CN107393852A - A kind of chip cleaning container - Google Patents
A kind of chip cleaning container Download PDFInfo
- Publication number
- CN107393852A CN107393852A CN201710597839.1A CN201710597839A CN107393852A CN 107393852 A CN107393852 A CN 107393852A CN 201710597839 A CN201710597839 A CN 201710597839A CN 107393852 A CN107393852 A CN 107393852A
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- China
- Prior art keywords
- chip
- accommodating chamber
- bottom plate
- slit
- holders
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
Abstract
The present invention discloses a kind of chip cleaning container, including accommodating chamber, the slit for allowing chip holders to stretch into is offered in the accommodating chamber, and some are offered in the side wall of the accommodating chamber and extends to bottom, the slit for allowing the chip holders to pass through from its slit.So, when staff takes chip placement by chip holders toward accommodating chamber inner clip, chip holders can be made to clamp chip first, chip is set to be located at the overthe openings of accommodating chamber, the orientation of chip holders is adjusted afterwards, so that the body of chip holders passes through slit set in the side wall of accommodating chamber, finally further along this slit, chip holders are gradually transferred to the lower surface for being close to accommodating chamber, unclamping chip holders can be soft by chip, stably it is placed into the lower surface of accommodating chamber, the end and accommodating chamber bottom for avoiding chip produce situation about hitting, effectively prevent chip from producing fragmentation by tumble injury, reduce economic loss.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of chip cleaning container.
Background technology
With the development of Chinese semicon industry, increasing semiconductor devices has been used widely.
Semiconductor devices be electric conductivity between good conductor of electricity and insulator, using semi-conducting material specific electrical properties come
The electronic device of specific function is completed, using different semi-conducting materials, using different technique and geometry, is had been developed that
The pole of a variety of crystal two that species is various, function and usage is different, it can be used to produce, control, receive, converting, amplified signal and progress
Energy conversion.The frequency coverage of crystal diode can be from low frequency, high frequency, microwave, millimeter wave, infrared up to light wave.Three ends
Device is usually active device, and Typical Representative is various transistors (also known as transistor).
Several crystal diodes, triode and resistance capacitance are all produced on same silicon, referred to as integrated electricity
Road, and chip is exactly the carrier of integrated circuit.The complex process degree of chip is higher, represents the current manufacturing industry achievement of people
Highly, several links, wherein chip system such as complete procedure includes chip design, wafer fabrication, encapsulation is made, cost is tested are made
Make the complexity of process particularly.It is chip design first, according to the demand of design, generates " pattern ", be made followed by by a little pure silicons
Silicon crystal bar, turn into the material of the crystalline semiconductor of manufacture integrated circuit, it is exactly wafer that chip manufacturing specifically needs to be cut into slices.
Then wafer film, wafer photolithography development, etching are carried out, the process has used the chemical substance to ultraviolet-sensitive, that is, meets purple
Outer light then softens, by controlling the position of shade to obtain the profile of chip.Then dash with impurity will be implanted into wafer from
Son, corresponding P, N based semiconductor is generated, after a few road techniques above, the crystalline substance of trellis one by one is formed on wafer
Grain.Manufacture is completed wafer and fixed by encapsulation, binds pin.
For chip during the manufacturing, difficulty can be by pollutant effects such as defective material impurity and silicone oil, therefore at certain
Need to be cleaned chip in a little processes.At present, often by chip be put into cleaning the gaily decorated basket in, then by chip together with the gaily decorated basket simultaneously
It is put into cleaning fluid and is cleaned.However, due to the cleaning gaily decorated basket of the prior art, depth is larger, in the process of chip placement
In, it is necessary to clamp chip with tweezers, then tilt and extend into the cleaning gaily decorated basket, the end thereof contacts of chip are to cleaning gaily decorated basket bottom
When, tweezers unclamp, and make chip freely fall down to drop enter in the gaily decorated basket.However, because chip is very thin in the fabrication process, intensity is not
It is enough and more crisp, therefore the cleaning gaily decorated basket of the prior art, during chip placement, be very easy to cause chip because
Impact stress caused by being landed and cracked, or even fragmentation, cause economic loss.
Therefore, how improvements is made to the structure of cleaning the gaily decorated basket so that technical staff, can in its past interior chip placement
It is effectively prevented from chip and fragmentation is produced by tumble injury, is those skilled in the art's technical problem urgently to be resolved hurrily.
The content of the invention
It is an object of the invention to provide a kind of chip cleaning container, can make technical staff when toward its interior chip placement,
It is effectively prevented from chip and fragmentation is produced by tumble injury, reduces economic loss.
In order to solve the above technical problems, the present invention provides a kind of chip cleaning container, including accommodating chamber, in the accommodating chamber
The slit for allowing chip holders to stretch into is offered, and some are offered in the side wall of the accommodating chamber and is prolonged from its slit
Extend bottom, the slit for allowing the chip holders to pass through.
Preferably, be provided with the bottom plate for containing chip in the accommodating chamber, and on the bottom plate with hole described in each bar
Sew up tactile opening position and be provided with and take piece groove, and described take piece groove to be connected with the slit.
Preferably, the surface of the bottom plate is smooth.
Preferably, some are provided with the surface of the bottom plate to cross one another and one end takes what piece groove connected with described
First slideway, and the circuit that the first slideway described in each bar is interconnected;First slideway and circuit be used to it is described
Chip holders, which coordinate, to be slided.
Preferably, some the second slideways, and the second slideway restocking described in each bar are additionally provided with the surface of the bottom plate
It is used to chip is kept the installation sliding block erect provided with several.
Preferably, the installation sliding block specifically includes the sliding part for coordinating with the second slideway described in each bar, Yi Jishe
It is placed in the slip, multiple spacer bars for clamping chip both side surface.
Preferably, be provided with several equally distributed spacing holes on the surface of the bottom plate, in addition to each limit
Position hole coordinates installation, several limited posts for limiting space of each chip in the accommodating chamber.
Preferably, each limited post includes being used for the Plug Division being inserted into the spacing hole, is arranged at described connect
Interpolating unit top and for being pressed on the backplate surface, to be abutted after each chip level moves pre-determined distance with its edge
Horizontal limiting unit, it is arranged at the compressed part top, for what is abutted after the vertical mobile pre-determined distance of each chip with its surface
Vertical limiting unit;And it is arranged at the vertical limiting unit top, the compact heap for being easy to the chip holders gripping.
Preferably, several osculums, and each row are installed with the side wall of the accommodating chamber and/or the bottom plate
Water hole is rounded.
Preferably, in addition to it is used for the multiple accommodating chambers axially concatenation, the connecting rods for fingertip grasp, and be located at
The mounting cylinder for installing the connecting rod is provided with the bottom plate of the accommodating chamber of bottom;The accommodating chamber of remainder layer
The mounting hole for coordinating with the connecting rod is offered on bottom plate.
Chip cleaning container provided by the present invention, mainly including accommodating chamber, wherein, offered in the side wall of the accommodating chamber
Slit, after chip holders (such as tweezers) clamping chip can be allowed, the body of clamper is directed at the slit, while make core
Piece is located at the overthe openings of accommodating chamber, can make clamper from the slit vertically over along under the bearing of trend of slit afterwards
Fall, and finally smoothly chip is placed in the lower surface of accommodating chamber.In this way, when staff is past by chip holders
When accommodating chamber inner clip takes chip placement, chip holders can be made to clamp chip first, chip is located at the overthe openings of accommodating chamber,
The orientation of chip holders is adjusted afterwards so that the body of chip holders passes through slit set in the side wall of accommodating chamber,
Finally further along this slit, chip holders are gradually transferred to the lower surface for being close to accommodating chamber, unclamp chip clamping
Chip softly, stably can be placed into the lower surface of accommodating chamber by device, compared to prior art, is avoided and is passed through chip
It is obliquely placed into accommodating chamber by one end that clamper clamps chip, and makes the another of chip when unclamping chip holders
End produces the situation that freely falling body strikes accommodating chamber lower surface, effectively prevents chip from producing fragmentation by tumble injury, reduces economical
Loss.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 is a kind of overall structure diagram of embodiment provided by the present invention;
Fig. 2 is the concrete structure schematic diagram of the accommodating chamber shown in Fig. 1;
Fig. 3 is the concrete structure schematic diagram for taking piece groove shown in Fig. 2;
Fig. 4 grips structure of the chip by slit for a kind of embodiment chips clamper provided by the present invention
Schematic diagram;
Fig. 5 is to be slided in a kind of embodiment provided by the present invention by chip holders in the first slideway or second
The structural representation of chip movement is promoted in road;
Fig. 6 is the concrete structure schematic diagram of the installation sliding block shown in Fig. 1;
Fig. 7 is the fit structure schematic diagram of spacing hole and limited post in a kind of embodiment provided by the present invention;
Fig. 8 is the concrete structure schematic diagram of the limited post shown in Fig. 7;
Fig. 9 is in the structural representation of multilayer accommodating chamber inner clip coring piece in a kind of embodiment provided by the present invention
Figure.
Wherein, in Fig. 1-Fig. 9:
Accommodating chamber -1, slit -2, bottom plate -3 take piece groove -4, the first slideway -5, and circuit -6, the second slideway -
7, sliding block -8, sliding part -801, spacer bar -802, spacing hole -9, limited post -10, Plug Division -101, level limit are installed
Portion -102 processed, vertical limiting unit -103, compact heap -104, osculum -11, connecting rod -12, mounting cylinder -13.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Fig. 1 is refer to, Fig. 1 is a kind of overall structure diagram of embodiment provided by the present invention.
In a kind of embodiment provided by the present invention, chip cleaning container mainly includes accommodating chamber.
Wherein, slit is offered in the side wall of the accommodating chamber 1, chip holders (such as tweezers) can be allowed from the slit
Place is goed deep into, so as to which chip is clamped into accommodating chamber 1.Also, some slits 2 are offered in the side wall of accommodating chamber 1, such as
3 slits 2 etc., the slit 2 extend to the bottom of accommodating chamber 1 since at the slit of accommodating chamber 1, form one and be available for
The passage that chip holders pass through.
In this way, when staff takes chip placement by chip holders toward the inner clip of accommodating chamber 1, chip gripper can be made first
Holder clamps chip, chip is located at the overthe openings of accommodating chamber 1, adjusts the orientation of chip holders afterwards so that chip gripper
The body of holder is through slit 2 set in the side wall of accommodating chamber 1, finally further along this slit 2, by chip holders by
Gradually transfer to the lower surface for being close to accommodating chamber 1, unclamp chip holders can chip is soft, be stably placed into receiving
In the lower surface of chamber 1, compared to prior art, avoid and one end of chip is clamped by chip holders obliquely put it
Put in accommodating chamber 1, and the other end of chip is produced freely falling body when unclamping chip holders and strike the bottom of accommodating chamber 1
The situation on surface, effectively prevent chip from producing fragmentation by tumble injury, reduce economic loss.
As shown in Figures 2 and 3, Fig. 2 is the concrete structure schematic diagram of the accommodating chamber 1 shown in Fig. 1, and Fig. 3 is shown in Fig. 2
The concrete structure schematic diagram for taking piece groove 4.
Accommodating chamber 1 can be stacked multilayer simultaneously, and typically can be in open disc shape.It is respectively provided with every layer of accommodating chamber 1
There is the bottom plate 3 for containing chip, and the opening position being in contact on every piece of bottom plate 3 with each bar slit 2 is provided with and takes piece recessed
Groove 4.When clamping chip and dropping to 3 surface of bottom plate along slit, the body of clamper, which can insert, to be taken in piece groove 4, and
When chip slide into take carry out taking piece at piece groove 4 when, chip holders can stretch into the bottom for taking piece groove 4, then by chip
Reversely rise after clamping along slit 2, and most chip gripper takes at last.Need to ensure to take the depth of piece groove 4 enough herein, so that
The space that one end of chip holders can be smoothly extend between the bottom surface of chip and the bottom surface of groove, while chip can be reduced
Clamper drops to vibration when taking piece groove 4, avoids that chip is caused to damage.
Pass through as shown in figure 4, Fig. 4 grips chip for a kind of embodiment chips clamper provided by the present invention
The structural representation of slit.
Simultaneously, it is contemplated that when placing or gripping chip, chip may moved on the surface of bottom plate 3, to avoid
Chip is damaged, in the present embodiment, the surface of bottom plate 3 is arranged to smooth surface.Such as the surface of bottom plate 3 can be by technique at
Reason ensures smooth as far as possible, reduces the abrasion to chip surface.Meanwhile bottom plate 3 can also possess certain elasticity, be arranged such that
There can be minor impact between chip imprudence and the surface of bottom plate 3, be able to will also be impacted by the elastic buffer function of elastic plate
Overcoming to reduce.In addition, the bottom plate 3 can also be designed as inclined-plane, such as inclined-plane that angle of inclination is 1~2 ° etc., it is arranged such,
When cleaning chip, cleaning fluid of chip surface etc. can be slided successfully under gravity, avoid aggregation from forming the globule,
The step of follow-up nitrogen purging can also be omitted simultaneously, directly dried.
As shown in figure 5, Fig. 5 is to be slided in a kind of embodiment provided by the present invention by chip holders first
The structural representation of chip movement is promoted in road or the second slideway.
, it is necessary to which each chip is on the bottom plate 3 of accommodating chamber 1 when further, to place or gripping in an orderly manner a large amount of chips
Neat or regularly arrange, be distributed, therefore, after chip gripper is got in accommodating chamber 1, staff often also needs to pair
Chip carries out position movement.Pin is on the other hand, the present embodiment sets some the first slideways 5 on the surface of bottom plate 3.Each bar first is slided
Road 5 crosses one another on the surface of bottom plate 3, and one end of the first slideway of each bar 5 takes piece groove 4 to connect with one respectively.Wherein,
First slideway 5 is mainly used in coordinating with chip holders, and the chute width of the first slideway 5 is wide slightly larger than the termination of chip holders
Degree, therefore chip holders can firmly be inserted in the first slideway 5 and enter line slip.And when chip holders are slided in each bar first
When being slided in road 5, you can promote or grip some chip and carry out position movement, so as to be moved into the default position on bottom plate 3
Put place.Herein preferably, can be in 4 the first slideways 5 of setting simultaneously on the surface of bottom plate 3, and this 4 the first slideways 5 intersect
In the midpoint of bottom plate 3, and this 4 the first slideways 5 can angle at 45 ° two-by-two, " rice " character form structure is integrally formed.
Moreover, to improve the agility for passing through the first slideway 5 and moving each chip, the present embodiment is also on bottom plate 3
It is additionally arranged circuit 6.The circuit 6 is annular in shape, and each first slideway 5 is interconnected, in this way, chip holders are at each article the
When being slided on one slideway 5, it can also at any time enter in circuit 6, improve the convenience of moving chip, eliminate chip in bottom plate
Mobile dead angle on 3 surfaces.
Furthermore, it is contemplated that segment chip is in cleaning process, it is understood that there may be a side surface is close to the surface of bottom plate 3 all the time
Situation that is upper and leading to not cleaning, pin is on the other hand, the present embodiment is additionally arranged some the second slideways 7 on the surface of bottom plate 3, together
When on the second slideway 7 be provided with installation sliding block 8.Specifically, each the second slideway of bar 7 can be disposed in parallel relation to one another, the second slideway 7 is led
It is used to provide for installation sliding block 8 and slides place, certainly, the second slideway 7 equally can inserts chip holders wherein to be slided
It is dynamic, and the second slideway 7 can also intersect with the first slideway 5.And sliding block 8 is installed and is slidably disposed on each the second slideway of bar 7
On, it is mainly used in setting up chip vertically so that the segment chip can be to keep the posture erect to be cleaned, in this way, cleaning
Liquid can be cleaned easily to two surfaces of the segment chip.
As shown in fig. 6, Fig. 6 is the concrete structure schematic diagram of the installation sliding block 8 shown in Fig. 1.
Specifically, in a kind of preferred embodiment on installing sliding block 8, the installation sliding block 8 specifically includes sliding part
801st, the Access Division 803 at multiple spacer bars 802 and both ends.Wherein, sliding part 801 is mainly used in matching with each the second slideway of bar 7
Close, can in each the second slideway of bar 7 synchronous slide, and multiple spacer bars 802 are arranged on sliding part 801, are mainly used in pressing from both sides
Two surfaces of chip are held, make it keep erectting.Also, the gap between each spacer bar 802, with the second adjacent slideway 7
Between gap in correspondence with each other, left side installation sliding block 8 on each spacer bar 802 between gap, right side installation sliding block 8 on
Gap between each spacer bar 802, three impetus are formed with the second slideway 7, fixed chip can be stablized.Access Division 803 is set
The end positions in sliding part 801 are put, is mainly used in being engaged with the buckling groove being arranged in the side wall of the second slideway 7, will install
Sliding block 8 is fixed in the second slideway 7.It is arranged such, when placing installation sliding block 8, sliding part 801 can be inserted into second first
In slideway 7, after slip behind precalculated position, firmly pressing makes the buckling groove in the side wall of 803 and second slideway of Access Division 7 form clamping
Coordinate, slideway 8 will be now installed and be fixed on the second slideway 7.In general, two can be set simultaneously on each the second slideway of bar 7
Individual installation sliding block 8, in this way, the both ends of chip piece can be separately mounted on two installation sliding blocks 8, meanwhile, two are slided respectively
Sliding block 8 is installed, changes its distance, the size range of chip can be changed.
As shown in fig. 7, Fig. 7 is the cooperation knot of spacing hole and limited post in a kind of embodiment provided by the present invention
Structure schematic diagram.
In addition, it is contemplated that in cleaning machine during clear chip, each chip may carry out space fortune in accommodating chamber 1
Dynamic, or cleaned liquid floats, flows, causing to collide with each other causes to damage, pin on the other hand, the present embodiment on the surface of bottom plate 3
It is upper to be provided with several equally distributed spacing holes 9, and arrange in pairs or groups using several limited posts 10 coordinated with spacing hole 9.Should
After limited post 10 is arranged on spacing hole 9, it is mainly used in limiting space of each chip in accommodating chamber 1, makes chip in water
Square upward motion and motion in vertical direction are limited in default narrow space, and then are accommodating chip
When being cleaned in chamber 1, it is only capable of moving in each self-corresponding narrow space, effectively prevents from colliding with each other.
As shown in figure 8, Fig. 8 is the concrete structure schematic diagram of the limited post shown in Fig. 7.
Specifically, spacing hole 9 can be the structures such as through hole, and limited post 10 mainly includes Plug Division 101, horizontal limiting unit
102nd, vertical limiting unit 103 and compact heap 104.Wherein, the diameter of Plug Division 101 is suitable with spacing hole 9, is mainly used in being inserted into
Coordinate installation with it in each spacing hole 9.Horizontal limiting unit 102 is arranged on the top of Plug Division 101, has a diameter larger than Plug Division
101 and the diameter of spacing hole 9, it is mainly used in after coordinating in Plug Division 101 and spacing hole 9, is pressed on the surface of bottom plate 3, together
When, certain distance is left between the outer rim of horizontal limiting unit 102 and the edge of chip, the distance is to allow chip in level side
Upward displacement, when the displacement of chip level motion reach this apart from when, the outer rim of horizontal limiting unit 102 is i.e. and chip
Edge abuts, so as to limit its horizontal movement.Similarly, vertical limiting unit 103 is arranged on the top of horizontal limiting unit 102, and its is straight
Footpath is more than the diameter of horizontal limiting unit 102, it is important that leaves one between the bottom surface of vertical limiting unit 103 and the surface of chip
Set a distance, the distance are to allow chip displacement in vertical direction, when the displacement of chip catenary motion reach this away from
From when, the bottom surface of vertical limiting unit 103 abuts with the surface of chip, so as to limit its catenary motion.
In addition, the present embodiment is also additionally arranged compact heap 104 on the surface of vertical limiting unit 103.Specifically, the compact heap
104 one side can facilitate chip holders to be gripped, on the other hand can also increase certain counterweight so that Plug Division 101 with
The cooperation of spacing hole 9 is more stable.
Further, horizontal limiting unit 102 and vertical limiting unit 103 can be specifically elastic construction, for example, foam-rubber cushion or
Block rubber etc., so when chip is cleaned in the accommodating chamber 1 and move to is abutted with both when, can try one's best vibration of the mitigation to chip
And impact, avoid damaging.
In addition, discharging cleaning fluid and rapid draing after cleaning terminates for convenience of chip, the present embodiment is in the side of accommodating chamber 1
Several osculums 11 have been opened up on wall and/or bottom plate 3.Importantly, the concrete shape of each osculum 11 is arc transition
Curve matching forms circular or oval etc., in this way, the corner of the rectangular chip in part can be avoided by osculum 11
Corner angle institute card column, is easy to smoothly take out.
As shown in figure 9, Fig. 9 is in multilayer accommodating chamber inner clip coring piece in a kind of embodiment provided by the present invention
Structural representation.
In addition, to improve the efficiency of cleaning chip, multiple accommodating chambers 1 are axially concatenated by connecting rod 12 in the present embodiment
Integrally, while in connecting rod 12 hook part can be set, be easy to fingertip grasp, grip.Specifically, each accommodating chamber 1 can be
Axially stacked arrangement on (or height) direction, is then provided with mounting cylinder 13, together on the bottom plate 3 positioned at the accommodating chamber 1 of bottom
When, mounting hole is provided with the bottom plate 3 of the accommodating chamber 1 of remainder layer, wherein, the mounting cylinder 13 is mainly used in installing connecting rod
12, for example mounting cylinder 13 can be connected through a screw thread with the lower part of connecting rod 12 or latch connects, while mounting hole is also used for
Coordinate with the lower part of connecting rod 12, form shaft hole matching.In this way, several accommodating chambers 1 can be concatenated by connecting rod 12
Integrally, clear a large amount of chips in cleaning machine are inserted while.Also, the lower part for passing through connecting rod 12 except the accommodating chamber 1 of bottom
Outside cooperation with mounting cylinder 13 can not rotate, remaining each layer accommodating chamber 1 can circumferentially rotate in the upper part of connecting rod 12,
Such as rotatable 180 ° etc..In this way, when needing the chip placement in each layer accommodating chamber 1, each layer being positioned above can be held
Chamber 1 of receiving rotates to the orientation such as 180 ° so that the opening and slit 2 for being currently needed for the accommodating chamber 1 of chip placement are exposed, so
Technical staff can easily carry out the gripping operation of chip in this layer of accommodating chamber 1 afterwards.And placed in each layer accommodating chamber 1
After chip, same orientation can be rotated it to, is easy to simultaneously insert each layer accommodating chamber 1 in cleaning machine and cleans, is not only saved empty
Between, and improve cleaning efficiency.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (10)
1. a kind of chip cleaning container, it is characterised in that including accommodating chamber (1), offered on the accommodating chamber (1) for allowing
The slit that chip holders stretch into, and some are offered in the side wall of the accommodating chamber (1) and extends to bottom from its slit, use
In the slit (2) for allowing the chip holders to pass through.
2. chip cleaning container according to claim 1, it is characterised in that be provided with the accommodating chamber (1) for containing
The bottom plate (3) of cartridge chip, and the opening position contacted on the bottom plate (3) with slit (2) described in each bar is provided with and takes piece groove
(4), and described piece groove (4) is taken to be connected with the slit (2).
3. chip cleaning container according to claim 2, it is characterised in that the surface of the bottom plate (3) is smooth.
4. chip cleaning container according to claim 2, it is characterised in that the bottom plate (3) if surface on be provided with
Dry bar crosses one another and one end and first slideway (5) for taking piece groove (4) to connect, and by the first slideway described in each bar
(5) circuit (6) interconnected;First slideway (5) and circuit (6) are used to coordinate with the chip holders and slided.
5. chip cleaning container according to claim 4, it is characterised in that be additionally provided with the surface of the bottom plate (3)
Some the second slideways (7), and the second slideway (7) restocking described in each bar is provided with several and is used to make chip keep the installation erect
Sliding block (8).
6. chip cleaning container according to claim 5, it is characterised in that the installation sliding block (8), which specifically includes, to be used for
The sliding part (801) coordinated with the second slideway (7) described in each bar, and be arranged on the sliding part (801), for clamping core
Multiple spacer bars (802) of piece both side surface.
7. chip cleaning container according to claim 6, it is characterised in that the bottom plate (3) if surface on be provided with
Dry equally distributed spacing hole (9), in addition to coordinate installation, for limiting each chip described with each spacing hole (9)
Several limited posts (10) of space in accommodating chamber (1).
8. chip cleaning container according to claim 7, it is characterised in that each limited post (10) includes being used to insert
Enter to the Plug Division (101) in the spacing hole (9), be arranged at the Plug Division (101) top and for being pressed on the bottom
Horizontal limiting unit (102) on plate (3) surface, to be abutted after each chip level movement pre-determined distance with its edge, is arranged at
Compressed part (102) top, the vertical limiting unit for being abutted after the vertical mobile pre-determined distance of each chip with its surface
(103);And it is arranged at vertical limiting unit (103) top, the compact heap for being easy to the chip holders gripping
(104)。
9. chip cleaning container according to claim 8, it is characterised in that the side wall of the accommodating chamber (1) and/or described
Several osculums (11) are offered on bottom plate (3), and each osculum (11) is rounded.
10. chip cleaning container according to claim 9, it is characterised in that also include being used for multiple accommodating chambers
(1) axially concatenation, the connecting rod (12) for fingertip grasp, and set on the bottom plate (3) of the accommodating chamber (1) of bottom
There is the mounting cylinder (13) for installing the connecting rod (12);Use is offered on the bottom plate (3) of the accommodating chamber (1) of remainder layer
In the mounting hole coordinated with the connecting rod (12).
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CN201710597839.1A CN107393852B (en) | 2017-07-20 | 2017-07-20 | A kind of chip cleaning container |
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CN201710597839.1A CN107393852B (en) | 2017-07-20 | 2017-07-20 | A kind of chip cleaning container |
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CN107393852B CN107393852B (en) | 2019-08-02 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112871860A (en) * | 2020-08-28 | 2021-06-01 | 山东华光光电子股份有限公司 | Cleaning device and cleaning method for metal part of semiconductor laser |
CN117153766A (en) * | 2023-10-31 | 2023-12-01 | 宁波尚进自动化科技有限公司 | Chip clamp |
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CN112871860A (en) * | 2020-08-28 | 2021-06-01 | 山东华光光电子股份有限公司 | Cleaning device and cleaning method for metal part of semiconductor laser |
CN117153766A (en) * | 2023-10-31 | 2023-12-01 | 宁波尚进自动化科技有限公司 | Chip clamp |
CN117153766B (en) * | 2023-10-31 | 2024-04-02 | 宁波尚进自动化科技有限公司 | Chip clamp |
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