CN112871860A - Cleaning device and cleaning method for metal part of semiconductor laser - Google Patents
Cleaning device and cleaning method for metal part of semiconductor laser Download PDFInfo
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- CN112871860A CN112871860A CN202010886707.2A CN202010886707A CN112871860A CN 112871860 A CN112871860 A CN 112871860A CN 202010886707 A CN202010886707 A CN 202010886707A CN 112871860 A CN112871860 A CN 112871860A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
Abstract
The invention provides a cleaning device and a cleaning method for a metal part of a semiconductor laser. The cleaning device comprises a lower shell clamp and an upper step heat sink clamp; a shell groove is formed in the upper end face of the lower shell clamp; the inner wall and the bottom surface of the shell groove are respectively provided with a shell groove side hole and a shell groove bottom hole; the upper end surface of the upper step heat sink clamp is provided with a step heat sink groove; the inner wall and the bottom surface of the step heat sink groove are respectively provided with a step heat sink groove side hole and a step heat sink groove bottom hole; a cylindrical upper part clamp middle hole penetrating through the upper part step heat sink clamp is formed in the center of the upper end face of the upper part step heat sink clamp; the middle hole of the upper clamp penetrates through the handle of the lower shell clamp and is movably fixed on the step of the handle. The invention solves the problems of incomplete and uneven cleaning and low efficiency, solves the problems of scratch and coating shedding caused by easy collision and friction among metal parts in direct mixed cleaning, and greatly improves the cleaning quality and the cleaning efficiency.
Description
Technical Field
The invention relates to a cleaning device and a cleaning method for a metal part of a semiconductor laser, and belongs to the technical field of semiconductor laser packaging.
Background
Semiconductor lasers have been known to society more and more over decades and have found applications in many areas. The photoelectric conversion efficiency of the semiconductor laser is over 60 percent and is far higher than that of other similar products; the LED lamp has the advantages of low energy consumption, less heat accumulation in devices, long service life, good collimation, long illumination distance and the like, so that the LED lamp is more and more widely applied as a new technology in the similar social industries. Semiconductor lasers have various advantages, which make them increasingly receive wide attention from all social circles.
The packaging process is a necessary way for preparing the semiconductor laser and has important influence on the performance of the semiconductor laser. The cleaning is the initial link of the whole semiconductor laser packaging process and is the premise and the basis of high-quality production and manufacturing. Dirt is easily introduced in the process of processing and transporting materials such as metal parts of a semiconductor laser, and the like, so that the method is directly applied to packaging processes such as welding and the like, and key performance indexes such as product reliability, firmness, heat dissipation, service life and the like are influenced, so that the qualification rate and the product quality are reduced. Therefore, the cleaning effect of materials such as metal parts is improved, the parameters such as surface energy and wettability of the product are improved to the maximum extent, and the quality of the whole packaged product is improved. The existing method for cleaning the metal part mainly comprises the steps of directly pouring the metal part into a container for mixing and cleaning, and has the problems of incomplete and uneven cleaning and low cleaning efficiency, and the problems of scratches and coating shedding caused by easy collision and friction of the metal part in the cleaning process seriously affect the quality and performance of a laser.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a cleaning device and a cleaning method for a metal part of a semiconductor laser. The invention solves the problems of incomplete and uneven cleaning and low efficiency, solves the problems of scratches and coating falling caused by easy collision and friction between metal parts in direct mixed cleaning, and greatly improves the cleaning quality and the cleaning efficiency.
The technical scheme of the invention is as follows:
a cleaning device for a metal part of a semiconductor laser comprises a lower shell clamp and an upper step heat sink clamp;
the lower shell clamp is a cylinder; a shell groove is formed in the upper end face of the lower shell clamp; a shell groove side hole is formed in the inner wall of the shell groove close to the side face of the lower shell clamp and penetrates through the side face of the lower shell clamp; a shell groove bottom hole is formed in the bottom surface of the shell groove and penetrates through the lower end surface of the lower shell clamp; a stepped cylindrical handle is arranged at the center of the upper end surface of the lower shell clamp, and a cylindrical lower clamp groove is arranged at the center of the lower end surface;
the upper step heat sink clamp is a cylinder; the upper end surface of the upper step heat sink clamp is provided with a step heat sink groove; a step heat sink groove side hole is formed in the inner wall of the step heat sink groove close to the side face of the upper step heat sink clamp and penetrates through the side face of the upper step heat sink clamp; a step heat sink groove bottom hole is formed in the bottom surface of the step heat sink groove and penetrates through the lower end face of the upper step heat sink clamp; a cylindrical upper clamp middle hole penetrating through the upper step heat sink clamp is formed in the center of the upper end face of the upper step heat sink clamp; a circular upper clamp groove is arranged on the lower end surface of the upper step heat sink clamp by taking the middle hole of the upper clamp as a central shaft;
the middle hole of the upper clamp penetrates through the handle of the lower shell clamp and is movably fixed on the step of the handle.
According to the invention, the shortest distance between the inner wall of the shell groove close to the side surface of the lower shell clamp and the side surface of the lower shell clamp is preferably 5-10 mm; the distance between the bottom end of the shell groove and the bottom end of the lower shell clamp is 10-15 mm: the shell grooves are uniformly distributed by taking the central shaft of the lower shell clamp as an axis.
According to the invention, the shell groove is used for placing a semiconductor laser shell, and two power-on pins of the semiconductor laser shell face outwards; the shape and size of the shell groove are matched with those of a semiconductor laser shell, and a gap of 1-3mm is reserved between the inner wall of the shell groove and the semiconductor laser shell; the number of the shell grooves can be set according to needs.
According to the invention, the diameters of the shell groove side hole and the shell groove bottom hole are both 5-10 mm; the shell groove side holes and the shell groove bottom holes are respectively and uniformly distributed on the inner wall and the bottom surface of the shell groove, and the distance between every two adjacent holes on the same inner wall or the bottom surface is 3-5 mm.
According to the invention, the diameter of the lower end cylinder of the stepped cylindrical handle is 20-25mm, the diameter of the upper end cylinder is 15-20mm, and the diameter of the upper end cylinder is smaller than that of the lower end cylinder; the diameter of the lower clamp groove is 35-45mm, and the depth is 15-25 mm. The lower clamp groove is used for reducing the weight of the metal part and the cleaning device integrally.
According to the invention, the shortest distance between the inner wall of the stepped heat sink groove close to the side surface of the upper stepped heat sink clamp and the side surface of the upper stepped heat sink clamp is 5-10 mm; the distance between the bottom end of the step heat sink groove and the bottom end of the upper step heat sink clamp is 5-10 mm; the step heat sink grooves are uniformly distributed by taking the central shaft of the upper step heat sink clamp as an axis.
According to the invention, the step heat sink groove is used for placing the step heat sink, and one side of the multiple steps faces outwards; the shape and size of the step heat sink groove are matched with those of the step heat sink, and a gap of 1-3mm is reserved between the inner wall of the step heat sink groove and the step heat sink; the number of the step heat sink grooves can be set according to the requirement.
According to the invention, the diameters of the side hole of the step heat sink groove and the bottom hole of the step heat sink groove are both 3-5 mm; the side holes of the step heat sink groove and the bottom holes of the step heat sink groove are uniformly distributed on the inner wall of the step heat sink groove and the bottom surface of the step heat sink groove, and the distance between two adjacent holes on the same inner wall or the bottom surface is 1-3 mm.
According to the invention, the diameter of the hole in the upper clamp is preferably 15-25mm, which is the same as the diameter of the cylinder at the upper end of the handle of the lower housing clamp.
According to the invention, the depth of the circular ring-shaped upper clamp groove is 15-25mm, the width is 10-20mm, and the diameter of the excircle is 70-75 mm. The upper clamp groove is used for reducing the weight of the metal part and the cleaning device integrally.
According to the invention, the gap between the lower shell clamp and the upper step heat sink clamp of the cleaning device is preferably larger than 2 times the length of the laser shell.
According to the invention, the distance between the top end of the handle of the lower shell clamp and the upper end surface of the upper step heat sink clamp in the cleaning device is preferably 100mm and 120 mm.
According to the invention, the material of the cleaning device is preferably polytetrafluoroethylene. The cleaning agent is white wax, semitransparent, high-temperature resistant, strong acid and strong alkali resistant, resists any organic solvent, has a low friction coefficient, is not adhered, is the one with the minimum surface tension in a solid material, is not adhered with any substance, and is extremely suitable for cleaning materials such as semiconductor laser metal parts and the like with high cleanliness requirements.
The method for cleaning the metal part of the semiconductor laser by using the cleaning device comprises the following steps:
(1) placing semiconductor laser shells in shell grooves of a lower shell clamp, wherein one semiconductor laser shell corresponds to one shell groove, and two power pins of the semiconductor laser shell face outwards;
(2) placing the step heat sinks in the step heat sink grooves of the upper step heat sink clamp, wherein one step heat sink corresponds to one step heat sink groove, and one side of each of the multiple steps faces outwards;
(3) putting the cleaning device provided with the semiconductor laser shell and the step heat sink into a clean container; pouring organic solvent, ultrasonically cleaning at 30-35 deg.C for 10-15min, and rotating the handle of the lower shell clamp to rotate the cleaning device; then taking out the cleaning device integrally and drying the cleaning device integrally;
(4) then replacing the new organic solvent, and repeating the step (3); the steps are repeated for 3-5 times;
(5) and finally, putting the whole cleaning device into an oven or a hot plate for drying.
According to the invention, in the step (3), the amount of the organic solvent is just less than the upper end surface of the upper step heat sink clamp, and the handle of the lower shell clamp is higher than the liquid level of the organic solvent.
Preferably, in step (3), the organic solvent is one of Micro90, acetone or methanol.
The invention has the following technical characteristics and beneficial effects:
1. the cleaning device can simultaneously bear the semiconductor laser shell and the step heat sink, and the semiconductor laser shell and the step heat sink can be cleaned simultaneously in batch, so that the cleaning device is time-saving and labor-saving and has high cleaning efficiency. Through holes are arranged on the inner walls and the bottom surfaces of the shell groove and the step heat sink groove, and organic solvent used for cleaning enters the shell groove and the step heat sink groove through the through holes, so that the semiconductor laser shell and the step heat sink are cleaned. The cleaning device is provided with the handle, so that the cleaning device is convenient to move integrally, and the handle can be rotated in the cleaning process, so that the whole cleaning device rotates, which is equivalent to a stirring effect, and the cleaning effect is further improved. The lower shell clamp and the upper step heat sink clamp are movably connected, so that the operation is convenient. The lower clamp groove and the upper clamp groove are arranged in the cleaning device, so that the weight of the metal part and the cleaning device is reduced integrally, and the operation is facilitated.
2. In the existing method for directly pouring metal parts into a container for mixing and cleaning, because the contact between the metal parts can influence the complete infiltration of an organic solvent and the metal parts, the metal parts are not cleaned thoroughly and uniformly; in the cleaning process, the metal parts are easy to scratch and the coating falls off due to collision and friction; in addition, in the cleaning process, the metal parts need to be independently taken out for blow-drying when the organic solvent is replaced every time, and the metal parts also need to be independently taken out for blow-drying after the cleaning is finished, so that the cleaning efficiency is low, and the operation is complicated. The cleaning device disclosed by the invention solves the problems existing in the method, metal parts are not contacted, the cleaning is thorough and uniform, the cleaning efficiency is high, the cleaning quality is improved, and the cleanliness of products is ensured; according to the invention, the cleaning device and the metal part are only required to be integrally taken out and dried, the cleaning operation is simple, the repeated labor force is saved, the cleaning efficiency is improved, the scratches and the coating falling caused by the collision and friction of the metal part are effectively avoided, and the subsequent welding quality is further ensured.
Drawings
FIG. 1 is a schematic view of the overall structure of a cleaning apparatus according to the present invention;
FIG. 2 is a schematic structural view of the lower housing clamp of the present invention 1;
FIG. 3 is a schematic structural view of the lower housing clamp of the present invention, FIG. 2;
FIG. 4 is a schematic structural view of the upper step heat sink clip of the present invention 1;
FIG. 5 is a schematic structural view of the upper step heat sink clip of the present invention, FIG. 2;
wherein, 1, a lower shell clamp; 2. an upper step heat sink clamp; 3. a semiconductor laser housing; 4. a step heat sink; 5. a housing recess; 6. a handle; 7. side holes of the groove of the shell; 8. a housing groove bottom hole; 9. a lower clamp groove; 10. a stepped heat sink recess; 11. a middle hole of the upper clamp; 12. a side hole of the step heat sink groove; 13. a step heat sink groove bottom hole; 14. an upper clamp groove.
Detailed Description
The present invention will be further described by way of examples, but not limited thereto, with reference to the accompanying drawings.
Example 1
A cleaning device for metal parts of a semiconductor laser comprises a lower shell clamp 1 and an upper step heat sink clamp 2 as shown in figures 1-4;
the lower housing fixture 1 is a cylinder. The upper end surface of the lower shell clamp 1 is provided with 8 shell grooves 5; the shortest distance between the inner wall of the shell groove 5 close to the side surface of the lower shell clamp 1 and the side surface of the lower shell clamp 1 is 8 mm; the distance between the bottom end of the shell groove 5 and the bottom end of the lower shell clamp 1 is 12 mm: the shell grooves 5 are uniformly distributed by taking the central shaft of the lower shell clamp 1 as an axis. The shell groove 5 is used for placing the semiconductor laser shell 3, two electrifying pins of the semiconductor laser shell 3 face outwards, and the height of the semiconductor laser shell 3 is higher than that of the shell groove 5; the shape and size of the shell groove 5 are matched with those of the semiconductor laser shell 3, and a gap of 2mm is reserved between the inner wall of the shell groove 5 and the semiconductor laser shell 3. A shell groove side hole 7 is formed in the inner wall of the shell groove 5 close to the side face of the lower shell clamp 1 and penetrates through the side face of the lower shell clamp 1; a shell groove bottom hole 8 is formed in the bottom surface of the shell groove 5 and penetrates through the lower end surface of the lower shell clamp 1; the diameters of the shell groove side hole 7 and the shell groove bottom hole 8 are both 8 mm; the shell groove side holes 7 are uniformly distributed along the height direction of the shell groove 5, and the circle centers of the shell groove side holes 7 are all positioned on the central line of the inner wall of the shell groove 5; the shell groove bottom holes 8 are uniformly distributed along the length direction of the shell groove 5, and the circle centers of the shell groove bottom holes 8 are all positioned on the central line of the bottom surface of the shell groove 5; the distance between two adjacent holes on the same inner wall or bottom surface is 4 mm. The center of the upper end face of the lower shell clamp 1 is provided with a stepped cylindrical handle 6, the diameter of the lower end cylinder of the stepped cylindrical handle 6 is 23mm, and the diameter of the upper end cylinder is 18 mm. A cylindrical lower clamp groove 9 is formed in the center of the lower end face of the lower shell clamp 1; the diameter of the lower clamp groove 9 is 40mm, and the depth is 20 mm.
The upper step heat sink clamp 2 is a cylinder; the upper end surface of the upper step heat sink clamp 2 is provided with 24 step heat sink grooves 10; the shortest distance between the inner wall of the step heat sink groove 10 close to the side surface of the upper step heat sink clamp 2 and the side surface of the upper step heat sink clamp 2 is 8 mm; the distance between the bottom end of the step heat sink groove 10 and the bottom end of the upper step heat sink clamp 2 is 8 mm; the step heat sink grooves 10 are uniformly distributed by taking the central axis of the upper step heat sink clamp 2 as an axis. The step heat sink groove 10 is used for placing the step heat sink 4, one side of the multiple steps faces outwards, and the height of the step heat sink 4 is higher than that of the step heat sink groove 10; the shape and size of the step heat sink groove 10 are matched with those of the step heat sink 4, and a gap of 2mm is reserved between the inner wall of the step heat sink groove 10 and the step heat sink 4. A step heat sink groove side hole 12 is arranged on the inner wall of the step heat sink groove 10 close to the side surface of the upper step heat sink clamp 2 and penetrates through the side surface of the upper step heat sink clamp 2; a step heat sink groove bottom hole 13 is arranged on the bottom surface of the step heat sink groove 10 and penetrates through the lower end surface of the upper step heat sink clamp 2; the diameters of the side hole 12 of the step heat sink groove and the bottom hole 13 of the step heat sink groove are both 4 mm. The side holes 12 of the step heat sink groove are uniformly distributed along the height direction of the step heat sink groove 10, and the circle centers of the side holes 12 of the step heat sink groove are all positioned on the central line of the inner wall of the step heat sink groove 10; the bottom holes 13 of the step heat sink groove are uniformly distributed along the length direction of the step heat sink groove 10, and the circle centers of the bottom holes 13 of the step heat sink groove are all positioned on the central line of the bottom surface of the step heat sink groove 10; the distance between two adjacent holes on the same inner wall or bottom surface is 2 mm. A cylindrical upper clamp middle hole 11 penetrating through the upper step heat sink clamp 2 is formed in the center of the upper end face of the upper step heat sink clamp 2; the diameter of the hole 11 in the upper part clamp is the same as the diameter of the cylinder at the upper end of the handle 6 of the lower part shell clamp, and is 18 mm. A circular upper clamp groove 14 is arranged on the lower end surface of the upper step heat sink clamp 2 by taking the upper clamp middle hole 11 as a central shaft; the depth of the circular upper clamp groove 14 is 20mm, the width is 15mm, and the diameter of the excircle is 73 mm.
The upper clamp central hole 11 passes through the handle 6 of the lower shell clamp 1 and is movably fixed on a step of the handle 6. The clearance between the lower shell clamp 1 and the upper step heat sink clamp 2 of the cleaning device is 3 times of the length of the laser shell. The distance between the top end of the handle 6 of the lower shell clamp 1 and the upper end surface of the upper step heat sink clamp 2 is 100 mm.
The cleaning device is made of polytetrafluoroethylene.
The method for cleaning the metal part of the semiconductor laser by using the cleaning device comprises the following steps:
(1) placing semiconductor laser shells 3 in shell grooves 5 of a lower shell clamp 1, wherein one semiconductor laser shell 3 corresponds to one shell groove 5, and two electrifying needles of the semiconductor laser shell 3 face outwards;
(2) the step heat sink 4 is placed in the step heat sink groove 10 of the upper step heat sink clamp 2, one step heat sink 4 corresponds to one step heat sink groove 10, and one side of a plurality of steps faces outwards;
(3) the cleaning device provided with the semiconductor laser shell 3 and the step heat sink 4 is integrally placed in a clean container; pouring organic solvent Micro90, wherein the amount of the organic solvent is just enough to submerge the upper end face of the upper step heat sink clamp 2, the handle 6 of the lower shell clamp 1 is higher than the liquid level of the organic solvent, then ultrasonically cleaning for 10min at 35 ℃, and simultaneously rotating the handle 6 of the lower shell clamp 1 to enable the cleaning device to integrally rotate; then taking out the whole cleaning device, and blowing the whole cleaning device to dry by using a nitrogen gun;
(4) then replacing the new organic solvent Micro90, and repeating the step (3); this step was repeated 4 times in total, i.e. 5 times in total;
(5) and finally, putting the whole cleaning device into an oven or a hot plate for drying to obtain the cleaned metal part.
Comparative example 1
A method for cleaning a metal component of a semiconductor laser comprises the following steps:
1) directly pouring metal parts, namely semiconductor laser shells (8) and step heat sinks (24), into a container for mixing, and pouring an organic solvent Micro90, wherein the use amount of the organic solvent Micro90 is less than that of all the metal parts;
2) then ultrasonically cleaning for 10min at 35 ℃, and then independently taking out the metal parts and drying the metal parts one by one;
3) then replacing the pure organic solvent Micro90 with new pure organic solvent, and repeating the step 2); this step was repeated 4 times in total, i.e. 5 times in total;
4) and then, respectively placing the metal parts on a tray, and drying by using a hot plate or an oven to obtain the cleaned metal parts.
Test example 1
The time taken for cleaning 32 (i.e., 8 semiconductor laser housings and 24 stepped heat sinks) of the semiconductor laser metal parts (excluding the time for baking in an oven or hot plate) using the methods of example 1 and comparative example 1, and the yield data of the metal parts obtained after cleaning are shown in the following table:
TABLE 1 time spent in cleaning and yield data sheet
| Time taken for cleaning (h) | Percent pass (%) | |
| Example 1 | 1 | 100 |
| Comparative example 1 | 1.5 | 80 |
As can be seen from the table above, the cleaning device provided by the invention has the advantages that the cleaning device can clean metal parts with the same quantity, the use time is less compared with comparative example 1, the product yield is far higher than that of comparative example 1, and the cleaning device provided by the invention has higher cleaning efficiency.
Claims (10)
1. A cleaning device for a metal part of a semiconductor laser is characterized by comprising a lower shell clamp and an upper step heat sink clamp;
the lower shell clamp is a cylinder; a shell groove is formed in the upper end face of the lower shell clamp; a shell groove side hole is formed in the inner wall of the shell groove close to the side face of the lower shell clamp and penetrates through the side face of the lower shell clamp; a shell groove bottom hole is formed in the bottom surface of the shell groove and penetrates through the lower end surface of the lower shell clamp; a stepped cylindrical handle is arranged at the center of the upper end surface of the lower shell clamp, and a cylindrical lower clamp groove is arranged at the center of the lower end surface;
the upper step heat sink clamp is a cylinder; the upper end surface of the upper step heat sink clamp is provided with a step heat sink groove; a step heat sink groove side hole is formed in the inner wall of the step heat sink groove close to the side face of the upper step heat sink clamp and penetrates through the side face of the upper step heat sink clamp; a step heat sink groove bottom hole is formed in the bottom surface of the step heat sink groove and penetrates through the lower end face of the upper step heat sink clamp; a cylindrical upper clamp middle hole penetrating through the upper step heat sink clamp is formed in the center of the upper end face of the upper step heat sink clamp; a circular upper clamp groove is arranged on the lower end surface of the upper step heat sink clamp by taking the middle hole of the upper clamp as a central shaft;
the middle hole of the upper clamp penetrates through the handle of the lower shell clamp and is movably fixed on the step of the handle.
2. The apparatus for cleaning a metal part of a semiconductor laser as claimed in claim 1, wherein the shortest distance between the inner wall of the housing groove near the side of the lower housing jig and the side of the lower housing jig is 5-10 mm; the distance between the bottom end of the shell groove and the bottom end of the lower shell clamp is 10-15 mm: the shell grooves are uniformly distributed by taking the central shaft of the lower shell clamp as an axis.
3. The apparatus for cleaning the metal component of the semiconductor laser as claimed in claim 1, wherein the diameters of the side hole of the housing groove and the bottom hole of the housing groove are both 5-10 mm; the shell groove side holes and the shell groove bottom holes are respectively and uniformly distributed on the inner wall and the bottom surface of the shell groove, and the distance between every two adjacent holes on the same inner wall or the bottom surface is 3-5 mm.
4. The apparatus for cleaning metal parts of semiconductor lasers as claimed in claim 1 wherein the diameter of the lower end cylinder of said stepped cylindrical handle is 20-25mm, the diameter of the upper end cylinder is 15-20mm, and the diameter of the upper end cylinder is smaller than the diameter of the lower end cylinder; the diameter of the lower clamp groove is 35-45mm, and the depth is 15-25 mm.
5. The apparatus for cleaning metal parts of semiconductor lasers as claimed in claim 1 wherein the shortest distance between the inner wall of the stepped heat sink groove close to the side of the upper stepped heat sink holder and the side of the upper stepped heat sink holder is 5-10 mm; the distance between the bottom end of the step heat sink groove and the bottom end of the upper step heat sink clamp is 5-10 mm; the step heat sink grooves are uniformly distributed by taking the central shaft of the upper step heat sink clamp as an axis.
6. The cleaning device for the metal component of the semiconductor laser as claimed in claim 1, wherein the diameters of the side hole of the stepped heat sink groove and the bottom hole of the stepped heat sink groove are both 3-5 mm; the side holes of the step heat sink groove and the bottom holes of the step heat sink groove are uniformly distributed on the inner wall of the step heat sink groove and the bottom surface of the step heat sink groove, and the distance between two adjacent holes on the same inner wall or the bottom surface is 1-3 mm.
7. A cleaning apparatus for a metal part of a semiconductor laser as claimed in claim 1, characterized by comprising one or more of the following conditions:
i. the diameter of the hole in the upper clamp is the same as that of a cylinder at the upper end of a handle of the lower shell clamp, and is 15-25 mm;
ii. The depth of the circular upper clamp groove is 15-25mm, the width is 10-20mm, and the diameter of the excircle is 70-75 mm;
iii, the clearance between a lower shell clamp and an upper step heat sink clamp of the cleaning device is more than 2 times of the length of the laser shell;
iv: in the cleaning device, the distance between the top end of the handle of the lower shell clamp and the upper end surface of the upper step heat sink clamp is 100-120 mm.
8. The apparatus for cleaning a metal part of a semiconductor laser as claimed in claim 1, wherein the cleaning apparatus is made of teflon.
9. A method for cleaning a metal part of a semiconductor laser using the cleaning apparatus for a metal part of a semiconductor laser as claimed in any one of claims 1 to 8, comprising the steps of:
(1) placing semiconductor laser shells in shell grooves of a lower shell clamp, wherein one semiconductor laser shell corresponds to one shell groove, and two power pins of the semiconductor laser shell face outwards;
(2) placing the step heat sinks in the step heat sink grooves of the upper step heat sink clamp, wherein one step heat sink corresponds to one step heat sink groove, and one side of each of the multiple steps faces outwards;
(3) putting the cleaning device provided with the semiconductor laser shell and the step heat sink into a clean container; pouring organic solvent, ultrasonically cleaning at 30-35 deg.C for 10-15min, and rotating the handle of the lower shell clamp to rotate the cleaning device; then taking out the cleaning device integrally and drying the cleaning device integrally;
(4) then replacing the new organic solvent, and repeating the step (3); the steps are repeated for 3-5 times;
(5) and finally, putting the whole cleaning device into an oven or a hot plate for drying.
10. A method for cleaning a metal component of a semiconductor laser according to claim 9, wherein in the step (3), the organic solvent is one of Micro90, acetone or methanol.
Priority Applications (1)
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| CN202010886707.2A CN112871860A (en) | 2020-08-28 | 2020-08-28 | Cleaning device and cleaning method for metal part of semiconductor laser |
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| CN202010886707.2A CN112871860A (en) | 2020-08-28 | 2020-08-28 | Cleaning device and cleaning method for metal part of semiconductor laser |
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| CN210805720U (en) * | 2019-12-27 | 2020-06-19 | 苏州长瑞光电有限公司 | Semiconductor wafer wet cleaning jig |
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