TW530368B - Heat sink sheet arrangement tool of semiconductor chip and the storage frame of the heat sink sheet thereof - Google Patents

Heat sink sheet arrangement tool of semiconductor chip and the storage frame of the heat sink sheet thereof Download PDF

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Publication number
TW530368B
TW530368B TW090130594A TW90130594A TW530368B TW 530368 B TW530368 B TW 530368B TW 090130594 A TW090130594 A TW 090130594A TW 90130594 A TW90130594 A TW 90130594A TW 530368 B TW530368 B TW 530368B
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Taiwan
Prior art keywords
heat sink
hole
positioning
holes
plate
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Application number
TW090130594A
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Chinese (zh)
Inventor
Chia-Min Chuang
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Orient Semiconductor Elect Ltd
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Publication date
Application filed by Orient Semiconductor Elect Ltd filed Critical Orient Semiconductor Elect Ltd
Priority to TW090130594A priority Critical patent/TW530368B/en
Priority to US10/197,428 priority patent/US20030106866A1/en
Priority to JP2002238023A priority patent/JP2003197649A/en
Application granted granted Critical
Publication of TW530368B publication Critical patent/TW530368B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333Trays for chips

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The present invention is a heat sink sheet arrangement tool of semiconductor chip and the storage frame of the heat sink sheet thereof, which is mainly formed of a set of tools and material storage frame. Firstly, several sets of erect induction pins are arranged to cross-dispose the heat sink sheets, which are stacked up, one set of the stacked heat sink sheets of the material storage frame is covered by the vacant rotational handle of the arranging tool, and the vertical induction pin is removed, the heat sink sheet is disposed in the rotational handle, which are stacked in a alternating fashion, the rotational handle containing heat sink sheets is moved from the material storage plane to the upper fixing block, and pressed by a screw pin, so that the rotational handle can rotate with respect to the vertical axis of the upper fixing block (long axis of the rotational handle), and the heat sink sheets in the rotational handle can pass through the shape-forming hole of the lower positioning block fixed under the upper fixing block by screw exactly and are ejected whenever it rotates for 90 DEG (positioned by the positioning ball every 90 DEG), i.e. before the rotational handle ejects the heat sink sheets every 90 DEG, the positioning points of the lower positioning block of the tool is aligned to the runner of the mold cavity, so that the heat sink sheet can be arranged into proper positions correctly and rapidly.

Description

530368 五、發明說明(1) · 本發明主要係用於半導體封裝領域之需將散熱片與晶 片一起塑模(Μ 〇 cl i n g D i e )成一封裝件(P a c k a g e )的生產線 上,以一治具與儲料架來快速棑入散熱片於模穴内者。 以往具有小形化要求的晶片,其採用表面封裝型態的 封裝方法如唯讀記憶體、通信用途、表示介面等晶片,由 、 於其電氣設計的考量,且對於晶片的尺寸封裝材料的比率 逐漸縮小,故散熱設計是小型封裝之必要條件。一般常見 ” 的作法係在於晶片的表面上放一散熱片(丨{e a t S i η k ),以 擴大其散熱面積,並提供系統對外部散熱的出口容量。其 ‘ 封裝製程中,於塑模進行前需以人工發送方式設置一散熱®. 片於模穴内。由於該散熱片極小極薄,以人工載手指套後 用手指一片一片搓開後排入模穴的進度緩慢,而將散熱片 排入模穴時可能因手指套不慎接觸模面而造成污染,且有 些散熱片亦令在其表面上設計小凹月力,使其散熱片同方向„ 層疊時,該小凹肋會相互嵌夾,使得以人工剝開的時間更 為拉長,使得該塑模封裝(P a c k a g e Μ 〇 d 1 i η g )的步驟需停 頓一段漫長的時程,靜候人工手棑方式,一片一片擺放完 畢後,始得開始進行,故此作業方式會導致作業時間過長 及容易造成不必要的污染。 | 本發明之首要目的係提供一以人工手持治具及一儲料胃 架之結構,先將散熱片於生產線外,一組一組先行堆疊填 滿足夠的量後,於塑模封裝前,以其手持治具裝填散熱片 後,旋轉排入散熱片於適當的模穴之中,以獲得較佳的排 , 入散熱片效率,大大地縮短整體製程時間。530368 V. Description of the invention (1) · The present invention is mainly used in the field of semiconductor packaging where the heat sink and the wafer need to be molded (MOCling Die) into a package (Package) production line. With a storage rack to quickly insert the heat sink into the cavity. In the past, chips with miniaturization requirements used surface-mount packaging methods such as read-only memory, communication applications, display interfaces, and other wafers. Due to their electrical design considerations, the ratio of packaging materials to the size of the wafer has gradually increased. Reduced size, so thermal design is a necessary condition for small packages. The "common" method is to place a heat sink on the surface of the chip to increase its heat dissipation area and provide the system's exit capacity for external heat dissipation. During its packaging process, it is used in plastic molds. Before proceeding, it is necessary to manually set a heat sink ®. The sheet is placed in the mold cavity. Because the heat sink is extremely small and thin, the finger pads are manually loaded with a finger and rubbed away one by one. Pollution may be caused by the finger cover accidentally contacting the mold surface when it is discharged into the cavity, and some heat sinks also design a small concave moon force on the surface, so that the heat sinks are in the same direction. When stacked, the small concave ribs will mutually The inserting clip makes the time of manual peeling longer, so that the step of packaging (Package Μ 〇 d 1 i η g) needs to stop for a long time, waiting for the manual mode, one by one After the placement is completed, it can be started. Therefore, the operation method will lead to long operation time and easy to cause unnecessary pollution. The primary object of the present invention is to provide a structure with a hand-held jig and a storage stomach rack. First, the heat sinks are placed outside the production line, and a group of groups is stacked in advance to fill a sufficient amount, before the mold is packaged. After the heat sink is filled with its hand-held jig, it is rotated into the heat sink in an appropriate cavity to obtain a better row and heat sink efficiency, which greatly reduces the overall process time.

530368 五、發明說明(2) ' 本發明之次要目的係可以治具排放散熱片,作業人員 的手指不會接觸到模面,而無污染之虞。 茲配合圖式將本發明較佳實施例詳細說明如下。 請參閱第一圖所示,本發明主要係由一治具1及儲料 架2所組成,其治具1主要包含: 一上固定塊1 2,為一方形塊,其中央開有一 U型階梯孔 1 2 1,在U型開口端兩對應側設有透孔1 2 2,可供一螺絲插 銷1 4插入,而在U型階梯孔1 2 1頂端側立面上設有螺孔1 2 1 1 可供内具定位珠1231及壓力功能(圖中未示)所形成一具壓 力之定位珠定位裝置1 2 3。 一下定位塊1 3,為一長形塊,其底部設有一可供定位用 之基緣1 3 1,而在頂面設有一適合散熱片形狀之長形透孔 1 3 2及一圓形淺槽1 3 3以供散熱片3在其圓形淺槽1 3 3順利被 導引旋轉。 一旋轉握把1 1,為一直立空心筒體1 1 0,其中心開一長 薄型散熱片十字交疊之外圍輪廓聯集造型之成型孔113, 以便自儲料架2上套入堆疊之散熱片3,以提供散熱片3堆 疊放置之空間,該成型孔1 1 3於空心筒體11 0之底面設有一 由成型孔1 1 3自轉5 °角依旋轉方向相反開設的成型孔偏移 槽1 1 4的淺槽(如第二圖所示),以使旋轉握把1 1轉動 時,。該散熱片3由埤淺槽保持平移,而不.致因散熱片3過半 面積懸空而翻轉掉入模穴4 1内,以確保該散熱片3能平面 落在模穴4 1内;另在筒底設有一底座凸緣1 Π,以便卡嵌 於上固定塊1 2之U型階梯孔1 2 1内,使緊迫壓住筒底面與下530368 V. Description of the invention (2) 'The secondary purpose of the present invention is to allow the fixture to discharge the heat sink, so that the fingers of the operator will not touch the mold surface, and there is no risk of pollution. The preferred embodiments of the present invention are described in detail below with reference to the drawings. Please refer to the first figure. The present invention is mainly composed of a jig 1 and a storage rack 2. The jig 1 mainly includes: an upper fixing block 12 which is a square block and a U-shaped opening in the center. Stepped holes 1 2 1 are provided with through holes 1 2 2 on the two opposite sides of the U-shaped open end for a screw plug 1 4 to be inserted, and screw holes 1 are provided on the top side of the U-shaped stepped hole 1 2 1 2 1 1 A positioning device for positioning beads with a pressure formed by the positioning beads 1231 and a pressure function (not shown in the figure) 1 2 3 is available. The lower positioning block 1 3 is an elongated block. A base edge 1 3 1 is provided at the bottom for positioning, and a long through hole 1 3 2 and a circular shallow hole suitable for the shape of a heat sink are provided on the top surface. The grooves 1 3 3 are used for smoothly guiding and rotating the heat sink 3 in its circular shallow grooves 1 3 3. A rotating grip 11 is an upright hollow cylinder 1 10, and a long and thin heat sink is formed with a cross-shaped outer contour in the center of the shape forming hole 113 so as to be nested on the storage rack 2 The heat sink 3 provides space for the heat sinks 3 to be stacked. The molding hole 1 1 3 is provided on the bottom surface of the hollow cylinder 110 with a molding hole 1 1 3 rotated at an angle of 5 ° and rotated in an opposite direction to the rotation direction. Slots 1 1 4 are shallow grooves (as shown in the second picture) to make the rotary grip 1 1 turn. The heat sink 3 is kept in translation by the shallow groove, so that the half of the area of the heat sink 3 is suspended and flipped into the cavity 41 to ensure that the heat sink 3 can fall flat inside the cavity 41; The bottom of the tube is provided with a base flange 1 Π so as to fit into the U-shaped stepped hole 1 2 1 of the upper fixing block 12 to press the bottom surface of the tube and the bottom tightly.

第6頁 530368 五、發明說明(3) 疋位塊1 3頂面,不留空隙,另在空心筒體}丨〇低側設有四 個等角分配之定位孔1 1 2以與上固定塊丨2之定位裝置1 2 3相 配合,即定位時,散熱片3可對正下定位塊丨3上之長形透 孔132,以排出散熱片3者。 而上述之散熱片3係一長形薄片(以適用於所加工的晶 片形狀),在其兩端部設有方孔3 1,且於該方孔兩側設有、 凸出之點狀凸緣3 2者。 ^ 另,本發明之儲料架2結構包含: 一底板2 1,為一長方形塊板,其頂面上設有數組以四·個.· 等分設置之盲孔2 1 1為一組之銷孔.2 1 2 ; ψ 一對支撐板2 2,設於底板2 1兩側,可與底板2 1螺固,並 於支撐板2 2頂設一螺孔2 2 1,以螺入上蓋板2 3 ; :上蓋板2 3,為一平板,可置於支撐板頂面與之螺合,' 以蓋住銷孔2 1 2上所設置之導引銷2 4端面,避免排入導引 銷2 4之散熱片3與隔塊2 5散落; 、四根為一組之導引銷2 4,可插入底板2 1上之銷孔2 1 2, 並可供長形散熱片3採十字交叉的方式逐個穿過導引銷2 4 ,堆宜起來形成一塔狀’並於適當高度後放入隔塊25;而 该導引銷24可於旋轉握把套入塔狀疊起之散熱片3後拔除 者。 · 依據前述結構,在上生產線前,預先將儲料架2之底 板^1與兩支撐板2 2螺固,並將導引銷2 4插滿銷孔2丨2,並 、 將散熱片3以十字交疊方式堆滿該導引銷2 4並於最頂端穿 入一隔塊2 5,俟每一銷孔2 1 2都棑滿後,將上蓋板2 3以壓 ΛPage 6 530368 V. Description of the invention (3) The top surface of the bit block 1 3, without any gaps, and the hollow cylinder is provided with four equally-angled positioning holes 1 1 2 on the lower side for fixing with the upper part. The positioning device 1 2 3 of the block 丨 2 is matched, that is, during positioning, the heat sink 3 can be aligned with the long through hole 132 on the lower positioning block 丨 3 to discharge the heat sink 3. The above-mentioned heat sink 3 is an elongated sheet (in the shape suitable for the processed wafer), and square holes 31 are provided at both ends thereof, and convex point-shaped protrusions are provided on both sides of the square hole. Margin 3 2 persons. ^ In addition, the structure of the storage rack 2 of the present invention includes: a bottom plate 21, which is a rectangular plate, the top surface of which is provided with an array of four blind holes 2 1 1 divided into a group Pin holes. 2 1 2; ψ A pair of support plates 2 2 are provided on both sides of the base plate 2 1 and can be screwed with the base plate 2 1, and a screw hole 2 2 1 is provided on the top of the support plate 2 2 to screw in Cover plate 2 3;: Upper cover plate 2 3 is a flat plate that can be placed on the top surface of the support plate and screwed with it, 'to cover the end face of the guide pin 2 4 provided on the pin hole 2 1 2 to avoid row The cooling fins 3 inserted into the guide pins 2 4 and the spacers 25 are scattered; and four guide pins 2 4 in a group can be inserted into the pin holes 2 1 2 on the base plate 2 1 and can be used for long heat sinks 3. Cross the guide pins 2 4 one by one in a crisscross manner. The stack should be formed into a tower shape and placed into the spacer 25 after a suitable height; and the guide pin 24 can be sleeved into the tower stack by the rotating grip. Remove the heat sink 3 after removal. · According to the foregoing structure, before the production line, the bottom plate ^ 1 of the storage rack 2 and the two support plates 22 are screwed in advance, and the guide pins 24 are inserted into the pin holes 2 丨 2, and the heat sink 3 Stack the guide pins 2 4 in a cross-over pattern and pierce a spacer 2 5 at the top. After each pin hole 2 1 2 is full, press the upper cover 2 3 to press Λ

第7頁 530368 五、發明說明(4) 花螺絲2 3 1螺於兩支撐板2 2頂面,以將導引銷2 4、散熱片3 及隔塊2 5限定於固定的空間位置,不致散落。而為因應生 產線之所需之散熱片3數量,可事先裝填好數組上述的儲 料架,並保存在適當之處(如第三圖示出)。 之後,續請參照第四圖所示,在生產線上使用時,先 將一組儲料架2取出,並將壓花螺絲2 3 1上蓋板2 3移除,並 先將一組銷孔2 1 2上之隔塊2 5拿開後,以旋轉握把1 1蓋入 一銷孔2 1 2之四支導引銷2 4及其上的散熱片3,使該散熱片 3完全沒入於旋轉握把1 1之成型孔1 1 3内,之後將四支導引 銷2 4拔除,並將止檔墊片1 1 5以螺絲1 1 6螺固於直立空心筒 體1 1。0之頂部.螺孔以阻檔散熱片3自成型孔1 1 3頂面逸出, 此時該旋轉握把1 1可以載著堆疊之散熱片3於底板2 1頂面 游走;續將上固定塊1 2與下定位塊1 3螺固成一體,並以上 固定塊1 2底緣與下定位塊1 3之接合頂面所呈現上長了短的 階梯狀來跨接於底板2 1邊緣後,將旋轉握把丨丨推入其上固 定塊1 2之U型階梯孔1 2 1内,可使旋轉握把丨丨之底座凸緣 1 1 1恰可套入U型階梯孔1 2 1之底孔内,並利用一螺絲插銷 1 4插入U型階梯孔1 2 1開口處之透孔1 2 2,使螺絲插銷丨4恰 可以壓住旋轉握把1 1之底座凸緣丨丨1並頂佐 空心筒體11〇外徑,使旋轉握把η可以以底;=;二 型階梯孔121與螺絲插銷14所構成的空間中作軸向 (如 第五圖所示),並由於該U型階梯孔丨2丨之壁面上亦設有一 定位裝置1 2 3,而該旋轉握把丨丨之筒身上又嗖有定位孔 112 ,可使該旋轉握把丨丨每轉動九十度時,=可定位一Page 7 530368 V. Description of the invention (4) The screw 2 3 1 is screwed on the top surface of the two supporting plates 22 to limit the guide pin 2 4, the heat sink 3 and the spacer 25 to a fixed space position. Scattered. In order to respond to the required number of heat sinks 3 of the production line, the storage racks of the above array can be filled in advance and stored in an appropriate place (as shown in the third figure). After that, please refer to the fourth figure. When using it on the production line, first remove a group of storage racks 2 and remove the embossing screws 2 3 1 and the upper cover 2 3, and firstly remove a group of pin holes. After taking off the spacer 2 2 on 2 1 2, cover the pin hole 2 1 with the rotating grip 11 and the four guide pins 2 4 on the 2 and the heat sink 3 on it, so that the heat sink 3 is completely hidden. Insert it into the forming hole 1 1 3 of the rotary grip 11, and then pull out the four guide pins 24, and screw the stop washer 1 1 5 to the upright hollow cylinder 11 with screws 1 1 6. The top of 0. The screw hole stops the heat sink 3 from the top surface of the molding hole 1 1 3. At this time, the rotary grip 11 can carry the stacked heat sink 3 and swim on the top surface of the bottom plate 2 1; The upper fixing block 12 and the lower positioning block 1 3 are screwed into one body, and the bottom surface of the upper edge of the upper fixing block 12 and the lower positioning block 13 are joined to form a long and short step to bridge the bottom plate 2 1 After the edge, push the rotary handle 丨 丨 into the U-shaped stepped hole 1 2 1 of the upper fixing block 1 2 so that the base flange 1 1 1 of the rotary handle 丨 can fit into the U-shaped stepped hole 1 2 1 in the bottom hole, and use a screw plug 1 4 to insert the U-shaped step Ladder hole 1 2 1 The through hole 1 2 2 at the opening, so that the screw pin 丨 4 can just press the base flange of the rotary grip 1 1 丨 1 and press the outer diameter of the hollow cylinder 11 〇 to make the rotary grip η can use the bottom; =; axial direction in the space formed by the second stepped hole 121 and the screw plug 14 (as shown in the fifth figure), and because the U-shaped stepped hole 丨 2 丨 is also provided with a positioning on the wall surface Device 1 2 3, and the rotary grip 丨 丨 has a positioning hole 112 on the barrel, so that the rotary grip 丨 丨 can be positioned every 90 degrees

第8頁 530368 五、發明說明(5) ~ 次。如此可將旋轉握把1 1、上固定塊丨2與下定位塊丨3所組 成的治具1連同旋轉握把1 1内所裝填之散熱片3以手持置於 模具4上,以底直之基緣1 3 1抵住模具4邊緣,再將,下定位 塊1 3之澆道4 2定位點1 3 4對準模具4之澆道4 2,以使該下定 位塊1 3之長形透孔1 3 2對準模穴4 1,在旋轉握把1 1旋轉至 該成型孔1 1 3内所裝的最下面一片的散熱片3與下定位塊丄3 之長形透孔1 3 2成一直線時,旋轉握把丨丨之定位孔u 2與定 位装置1 2 3恰可對正定位,並使該成型孔1 1 3内最下方散熱 片3經由下定位塊1 3之長形透孔丨3 2排出到模穴4丨上,^ ^ 治具1之下定位塊1 3基緣1 3 1沿模具4邊緣滑至下一模穴4工 的位置,並在使定位點134對準該模六41的澆道42的位置 後’繼續轉動旋轉握把1 1旋轉九十度,使交叉疊起之散執 片3最下一片被排出到模穴4 1内者(如第六圖所示)/…、 。另’靖參照苐·七圖之又一實施例,本發明之儲料架5 亦可採用另外一種底板5 1與蓋板5 1相同形狀、兩側支擇· 5 2相同形狀之儲料架5,其中: # 一底(蓋)板5 1,為一長方形塊板,其内面上設有數組以 四個等分設置之盲孔5 1 2為一組之銷孔組5丨3 ; '' 一對支撐板5 2 ’设於底(蓋)板5 1兩側,在内側面上之 上、下部挖入一凹入處,以形成一肩部52〇,可供底(蓋) 板5 1搭置,並由支撐板5 2側向之側孔5 1 1螺固螺入壓花 絲5 2 2,以螺固底(蓋)板51 ; ' " 依據上述構件,先將底(蓋)板5 1平置,盲孔5丨2朝 上’將兩側支撐板5 2螺设於兩端,即可當成—儲料架$,Page 8 530368 V. Description of the invention (5) ~ times. In this way, the jig 1 composed of the rotary grip 11, the upper fixing block 丨 2 and the lower positioning block 丨 3 together with the heat sink 3 filled in the rotary grip 11 can be placed on the mold 4 by hand, with the bottom straight The base edge 1 3 1 is against the edge of the mold 4 and then, the runner 4 of the lower positioning block 13 2 is positioned at the runner 4 2 of the mold 4 to make the lower positioning block 1 3 elongate The through hole 1 3 2 is aligned with the cavity 4 1, and the rotary grip 1 1 is rotated to the longest through hole 1 3 of the heat sink 3 and the lower positioning block 丄 3 in the molding hole 1 1 3. When it is in a straight line, the positioning hole u 2 of the rotary handle 丨 丨 can be aligned with the positioning device 1 2 3 and the bottom heat sink 3 in the molding hole 1 1 3 passes through the elongated shape of the lower positioning block 1 3 The through hole 3 2 is discharged to the mold cavity 4 ^ ^ Positioning block 1 3 under the fixture 1 3 Base edge 1 3 1 Slide along the edge of the mold 4 to the position of the next mold cavity 4 and make the positioning point 134 After aligning the position of the runner 42 of the mold six 41, 'continue to rotate the rotary grip 1 1 to rotate ninety degrees, so that the lowermost piece of the cross-stacked diffuser piece 3 is discharged into the mold cavity 4 1 (such as the first (Shown in Figure 6) / ...,. In addition, referring to FIG. 7 and another embodiment of the seventh figure, the storage rack 5 of the present invention may also use a storage rack with the same shape of the bottom plate 5 1 and the cover 5 1 and the same shape on both sides. 5 2 The same shape of the storage rack 5 5, where: # 一 底 (盖) 板 51 1 is a rectangular plate, the inner surface of which is provided with an array of blind holes 5 1 2 arranged in four equally divided pin hole groups 5 丨 3; ' 'A pair of support plates 5 2' are provided on both sides of the bottom (cover) plate 51, and a recess is dug above and below the inner side to form a shoulder 52 for the bottom (cover) plate 5 1 stacked, and the support plate 5 2 lateral side holes 5 1 1 screwed into the embossed wire 5 2 2 to screw the bottom (cover) plate 51; '" According to the above components, first the bottom ( Cover) The plate 5 1 is placed flat, with the blind holes 5 丨 2 facing upwards. The support plates 5 2 on both sides are screwed at both ends, which can be regarded as a storage rack.

第9頁 530368 五、發明說明(6) 而由於該底板5 1與蓋板5 1之形狀完全相同,其上所設之銷 孔組5 1 3亦完全一樣,因此該儲料架5可雙向使同,即底板 5 1亦可當蓋板5 1,此特性特別適用於在堆疊散熱片3時, 可使用二組儲料架,一組專門放置正面向的散熱片3、一 組專門用來背面向的散熱片3,而放置正面向的散熱片3儲 料架5依之前儲料架2的使用方法放完散熱片3時,即可將 蓋板5 1螺鬆移除使用;至於放置反面向的散熱片3儲料架5 依前揭的方法放完散熱片3時,即可將整個儲料架5上下旋 轉1 8 0度,使 >該反®堆疊的散熱片3變成正面,而原先的底 板5 1變成蓋板5 1,之後再將位置頂面的蓋板5 1螺鬆移除使 用之,按此儲料架結構,可在預先堆疊放置散熱片3於儲 料架5的時候,可以不必花費額外的時間來將反面的散熱 片3翻正後再予以堆疊,能更為節省將散熱片3疊堆放入儲 料架5的時間,以增取效率。 由前述本發明之結構及操作可知,本發明可在生產線 外預先將一片片散熱片交疊堆起,並可以使用治具一次裝 填一條堆疊散熱片,快速、準確地排入模穴之中,如此可 大量節省生產線上,以人工手動的方式放置散熱片,且整 個作業流程之中,手指完全不會接觸模具,避免作業疏失 而產生污染。 綜上所述,當知本案所發明之治具及儲料架已具有新 穎性與進步性,符合發明專利要件。惟以上所述者,僅為 本發明之較佳實施例而已,並非用來限定本發明實施之範Page 9 530368 V. Description of the invention (6) And because the shape of the bottom plate 5 1 and the cover plate 51 are exactly the same, and the pin hole groups 5 1 3 provided on it are also exactly the same, the storage rack 5 can be bidirectional The same, that is, the bottom plate 51 can also be used as the cover plate 51. This feature is especially suitable for stacking the heat sink 3, two sets of storage racks can be used, one set is used to place the front facing heat sink 3, and one set is used exclusively. Come to the back side heat sink 3, and place the front side heat sink 3 storage rack 5 according to the previous method of using the stock rack 2, after the heat sink 3 is finished, the cover 51 can be removed and used loosely; Place the heat sink 3 on the opposite side. Storage rack 5 When the heat sink 3 is finished in the same way as before, you can rotate the entire storage rack 5 up and down 180 degrees, so that the reverse stack of heat sinks 3 becomes Front side, and the original bottom plate 5 1 becomes the cover plate 51, and then the cover plate 5 1 at the top surface is removed and used loosely. According to the structure of the storage rack, the heat sink 3 can be stacked in advance in the storage material. When the rack 5 is used, it is not necessary to spend extra time to turn the heat sink 3 on the opposite side and then stack it, which can save the heat sink 3 more. The stacking time is put into the storage rack 5 to increase the efficiency. According to the structure and operation of the present invention, it can be known that the present invention can stack up one heat sink in advance outside the production line, and can use a fixture to fill one stack of heat sinks at a time, and quickly and accurately discharge them into the mold cavity. In this way, the production line can be greatly saved, and the heat sink can be placed manually, and the fingers will not touch the mold at all during the entire operation process, which can avoid pollution caused by negligent operation. In summary, it is known that the fixtures and storage racks invented in this case have been innovative and progressive, and meet the requirements of the invention patent. However, the above are only preferred embodiments of the present invention, and are not intended to limit the scope of implementation of the present invention.

第10頁 530368 五、發明說明(7) 圍。即凡依本發明申請專利範圍所做的均等變化與修飾 皆為本發明專利範圍所涵蓋。 iiiil 530368 圖式簡單說明 圖式簡單說明 第一圖A、B係本發明治具及儲料架之立體分解圖。 第二圖係本發明之旋轉握把底側之成型孔偏移槽之立體示 意圖。 第三圖係本發明儲料架組合圖。 第四勳圖係本發明之治具裝填散熱片之動作示意圖。 第五圖A、B、C係本發明之治具裝填散熱片後之上視圖、 前視圖及底視圖。 第六圖係本發明之治具與塑模封裝模具示意圖。 第七圖係本發明之儲料架之又一實施例。 圖式中之參照號數 本發明部份 1 ·治。具 · · . 0 » 1 1.旋轉握把 . 1 1 0 .空心筒體 111.底座凸緣1 1 2.定位孔 1 1 3 .成型孔 1 1 4.成型孔偏移槽 1 1 5.止檔墊片 1 1 6 .螺絲 1 2 .上固定塊 1 2 1. U型階梯孔 1 2 1 1.螺孔 1 2 2 .透孔Page 10 530368 V. Description of Invention (7). That is, all equivalent changes and modifications made in accordance with the scope of patent application of the present invention are covered by the scope of patent of the present invention. iiiil 530368 Brief description of the drawings Brief description of the drawings The first drawings A and B are exploded perspective views of the jig and the storage rack of the present invention. The second figure is a perspective view of the forming hole offset groove on the bottom side of the rotary grip of the present invention. The third figure is a combination diagram of the storage rack of the present invention. The fourth figure is a schematic diagram of the operation of filling the heat sink of the fixture according to the present invention. The fifth figures A, B, and C are an upper view, a front view, and a bottom view of the jig of the present invention after the heat sink is filled. The sixth figure is a schematic diagram of the fixture and the mold packaging mold of the present invention. The seventh diagram is another embodiment of the storage rack of the present invention. Reference numerals in the drawings Part of the present invention 1. Governance. · ·. 0 »1 1. Rotating grip. 1 1 0. Hollow cylinder 111. Base flange 1 1 2. Positioning hole 1 1 3. Forming hole 1 1 4. Forming hole offset groove 1 1 5. Stop washer 1 1 6. Screw 1 2. Upper fixing block 1 2 1. U-shaped stepped hole 1 2 1 1. Screw hole 1 2 2. Through hole

第12頁 530368 圖式簡單說明 1 2 3 .定位珠定位裝置 1 2 3 1 ·定位珠 1 3 .下定位塊 1 3 1.基緣 1 3 2 .長形透孔 1 3 3 .圓形淺槽 1 3 4.定位點 1 4.螺絲振銷 β 2. 儲料架 2 1.底板 2 1 1.盲孔2 1 2 .銷孔 2 2.支撐板 2 2 1.螺孔 2 3.上蓋板 2 3 1.壓花螺絲 2 4.導引銷 2 5.隔塊 2 5 1.透孔 3. 散熱片 3 1.孔3 2 .凸緣 4. 模具 4 1.模穴 42.澆道 5. 儲料架Page 12 530368 Brief description of the drawings 1 2 3 .Positioning device 1 2 3 1 · Positioning ball 1 3 .Lower positioning block 1 3 1.Base edge 1 3 2 .Long through hole 1 3 3 .Circular shallow Slot 1 3 4. Locating point 1 4. Screw vibrating pin β 2. Storage rack 2 1. Base plate 2 1 1. Blind hole 2 1 2. Pin hole 2 2. Support plate 2 2 1. Screw hole 2 3. Up Cover 2 3 1. Embossed screw 2 4. Guide pin 2 5. Spacer 2 5 1. Through hole 3. Heat sink 3 1. Hole 3 2. Flange 4. Mold 4 1. Cavity 42. Pouring Road 5. Storage rack

第13頁 530368 圖式簡單說明 5 1 ·底(蓋)板 5 1 1.側孔 5 1 2 .盲孔 5 1 3 .銷孔組 5 2.支撐板 5 2 0.肩部 5 2 1 ·孔 5 2 2 .壓花螺絲 1^1Page 13 530368 Brief description of the diagram 5 1 · Bottom (cover) plate 5 1 1.Side hole 5 1 2 .Blind hole 5 1 3 .Pin hole group 5 2.Support plate 5 2 0.Shoulder 5 2 1 · Hole 5 2 2 .Embossed screw 1 ^ 1

Claims (1)

_!717:7^號 90130594 曰 修正 六、申請專利範圍 i::半導體晶片之排入散熱片治具及其散熱片儲料架, 主2係由一治具及儲料架所組成,其治具主要包含: 二上固^塊,為-方形塊,其中央開有型階梯 :广型開口端兩對應側設有透孔,可供一螺絲插銷 定位玻:在1型頂端&兩側設有螺孔可供内具彈力功能的 疋位珠定位裝置; 之A:下ί位塊’為—長形&,其底部設有-可供定位用 頂二右:I對正模具上模穴内之洗道的定位塊,而在 :::::適合散熱片形狀之長形透孔及一圓形淺槽以供 政熱片在其淺槽順利旋轉; 散埶,為一直立空心筒體,其中心開-長薄型 料架= = :廊:集造型之成型孔,以便自儲 該成型孔於“面=散熱片堆疊放置之空間, 轉方向相士 、之底面汉有一由成型孔自轉5。角依旋 緣,二# +10又的成型孔偏移槽的淺槽;在筒底設有一座 Ϊ面= ΐ = :定塊之u型階梯孔内,使緊迫壓住筒 絲螺固於直立空心空隙,另以一止樓塾片藉一螺 散熱片自成型頂部螺孔,以阻檔填入成型孔之 配之定你:^丨、b面逸出,另在筒身低侧設有四個等角分 成帮 以,、上固定塊之定位裝置相配合,即定位時, =孔内散熱片可對正下定位塊上之長形透孔,以排出散 其儲料架結構包含: 第15頁 530368 曰 案號 90130594 六、申請專利範圍 一底板’為一長方形塊板’其頂面上設有數組以四個 等分設置之盲孔為一組之銷孔; 一對支撐板’設於底板兩側,可與底板螺固,並於支 撐板頂設一螺孔,以螺入上蓋板; 一上蓋板,為一平板,可置於支撐板頂面與之螺合, 以蓋住銷孔上所設置之導引銷端面,避免排入導引銷之 散熱片與隔塊散落; 四根為一組之導引銷,可插入底板上之銷孔,並可供長 形散熱片採十字交叉的方式逐個穿過導引銷而堆疊起來 形成一塔狀,並於適當高度後放入隔塊;而該導引銷可 於旋轉握把套入塔狀散熱片後拔除者。 片之排入散熱片治具及其散熱片儲料架, 孔,有透其/央開有^型階梯 插入,而在u型頂:透孔,可供-螺絲插銷 定位珠定位裝置; 供円,、弹力功犯的 之基緣 頂面設 散熱片 散熱片 料架上 下疋位塊,為一長形塊,复执 、及一可對正掇且卜y,、底邛5又有一可供定位用 右一、翁人^ 杈具上杈穴内之澆道的定位塊,而在 在i ΐ二ί熱片形狀之長形透孔及一圓形淺槽以# 在其淺槽順利旋轉; ^久谓以供 旋轉握把,為一古—〜 十字交疊之外圍J 筒體,其中心開-長薄型 攸供政熱片堆豐放置之空間,_! 717: 7 ^ No. 90130594 Amendment VI. Patent Application Scope i :: Semiconductor wafer discharge heat sink fixture and heat sink storage rack. The main 2 is composed of a fixture and a storage rack. The fixture mainly includes: two upper solid blocks, which are square blocks, with a step in the center: a wide open end is provided with through holes on the two corresponding sides, and a screw pin can be used to locate the glass: at the top of the type 1 & two The side is provided with a screw hole for the positioning function of the bead positioning ball with internal elastic function; A: The lower position block is-long & the bottom is provided with-for positioning. Top right: I alignment mold The positioning block of the washing channel in the upper mold cavity, and the long through hole and a circular shallow groove suitable for the shape of the heat sink are used for the smooth rotation of the heat sink in its shallow groove; Hollow cylinder, the center of which is open-long and thin material rack = =: Gallery: Set the molding holes for self-storing the molding holes in the space where "face = heat sinks are stacked. The forming hole rotates 5. The angle depends on the edge of the rotation, the second # +10 is the shallow groove of the offset hole of the forming hole; a bottom surface is provided at the bottom of the cylinder = ΐ =: Inside the u-shaped stepped hole of the block, the pressing wire can be screwed to the vertical hollow space, and the other one can use a spiral heat sink to self-form the top screw hole to prevent the filling of the molding hole. You: ^ 丨, b surface escapes, and there are four equiangular divisions on the lower side of the barrel. The positioning device of the upper fixing block cooperates, that is, when positioning, = the heat sink in the hole can be positioned directly downward. The long through-holes on the block to discharge the storage rack structure include: Page 15 530368 Case No. 90130594 Sixth, the scope of patent application A bottom plate 'is a rectangular block plate' on its top surface is provided with an array of four A set of blind holes is a set of pin holes; a pair of support plates are provided on both sides of the bottom plate and can be screwed with the bottom plate, and a screw hole is provided on the top of the support plate to screw into the upper cover; an upper cover The plate is a flat plate that can be placed on the top surface of the support plate and screwed with it to cover the end face of the guide pin provided on the pin hole to prevent the heat sinks and spacers discharged into the guide pin from scattering; The guide pin of the group can be inserted into the pin hole on the bottom plate, and the long heat sink can be used in a crosswise manner. The guide pins are stacked to form a tower shape, and the spacer is placed at an appropriate height; and the guide pin can be pulled out after the rotary grip is sleeved into the tower heat sink. And its heat sink storage rack, holes, through the / central opening with a ^ -type stepped insert, and in the U-shaped top: through-hole, available-screw bolt positioning bead positioning device; The top surface of the base edge is provided with upper and lower positioning blocks of the heat sink fin material rack, which is an elongated block, which can be repositioned, and can be aligned, and the bottom can be used for positioning. The person ^ has a positioning block for the runner in the upper hole of the branch, and the long through hole and a circular shallow groove in the shape of the hot plate are rotated smoothly in the shallow groove; The grip is an ancient- ~ cross-overlapping peripheral J-cylinder, with its center open-a long and thin type of space for placing hot film piles, 第16頁 填入堆疊之散熱片,提 ,以便自儲 530368 銮號 90130594 六、申請專利範圍 該成型孔於空心筒體之底面設有—由成型孔自轉5。角依旋 轉方向相反開設的成型孔偏移槽的淺槽;在筒底設有一座 緣,以便卡嵌於上固定塊之U型階梯孔内,使緊迫壓住筒 底面與下定位塊頂面,不留空隙,另以一止檔墊片藉一 ,螺固於直立空心筒體之頂部螺孔,以阻檔填入成^孔之 政熱片自成型孔頂面逸出;另在筒身低側設有四個等角分 ,之定位孔以與上固定塊之定位裝置相配合,即定位時, 孔内散熱片可對正下定位塊上之長形透孔,以排出散 其儲料架結構包含: 一底(蓋)板,為一長方形塊板,其内面上設有數組以 四個等分設置之盲孔為一組之銷孔組; 一對支撐板,設於底(蓋)板兩側:在内側面上之上、 尾部挖入-凹入處’以形成—肩部,可供底(蓋)板搭 螺固;Γ蓋2板侧向設有侧孔,以供固螺入壓花螺絲’ 支‘Si 2件’先將底(蓋)板平置’盲孔朝上’將兩側 底二;兩端,另以四根為一組之導引銷,可插入 個穿、尚,並可供長形散熱片採十字交叉的方式逐 引銷而堆叠起來形成-塔狀,並於適當高度後 散熱片後拔:ϊ導引銷可於旋轉握把套入堆疊成塔狀之Page 16 Fill in the stacked heat sinks and lift them for self-storage 530368 # 90130594 VI. Scope of patent application The molding hole is provided on the bottom surface of the hollow cylinder—rotating from the molding hole5. A shallow groove with an offset hole formed at an angle opposite to the direction of rotation; an edge is provided at the bottom of the cylinder so as to fit into the U-shaped stepped hole of the upper fixing block, so that the bottom surface of the cylinder and the top surface of the lower positioning block are pressed tightly Without leaving a gap, another one was used to stop the gasket and screw it to the top screw hole of the upright hollow cylinder to prevent the hot sheet filled with ^ holes from escaping from the top surface of the forming hole; The lower side is provided with four equal angles, and the positioning holes are matched with the positioning device of the upper fixing block, that is, during positioning, the heat sink in the hole can be aligned with the long through hole on the lower positioning block to discharge the scattered holes. The storage rack structure includes: a bottom (cover) plate, which is a rectangular plate, and an inner surface thereof is provided with a pin hole group consisting of an array of four equally divided blind holes; a pair of support plates provided at the bottom Both sides of the (cover) board: above the inner side, the tail is dug in-recessed to form-the shoulder, which can be used for screwing the bottom (cover) board; Γ cover 2 board is provided with side holes, Embed the embossing screws with the screws into the 'bracket' Si 2 pieces' first, place the bottom (cover) plate flat, with the blind holes facing up, and place the bottom two at the two sides; at the two ends, take the other four The guide pin of the group can be inserted into a pendant, and can be used for the long heat sink to be stacked in a cross-by-lead manner to form a tower-like shape, and the heat sink is pulled out after the appropriate height: ϊGuide pin Can be turned into a stack of towers with a rotating grip
TW090130594A 2001-12-07 2001-12-07 Heat sink sheet arrangement tool of semiconductor chip and the storage frame of the heat sink sheet thereof TW530368B (en)

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TW090130594A TW530368B (en) 2001-12-07 2001-12-07 Heat sink sheet arrangement tool of semiconductor chip and the storage frame of the heat sink sheet thereof
US10/197,428 US20030106866A1 (en) 2001-12-07 2002-07-18 Heat sinks holding kit and storage rack for semiconductor chip
JP2002238023A JP2003197649A (en) 2001-12-07 2002-08-19 Heat sink for semiconductor chip, and jig and storage frame for the same

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