CN216213359U - Wafer clamp - Google Patents
Wafer clamp Download PDFInfo
- Publication number
- CN216213359U CN216213359U CN202122370407.1U CN202122370407U CN216213359U CN 216213359 U CN216213359 U CN 216213359U CN 202122370407 U CN202122370407 U CN 202122370407U CN 216213359 U CN216213359 U CN 216213359U
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- crystal array
- wafer
- base
- wafer holder
- column
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a wafer clamp, comprising: arranging a base at the bottom of the wafer clamp; arranging a positioning column on the base along a preset axis; a fixed column is arranged on the base on an axis vertical to the preset axis; a cover plate is arranged above the positioning column and the fixing column; the utility model widens the application field of the automatic chip mounter, replaces the traditional manual crystal array chip mounting, realizes the automatic production of the crystal array chip mounting by using the automatic chip mounter in the field of the crystal array chip mounting, improves the precision and the efficiency of the crystal array chip mounting, and reduces the labor and the cost required by the crystal array chip mounting. The technical problems that manual operation is generally adopted in the field of crystal array patch processing and assembling in the prior art, a large amount of manpower is needed for assembling the crystal array patches, the processed crystal array patches have large precision difference and low efficiency, and the cost of the crystal array patches is high are solved.
Description
Technical Field
The embodiment of the utility model relates to a wafer clamp in the field of crystal array processing and assembling, in particular to a wafer clamp used on a crystal array chip mounter.
Background
In the traditional crystal array paster processing equipment field, generally adopt manual work, crystal array paster equipment needs a large amount of manpowers, and the crystal array paster precision difference that the while processed is great, and inefficiency, and crystal array paster cost is higher. The crystal array patch processing and assembling technology mainly comprises: the method comprises the steps of chip surface mounting, gluing, reflection film pasting and curing, wherein when the chip array surface mounting is assembled, firstly, a layer of glue is coated on the surface of a chip, then, a layer of reflection film is pasted, then, the chip is pasted, the operation is repeated until the required number of chips are pasted, and then, the curing is carried out. In the process of reflecting film and wafer paster, the requirement for pasting the reflecting film and the precision of the wafer paster is high, because the hardness of the wafer material used in the crystal array is high, the density is high, a special wafer clamp is needed to fix the wafer, then the wafer and the wafer clamp are fixed and transported by a specific feeding tray, and the existing automatic chip mounter in the market does not have a proper wafer clamp for assembling the crystal array paster, so the existing automatic chip mounter needs to be improved and optimized, a set of wafer clamp for assembling the crystal array paster is designed, and the existing chip mounter can be applied to assembling the crystal array paster, so that the efficiency and the precision of the crystal array paster assembly are improved, and the flow and the high efficiency of the crystal array assembly are realized.
SUMMERY OF THE UTILITY MODEL
An object of an embodiment of the present invention is to provide a wafer chuck capable of streamlining and increasing efficiency of crystal array assembly.
In order to achieve the above object, an embodiment of the present invention provides a wafer chuck including:
a pedestal, wherein the pedestal is arranged at the bottom of the wafer clamp;
the positioning column is arranged on the base along a preset axis;
the fixing column is arranged on the base and on an axis perpendicular to the preset axis;
the cover plate is arranged above the positioning column and the fixing column.
Furthermore, the cover plate is arranged in an area formed by the positioning column and the fixing column.
Furthermore, grooves are formed in the base along two sides of the preset axis.
Furthermore, fixing holes are formed in two sides of the cover plate, and the fixing columns are inserted into the fixing holes to fix the wafer.
Furthermore, the positioning columns are symmetrically arranged along the central axis of the base; and a groove is formed between the two positioning columns.
Furthermore, the top end of the positioning column is arranged into an arc shape towards the direction of the preset axis.
Furthermore, a convex block is arranged in the middle of the cover plate.
Furthermore, a chamfer is arranged on the edge of the bump.
Furthermore, the groove is embedded into the inner side of the positioning column.
Further, the material of the wafer clamp is nylon or metal.
Compared with the prior art, the implementation mode of the utility model widens the application field of the automatic chip mounter, replaces the traditional manual crystal array chip mounting, realizes the automatic production of the crystal array chip mounting by using the automatic chip mounter in the field of the crystal array chip mounting, improves the precision and efficiency of the crystal array chip mounting, and reduces the labor and cost required by the crystal array chip mounting. The technical problems that manual operation is generally adopted in the field of crystal array patch processing and assembling in the prior art, a large amount of manpower is needed for assembling the crystal array patches, the processed crystal array patches have large precision difference and low efficiency, and the cost of the crystal array patches is high are solved.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic front view of FIG. 1;
FIG. 3 is a schematic top view of FIG. 1;
fig. 4 is a left side view of fig. 1.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solutions claimed in the claims of the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments.
An embodiment of the present invention relates to a wafer chuck, as shown in fig. 1, 2, and 3, including:
a pedestal 3 is provided at the bottom of the wafer holder in this embodiment; the base 3 serves as a bottom in the present embodiment.
A positioning column 1 is arranged on a base 3 along a preset axis; the positioning posts 1 position the wafer. The preset axis in this embodiment is a longitudinal central axis on the base 3;
on the base 3, a fixed column 2 is arranged on an axis vertical to a preset axis, namely a longitudinal central axis on the base 3, and the fixed column 2 and the fixed column 1 are vertical to each other to form a crystal placing area;
and a cover plate 4 is arranged above the positioning column 1 and the fixing column 2. The cover plate 4 covers the area between the fixed column 2 and the positioning column 1; the wafer fixing device is used for fixing a wafer placed between the fixing column 2 and the positioning column 1; therefore, as shown in fig. 1, 2, and 3, a cover plate 4 is provided in the region formed by the positioning column 1 and the fixing column 2.
As shown in fig. 1, 2, and 3, grooves 5 are formed in the base 3 along a predetermined axis, that is, along both sides of a longitudinal center axis of the base 3.
As shown in fig. 1, 2 and 3, the positioning posts 1 are symmetrically arranged along the central axis of the base 3; a groove 5 is arranged between the two positioning columns 1. As shown in fig. 1, 2, and 3, the groove 5 is fitted into the inner side of the positioning post 1. The purpose of the grooves 5 is mainly to facilitate the removal of the wafer from the holder in this embodiment.
As shown in fig. 1, 2, and 3, fixing holes 6 are formed in both sides of the cover plate 4, and the fixing posts 2 are inserted into the fixing holes 6 to fix the wafer.
As shown in fig. 1, 2, and 3, the top end of the positioning column 1 is provided in an arc shape toward a predetermined axial direction, i.e., a longitudinal central axis on the base 3. The top end of the positioning column 1 is arranged to be arc-shaped, so that a crystal can be conveniently placed in an area formed by the positioning column 1 and the fixing column 2, and the crystal can be conveniently scratched into the area.
As shown in fig. 1, 2 and 3, a bump 7 is provided at the middle position of the cover plate 4. The bumps 7 can serve to better hold down the wafer. In order not to damage the wafer, as shown in fig. 1, 2, and 3, a chamfer 8 is provided at the edge of the bump 7.
As shown in fig. 1, 2, and 3, the material of the wafer holder in this embodiment is nylon or metal, depending on the usage.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the utility model, and that various changes in form and details may be made therein without departing from the spirit and scope of the utility model in practice.
Claims (10)
1. A wafer chuck, comprising:
a pedestal, wherein the pedestal is arranged at the bottom of the wafer clamp;
the positioning column is arranged on the base along a preset axis;
the fixing column is arranged on the base and on an axis perpendicular to the preset axis;
the cover plate is arranged above the positioning column and the fixing column.
2. The wafer holder of claim 1, wherein said cover plate is disposed in an area defined by said positioning posts and said fixing posts.
3. The wafer holder of claim 1, wherein grooves are formed in the base along both sides of the predetermined axis.
4. The wafer holder as claimed in claim 1, wherein fixing holes are formed at both sides of the cover plate, and the fixing posts are inserted into the fixing holes to fix the wafer.
5. The wafer holder of claim 1, wherein the positioning posts are symmetrically disposed along a central axis of the base; and a groove is formed between the two positioning columns.
6. The wafer holder of claim 1, wherein the top ends of the positioning posts are disposed in an arc shape toward the predetermined axis.
7. The wafer holder of claim 4, wherein a bump is disposed at a central location of the cover plate.
8. The wafer holder of claim 7, wherein a chamfer is provided at the edge of said bump.
9. The wafer holder of claim 3, wherein the recess is embedded in the inner side of the positioning post.
10. The wafer holder of any of claims 1-9, wherein the wafer holder is made of nylon or metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122370407.1U CN216213359U (en) | 2021-09-28 | 2021-09-28 | Wafer clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122370407.1U CN216213359U (en) | 2021-09-28 | 2021-09-28 | Wafer clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216213359U true CN216213359U (en) | 2022-04-05 |
Family
ID=80927796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122370407.1U Active CN216213359U (en) | 2021-09-28 | 2021-09-28 | Wafer clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216213359U (en) |
-
2021
- 2021-09-28 CN CN202122370407.1U patent/CN216213359U/en active Active
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