intense heating at 700 ℃ for 2 hours in an atmospheric atmosphere.
(b) The obtained ash was dispersed in pure water and subjected to ultrasonic treatment for 10 minutes, and the particle size distribution (volume basis) was determined using a laser diffraction scattering particle size distribution measuring apparatus (Beckman coulter, Inc.' LS 13320; wet method).
In addition, as the composition of the sealing sheet 11, organic components other than the inorganic filler were used, and since substantially all of the organic components were burned out by the above-described intense heat treatment, the obtained ash was measured as an inorganic filler. Further, the average particle size may be calculated simultaneously with the particle size distribution.
The sealing sheet 11 is preferably surface-treated with the inorganic filler in advance with the silane coupling agent. That is, the case (1) is preferable. When the surface of the inorganic filler is treated with a silane coupling agent, outgas (e.g., methanol) is generated. Therefore, if the inorganic filler is surface-treated with the silane coupling agent in advance in the stage before the sealing sheet 11 is formed, the outgas at this stage can be eliminated. As a result, the amount of outgas in the sealed sheet can be suppressed when the sealing sheet 11 is produced, and the occurrence of voids can be reduced.
When the sealing sheet 11 contains an inorganic filler having a methacryloxy group or an acryloxy group as a silane coupling agent, which has been subjected to a surface treatment in advance (in the case of (1) above), the inorganic filler is preferably subjected to a surface treatment in advance with 0.5 to 2 parts by weight of the silane coupling agent per 100 parts by weight of the inorganic filler.
When the surface treatment of the inorganic filler is performed with a silane coupling agent, the viscosity of the sealing sheet 11 can be reduced, but when the amount of the silane coupling agent is large, the amount of outgas generated also increases. Therefore, even if the inorganic filler is surface-treated in advance, outgassing occurring when the sealing sheet 11 is produced may cause a reduction in the performance of the sealing sheet 11. On the other hand, if the amount of the silane coupling agent is small, the viscosity cannot be suitably reduced. Therefore, when the inorganic filler is subjected to a surface treatment in advance with 0.5 to 2 parts by weight of the silane coupling agent per 100 parts by weight of the inorganic filler, the viscosity can be suitably reduced and the performance degradation due to outgassing can be suppressed.
When the sealing sheet 11 contains an inorganic filler having a methacryloxy group or an acryloxy group as a silane coupling agent, which has been subjected to a surface treatment in advance (in the case of (1) above), and when a filler obtained by mixing 2 types of inorganic fillers having different average particle diameters is used as the inorganic filler, it is preferable that at least the inorganic filler having a small average particle diameter is subjected to a surface treatment with a silane coupling agent in advance. Since the inorganic filler having a small average particle diameter has a large specific surface area, the increase in viscosity can be further suppressed.
When an inorganic filler obtained by mixing 2 kinds of inorganic fillers having different average particle diameters is used as the inorganic filler, it is more preferable that both the inorganic filler having a small average particle diameter and the inorganic filler having a large average particle diameter are surface-treated with a silane coupling agent in advance. In this case, the viscosity can be further suppressed from increasing.
When the sealing sheet 11 contains a compound having a methacryloxy group or an acryloxy group as a silane coupling agent (in the case of (2) above), the content of the silane coupling agent in the sealing sheet 11 is preferably 0.4 to 1.8% by weight. When the content is 0.4% by weight or more, the viscosity can be suitably reduced. On the other hand, if the content is 1.8% by weight or less, the generation of outgas can be suppressed.
The minimum viscosity Y of the sealing sheet 11 is in the range of 10 to 1000000 pas, preferably 5000 to 800000 pas, and more preferably 10000 to 700000 pas. Since the minimum viscosity of the sealing sheet 11 is within the range of 10 to 1000000Pa · s, the viscosity increase is suppressed.
The sealing sheet 11 has a ratio X/Y of preferably 15 to 100(1/s), more preferably 20 to 80(1/s), and still more preferably 30 to 60(1/s) when the tensile storage elastic modulus at 50 ℃ is X and the minimum viscosity is Y. When the ratio X/Y is 15 or more, the workability as a sheet and the following property to a member at the time of molding can be both achieved, and molding can be performed with high yield. On the other hand, if the ratio X/Y is 100 or less, the sheet is not excessively hard, and therefore, the sheet can be prevented from being broken or chipped at the time of molding.
The sealing sheet 11 preferably has a tensile storage elastic modulus X at 50 ℃ in the range of 200000 to 40000000Pa, more preferably 500000 to 13000000Pa, and still more preferably 1000000 to 12000000 Pa. When the tensile storage elastic modulus X is 200000Pa or more, the sheet is firm (the lumbar cross あり) and good in handling property. On the other hand, when the tensile storage elastic modulus X is 40000000Pa or less, cracking and chipping at the time of handling can be prevented.
The sealing sheet 11 preferably contains an epoxy resin and a phenol resin. Thus, a good thermosetting property can be obtained.
The epoxy resin is not particularly limited. Various epoxy resins such as triphenylmethane type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, modified bisphenol a type epoxy resin, bisphenol F type epoxy resin, modified bisphenol F type epoxy resin, dicyclopentadiene type epoxy resin, phenol novolac type epoxy resin, phenoxy resin, and the like can be used. These epoxy resins may be used alone or in combination of 2 or more.
From the viewpoint of securing toughness after curing of the epoxy resin and reactivity of the epoxy resin, a material which is solid at room temperature having an epoxy equivalent of 150 to 250 and a softening point or melting point of 50 to 130 ℃ is preferred, and among them, from the viewpoint of moldability and reliability, bisphenol F type epoxy resin, bisphenol a type epoxy resin, biphenyl type epoxy resin, and the like are more preferred.
The phenolic resin is not particularly limited as long as it is a substance that causes a curing reaction with the epoxy resin. For example, phenol novolac resin, phenol aralkyl resin, biphenyl aralkyl resin, dicyclopentadiene type phenol resin, cresol novolac resin, resol type phenol resin, and the like are used. These phenol resins may be used alone, or 2 or more of them may be used in combination.
The phenolic resin is preferably a phenolic resin having a hydroxyl equivalent weight of 70 to 250 and a softening point of 50 to 110 ℃ from the viewpoint of reactivity with an epoxy resin, and among these, a phenol novolac resin can be suitably used from the viewpoint of high curing reactivity and low cost. In addition, from the viewpoint of reliability, a resin having low moisture absorption such as a phenol aralkyl resin or a biphenyl aralkyl resin can be suitably used.
From the viewpoint of curing reactivity, the mixing ratio of the epoxy resin and the phenol resin is preferably 0.7 to 1.5 equivalents, and more preferably 0.9 to 1.2 equivalents, based on 1 equivalent of the epoxy group in the epoxy resin, based on the total amount of the hydroxyl groups in the phenol resin.
The lower limit of the total content of the epoxy resin and the phenol resin in the sealing sheet 11 is preferably 5.0 wt% or more, and more preferably 7.0 wt% or more. When the content is 5.0% by weight or more, the adhesive strength to an electronic device, a substrate, or the like can be favorably obtained. On the other hand, the upper limit of the total content is preferably 25% by weight or less, and more preferably 20% by weight or less. When the content is 25% by weight or less, the moisture absorption of the sealing sheet can be reduced.
The sealing sheet 11 preferably contains a thermoplastic resin. This improves the heat resistance, flexibility and strength of the obtained sealing sheet for hollow sealing.
Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, an ethylene-vinyl acetate copolymer, an ethylene-acrylic acid ester copolymer, a polybutadiene resin, a polycarbonate resin, a thermoplastic polyimide resin, a polyamide resin such as 6-nylon or 6, 6-nylon, a phenoxy resin, an acrylic resin, a saturated polyester resin such as PET or PBT, a polyamideimide resin, a fluorine-containing resin, and a styrene-isobutylene-styrene block copolymer. These thermoplastic resins may be used alone or in combination of 2 or more. Among them, acrylic resins are preferred from the viewpoint of easy availability of flexibility and good dispersibility with epoxy resins.
The acrylic resin is not particularly limited, and examples thereof include polymers (acrylic copolymers) containing 1 or 2 or more species of esters of acrylic acid or methacrylic acid having a linear or branched alkyl group having 30 or less carbon atoms, particularly having 4 to 18 carbon atoms. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a tert-butyl group, an isobutyl group, a pentyl group, an isopentyl group, a hexyl group, a heptyl group, a cyclohexyl group, a 2-ethylhexyl group, an octyl group, an isooctyl group, a nonyl group, an isononyl group, a decyl group, an isodecyl group, an undecyl group, a lauryl group, a tridecyl group, a tetradecyl group, a stearyl group, an octadecyl group, and a dodecyl group.
The glass transition temperature (Tg) of the acrylic resin is preferably 50 ℃ or lower, more preferably-70 to 20 ℃, and still more preferably-50 to 0 ℃. By setting the temperature to 50 ℃ or lower, the sheet can be made flexible.
Among the acrylic resins, a resin having a weight average molecular weight of 5 ten thousand or more is preferable, a resin having a weight average molecular weight of 10 ten thousand to 200 ten thousand is more preferable, and a resin having a weight average molecular weight of 30 ten thousand to 160 ten thousand is even more preferable. When the amount is within the above numerical range, the viscosity and flexibility of the sealing sheet 11 can be further improved. The weight average molecular weight is a value calculated from polystyrene conversion measured by GPC (gel permeation chromatography).
Other monomers for forming the polymer are not particularly limited, and examples thereof include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid, acid anhydride monomers such as maleic anhydride and itaconic anhydride, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl acrylate, hydroxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid, and the like, Sulfonic acid group-containing monomers such as styrenesulfonic acid, allylsulfonic acid, 2- (meth) acrylamido-2-methylpropanesulfonic acid, (meth) acrylamidopropanesulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloyloxynaphthalenesulfonic acid, and phosphoric acid group-containing monomers such as 2-hydroxyethylacryloyl phosphate. Among them, from the viewpoint of being able to react with the epoxy resin to increase the viscosity of the sealing sheet 11, at least one of a carboxyl group-containing monomer, a glycidyl (epoxy) group-containing monomer, and a hydroxyl group-containing monomer is preferably contained.
The content of the thermoplastic resin in the sealing sheet 11 is preferably 0.5 wt% or more, and more preferably 1.0 wt% or more. When the content is 0.5% by weight or more, flexibility and pliability of the sealing sheet can be obtained. The content of the thermoplastic resin in the sealing sheet 11 is preferably 10 wt% or less, and more preferably 5 wt% or less. When the content is 10% by weight or less, the adhesiveness of the sealing sheet to an electronic device or a substrate is good.
The sealing sheet 11 preferably contains a curing accelerator.
The curing accelerator is not particularly limited as long as the curing of the epoxy resin and the phenol resin proceeds, and examples thereof include organic phosphorus compounds such as triphenylphosphine and tetraphenylphosphonium tetraphenylboronate; imidazole compounds such as 2-phenyl-4, 5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole; and the like. Among them, imidazole compounds are preferable because they have good reactivity and the Tg of the cured product is easily increased.
The content of the curing accelerator is preferably 0.1 to 5 parts by weight based on 100 parts by weight of the total of the epoxy resin and the phenol resin.
The sealing sheet 11 may contain a flame retardant component as necessary. This can reduce the expansion of combustion in the event of fire due to short-circuiting of parts, heat generation, or the like. As the flame retardant component, various metal hydroxides such as aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, and composite metal hydroxide; phosphazene flame retardants, and the like.
The sealing sheet 11 preferably contains a pigment. The pigment is not particularly limited, and examples thereof include carbon black.
The content of the pigment in the sealing sheet 11 is preferably 0.1 to 2 wt%. When the content is 0.1% by weight or more, good marking properties can be obtained. When the content is 2% by weight or less, the strength of the cured sealing sheet can be ensured.
In addition, other additives may be appropriately added to the resin composition as needed, in addition to the above-described components.
[ method for producing sealing sheet ]
The sealing sheet 11 can be formed by dissolving and dispersing a resin or the like for forming the sealing sheet 11 in an appropriate solvent to prepare a varnish, applying the varnish to a predetermined thickness on the support 11a to form a coating film, and then drying the coating film under predetermined conditions. The coating method is not particularly limited, and examples thereof include roll coating, screen coating, and gravure coating. The drying is carried out at a drying temperature of 70 to 160 ℃ for a drying time of 1 to 30 minutes, for example. After a varnish is applied to the separator to form a coating film, the coating film may be dried under the above-described drying conditions to form the sealing sheet 11. Then, the sealing sheet 11 and the spacer sheet are bonded to each other on the support 11 a. In the case where the sealing sheet 11 contains a thermoplastic resin (acrylic resin), an epoxy resin, or a phenol resin, in particular, all of them are dissolved in a solvent, and then coated and dried. Examples of the solvent include methyl ethyl ketone, ethyl acetate, and toluene.
The thickness of the sealing sheet 11 is not particularly limited, but is, for example, 100 to 2000 μm. Within the above range, the electronic device can be sealed satisfactorily.
The sealing sheet 11 may have a single-layer structure, or may have a multilayer structure in which 2 or more sealing sheets are stacked.
[ method for manufacturing hollow Package ]
Hereinafter, a case where the SAW chip is hermetically sealed by the sealing sheet 11 will be described.
Fig. 2A to 2C are views each schematically showing one step of the method for manufacturing a hollow package according to the embodiment of the present invention. The hollow sealing method is not particularly limited, and sealing can be performed by a conventionally known method. Examples thereof include the following methods: the uncured sealing sheet 11 is laminated (mounted) on the substrate so as to cover the electronic component on the adherend while maintaining the hollow structure, and then the sealing sheet 11 is cured and sealed. The adherend is not particularly limited, and examples thereof include a printed wiring board, a ceramic substrate, a silicon substrate, and a metal substrate. In the present embodiment, the SAW chip 13 mounted on the printed wiring board 12 is hermetically sealed by the sealing sheet 11 to produce a hollow package. The SAW chip 13 is a chip having a SAW (surface Acoustic wave) filter.
(SAW chip mounting substrate preparation Process)
In the SAW chip mounting substrate preparation step, a printed wiring substrate 12 (see fig. 2A) on which a plurality of SAW chips 13(SAW filters 13) are mounted is prepared. The SAW chip 13 can be formed by dicing a piezoelectric crystal having a predetermined comb-shaped electrode by a known method and then forming the piezoelectric crystal into individual pieces. For mounting the SAW chip 13 on the printed wiring board 12, a known device such as a flip chip bonder or a die bonder can be used. The SAW chip 13 and the printed wiring board 12 are electrically connected by a bump electrode 13a such as a bump. Further, the hollow portion 14 is maintained between the SAW chip 13 and the printed wiring board 12 so as not to obstruct propagation of surface acoustic waves on the surface of the SAW filter. The distance between the SAW chip 13 and the printed wiring board 12 (the width of the hollow portion) can be set appropriately, and is generally about 10 to 100 μm.
(laminating step)
In the laminating step, the sealing sheet 11 is laminated on the printed wiring board 12 so as to cover the SAW chip 13, and the SAW chip 13 is sealed with the sealing sheet 11 by resin (see fig. 2B). The sealing sheet 11 functions as a sealing resin for protecting the SAW chip 13 and components attached thereto from the external environment.
The method of laminating the sealing sheet 11 on the printed wiring board 12 is not particularly limited, and may be performed by a known method such as hot pressing or lamination. The hot pressing conditions include, for example, a temperature of 40 to 150 ℃, preferably 50 to 120 ℃, a pressure of 0.1 to 10MPa, preferably 0.5 to 8MPa, and a time of 0.3 to 10 minutes, preferably 0.5 to 5 minutes. In consideration of improvement in adhesion and conformability of the sealing sheet 11 to the SAW chip 13 and the printed wiring board 12, it is preferable to pressurize the sheet under reduced pressure (for example, 0.01 to 5 kPa).
(Process for Forming sealing Material)
In the sealing body forming step, the sealing sheet 11 is subjected to thermosetting treatment to form the sealing body 15 (see fig. 2B). The heating temperature is preferably 100 ℃ or higher, and more preferably 120 ℃ or higher as the conditions for the heat curing treatment. On the other hand, the upper limit of the heating temperature is preferably 200 ℃ or less, more preferably 180 ℃ or less. The heating time is preferably 10 minutes or more, and more preferably 30 minutes or more. On the other hand, the upper limit of the heating time is preferably 180 minutes or less, and more preferably 120 minutes or less. If necessary, the pressure may be increased, and is preferably 0.1MPa or more, more preferably 0.5MPa or more. On the other hand, the upper limit is preferably 10MPa or less, more preferably 5MPa or less.
(chip cutting Process)
Next, the sealing body 15 may be die-cut (see fig. 2C). Thereby, the hollow package 18 (electronic device package) of the SAW chip 13 unit can be obtained.
(substrate mounting Process)
A substrate mounting step of forming bumps on the hollow package 18 and mounting the bump on a separate substrate (not shown) may be performed as necessary. For mounting the hollow package 18 on the substrate, a known device such as a flip chip bonder or a die bonder can be used.
In the above embodiment, the description has been given of the case where the electronic component sealing sheet 11 is a hollow sealing sheet capable of sealing an electronic component while leaving a hollow portion between an adherend and the electronic component. However, the electronic device sealing sheet in the present invention is not particularly limited as long as it can seal an electronic device. For example, the electronic device sealing sheet may be used to seal an electronic device in such a manner that a hollow portion does not remain between an adherend and the electronic device.
In the above embodiment, the case where the electronic device of the present invention is the SAW chip 13 which is a semiconductor chip having a movable portion is described. However, the electronic device of the present invention is not limited to this example. For example, the semiconductor chip may have mems (micro Electro Mechanical systems) such as a pressure sensor and a vibration sensor as a movable portion. In addition, the semiconductor chip may have no movable portion. In addition, a capacitor, a resistor, or the like may be used.
Examples
Hereinafter, preferred embodiments of the present invention will be described in detail by way of examples. However, the materials, amounts and the like described in the examples are not intended to limit the scope of the present invention.
The components used in the examples are explained below.
Epoxy resin: YSLV-80XY (bisphenol F type epoxy resin, epoxy equivalent 200g/eq., softening point 80 ℃ C.) manufactured by Nippon Fei chemical Co., Ltd
Phenolic resin: LVR8210DL (Novolac phenolic novolak resin, hydroxyl equivalent 104g/eq., softening point 60 ℃ C.)
Thermoplastic resin: HME-2006M (carboxyl group-containing acrylate copolymer, weight average molecular weight: about 60 ten thousand, glass transition temperature (Tg): 35 ℃ C.) manufactured by Kokai Co., Ltd.)
Inorganic filler a: FB-5SDC (average particle diameter: 5 μm) manufactured by the electric chemical industry Co., Ltd is surface-treated with 3-methacryloxypropyltrimethoxysilane (product name: KBM-503 manufactured by shin-Etsu chemical Co., Ltd.). The surface treatment was performed with 1 part by weight of a silane coupling agent with respect to 100 parts by weight of the inorganic filler a.
Inorganic filler B: SO-25R (average particle diameter 0.5 μm) manufactured by admatechs was surface-treated with 3-methacryloxypropyltrimethoxysilane (product name: KBM-503 manufactured by shin-Etsu chemical Co., Ltd.). The surface treatment was performed with 1 part by weight of a silane coupling agent with respect to 100 parts by weight of the inorganic filler B.
Inorganic filler C: FB-5SDC (average particle diameter 5 μm, not surface-treated) manufactured by Electrical chemical industries, Ltd
Inorganic filler D: SO-25R (average particle diameter 0.5 μm, not surface-treated) manufactured by admatechs corporation
Silane coupling agent: 3-Methacryloyloxypropyltrimethoxysilane (KBM-503, product name of shin-Etsu chemical Co., Ltd.)
Carbon black: mitsubishi chemical corporation #20
Curing accelerator: 2PHZ-PW (2-phenyl-4, 5-dihydroxymethylimidazole) manufactured by four national chemical industries Ltd
[ examples and comparative examples ]
The respective components were dissolved and dispersed in methyl ethyl ketone as a solvent at the compounding ratios shown in table 1 to obtain varnishes having a concentration of 90% by weight. This varnish was applied to a release-treated film comprising a polyethylene terephthalate film having a thickness of 38 μm after silicone release treatment, and then dried at 110 ℃ for 5 minutes. Thus, a sheet having a thickness of 65 μm was obtained. The sheets were laminated into 4 layers to prepare a sealing sheet for sealing a hollow having a thickness of 260 μm.
TABLE 1
(tensile storage modulus of elasticity at 50 ℃ C. of the sealing sheet)
The sealing sheets prepared in examples and comparative examples were measured for tensile storage elastic modulus X at 50 ℃ using a viscoelasticity measuring apparatus (manufactured by Rheometric Co., Ltd.: form: RSA-II). Specifically, the prepared sealing sheet was cut to prepare a sample having a size of 30mm in length × 5mm in width, and a measurement sample was set in a jig for film stretching measurement and measured at a frequency of 1Hz, a strain of 0.01%, and a temperature rise rate of 10 ℃/min in a temperature range of-20 ℃ to 100 ℃. The results are shown in table 2.
(measurement of the lowest viscosity of the sealing sheet)
The minimum viscosity of the sealing sheets prepared in examples and comparative examples was measured by a parallel plate method using a rheometer (MARS III, manufactured by HAAKE). In more detail, at a gap of 1mm, a parallel plate diameter of 8mm, a rotation speed of 5s-1The viscosity was measured at a temperature of 50 to 130 ℃ under the conditions of 0.05% strain and a temperature rise rate of 10 ℃/min, and the lowest value of the viscosity at that time was defined as the lowest viscosity. The results are shown in table 2.
Table 2 also shows the ratio X/Y.
(evaluation of flexibility and tackiness of sealing sheet)
2 sheets of the viscoelastic sample were set in a viscoelasticity measuring apparatus (RSA-3 manufactured by TA INSTRUMENT Co., Ltd.)
(diameter 25mm) plate. After the sealing sheets of examples and comparative examples were fixed to the lower plate among the 2 plates by a double-sided tape, the upper plate (probe) was lowered in an atmosphere of 25 ℃, and the upper plate was pressed against the sealing sheet with a load of 100 g. Then, the load required to peel the upper plate from the sealing sheet by raising the upper plate was measured. The load of 5g or more was evaluated as O, and the load of less than 5g was evaluated as X. The results are shown in table 2.
(evaluation of warpage after curing)
The warpage amount after curing of the sealing sheets of examples and comparative examples was measured as follows.
0.5kgf/cm for alumina substrate of 100mm × 100mm size and 0.2mm thickness2The sealing sheet of the same size and thickness was pressure-bonded at 100 ℃ for 30 seconds. After that, after curing in an oven at 150 ℃ for 1 hour, the maximum amount of warpage after leaving at room temperature to cool was measured with a vernier caliper. Specifically, the sealing sheet was placed on a flat table so as to have an upper surface, and the thickness was measured from the table surface to the farthest portion. Next, the thickness of the alumina substrate was subtracted from the obtained measured thickness: 0.2mm and thickness of the sealing sheet: the value after 0.2mm is the warpage amount, and the case where the warpage amount is less than 2mm is evaluated as O, and the case where the warpage amount is 2mm or more is evaluated as X. The results are shown in table 2.
(evaluation of resin Admission into hollow part of Package)
A SAW chip mounting substrate was produced in which a SAW chip of the following specifications, on which aluminum comb-shaped electrodes were formed, was mounted on a ceramic substrate under the following bonding conditions. The gap width between the SAW chip and the ceramic substrate was 15 μm.
< SAW chip >
Chip size: 1.2mm square (thickness 150 μm)
The bump material: au (high 15 μm)
The number of the convex blocks is as follows: 6 bump
The number of chips: 100 pieces (10 pieces are multiplied by 10 pieces)
< chip bonding conditions >
The device comprises the following steps: preparation of electrical engineering (Kabushiki)
Bonding conditions: 200 ℃, 3N, 1sec, ultrasonic output power 2W
Each sealing sheet was attached to the obtained SAW chip mounting substrate under the following heating and pressurizing conditions by vacuum pressurization.
< attachment conditions >
Temperature: 60 deg.C
Pressurizing force: 4MPa
Vacuum degree: 1.6kPa
Pressurizing time: 1 minute
After the release to the atmospheric pressure, the sealing sheet was thermally cured at 150 ℃ for 1 hour in a hot air dryer to obtain a seal. The substrate and the sealing resin interface of the obtained sealing body were cleaved, and the amount of resin entering the hollow portion between the SAW chip and the ceramic substrate was measured by the product name "digital microscope °" (200 times) manufactured by KEYENCE corporation. The resin entry amount is determined by measuring the maximum reaching distance of the resin entering the hollow portion from the end of the SAW chip. When the hollow portion is not inserted and the hollow portion is expanded outward beyond the SAW chip, the resin insertion amount is represented by a minus sign. The resin entry amount was evaluated as "O" in the case of-50 μm to 50 μm and as "X" in the case of less than-50 μm or more than 50 μm. The results are shown in table 2.
[ Table 2]
Description of the symbols
11 sealing sheet (electronic device sealing sheet)
11a support
13SAW chip
15 sealing body
18 hollow package
Claims (5)
1. An electronic device sealing sheet characterized in that,
a compound having a methacryloxy group or an acryloxy group is used as a silane coupling agent,
an inorganic filler is contained in a range of 69 to 86 vol%,
the minimum viscosity is in the range of 10Pa · s to 1000000Pa · s.
2. The electronic device sealing sheet according to claim 1,
the ratio X/Y is in the range of 15 to 100 when the tensile storage elastic modulus at 50 ℃ is X and the minimum viscosity is Y.
3. The electronic device sealing sheet according to claim 1,
the inorganic filler is surface-treated with the silane coupling agent in advance.
4. The electronic device sealing sheet according to claim 3,
the inorganic filler is previously surface-treated with 0.5 to 2 parts by weight of the silane coupling agent per 100 parts by weight of the inorganic filler.
5. A method of manufacturing an electronic device package, comprising:
a process for preparing the electronic device sealing sheet according to claim 1 to 4,
A laminating step of laminating the electronic component sealing sheet so as to cover 1 or more electronic components arranged on an adherend,
And a sealing body forming step of curing the electronic device sealing sheet to form a sealing body.
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| JP2014227057A JP6685080B2 (en) | 2014-11-07 | 2014-11-07 | Sheet for encapsulating electronic device and method for manufacturing electronic device package |
| JP2014-227057 | 2014-11-07 | ||
| CN201510750350.4A CN105590905B (en) | 2014-11-07 | 2015-11-06 | Electronic device sealing sheet and method for manufacturing electronic device package |
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| CN201510750350.4A Division CN105590905B (en) | 2014-11-07 | 2015-11-06 | Electronic device sealing sheet and method for manufacturing electronic device package |
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| CN201510750350.4A Active CN105590905B (en) | 2014-11-07 | 2015-11-06 | Electronic device sealing sheet and method for manufacturing electronic device package |
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| JP5435685B2 (en) * | 2007-02-28 | 2014-03-05 | ナミックス株式会社 | Resin film for sealing |
| JP5176075B2 (en) * | 2007-08-29 | 2013-04-03 | 日立化成株式会社 | Epoxy resin molding material for sealing and electronic component device provided with element sealed using the same |
| CN102834431A (en) * | 2010-04-16 | 2012-12-19 | 株式会社大赛璐 | Radical polymerizable resin, radical polymerizable resin composition, and cured product thereof |
| JP2013147589A (en) * | 2012-01-20 | 2013-08-01 | Nitto Denko Corp | Resin composition sheet for encapsulating electronic part and method of producing electronic part apparatus using the sheet |
| JP5735029B2 (en) * | 2013-03-28 | 2015-06-17 | 日東電工株式会社 | Resin sheet for sealing electronic device and method for manufacturing electronic device package |
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| JP6685080B2 (en) | 2020-04-22 |
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