CN112863329B - Display device - Google Patents

Display device Download PDF

Info

Publication number
CN112863329B
CN112863329B CN202010830552.0A CN202010830552A CN112863329B CN 112863329 B CN112863329 B CN 112863329B CN 202010830552 A CN202010830552 A CN 202010830552A CN 112863329 B CN112863329 B CN 112863329B
Authority
CN
China
Prior art keywords
opening
display device
pad
insulating layer
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010830552.0A
Other languages
Chinese (zh)
Other versions
CN112863329A (en
Inventor
戴名柔
蔡嘉豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Innolux Corp
Original Assignee
Innolux Display Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innolux Display Corp filed Critical Innolux Display Corp
Priority to CN202310059835.3A priority Critical patent/CN115830996A/en
Priority to US17/073,402 priority patent/US11756963B2/en
Publication of CN112863329A publication Critical patent/CN112863329A/en
Application granted granted Critical
Publication of CN112863329B publication Critical patent/CN112863329B/en
Priority to US18/359,897 priority patent/US20230387142A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136227Through-hole connection of the pixel electrode to the active element through an insulation layer

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

The present disclosure provides a display device including a thin film transistor, a landing pad, and a pixel electrode. The thin film transistor includes a drain electrode. The adapter pad is electrically connected to the drain. The pixel electrode is electrically connected to the transfer pad through the first opening of the first insulating layer. The first insulating layer is arranged between the transfer pad and the pixel electrode. The width of the first opening is larger than that of the drain electrode. The width of the first opening is smaller than that of the transfer pad. The display device can improve and stabilize the electron transmission between the pixel electrode and the drain electrode.

Description

Display device
Technical Field
The present disclosure relates to an electronic device, and more particularly, to a display device capable of improving and stabilizing electron transmission between a pixel electrode and a drain electrode.
Background
Flat display panels have been widely used in electronic devices such as mobile phones, televisions, monitors, tablet computers, displays for vehicles, wearable devices, and desktop computers. With the rapid development of electronic products, the requirements for display quality on the electronic products are higher and higher, so that the electronic devices for displaying are continuously improved towards larger or higher resolution display effects.
Disclosure of Invention
The present disclosure provides a display device that can improve and stabilize electron transfer between a pixel electrode and a drain electrode.
According to an embodiment of the present disclosure, a display device includes a thin film transistor, a landing pad, and a pixel electrode. The thin film transistor includes a drain electrode. The adapter pad is electrically connected to the drain. The pixel electrode is electrically connected to the transfer pad through the first opening of the first insulating layer. The first insulating layer is arranged between the transfer pad and the pixel electrode. The width of the first opening is larger than that of the drain electrode. The width of the first opening is smaller than that of the transfer pad.
In view of the above, in the display device according to the embodiment of the disclosure, the pixel electrode may be electrically connected to the landing pad through the first opening of the first insulating layer, and the landing pad may be electrically connected to the drain. The width of the first opening is larger than that of the drain electrode, and the width of the first opening is smaller than that of the transfer pad, so that the contact area between the pixel electrode and the transfer pad can be increased. Therefore, the display device of the embodiment can improve and stabilize the electron transmission between the pixel electrode and the drain electrode by arranging the landing pad, so as to reduce the resistance between the pixel electrode and the drain electrode and improve the display quality of the display device.
Drawings
The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the disclosure and together with the description serve to explain the principles of the disclosure.
Fig. 1A is a schematic top view of a display device according to an embodiment of the disclosure;
FIG. 1B isbase:Sub>A schematic cross-sectional view of the display device of FIG. 1A along section line A-A';
FIG. 1C is a schematic cross-sectional view of the display device of FIG. 1A along section line B-B';
fig. 2 is a schematic top view of a display device according to another embodiment of the disclosure.
Description of the reference numerals
100. 100a: a display device;
110: a thin film transistor;
120. 120a, 120b: connecting the pad;
121. 121a, 121b: a first portion;
122. 122a, 122b: a second portion;
123. 123a, 123b: a first side edge;
124. 124a, 124b: a second side edge;
130: a pixel electrode;
140: a substrate;
150: a first insulating layer;
151. 151a, 151b: a first opening;
160: a second insulating layer;
161. 161a, 161b: a second opening;
170: a buffer layer;
171: a shielding layer;
172. 174, and (3) a step of: an insulating layer;
173: a dielectric layer;
173a, 173b, 173c: opening a hole;
180: a common electrode;
190: a black matrix layer;
CH: channel
D1, D2: a distance;
DL: a data line;
GE: a gate electrode;
GI: a gate insulating layer;
GIa, GIb, GIc: opening a hole;
SD1: a source electrode;
SD2: a drain electrode;
and SE: a semiconductor layer;
SL: scanning a line;
w1, W2, W3, W4, W5, W6: a width;
x, Y: and (4) direction.
Detailed Description
The present disclosure may be understood by reference to the following detailed description taken in conjunction with the accompanying drawings, in which it is noted that, for the sake of clarity and brevity of the drawings, the various drawings in the present disclosure depict only some of the electronic devices and are not necessarily drawn to scale. In addition, the number and size of the elements in the figures are merely illustrative and are not intended to limit the scope of the present disclosure.
In the following specification and claims, the words "comprise", "comprising", "includes" and "including" are open-ended words, and thus should be interpreted to mean "including, but not limited to, \8230;".
It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers may be present (not directly). In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or film, there are no intervening elements or films present between the two.
Although the terms first, second and third 8230can be used to describe various components, the components are not limited by these terms. This term is used only to distinguish a single component from other components within the specification. The same terms may not be used in the claims, but may be replaced by the first, second and third 8230in the order in which the elements in the claims are announced. Therefore, in the following description, a first constituent element may be a second constituent element in the claims.
In some embodiments of the present disclosure, terms such as "connected," "interconnected," and the like, with respect to bonding, connecting, and the like, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, unless otherwise specified, with respect to the structure between which they are disposed. And the terms coupled and connected should also be construed to include both structures being movable or both structures being fixed. Furthermore, the term "coupled" includes any direct and indirect electrical connection.
In the present disclosure, the length and the width can be measured by an optical microscope, and the thickness can be measured by a cross-sectional image in an electron microscope, but not limited thereto. In addition, there may be some error in any two values or directions for comparison.
The electronic device of the present disclosure may include, but is not limited to, a display device, an antenna device, a sensing device, a touch display device (touch display), a curved display device (curved display), or a non-rectangular display device (free shape display). The electronic device can be a bendable or flexible electronic device. The electronic device may include, for example, but is not limited to, a light emitting diode, a liquid crystal (liquid crystal), a fluorescent (fluorescent), a phosphorescent (phosphor), a Quantum Dot (QD), other suitable display medium, or a combination of the foregoing. The light emitting diode may include, for example, an Organic Light Emitting Diode (OLED), an inorganic Light Emitting Diode (LED), a sub-millimeter light emitting diode (mini LED), a micro LED, or a quantum dot light emitting diode (which may be, for example, a QLED or a QDLED), or other suitable materials or any combinations thereof, but is not limited thereto. The display device may include, for example, a tiled display device, but is not so limited. The antenna device may be, for example, a liquid crystal antenna, but is not limited thereto. The antenna device may include, for example, but is not limited to, an antenna splicing device. It should be noted that the electronic device can be any permutation and combination of the foregoing, but not limited thereto. In addition, the exterior of the electronic device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The electronic device may have a driving system, a control system, a light source system, a layer shelf system 8230a peripheral system to support a display device, an antenna device or a splicing device. The present disclosure will be described with reference to a display device, but the present disclosure is not limited thereto.
It is to be understood that the following disclosure is illustrative of various embodiments, and that various changes, substitutions, and alterations can be made herein without departing from the spirit and scope of the disclosure. Features of the various embodiments may be combined and matched as desired, without departing from the spirit or ambit of the invention.
Reference will now be made in detail to the exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
Fig. 1A is a schematic top view of a display device according to an embodiment of the disclosure. FIG. 1B isbase:Sub>A cross-sectional view of the display device of FIG. 1A along the section line A-A'. FIG. 1C is a cross-sectional view of the display device of FIG. 1A along section line B-B'. For clarity of the drawings and ease of description, several elements in the display device are omitted from fig. 1A.
Referring to fig. 1A, fig. 1B and fig. 1C, the display device 100 of the present embodiment includes a thin film transistor 110, a landing pad 120 and a pixel electrode 130. The tft 110, the landing pad 120, and the pixel electrode 130 are disposed on the substrate 140 of the display device 100. In the present embodiment, the substrate 140 may include a rigid substrate, a flexible substrate, or a combination thereof. For example, the material of the substrate 140 may include glass, quartz, sapphire (sapphire), ceramic, polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), other suitable substrate materials, or a combination thereof, but is not limited thereto.
In the present embodiment, the thin film transistor 110 includes a gate electrode GE, a portion of a gate insulating layer GI, a source electrode SD1, a drain electrode SD2, and a semiconductor layer SE, but not limited thereto. The gate insulating layer GI may have openings GIa and GIb to expose a portion of the semiconductor layer SE. In the present embodiment, the material of the source electrode SD1 and/or the drain electrode SD2 may include a transparent conductive material or a non-transparent conductive material, such as indium tin oxide, indium zinc oxide, indium oxide, zinc oxide, tin oxide, a metal material (e.g., aluminum, molybdenum, copper, silver, etc.), other suitable materials, or a combination thereof, but is not limited thereto. The material of the semiconductor layer SE may include amorphous silicon (amorphous silicon), low Temperature Polysilicon (LTPS), metal oxide (e.g., indium gallium zinc oxide IGZO), other suitable materials, or a combination thereof, but is not limited thereto. In other embodiments, different thin film transistors may include different semiconductor layer materials, but not limited thereto.
In the top view of the display device 100 of the present embodiment (as shown in fig. 1A), the display device 100 further includes scan lines SL and data lines DL. The scan lines SL and the data lines DL are disposed on the substrate 140. The scan lines SL extend along a direction X, the data lines DL extend along a direction Y, and the direction X is different from the direction Y. Since the source SD1 of the tft 110 can be electrically connected to the data line DL and the gate GE of the tft 110 can be electrically connected to the scan line SL, the tft 110 can be electrically connected to the data line DL and the scan line SL.
Referring to fig. 1A, fig. 1B and fig. 1C, in the present embodiment, the display device 100 further includes a first insulating layer 150 having a first opening 151, a second insulating layer 160 having a second opening 161, a buffer layer 170, a shielding layer 171, an insulating layer 172, a dielectric layer 173, an insulating layer 174 and a common electrode 180. The first insulating layer 150, the second insulating layer 160, the buffer layer 170, the insulating layer 172, the dielectric layer 173 and the insulating layer 174 may be a single-layer or multi-layer structure, and may include, for example, an organic material, an inorganic material or a combination thereof, but not limited thereto. In the present embodiment, the material of the shielding layer 171 may be, for example, a metal material or other light-shielding materials. In some embodiments, the display device 100 may also be provided without a shielding layer (not shown).
In the present embodiment, the buffer layer 170 and the shielding layer 171 are disposed between the thin film transistor 110 and the substrate 140, and the shielding layer 171 is disposed corresponding to the channel CH of the gate GE in the semiconductor layer SE. The insulating layer 172 is disposed between the gate electrode GE and the gate insulating layer GI, and the insulating layer 172 is disposed corresponding to the gate electrode GE. The dielectric layer 173 is disposed between the second insulating layer 160 and the gate insulating layer GI to cover the gate electrode GE and the gate insulating layer GI. The dielectric layer 173 may have openings 173a, 173b. The opening 173a is connected to the opening GIa to expose a portion of the semiconductor layer SE, and the opening 173b is connected to the opening GIb to expose a portion of the semiconductor layer SE.
In the present embodiment, the source SD1 and the drain SD2 are respectively disposed on the dielectric layer 173. The source SD1 may also be disposed in the opening 173a of the dielectric layer 173 and the opening GIa of the gate insulating layer GI, such that the source SD1 may be electrically connected to the semiconductor layer SE through the opening 173a and the opening GIa. The drain SD2 may also be disposed in the opening 173b of the dielectric layer 173 and the opening GIb of the gate insulating layer GI, such that the drain SD2 may be electrically connected to the semiconductor layer SE through the opening 173b and the opening GIb.
In the embodiment, the second insulating layer 160 is disposed between the landing pad 120 and the drain SD2. Specifically, the second insulating layer 160 is disposed on the thin film transistor 110. The second insulating layer 160 covers the source electrode SD1, the drain electrode SD2, and the dielectric layer 173. The second insulating layer 160 and the substrate 140 are disposed on two opposite sides of the thin film transistor 110. The second insulating layer 160 has a second opening 161, and the second opening 161 exposes a portion of the drain SD2.
In the present embodiment, the landing pad 120 may be electrically connected to the drain SD2. Specifically, the landing pad 120 is disposed on the second insulating layer 160 and between the pixel electrode 130 and the drain electrode SD2. The landing pad 120 may also be disposed in the second opening 161 of the second insulating layer 160, so that the landing pad 120 may be electrically connected to the drain SD2 through the second opening 161 of the second insulating layer 160. In some embodiments, the landing pad 120 may be disposed corresponding to the drain SD2. The orthographic projection of the landing pad 120 on the substrate 140 may overlap the orthographic projection of the drain SD2 on the substrate 140, and the orthographic projection of the landing pad 120 on the substrate 140 may be larger than the orthographic projection of the drain SD2 on the substrate 140. In the top view of the display device 100 (as shown in fig. 1A), the area of the landing pad 120 may be larger than the area of the drain SD2. In the present embodiment, the landing pad 120 is made of a metal material, which may include molybdenum (Mo), aluminum (Al), titanium (Ti), copper (Cu), other suitable metals, or alloys or combinations thereof, but is not limited thereto. In some embodiments, the material of the landing pad 120 may also include a transparent conductive material, such as indium tin oxide (ito) or indium zinc oxide (izo), but not limited thereto.
In the embodiment, the first insulating layer 150 is disposed between the landing pad 120 and the pixel electrode 130. Specifically, the first insulating layer 150 is disposed on the landing pad 120, and the first insulating layer 150 covers the landing pad 120 and the second insulating layer 160. The first insulating layer 150 and the thin film transistor 110 are disposed on two opposite sides of the second insulating layer 160. The first insulating layer 150 has a first opening 151, and a portion of the landing pad 120 is exposed through the first opening 151. In some embodiments, the first opening 151 of the first insulating layer 150 may be disposed corresponding to the landing pad 120, but is not limited thereto.
In the present embodiment, the pixel electrode 130 is disposed on the first insulating layer 150 and located between the insulating layer 174 and the first insulating layer 150. The pixel electrode 130 can also be disposed in the first opening 151, so that the pixel electrode 130 can be electrically connected to the transfer pad 120 through the first opening 151 of the first insulating layer 150. In some embodiments, the orthographic projection of the pixel electrode 130 on the substrate 140 overlaps the orthographic projection of the landing pad 120 on the substrate 140, but not limited thereto.
In the present embodiment, the insulating layer 174 is disposed on the pixel electrode 130 and in the first opening 151. The insulating layer 174 covers the pixel electrode 130 and the first insulating layer 150. The common electrode 180 is disposed on the insulating layer 174 and in the first opening 151, such that the insulating layer 174 is located between the common electrode 180 and the pixel electrode 130.
In detail, in the present embodiment, in a top view of the display device 100 (as shown in fig. 1A), the adapter pad 120 may include a first portion 121 corresponding to the first opening 151 and a second portion 122 corresponding to the second opening 161. The first portion 121 of the transfer pad 120 may be exposed by the first opening 151 of the first insulating layer 150, but the second portion 122 of the transfer pad 120 may not be exposed by the first opening 151 of the first insulating layer 150. The second portion 122 of the transfer pad 120 may also be disposed in the second opening 161 of the second insulating layer 160, but the first portion 121 of the transfer pad 120 is not disposed in the second opening 161 of the second insulating layer 160. Since the area of the orthographic projection of the landing pad 120 on the substrate 140 is larger than the area of the orthographic projection of the drain electrode SD2 on the substrate 140, and the width W1 of the first portion 121 and the width W2 of the second portion 122 of the landing pad 120 are both larger than the width W3 of the drain electrode SD2, the landing pad 120 has a larger area to contact the pixel electrode 130 compared with the drain electrode SD2.
In more detail, in the embodiment, in a top view of the display device 100 (as shown in fig. 1A), the width W4 of the first opening 151 may be smaller than the width W1 of the first portion 121 of the landing pad 120, and the width W4 of the first opening 151 may be greater than the width W3 of the drain SD2. Then, since the landing pad 120 has a larger area than the drain electrode SD2 and can contact the pixel electrode 130, the width W4 of the first opening 151 corresponding to the landing pad 120 may be larger than the width W5 of the second opening 161 corresponding to the drain electrode SD2. That is, a first contact area of the pixel electrode 130 contacting the landing pad 120 through the first opening 151 may be larger than a second contact area of the landing pad 120 contacting the drain SD2 through the second opening 161. The size of the contact area can be used to indicate the electron transport amount, i.e. the electron transport amount is higher when the contact area is larger, and the electron transport amount is lower when the contact area is smaller. Therefore, compared to a display device without a transfer pad, the display device 100 of the embodiment can increase the contact area with the pixel electrode 130 by the arrangement of the transfer pad 120, so as to improve and stabilize the electron transmission between the pixel electrode 130 and the drain electrode SD2 (i.e., the pixel electrode 130 is electrically connected to the drain electrode SD2 through the first opening 151, the transfer pad 120 and the second opening 161), and reduce the resistance between the pixel electrode 130 and the drain electrode SD2, thereby improving the display quality of the display device 100. In the present embodiment, the width W1 of the first portion 121, the width W2 of the second portion 122, the width W3 of the drain electrode SD2, the width W4 of the first opening 151, and the width W5 of the second opening 161 are, for example, the maximum widths measured along the extending direction (i.e., the direction X) of the scan line SL.
In addition, in the present embodiment, in a top view (as shown in fig. 1A) of the display device 100, the width W1 of the first portion 121 of the landing pad 120 may be greater than the width W2 of the second portion 122 of the landing pad 120, for example, and the landing pad 120 may form a contour similar to a gourd-shaped (gourd shape). In the embodiment, since the width W1 of the first portion 121 of the landing pad 120 is greater than the width W2 of the second portion 122 of the landing pad 120, and the distance D1 between the second portion 122 of the landing pad 120 and the data line DL can be greater than the distance between the first portion 121 of the landing pad 120 and the data line DL, the parasitic capacitance between the landing pad 120 and the data line DL (or the source SD 1) can be reduced, the phenomenon of cross-talk between the landing pad 120 and the data line DL (or the source SD 1) can be reduced, and the problem of uneven block brightness can be avoided.
In addition, in the present embodiment, in a top view of the display device 100 (as shown in fig. 1A), the first opening 151 of the first insulating layer 150 may not overlap the second opening 161 of the second insulating layer 160. The first opening 151 of the first insulating layer 150 and the second opening 161 of the second insulating layer 160 may have a distance D2 therebetween. In detail, since the first opening 151 of the first insulating layer 150 does not overlap the second opening 161 of the second insulating layer 160, the insulating layer 174 in the first opening 151 can be formed between the pixel electrode 130 and the common electrode 180, thereby preventing the risk of short circuit due to the contact between the pixel electrode 130 and the common electrode 180. On the contrary, when the first opening of the first insulating layer overlaps the second opening (not shown) of the second insulating layer, the inverted taper (inverted taper) of the landing pad may cause the insulating layer in the first opening to be broken, and further cause the pixel electrode to contact the common electrode and cause a short circuit.
In addition, in the cross-sectional view of the display device 100 (as shown in fig. 1C), since the landing pad 120 may be disposed on the drain SD2 and may be stacked differently from the source SD1 (or the data line DL), the widths W1 and W2 of the landing pad 120 may be greater than the width W4 of the first opening 151. That is, the orthographic projection of the landing pad 120 on the substrate 140 can be partially overlapped with the orthographic projection of the first insulating layer 150 on the substrate 140. In the present embodiment, in the first opening 151, the widths W1 and W2 of the via pad 120 may be greater than the width W6 of the pixel electrode 130. Thus, a relatively flat topography (topograph) may be provided so that the insulating layer 174 in the first opening 151 may be formed between the pixel electrode 130 and the common electrode 180, thereby avoiding a risk of short circuit due to contact between the pixel electrode 130 and the common electrode 180. On the contrary, in a display device (not shown) without a landing pad, when the width of the drain is smaller than that of the first opening and the edge of the drain is exposed in the first opening, the insulating layer in the first opening may be broken due to the vertical taper (vertical taper) or the inverted taper (inverted taper) of the drain, so that the pixel electrode may contact the common electrode and cause a short circuit. In the present embodiment, the width W6 of the pixel electrode 130 in the first opening 151 is measured, for example, along the extending direction of the scan line SL (i.e., the direction X).
In addition, in the present embodiment, in a top view of the display device 100 (as shown in fig. 1A), the adapter pad 120 has a first side 123 and a second side 124 opposite to each other. The first side 123 is adjacent to the first opening 151, and the second side 124 is adjacent to the second opening 161. The first side 123 may be regarded as a side of the first portion 121 of the transfer pad 120 away from the second opening 161, and the second side 124 may be regarded as a side of the second portion 122 of the transfer pad 120 away from the first opening 151. In the present embodiment, in the extending direction of the data line DL (i.e., the direction Y), in two adjacent transfer pads 120, the first side 123 of one transfer pad 120 faces the second side 124 of the other transfer pad 120, and the second side 124 of one transfer pad 120 faces away from the first side 123 of the other transfer pad 120.
In short, in the display device 100 according to the embodiment of the disclosure, the pixel electrode 130 may be electrically connected to the landing pad 120 through the first opening 151 of the first insulating layer 150, and the landing pad 120 may be electrically connected to the drain SD2. Since the width W4 of the first opening 151 is greater than the width W3 of the drain SD2, and the width W4 of the first opening 151 is less than the width W1 of the landing pad 120, the contact area between the pixel electrode 130 and the landing pad 120 can be increased. In this way, the display device 100 of the embodiment can improve and stabilize the electron transmission between the pixel electrode 130 and the drain SD2 by the arrangement of the landing pad 120, so as to reduce the resistance between the pixel electrode 130 and the drain SD2 and improve the display quality of the display device 100.
Other examples will be listed below for illustration. It should be noted that the following embodiments follow the reference numerals and parts of the contents of the foregoing embodiments, wherein the same reference numerals are used to indicate the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.
Fig. 2 is a schematic top view of a display device according to another embodiment of the disclosure. For clarity and ease of illustration, fig. 2 omits the pixel electrodes in the display device. Referring to fig. 1A and fig. 2, the display device 100a of the present embodiment is substantially similar to the display device 100 of fig. 1A, and therefore, the same and similar components in the two embodiments are not repeated herein. The display device 100a of the present embodiment is different from the display device 100 in that two adjacent pixel electrodes (not shown) in the direction Y of the display device 100a of the present embodiment are arranged in a back-to-back (back-to-back) manner. In addition, in the extending direction of the data line DL (i.e., the direction Y), in two adjacent transfer pads 120a and 120b, the first side 123a of the transfer pad 120a and the first side 123b of the transfer pad 120b face each other, and the second side 124a of the transfer pad 120a and the second side 124b of the transfer pad 120b are opposite to each other.
Specifically, in the display device 100a of the present embodiment, the through pad 120a and the through pad 120b are adjacent to each other in the direction Y. The adapter pad 120a has a first side 123a and a second side 124a opposite to each other, and the adapter pad 120b has a first side 123b and a second side 124b opposite to each other. The first side 123a of the adapter pad 120a is adjacent to the first opening 151a and the second side 124a is adjacent to the second opening 161a, and the first side 123b of the adapter pad 120b is adjacent to the first opening 151b and the second side 124b is adjacent to the second opening 161b. The first side 123a of the transfer pad 120a can be regarded as a side of the first portion 121a of the transfer pad 120a away from the second opening 161a, and the second side 124a of the transfer pad 120a can be regarded as a side of the second portion 122a of the transfer pad 120a away from the first opening 151 a. The first side 123b of the transfer pad 120b can be regarded as the side of the first portion 121b of the transfer pad 120b away from the second opening 161b, and the second side 124b of the transfer pad 120b can be regarded as the side of the second portion 122b of the transfer pad 120b away from the first opening 151 b. In addition, openings GIc and 173c are further included between the adjacent landing pads 120a and 120b, so that the source (not shown) and the drain SD2 can be electrically connected to the semiconductor layer SE, respectively.
In this embodiment, in order to avoid light leakage caused by a topographic problem (topographiy layout) of the first openings 151a and 151b, the black matrix layer 190 of the display device 100a may shield the scan line SL, and may also shield the edges of the first openings 151a and 151b and the first openings 151a and 151b from extending outward by about 3 micrometers.
In addition, in order to increase the aperture ratio (aperture ratio), the display device 100a of the present embodiment further arranges the first openings 151a, 151b in the central area of the black matrix layer 190 and arranges the second openings 161a, 161b in the peripheral area of the black matrix layer 190. Specifically, the first openings 151a and 151b of the adapter pad 120a and the first opening 151b of the adapter pad 120b may face each other, and the second opening 161a of the adapter pad 120a and the second opening 161b of the adapter pad 120b may face away from each other, so that the first openings 151a and 151b may be disposed in a central region of the black matrix layer 190. That is, the first opening 151a of the adapter pad 120a may be adjacent to the first opening 151b of the adapter pad 120b, the first opening 151a of the adapter pad 120a may be distant from the second opening 161b of the adapter pad 120b, and the first opening 151b of the adapter pad 120b may be distant from the second opening 161a of the adapter pad 120 a. On the contrary, if the first opening is disposed in the peripheral region of the black matrix layer and the second opening is disposed in the central region (not shown) of the black matrix layer, in order to ensure that the edge of the first opening can be shielded and extend outward for about 3 microns, the shielding range of the black matrix layer needs to be additionally increased, and thus, the aperture ratio is decreased.
In summary, in the display device according to the embodiment of the disclosure, the pixel electrode can be electrically connected to the landing pad through the first opening of the first insulating layer, and the landing pad can be electrically connected to the drain. The width of the first opening is larger than that of the drain electrode, and the width of the first opening is smaller than that of the transfer pad, so that the contact area between the pixel electrode and the transfer pad can be increased. Therefore, the display device of the embodiment can improve and stabilize the electron transmission between the pixel electrode and the drain electrode by arranging the landing pad, so as to reduce the resistance between the pixel electrode and the drain electrode and improve the display quality of the display device. For example, in a high-pixel display panel with a small pixel size (such as, but not limited to, a Virtual Reality (VR) display panel), since the width of the drain is smaller than that of the drain of the high-pixel display panel with a large pixel size, the contact area between the pixel electrode and the drain may be too small to allow stable electron transfer. Therefore, if the landing pads are disposed in the display panel with a small pixel size and a high pixel density and the electrical connection design of the landing pads is adopted according to the teachings of the present embodiment, the resistance between the pixel electrode and the drain can be reduced to meet the requirements of a small pixel size and a high resolution.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present disclosure, and not for limiting the same; while the present disclosure has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present disclosure.

Claims (8)

1. A display device, comprising:
a thin film transistor including a drain electrode;
a landing pad electrically connected to the drain through a second opening of a second insulating layer, wherein the second insulating layer is disposed between the landing pad and the drain; and
a pixel electrode electrically connected to the landing pad through a first opening of a first insulating layer, wherein the first insulating layer is disposed between the landing pad and the pixel electrode,
wherein the width of the first opening is greater than the width of the drain, and the width of the first opening is less than the width of the landing pad,
the area of the transfer pad is larger than that of the drain electrode, and a first contact area of the pixel electrode, which is contacted with the transfer pad through the first opening, is larger than a second contact area of the transfer pad, which is contacted with the drain electrode through the second opening.
2. The display device according to claim 1, wherein the landing pads are made of a metal material.
3. The display device according to claim 1, wherein the first opening does not overlap the second opening.
4. The display device according to claim 1, wherein the tft is electrically connected to a data line, and the landing pad comprises a first portion corresponding to the first opening and a second portion corresponding to the second opening, and a distance between the second portion and the data line is greater than a distance between the first portion and the data line.
5. The display device according to claim 4, wherein a width of the first portion is larger than a width of the second portion.
6. The display device according to claim 1, wherein a width of the first opening is larger than a width of the second opening.
7. The display device according to claim 1, wherein a width of the landing pad in the first opening is larger than a width of the pixel electrode.
8. The display device according to claim 1, wherein in an extending direction of the data lines, a first side of one of the transfer pads and a first side of the other transfer pad face each other, and a second side of the one transfer pad and a second side of the other transfer pad face away from each other.
CN202010830552.0A 2019-11-12 2020-08-18 Display device Active CN112863329B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202310059835.3A CN115830996A (en) 2019-11-12 2020-08-18 Display device
US17/073,402 US11756963B2 (en) 2019-11-12 2020-10-19 Display device
US18/359,897 US20230387142A1 (en) 2019-11-12 2023-07-27 Electronic device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962933987P 2019-11-12 2019-11-12
US201962933986P 2019-11-12 2019-11-12
US62/933,987 2019-11-12
US62/933,986 2019-11-12

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202310059835.3A Division CN115830996A (en) 2019-11-12 2020-08-18 Display device

Publications (2)

Publication Number Publication Date
CN112863329A CN112863329A (en) 2021-05-28
CN112863329B true CN112863329B (en) 2023-02-17

Family

ID=75996123

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010830552.0A Active CN112863329B (en) 2019-11-12 2020-08-18 Display device

Country Status (1)

Country Link
CN (1) CN112863329B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1624545A (en) * 2003-12-03 2005-06-08 Lg.菲利浦Lcd株式会社 Liquid crystal display device and method of fabricating the same
CN103926760A (en) * 2013-01-14 2014-07-16 瀚宇彩晶股份有限公司 Pixel structure and pixel array structure
CN109671726A (en) * 2019-01-04 2019-04-23 京东方科技集团股份有限公司 Array substrate and its manufacturing method, display panel, display device
CN110095889A (en) * 2018-01-30 2019-08-06 瀚宇彩晶股份有限公司 Display panel and preparation method thereof

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100604762B1 (en) * 2004-04-23 2006-07-26 일진디스플레이(주) Liquid crystal panel and manufacturing method thereof
CN1893088A (en) * 2005-07-04 2007-01-10 中华映管股份有限公司 Film transistor array
KR20120031772A (en) * 2010-09-27 2012-04-04 삼성모바일디스플레이주식회사 Organic light emitting diode display and manufacturing method thereof
KR101885329B1 (en) * 2012-01-05 2018-08-06 삼성디스플레이 주식회사 Substrate comprising thin film transistors and organic light emitting display apparatus comprising the same
KR101706480B1 (en) * 2012-06-25 2017-02-13 샤프 가부시키가이샤 Active matrix substrate, liquid crystal display device, and method for manufacturing active matrix substrate
KR20150030034A (en) * 2013-09-11 2015-03-19 삼성디스플레이 주식회사 display apparatus and manufacturing method for the same
CN104656328B (en) * 2013-11-15 2017-10-31 群创光电股份有限公司 Display panel and display device
KR20150073297A (en) * 2013-12-20 2015-07-01 삼성디스플레이 주식회사 Thin film transistor, display substrate having the same and method of manufacturing a display substrate
CN104865761B (en) * 2014-02-25 2018-06-08 群创光电股份有限公司 Display panel and display device
KR102176926B1 (en) * 2014-08-27 2020-11-11 엘지디스플레이 주식회사 Display Device and Method of manufacturing the same
TWI598670B (en) * 2014-11-25 2017-09-11 友達光電股份有限公司 Pixel structure of display panel
CN104779272B (en) * 2015-04-10 2016-04-06 京东方科技集团股份有限公司 Thin-film transistor and array base palte and preparation method thereof, display unit
CN105047722A (en) * 2015-08-19 2015-11-11 京东方科技集团股份有限公司 Film transistor, manufacturing method therefor, array substrate, and display panel
TWI608599B (en) * 2016-03-02 2017-12-11 Innolux Corp Display panel
KR102547501B1 (en) * 2016-04-28 2023-06-26 삼성디스플레이 주식회사 Display device and method of manufacturing display device
CN105742299B (en) * 2016-05-16 2019-11-29 京东方科技集团股份有限公司 A kind of pixel unit and preparation method thereof, array substrate and display device
KR102549444B1 (en) * 2016-06-16 2023-06-29 삼성디스플레이 주식회사 Display device and manufacturing method the same
KR102575531B1 (en) * 2017-01-31 2023-09-06 삼성디스플레이 주식회사 Display panel and display device having the smae
CN107065347A (en) * 2017-03-28 2017-08-18 上海天马微电子有限公司 The preparation method of array base palte, liquid crystal display panel and array base palte
KR102448030B1 (en) * 2017-09-21 2022-09-28 삼성디스플레이 주식회사 Display apparatus
CN109659310B (en) * 2017-10-10 2021-02-05 瀚宇彩晶股份有限公司 Pixel structure and manufacturing method thereof
CN108681167B (en) * 2018-06-22 2021-09-03 厦门天马微电子有限公司 Display panel and display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1624545A (en) * 2003-12-03 2005-06-08 Lg.菲利浦Lcd株式会社 Liquid crystal display device and method of fabricating the same
CN103926760A (en) * 2013-01-14 2014-07-16 瀚宇彩晶股份有限公司 Pixel structure and pixel array structure
CN110095889A (en) * 2018-01-30 2019-08-06 瀚宇彩晶股份有限公司 Display panel and preparation method thereof
CN109671726A (en) * 2019-01-04 2019-04-23 京东方科技集团股份有限公司 Array substrate and its manufacturing method, display panel, display device

Also Published As

Publication number Publication date
CN112863329A (en) 2021-05-28

Similar Documents

Publication Publication Date Title
US20140167052A1 (en) Array substrate for narrow bezel type liquid crystal display device and method of manufacturing the same
CN110501847B (en) Display device
KR20160090233A (en) Display device
CN112863329B (en) Display device
CN110456576B (en) Display device
KR20160123234A (en) Display panel
US11756963B2 (en) Display device
CN112785917B (en) electronic device
US11658207B2 (en) Capacitor and electronic device
US11676973B2 (en) Display device
TWI804313B (en) Electronic device and manufacturing method thereof
TWI752508B (en) Display device
CN112993020B (en) Electronic device
US20230176632A1 (en) Electronic device
US11973085B2 (en) Electronic device
CN112786618B (en) Semiconductor device with a semiconductor device having a plurality of semiconductor chips
CN112864233B (en) Electronic device
US11488985B2 (en) Semiconductor device
US11575075B2 (en) Electronic device
CN112928124B (en) Connection structure and display device comprising same
JP2024072635A (en) Display device
CN117492287A (en) Display panel

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant