CN112868275A - 均热板、散热器及终端 - Google Patents

均热板、散热器及终端 Download PDF

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Publication number
CN112868275A
CN112868275A CN201980038303.3A CN201980038303A CN112868275A CN 112868275 A CN112868275 A CN 112868275A CN 201980038303 A CN201980038303 A CN 201980038303A CN 112868275 A CN112868275 A CN 112868275A
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substrate
heat
reinforcing
region
plate
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CN201980038303.3A
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CN112868275B (zh
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丹尼斯·叶尔琴科
孙浩
谢尔盖·科海勒纳索夫
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00—Reinforcing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00—Reinforcing means
    • F28F2225/04—Reinforcing means for conduits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种均热板、散热器及终端。均热板(10)包括第一基板(12)、第二基板(13)及毛细结构(15)，第一基板(12)与第二基板(13)层叠设置并固定相接且共同围成腔体(11)，腔体(11)用于容纳工作介质，第一基板(12)与第二基板(13)之间设有多个支撑柱(120)，腔体(11)的内壁及至少一个支撑柱(120)的外壁上设有毛细结构(15)，毛细结构(15)用于为工作介质提供回液的毛细力，第一基板(12)与第二基板(13)之间设有位于腔体(11)内的补强台(127)，补强台(127)用于提高均热板(10)的刚度。

Description

PCT国内申请，说明书已公开。

Claims (14)

  1. PCT国内申请，权利要求书已公开。
CN201980038303.3A 2019-09-12 2019-09-12 均热板、散热器及终端 Active CN112868275B (zh)

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PCT/CN2019/105796 WO2021046827A1 (zh) 2019-09-12 2019-09-12 均热板、散热器及终端

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CN112868275B CN112868275B (zh) 2022-09-16

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US (1) US12082381B2 (zh)
EP (1) EP3836766B1 (zh)
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WO (1) WO2021046827A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114396818A (zh) * 2022-02-10 2022-04-26 嵊州天脉导热科技有限公司 一种vc均热板盖板散热模组
CN117500149A (zh) * 2023-12-27 2024-02-02 荣耀终端有限公司 一种均热板、电路板组件及电子设备

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11678464B2 (en) * 2021-08-06 2023-06-13 Dell Products L.P. Heat transfer device for use in an information handling system
CA3170441A1 (en) * 2021-11-02 2023-05-02 Ametek, Inc. Circuit card assemblies
TWI842472B (zh) 2023-04-12 2024-05-11 國立清華大學 均溫板裝置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101232794A (zh) * 2007-01-24 2008-07-30 富准精密工业(深圳)有限公司 均热板及散热装置
CN201706933U (zh) * 2010-06-24 2011-01-12 索士亚科技股份有限公司 具有复合式支撑结构的均温板
CN202514230U (zh) * 2012-03-12 2012-10-31 华南理工大学 一种带内烧结结构支撑柱的均热板
CN107557825A (zh) * 2017-07-21 2018-01-09 林进东 铜粉金属镀层、金属基板、节能防胀爆散热装置及其制备工艺
CN107949238A (zh) * 2017-11-10 2018-04-20 中国船舶重工集团公司第七六研究所 一种带支撑柱结构的均热板散热装置及其制备方法
CN207427663U (zh) * 2017-07-10 2018-05-29 广州华钻电子科技有限公司 一种超亲水性均热板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050128710A1 (en) * 2003-12-15 2005-06-16 Beiteimal Abdlmonem H. Cooling system for electronic components
DE202007007568U1 (de) * 2007-05-25 2007-09-20 Boston Cool Tec Corporation, Wilmington Eine flache Heatpipe (Wärmeleitrohr) und Kühlkörper welche diese verwenden
US20090040726A1 (en) * 2007-08-09 2009-02-12 Paul Hoffman Vapor chamber structure and method for manufacturing the same
US8018719B2 (en) 2009-05-26 2011-09-13 International Business Machines Corporation Vapor chamber heat sink with cross member and protruding boss
US8857502B2 (en) * 2011-07-26 2014-10-14 Kunshan Jue-Chung Electronics Co., Ltd. Vapor chamber having heated protrusion
US20180066897A1 (en) * 2016-09-08 2018-03-08 Taiwan Microloops Corp. Vapor chamber and upper casing member thereof
US20180320997A1 (en) * 2017-05-05 2018-11-08 Forcecon Technology Co., Ltd. Temperature-uniforming plate with supporting effect
US20190027424A1 (en) * 2017-07-19 2019-01-24 Heatscape.Com, Inc. High strength high performance reinforced vapor chamber and related heatsinks
US10470291B2 (en) * 2017-07-21 2019-11-05 Chintung Lin Process for preparing an energy saving anti-burst heat dissipation device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101232794A (zh) * 2007-01-24 2008-07-30 富准精密工业(深圳)有限公司 均热板及散热装置
CN201706933U (zh) * 2010-06-24 2011-01-12 索士亚科技股份有限公司 具有复合式支撑结构的均温板
CN202514230U (zh) * 2012-03-12 2012-10-31 华南理工大学 一种带内烧结结构支撑柱的均热板
CN207427663U (zh) * 2017-07-10 2018-05-29 广州华钻电子科技有限公司 一种超亲水性均热板
CN107557825A (zh) * 2017-07-21 2018-01-09 林进东 铜粉金属镀层、金属基板、节能防胀爆散热装置及其制备工艺
CN107949238A (zh) * 2017-11-10 2018-04-20 中国船舶重工集团公司第七六研究所 一种带支撑柱结构的均热板散热装置及其制备方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114396818A (zh) * 2022-02-10 2022-04-26 嵊州天脉导热科技有限公司 一种vc均热板盖板散热模组
CN114396818B (zh) * 2022-02-10 2024-06-18 嵊州天脉导热科技有限公司 一种vc均热板盖板散热模组
CN117500149A (zh) * 2023-12-27 2024-02-02 荣耀终端有限公司 一种均热板、电路板组件及电子设备
CN117500149B (zh) * 2023-12-27 2024-04-26 荣耀终端有限公司 一种均热板、电路板组件及电子设备

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Publication number Publication date
EP3836766A4 (en) 2021-10-27
EP3836766A1 (en) 2021-06-16
US20210289669A1 (en) 2021-09-16
CN112868275B (zh) 2022-09-16
EP3836766B1 (en) 2022-07-27
WO2021046827A1 (zh) 2021-03-18
US12082381B2 (en) 2024-09-03

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