CN112858027A - Chip packaging test system and test method thereof - Google Patents
Chip packaging test system and test method thereof Download PDFInfo
- Publication number
- CN112858027A CN112858027A CN202110220183.8A CN202110220183A CN112858027A CN 112858027 A CN112858027 A CN 112858027A CN 202110220183 A CN202110220183 A CN 202110220183A CN 112858027 A CN112858027 A CN 112858027A
- Authority
- CN
- China
- Prior art keywords
- plate
- wall
- rod
- groove
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
- G01N3/10—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces generated by pneumatic or hydraulic pressure
- G01N3/12—Pressure testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to the technical field of chip packaging test, and discloses a chip packaging test system and a test method thereof, wherein the chip packaging test system comprises a bottom plate, a back plate is fixedly arranged at the top of the bottom plate, a belt is arranged on the front surface of the back plate, and a material conveying mechanism which is rotatably arranged on the outer wall of the back plate is used for opening the belt and assisting the belt to rotate; the outer wall of belt has evenly seted up the standing groove, the inner wall activity of standing groove is provided with the encapsulation chip, logical groove has still been seted up to the inner wall of standing groove, the position of seting up of logical groove is corresponding with the position of encapsulation chip center department. When the first cylinder drives the movable block to descend, the movable rod can swing leftwards under the guide of the inclined plate, and then the belt is pushed to rotate leftwards through the pushing groove, so that the packaging chip in the next placing groove is just positioned below the stamping head, and the effect of automatically transporting the packaging chip is achieved. The invention has the advantages of novel design, convenient pressure test on the packaged chip and high automation degree.
Description
Technical Field
The invention relates to the technical field of chip packaging test, in particular to a chip packaging test system and a test method thereof.
Background
The shell for installing semiconductor integrated circuit chip has the functions of placing, fixing, sealing, protecting chip and enhancing electrothermal performance, and is also the bridge for communicating the internal world of chip with external circuit, and the contacts on the chip are connected to the pins of the package shell by wires, and these pins are connected with other devices by wires on the printed board. Therefore, the package plays an important role for both the CPU and other LSI integrated circuits. During the chip packaging process, the packaging quality needs to be tested, for example, the packaged chip needs to be subjected to a pressure test to detect whether the strength of the packaged chip is qualified.
In the prior art, the pressure test is usually carried out on the packaged chip manually or by using simple machinery, the automation degree is very low, a large amount of manpower is required to be consumed, the test effect is not satisfactory, and a standardized test flow does not exist.
Based on this, we propose a chip package testing system and a testing method thereof, which hopefully solve the disadvantages in the prior art.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a chip packaging test system and a test method thereof, which have the advantages of convenience in pressure test of a packaged chip and high automation degree.
(II) technical scheme
In order to realize the purposes of conveniently carrying out pressure test on the packaged chip and having high automation degree, the invention provides the following technical scheme: a chip packaging test system comprises a bottom plate, wherein a back plate is fixedly mounted at the top of the bottom plate, a belt is arranged on the front surface of the back plate, and a material conveying mechanism which is rotatably arranged on the outer wall of the back plate is used for opening the belt and assisting the belt to rotate;
the outer wall of the belt is uniformly provided with a placing groove, the inner wall of the placing groove is movably provided with a packaged chip, the inner wall of the placing groove is also provided with a through groove, and the opening position of the through groove corresponds to the position of the center of the packaged chip;
the outer wall of the back plate is also fixedly provided with a fixed frame, the tail end of the fixed frame is fixedly provided with a fixed plate, the top of the fixed plate is fixedly provided with a top plate, the outer wall of the fixed plate is provided with a movable block in a sliding manner, and a driving device connected between the top plate and the movable block drives the movable block to slide up and down on the outer wall of the fixed plate;
the bottom of the movable block is fixedly provided with an elastic testing device for applying pressure to the packaged chip and testing the pressure of the packaged chip;
a guide rod is further inserted into the movable block, the guide rod is fixedly installed at the bottom of the top plate, an electric heating plate is fixedly installed at the bottom of the guide rod, and a heater is fixedly installed at the top of the top plate and used for heating the electric heating plate;
the left side of the movable block is also fixedly provided with a pushing device, and when the movable block and the testing device punch downwards, the belt is pushed to move for a preset distance in advance;
the back of movable block still fixed mounting have the knee, the outer wall of fixed plate seted up with knee assorted movable groove, the bottom fixed mounting of knee has translation device and loading attachment, loading attachment is used for inhaling the encapsulation chip when the movable block moves down, the translation device is used for driving loading attachment and removes the top to the standing groove when the movable block is located upper portion.
As a preferred technical scheme of the invention, the material conveying mechanism comprises a damping rotating shaft, a synchronizing wheel and a rubber ring, the damping rotating shaft is rotatably arranged on the left side of the outer wall and the right side of the outer wall of the back plate, the synchronizing wheel is fixedly arranged on the outer wall of the damping rotating shaft, the rubber ring is fixedly arranged on the outer wall of the synchronizing wheel, and the rubber ring is movably arranged at two ends of the inner wall of the belt.
As a preferable technical solution of the present invention, the driving device is a first cylinder, the first cylinder is fixedly installed at the bottom of the top plate, and the movable block is fixedly installed at the bottom of the output shaft of the first cylinder.
As a preferred technical scheme of the invention, the testing device comprises an upright column, a connecting column and a stamping head, wherein the upright column is fixedly arranged at the bottom of the movable block, a cavity is formed inside the upright column, a spring is fixedly arranged on the inner top wall of the cavity, a pressing plate is fixedly arranged at the bottom of the spring, the connecting column is fixedly arranged at the bottom of the pressing plate, a column groove is formed in the inner bottom wall of the cavity, the bottom end of the connecting column penetrates through the column groove and extends to the outside of the upright column, a thread groove is formed inside the connecting column, a threaded rod is connected to the inner wall of the thread groove in a threaded manner, the threaded rod is fixedly arranged at the top of the stamping head, and the bottom of the stamping head.
As a preferred technical scheme of the invention, the pushing device comprises a side lug, a movable rod and a pushing groove, wherein the side lug is fixedly arranged on the left side of the movable block, the movable rod is rotatably arranged on the outer wall of the side lug, and a torsional spring is further arranged at the joint of the movable rod and the side lug and used for applying right elastic force to the movable rod;
the outer wall of the side lug is also fixedly provided with a limiting plate for limiting the angle of the movable rod inclining to the right;
the outer wall of the belt is also uniformly provided with push grooves, and the push grooves and the placing grooves are arranged in parallel and are in one-to-one correspondence in number;
the outer wall of the back plate is also fixedly provided with a supporting block, the supporting block is positioned inside the belt, an inner groove is formed inside the supporting block, and the forming position of the inner groove corresponds to the position of the through groove;
the left side of the support block is also fixedly provided with an inclined plate, the top of the inclined plate is an inclined plane inclined to the left, and the inclined plate is used for guiding the movable rod to swing to the left when the movable rod moves downwards so as to push the belt to rotate.
As a preferred technical scheme, the translation device comprises an upper fixing block, a second cylinder and a lower fixing block, the upper fixing block is fixedly installed at the bottom of the bent rod, the second cylinder is arranged inside the upper fixing block, a short rod is fixedly installed at the top of an output shaft of the second cylinder, a vertical plate is fixedly installed at the tail end of the short rod, a linkage rod is fixedly installed on the outer wall of the vertical plate, the lower fixing block is fixedly installed at the tail end of the linkage rod, and the lower fixing block is slidably arranged at the bottom of the upper fixing block.
As a preferred technical scheme of the invention, the feeding device comprises a tail rod, an air duct and a fan, wherein the tail rod is fixedly arranged at the bottom of the bent rod, the air duct is formed inside the tail rod, the top of the air duct is provided with an air outlet groove, and the tail end of the air outlet groove is communicated with the side surface of the tail rod;
the bottom fixed mounting of tailpiece has the dryer, the inner wall fixed mounting of dryer has the fan, the bottom fixed mounting of dryer has the buffering circle.
As a preferred technical scheme of the invention, the storage device comprises a first magnetic sheet, a second magnetic sheet and a storage box, wherein the first magnetic sheet is fixedly arranged at the top of the bottom plate, the outer wall of the first magnetic sheet is movably provided with the second magnetic sheet, the second magnetic sheet is fixedly arranged at the bottom of the storage box, a packaged chip is arranged in the storage box, and the storage box and the feeding device are on the same vertical line.
A chip package test method for a chip package test system includes the following steps
S01: the storage box with the packaged chip placed inside is attracted to the top of the first magnetic sheet through the second magnetic sheet;
s02: controlling a heater to operate, and heating the punching head through an electric heating plate;
s03: controlling the first cylinder to operate to enable the movable block at the bottom of the output shaft of the first cylinder to move downwards;
s04: when the movable block moves downwards, the movable rod is firstly inserted into the push groove to be contacted with the inclined plate and swings leftwards under the guidance of the inclined plate, the movable rod swings leftwards to push the belt through the push groove to rotate leftwards, the belt rotates leftwards to enable the packaged chip in the rear placement groove to be positioned below the movable block, and at the moment, the stamping head is driven by the movable block to descend to be contacted with the packaged chip and apply pressure to the packaged chip to carry out pressure test;
when the stamping head contacts the packaged chip to carry out pressure test on the packaged chip, the translation device and the feeding device are driven by the bent rod to descend, and the feeding device can suck the packaged chip in the storage box through the suction force of a fan inside the feeding device;
s05: the stamping head completes pressure test, and the output shaft of the first cylinder retracts to enable the movable block to move upwards;
s06: when the movable block moves upwards, the stamping head is separated from the packaged chip, the movable rod is drawn out from the push groove, the translation device and the feeding device drive the packaged chip attracted by the translation device and the feeding device to move upwards, and when the translation device and the feeding device move to the topmost end, an output shaft of a second air cylinder of the translation device extends out, the lower fixed block is driven to translate through the short rod, the vertical plate and the linkage rod, so that the lower fixed block and the feeding device are positioned above the placing groove, at the moment, the fan is controlled to stop running, the packaged chip at the bottom of the air duct loses attraction, falls down and just falls into the placing groove, and feeding is completed;
s07: and controlling the first cylinder to operate again to enable the movable block at the bottom of the output shaft to move downwards, and circulating the operation in such a way to automatically complete the pressure test on the packaged chip.
(III) advantageous effects
Compared with the prior art, the invention provides a chip packaging test system and a test method thereof, which have the following beneficial effects:
1. according to the chip packaging test system and the test method thereof, when the first cylinder drives the movable block to descend, the movable rod can swing leftwards under the guide of the inclined plate, and then the belt is pushed to rotate leftwards through the push groove, so that the packaging chip in the latter placing groove is just positioned below the stamping head, the effect of automatically transporting the packaging chip is achieved, and the pressure test on the packaging chip is facilitated.
2. According to the chip packaging test system and the test method thereof, when the first cylinder drives the movable block to descend, the stand column, the connecting column and the stamping head also descend along with the descending of the movable block, the stamping head descends to perform pressure test on the packaged chips in the placing groove, whether indexes such as strength are qualified is detected, the test is more convenient, the springs are further arranged between the stamping head, the connecting column and the stand column, certain elasticity is achieved, and the packaged chips cannot be directly broken when the pressure test is performed on the packaged chips.
3. According to the chip packaging test system and the test method thereof, when the first cylinder drives the movable block to descend, the translation device and the feeding device are also driven by the movable block to descend through the bent rod, and the feeding device can suck up the packaged chips in the storage box through the suction force of the fan inside the feeding device; when the first cylinder takes the movable block to rise again, the output shaft of the second cylinder of the translation device stretches out, the fixed block can be driven to translate through the short rod, the vertical plate and the linkage rod, the lower fixed block and the feeding device are located above the placing groove, at the moment, the fan is controlled to stop running, the packaging chip at the bottom of the air duct loses attraction and can fall down, the packaging chip just falls into the placing groove, the feeding can be automatically completed, the labor is greatly reduced, and the automation degree is higher.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged view taken at A in FIG. 1 according to the present invention;
FIG. 3 is a partial top plan view of the belt of the present invention;
FIG. 4 is a perspective view of a section of the pallet of the present invention;
FIG. 5 is an enlarged view of the invention at B of FIG. 1;
FIG. 6 is a rear view of the fixing plate portion of the present invention;
FIG. 7 is a cross-sectional view of portions of the upper and lower retaining blocks of the present invention;
FIG. 8 is an enlarged view of the invention at C of FIG. 1.
In the figure: 1. a base plate; 2. a back plate; 3. a first magnetic sheet; 4. a second magnetic sheet; 5. a storage box; 6. a damping rotating shaft; 7. a synchronizing wheel; 8. a rubber ring; 9. a belt; 10. a through groove; 11. a placement groove; 12. packaging the chip; 13. a support block; 14. an inner tank; 15. a sloping plate; 16. a fixing plate; 17. a top plate; 18. a first cylinder; 19. a movable block; 20. a column; 21. a cavity; 22. a spring; 23. pressing a plate; 24. connecting columns; 25. a column groove; 26. a thread groove; 27. a threaded rod; 28. punching a head; 29. a guide bar; 30. a heater; 31. an electric hot plate; 32. a lateral ear; 33. a movable rod; 34. a limiting plate; 35. pushing the groove; 36. bending a rod; 37. a movable groove; 38. an upper fixed block; 39. a second cylinder; 40. a short bar; 41. a vertical plate; 42. a linkage rod; 43. a lower fixed block; 44. a tail rod; 45. an air duct; 46. an air duct; 47. a fan; 48. a buffer ring; 49. a fixed mount; 50. and (4) an air outlet groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-8, a chip package testing system includes a bottom plate 1, a back plate 2 is fixedly mounted on the top of the bottom plate 1, a belt 9 is disposed on the front surface of the back plate 2, and a material transporting mechanism rotatably disposed on the outer wall of the back plate 2 is configured to open the belt 9 and assist the belt 9 to rotate;
the outer wall of the belt 9 is uniformly provided with a placing groove 11, the inner wall of the placing groove 11 is movably provided with a packaged chip 12, the inner wall of the placing groove 11 is also provided with a through groove 10, and the opening position of the through groove 10 corresponds to the position of the center of the packaged chip 12;
the outer wall of the back plate 2 is also fixedly provided with a fixed frame 49, the tail end of the fixed frame 49 is fixedly provided with a fixed plate 16, the top of the fixed plate 16 is fixedly provided with a top plate 17, the outer wall of the fixed plate 16 is provided with a movable block 19 in a sliding manner, and a driving device connected between the top plate 17 and the movable block 19 drives the movable block 19 to slide up and down on the outer wall of the fixed plate 16;
the bottom of the movable block 19 is fixedly provided with an elastic testing device for applying pressure to the packaged chip 12 to perform pressure testing on the packaged chip 12;
a guide rod 29 is further inserted into the movable block 19, the guide rod 29 is fixedly mounted at the bottom of the top plate 17, an electric heating plate 31 is fixedly mounted at the bottom of the guide rod 29, and a heater 30 is fixedly mounted at the top of the top plate 17 and used for heating the electric heating plate 31;
a pushing device is fixedly arranged on the left side of the movable block 19, and when the movable block 19 and the testing device punch downwards, the belt 9 is pushed to move for a preset distance in advance;
still fixed mounting has knee 36 at the back of movable block 19, the outer wall of fixed plate 16 seted up with knee 36 assorted movable slot 37, the bottom fixed mounting of knee 36 has translation device and loading attachment, loading attachment is used for inhaling packaged chip 12 when movable block 19 moves down, translation device is used for driving loading attachment and removes the top to standing groove 11 when movable block 19 is located upper portion.
In this embodiment, fortune material mechanism includes damping pivot 6, synchronizing wheel 7 and rubber ring 8, the outer wall left side and the outer wall right side of backplate 2 are all rotated and are provided with damping pivot 6, the outer wall fixed mounting of damping pivot 6 has synchronizing wheel 7, the outer wall fixed mounting of synchronizing wheel 7 has rubber ring 8, the activity of rubber ring 8 sets up the both ends of belt 9 inner wall, through damping pivot 6 and rubber ring 8, can make belt 9's rotation have certain resistance, when movable rod 33 was taken out from pushing away groove 35, belt 9 can not be promoted to rotate the right by movable rod 33's right thrust under the effect of resistance.
In this embodiment, the driving device is a first cylinder 18, the first cylinder 18 is fixedly installed at the bottom of the top plate 17, and the movable block 19 is fixedly installed at the bottom of the output shaft of the first cylinder 18.
In this embodiment, the testing device includes a stand column 20, a connecting column 24 and a stamping head 28, the stand column 20 is fixedly mounted at the bottom of the movable block 19, a cavity 21 is formed inside the stand column 20, a spring 22 is fixedly mounted on an inner top wall of the cavity 21, a pressing plate 23 is fixedly mounted at the bottom of the spring 22, the connecting column 24 is fixedly mounted at the bottom of the pressing plate 23, a column groove 25 is formed on an inner bottom wall of the cavity 21, the bottom end of the connecting column 24 passes through the column groove 25 and extends to the outside of the stand column 20, a thread groove 26 is formed inside the connecting column 24, a threaded rod 27 is connected to an inner wall thread of the thread groove 26, the threaded rod 27 is fixedly mounted at the top of the stamping head 28, the bottom of the stamping head 28 is a cone, a plane or an arc surface, when the first cylinder 18 drives the movable block 19 to descend, the stand column 20, the connecting column 24, the decline of punching press head 28 can carry out pressure test to the encapsulation chip 12 in the standing groove 11 to whether index such as its intensity is qualified, it is more convenient to test, and still be provided with spring 22 between punching press head 28 and spliced pole 24 and the stand 20, have certain elasticity, when carrying out pressure test to encapsulation chip 12, can directly not press disconnected encapsulation chip 12.
In this embodiment, the pushing device includes a side lug 32, a movable rod 33 and a pushing slot 35, the side lug 32 is fixedly installed on the left side of the movable block 19, the movable rod 33 is rotatably installed on the outer wall of the side lug 32, and a torsion spring is further arranged at the connection position of the movable rod 33 and the side lug 32 and used for applying a right elastic force to the movable rod 33;
a limit plate 34 is fixedly arranged on the outer wall of the side lug 32 and used for limiting the angle of the movable rod 33 inclining to the right;
the outer wall of the belt 9 is also uniformly provided with push grooves 35, and the push grooves 35 and the placing grooves 11 are arranged in parallel and are in one-to-one correspondence in number;
the outer wall of the back plate 2 is also fixedly provided with a support block 13, the support block 13 is positioned inside the belt 9, an inner groove 14 is formed inside the support block 13, and the position of the inner groove 14 corresponds to the position of the through groove 10;
an inclined plate 15 is fixedly mounted on the left side of the support block 13, the top of the inclined plate 15 is an inclined surface inclined to the left, and when the movable rod 33 moves downwards, the inclined surface is used for guiding the movable rod 33 to swing leftwards so as to push the belt 9 to rotate;
when the movable block 19 moves downward, the movable rod 33 is inserted into the push groove 35 first to contact with the inclined plate 15 and swings leftward under the guidance of the inclined plate 15, the movable rod 33 swings leftward to push the belt 9 leftward through the push groove 35, so that the belt 9 rotates leftward, and the belt 9 rotates leftward to position the packaged chip 12 in the rear placement groove 11 below the movable block 19.
In this embodiment, the translation device includes an upper fixing block 38, a second cylinder 39 and a lower fixing block 43, the upper fixing block 38 is fixedly installed at the bottom of the bent rod 36, the second cylinder 39 is arranged inside the upper fixing block 38, a short rod 40 is fixedly installed at the top of an output shaft of the second cylinder 39, a vertical plate 41 is fixedly installed at the tail end of the short rod 40, a linkage rod 42 is fixedly installed on the outer wall of the vertical plate 41, the lower fixing block 43 is fixedly installed at the tail end of the linkage rod 42, and the lower fixing block 43 is slidably arranged at the bottom of the upper fixing block 38;
the feeding device comprises a tail rod 44, an air duct 46 and a fan 47, wherein the tail rod 44 is fixedly installed at the bottom of the bent rod 36, an air duct 45 is formed inside the tail rod 44, an air outlet groove 50 is formed in the top of the air duct 45, and the tail end of the air outlet groove 50 is communicated with the side surface of the tail rod 44;
the bottom of the tail rod 44 is fixedly provided with an air duct 46, the inner wall of the air duct 46 is fixedly provided with a fan 47, and the bottom of the air duct 46 is fixedly provided with a buffer ring 48;
the storage device comprises a first magnetic sheet 3, a second magnetic sheet 4 and a storage box 5, wherein the first magnetic sheet 3 is fixedly arranged at the top of the bottom plate 1, the second magnetic sheet 4 is movably arranged on the outer wall of the first magnetic sheet 3, the second magnetic sheet 4 is fixedly arranged at the bottom of the storage box 5, a packaging chip 12 is arranged inside the storage box 5, and the storage box 5 and the feeding device are on the same vertical line;
when the punching head 28 contacts the packaged chip 12 to perform pressure test on the packaged chip 12, the translation device and the feeding device are also driven by the bent rod 36 to descend, the feeding device can suck the packaged chip 12 in the storage box 5 through the suction force of the fan 47 in the feeding device, when the movable block 19 moves upwards, the punching head 28 is separated from the packaged chip 12, the movable rod 33 is drawn out from the push groove 35, the translation device and the feeding device also drive the packaged chip 12 sucked by the translation device and the feeding device to move upwards, and when the translation device and the feeding device move to the topmost end, the output shaft of the second air cylinder 39 of the translation device extends out, the lower fixed block 43 is driven by the short rod 40, the vertical plate 41 and the linkage rod 42 to translate, so that the lower fixed block 43 and the feeding device are positioned above the placing groove 11, at the moment, the fan 47 is controlled to stop running again, the packaged chip 12 at the bottom of the air duct 46 loses the suction force and falls down to just fall, the feeding can be automatically completed.
A chip package test method for a chip package test system includes the following steps
The method comprises the following steps: a storage box 5 with an encapsulated chip 12 placed inside is attracted to the top of the first magnetic sheet 3 through the second magnetic sheet 4;
step two: controlling the heater 30 to operate, and heating the punching head 28 through the electric heating plate 31;
step three: controlling the first cylinder 18 to operate, so that the movable block 19 at the bottom of the output shaft of the first cylinder moves downwards;
step four: when the movable block 19 moves downwards, the movable rod 33 is firstly inserted into the push groove 35 to contact with the inclined plate 15 and swings leftwards under the guidance of the inclined plate 15, the movable rod 33 swings leftwards to push the belt 9 through the push groove 35 to drive the belt 9 to rotate leftwards, the belt 9 rotates leftwards to enable the packaged chip 12 in the rear placing groove 11 to be positioned below the movable block 19, at the moment, the stamping head 28 is driven by the movable block 19 to descend to contact with the packaged chip 12, pressure is applied to the packaged chip 12, and pressure testing is carried out;
while the punching head 28 contacts the packaged chip 12 to perform pressure test on the packaged chip, the translation device and the feeding device are also driven by the bent rod 36 to descend, and the feeding device can suck the packaged chip 12 in the storage box 5 through the suction force of the internal fan 47 of the feeding device;
step five: the punching head 28 completes the pressure test, and the output shaft of the first air cylinder 18 retracts to enable the movable block 19 to move upwards;
step six: when the movable block 19 moves upwards, the stamping head 28 is separated from the packaged chip 12, the movable rod 33 is pulled out from the push groove 35, the translation device and the feeding device drive the packaged chip 12 attracted by the translation device and the feeding device to move upwards, and when the translation device and the feeding device move to the topmost end, an output shaft of a second air cylinder 39 of the translation device extends out, a lower fixed block 43 is driven to translate through a short rod 40, a vertical plate 41 and a linkage rod 42, so that the lower fixed block 43 and the feeding device are positioned above the placing groove 11, at the moment, the fan 47 is controlled to stop running, the packaged chip 12 at the bottom of the air duct 46 loses attraction and falls down and just falls into the placing groove 11, and feeding is completed;
step seven: and controlling the first air cylinder 18 to operate again, so that the movable block 19 at the bottom of the output shaft moves downwards, and repeating the steps, thereby automatically completing the pressure test on the packaged chip 12.
The working principle and the using process of the invention are as follows:
a storage box 5 with an encapsulated chip 12 placed inside is attracted to the top of the first magnetic sheet 3 through the second magnetic sheet 4;
controlling the heater 30 to operate, and heating the stamping head 28 through the electric heating plate 31 to enable the stamping head 28 to have a certain temperature, so that the heat resistance of the packaged chip 12 can be conveniently tested;
controlling the first cylinder 18 to operate, so that the movable block 19 at the bottom of the output shaft of the first cylinder moves downwards;
when the movable block 19 moves downwards, the movable rod 33 is firstly inserted into the push groove 35 to contact with the inclined plate 15 and swings leftwards under the guidance of the inclined plate 15, the movable rod 33 swings leftwards to push the belt 9 through the push groove 35 to drive the belt 9 to rotate leftwards, the belt 9 rotates leftwards to enable the packaged chip 12 in the rear placing groove 11 to be positioned below the movable block 19, at the moment, the stamping head 28 is driven by the movable block 19 to descend to contact with the packaged chip 12, pressure is applied to the packaged chip 12, and pressure testing is carried out;
while the punching head 28 contacts the packaged chip 12 to perform pressure test on the packaged chip, the translation device and the feeding device are also driven by the bent rod 36 to descend, and the feeding device can suck the packaged chip 12 in the storage box 5 through the suction force of the internal fan 47 of the feeding device;
the punching head 28 completes the pressure test, and the output shaft of the first air cylinder 18 retracts to enable the movable block 19 to move upwards;
when the movable block 19 moves upwards, the stamping head 28 is separated from the packaged chip 12, the movable rod 33 is drawn out from the push groove 35, the translation device and the feeding device drive the packaged chip 12 attracted by the translation device and the feeding device to move upwards, and when the translation device and the feeding device move to the topmost end, the output shaft of the second air cylinder 39 of the translation device extends out, the lower fixed block 43 is driven to translate through the short rod 40, the vertical plate 41 and the linkage rod 42, so that the lower fixed block 43 and the feeding device are positioned above the placing groove 11, at the moment, the fan 47 is controlled to stop running, the packaged chip 12 at the bottom of the air duct 46 loses attraction and falls down and just falls into the placing groove 11, so that the loading can be automatically completed, the labor is greatly reduced, and the automation degree is higher;
and controlling the first air cylinder 18 to operate again to enable the movable block 19 at the bottom of the output shaft to move downwards, and circulating the steps, so that the pressure test on the packaged chip 12 can be automatically completed.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A chip package test system comprises a bottom plate (1), and is characterized in that: the top of the bottom plate (1) is fixedly provided with a back plate (2), the front surface of the back plate (2) is provided with a belt (9), and a material conveying mechanism which is rotatably arranged on the outer wall of the back plate (2) is used for opening the belt (9) and assisting the belt (9) to rotate;
the outer wall of the belt (9) is uniformly provided with a placing groove (11), the inner wall of the placing groove (11) is movably provided with a packaged chip (12), the inner wall of the placing groove (11) is also provided with a through groove (10), and the opening position of the through groove (10) corresponds to the position of the center of the packaged chip (12);
the outer wall of the back plate (2) is also fixedly provided with a fixed frame (49), the tail end of the fixed frame (49) is fixedly provided with a fixed plate (16), the top of the fixed plate (16) is fixedly provided with a top plate (17), the outer wall of the fixed plate (16) is provided with a movable block (19) in a sliding manner, and a driving device connected between the top plate (17) and the movable block (19) drives the movable block (19) to slide up and down on the outer wall of the fixed plate (16);
the bottom of the movable block (19) is fixedly provided with an elastic testing device for applying pressure to the packaged chip (12) and testing the pressure of the packaged chip (12);
a guide rod (29) is further inserted into the movable block (19), the guide rod (29) is fixedly installed at the bottom of the top plate (17), an electric heating plate (31) is fixedly installed at the bottom of the guide rod (29), and a heater (30) is fixedly installed at the top of the top plate (17) and used for heating the electric heating plate (31);
a pushing device is fixedly arranged on the left side of the movable block (19), and when the movable block (19) and the testing device punch downwards, the belt (9) is pushed to move for a preset distance in advance;
still fixed mounting have knee (36) at the back of movable block (19), the outer wall of fixed plate (16) seted up with knee (36) assorted movable slot (37), the bottom fixed mounting of knee (36) has translation device and loading attachment, loading attachment is used for inhaling encapsulation chip (12) when movable block (19) move down, translation device is used for driving loading attachment and removes the top to standing groove (11) when movable block (19) are located upper portion.
2. The chip package testing system according to claim 1, wherein: fortune material mechanism includes damping pivot (6), synchronizing wheel (7) and rubber circle (8), the outer wall left side and the outer wall right side of backplate (2) all rotate and are provided with damping pivot (6), the outer wall fixed mounting of damping pivot (6) has synchronizing wheel (7), the outer wall fixed mounting of synchronizing wheel (7) has rubber circle (8), the activity of rubber circle (8) sets up the both ends of belt (9) inner wall.
3. The chip package testing system of claim 2, wherein: the driving device is a first air cylinder (18), the first air cylinder (18) is fixedly installed at the bottom of the top plate (17), and the movable block (19) is fixedly installed at the bottom of an output shaft of the first air cylinder (18).
4. The chip package testing system according to claim 3, wherein: testing arrangement includes stand (20), spliced pole (24) and punching press head (28), stand (20) fixed mounting is in the bottom of movable block (19), the inside of stand (20) is formed with cavity (21), the interior roof fixed mounting of cavity (21) has spring (22), the bottom fixed mounting of spring (22) has clamp plate (23), the bottom fixed mounting of clamp plate (23) has spliced pole (24), column groove (25) have been seted up to the interior diapire of cavity (21), the outside that column groove (25) extended to stand (20) is passed to the bottom of spliced pole (24), the inside of spliced pole (24) is formed with thread groove (26), the inner wall threaded connection of thread groove (26) has threaded rod (27), threaded rod (27) fixed mounting is at the top of punching press head (28), the bottom of punching press head (28) is toper, A flat surface or a curved surface.
5. The chip package testing system according to claim 4, wherein: the pushing device comprises a side lug (32), a movable rod (33) and a pushing groove (35), the side lug (32) is fixedly installed on the left side of the movable block (19), the movable rod (33) is rotatably arranged on the outer wall of the side lug (32), and a torsion spring is further arranged at the joint of the movable rod (33) and the side lug (32) and used for applying right elastic force to the movable rod (33);
a limiting plate (34) is fixedly mounted on the outer wall of the side lug (32) and used for limiting the right inclination angle of the movable rod (33);
the outer wall of the belt (9) is also uniformly provided with push grooves (35), and the push grooves (35) are arranged in parallel with the placing grooves (11) and are in one-to-one correspondence in quantity;
the outer wall of the back plate (2) is also fixedly provided with a supporting block (13), the supporting block (13) is positioned inside the belt (9), an inner groove (14) is formed inside the supporting block (13), and the forming position of the inner groove (14) corresponds to the position of the through groove (10);
the left side of tray (13) still fixed mounting have swash plate (15), the top of swash plate (15) is the inclined plane to the left bank, is used for guiding movable rod (33) swing left when movable rod (33) lapse, and then promotes belt (9) and rotates.
6. The chip package testing system according to claim 5, wherein: the translation device comprises an upper fixing block (38), a second cylinder (39) and a lower fixing block (43), the upper fixing block (38) is fixedly installed at the bottom of the bent rod (36), the second cylinder (39) is arranged inside the upper fixing block (38), a short rod (40) is fixedly installed at the top of an output shaft of the second cylinder (39), a vertical plate (41) is fixedly installed at the tail end of the short rod (40), a linkage rod (42) is fixedly installed on the outer wall of the vertical plate (41), the lower fixing block (43) is fixedly installed at the tail end of the linkage rod (42), and the lower fixing block (43) is arranged at the bottom of the upper fixing block (38) in a sliding mode.
7. The chip package testing system according to claim 6, wherein: the feeding device comprises a tail rod (44), an air duct (46) and a fan (47), the tail rod (44) is fixedly installed at the bottom of the bent rod (36), an air duct (45) is formed inside the tail rod (44), an air outlet groove (50) is formed in the top of the air duct (45), and the tail end of the air outlet groove (50) is communicated with the side face of the tail rod (44);
the bottom fixed mounting of tailpiece (44) has dryer (46), the inner wall fixed mounting of dryer (46) has fan (47), the bottom fixed mounting of dryer (46) has buffer ring (48).
8. The chip package testing system according to claim 7, wherein: still include storage device, storage device includes first magnetic sheet (3), second magnetic sheet (4) and storage box (5), first magnetic sheet (3) fixed mounting is at the top of bottom plate (1), the outer wall activity of first magnetic sheet (3) is provided with second magnetic sheet (4), second magnetic sheet (4) fixed mounting is in the bottom of storage box (5), the inside of storage box (5) is provided with encapsulation chip (12), storage box (5) are on same vertical line with loading attachment.
9. A chip package testing method for use in a chip package testing system according to any one of claims 1 to 8, wherein: comprises the following steps
S01: a storage box (5) with a packaged chip (12) placed inside is sucked on the top of the first magnetic sheet (3) through a second magnetic sheet (4);
s02: controlling a heater (30) to operate, and heating the punching head (28) through an electric heating plate (31);
s03: controlling the first air cylinder (18) to operate to enable a movable block (19) at the bottom of an output shaft of the first air cylinder to move downwards;
s04: when the movable block (19) moves downwards, the movable rod (33) is inserted into the push groove (35) firstly to be contacted with the inclined plate (15) and swings leftwards under the guide of the inclined plate (15), the movable rod (33) swings leftwards to push the belt (9) leftwards through the push groove (35) so that the belt (9) rotates leftwards, the belt (9) rotates leftwards so that the packaged chip (12) in the rear placing groove (11) is positioned below the movable block (19), and at the moment, the stamping head (28) is driven by the movable block (19) to descend and contact with the packaged chip (12) and applies pressure to the packaged chip (12) to carry out pressure test;
when the stamping head (28) contacts the packaged chip (12) to carry out pressure test on the packaged chip, the translation device and the feeding device are driven to descend by the bent rod (36), and the feeding device can suck the packaged chip (12) in the storage box (5) through the suction force of a fan (47) in the feeding device;
s05: the punching head (28) completes the pressure test, and the output shaft of the first air cylinder (18) retracts to enable the movable block (19) to move upwards;
s06: when the movable block (19) moves upwards, the stamping head (28) is separated from the packaged chip (12), the movable rod (33) is pulled out from the push groove (35), the translation device and the feeding device drive the packaged chip (12) attracted by the translation device and the feeding device to move upwards, and when the translation device and the feeding device move to the topmost end, an output shaft of a second air cylinder (39) of the translation device extends out, the lower fixed block (43) is driven to translate through the short rod (40), the vertical plate (41) and the linkage rod (42), so that the lower fixed block (43) and the feeding device are positioned above the placing groove (11), at the moment, the fan (47) is controlled to stop running, the packaged chip (12) at the bottom of the air duct (46) loses attraction force and falls down just in the placing groove (11), and feeding is completed;
s07: and controlling the first air cylinder (18) to operate again to enable the movable block (19) at the bottom of the output shaft to move downwards, and circulating the operation, so that the pressure test on the packaged chip (12) is automatically completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110220183.8A CN112858027B (en) | 2021-02-27 | 2021-02-27 | Chip packaging test system and test method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110220183.8A CN112858027B (en) | 2021-02-27 | 2021-02-27 | Chip packaging test system and test method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112858027A true CN112858027A (en) | 2021-05-28 |
| CN112858027B CN112858027B (en) | 2022-09-30 |
Family
ID=75990348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110220183.8A Active CN112858027B (en) | 2021-02-27 | 2021-02-27 | Chip packaging test system and test method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112858027B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113654897A (en) * | 2021-06-28 | 2021-11-16 | 杭州长川科技股份有限公司 | Pressure regulating system, control method thereof, pressure regulating device and electronic element crimping system |
| CN115267512A (en) * | 2022-08-22 | 2022-11-01 | 深圳市睿智科精密科技有限公司 | Detection device and detection method for chip packaging part |
| CN115963016A (en) * | 2023-03-17 | 2023-04-14 | 无锡祺芯半导体科技有限公司 | Chip packaging test system and test method thereof |
| CN116773342A (en) * | 2023-06-21 | 2023-09-19 | 深圳市艾格林电子有限公司 | Integrated circuit chip performance stability analysis device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6292003B1 (en) * | 1998-07-01 | 2001-09-18 | Xilinx, Inc. | Apparatus and method for testing chip scale package integrated circuits |
| US20070170938A1 (en) * | 2006-01-26 | 2007-07-26 | Horng Terng Automation Co., Ltd | Test fixture and method for testing a semi-finished chip package |
| CN206656917U (en) * | 2017-04-05 | 2017-11-21 | 江苏中宏机械制造有限公司 | LP gas cylinder multistation automatic voltage withstanding experimental rig |
| CN208921554U (en) * | 2018-03-07 | 2019-05-31 | 陕西国防工业职业技术学院 | A kind of test equipment of high water absorbent resin gel intensity |
| CN209802864U (en) * | 2019-01-03 | 2019-12-17 | 天津路骋自行车制造有限公司 | Frame bearing capacity testing arrangement for bicycle manufacturing |
| CN110987685A (en) * | 2019-11-12 | 2020-04-10 | 陕西迈拓克能源科技有限公司 | Detection device for building material |
| CN112284910A (en) * | 2020-10-14 | 2021-01-29 | 德清新业建筑产业化有限公司 | Building material strength detection device |
-
2021
- 2021-02-27 CN CN202110220183.8A patent/CN112858027B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6292003B1 (en) * | 1998-07-01 | 2001-09-18 | Xilinx, Inc. | Apparatus and method for testing chip scale package integrated circuits |
| US20070170938A1 (en) * | 2006-01-26 | 2007-07-26 | Horng Terng Automation Co., Ltd | Test fixture and method for testing a semi-finished chip package |
| CN206656917U (en) * | 2017-04-05 | 2017-11-21 | 江苏中宏机械制造有限公司 | LP gas cylinder multistation automatic voltage withstanding experimental rig |
| CN208921554U (en) * | 2018-03-07 | 2019-05-31 | 陕西国防工业职业技术学院 | A kind of test equipment of high water absorbent resin gel intensity |
| CN209802864U (en) * | 2019-01-03 | 2019-12-17 | 天津路骋自行车制造有限公司 | Frame bearing capacity testing arrangement for bicycle manufacturing |
| CN110987685A (en) * | 2019-11-12 | 2020-04-10 | 陕西迈拓克能源科技有限公司 | Detection device for building material |
| CN112284910A (en) * | 2020-10-14 | 2021-01-29 | 德清新业建筑产业化有限公司 | Building material strength detection device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113654897A (en) * | 2021-06-28 | 2021-11-16 | 杭州长川科技股份有限公司 | Pressure regulating system, control method thereof, pressure regulating device and electronic element crimping system |
| CN113654897B (en) * | 2021-06-28 | 2024-03-26 | 杭州长川科技股份有限公司 | Pressure regulating system, control method thereof, pressure regulating device and electronic element crimping system |
| CN115267512A (en) * | 2022-08-22 | 2022-11-01 | 深圳市睿智科精密科技有限公司 | Detection device and detection method for chip packaging part |
| CN115963016A (en) * | 2023-03-17 | 2023-04-14 | 无锡祺芯半导体科技有限公司 | Chip packaging test system and test method thereof |
| CN116773342A (en) * | 2023-06-21 | 2023-09-19 | 深圳市艾格林电子有限公司 | Integrated circuit chip performance stability analysis device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112858027B (en) | 2022-09-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112858027B (en) | Chip packaging test system and test method thereof | |
| KR101156962B1 (en) | Electronic component testing method, insert, tray, and electronic component testing apparatus | |
| CN113401651A (en) | Automatic feeding and testing device for semiconductor element | |
| JPH0627192A (en) | Contact assembly for automatic test handler | |
| CN217369300U (en) | Laser chip test sorting machine | |
| CN114733782A (en) | Laser chip testing and sorting machine and working method thereof | |
| CN113539872B (en) | Semiconductor element translation type testing, coding and taping integrated machine | |
| CN209389002U (en) | Chip high temperature side presses separation system | |
| TW201111259A (en) | Pick-and-place apparatus for inspection equirement of electric device, picking apparatus thereof and method for loading electric device onto loading position | |
| CN113567470B (en) | Optical chip testing device | |
| CN112224866A (en) | Singlechip automatic feeding equipment | |
| CN115980401B (en) | Automatic testing device based on down-pressure SOP test seat | |
| CN209329379U (en) | A kind of Full-automatic pin machine | |
| CN105491869B (en) | Full-automatic multichannel paster feedway in bulk | |
| KR100610778B1 (en) | Carrier Module for Semiconductor Test Handler | |
| CN212749077U (en) | Electric performance testing mechanism of filter testing machine | |
| CN214278329U (en) | Testing jig for flat pin chip diode | |
| CN112002661B (en) | Sorting device for integrated circuit packaging chips | |
| CN213646537U (en) | Energy storage device assemblage mechanism | |
| CN114545206A (en) | Continuous detection device for integrated circuit packaging | |
| CN113245215A (en) | Sorter for testing electronic components | |
| CN208051344U (en) | Electric cooker intelligent automation assembling line | |
| CN105583601A (en) | Sucking, guiding and press-fitting mechanism | |
| CN114113965B (en) | High-efficiency testing device for multi-specification electronic packaging products | |
| TWI788966B (en) | Pressing mechanism, testing apparatus, and handler using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220909 Address after: No. 3, Jinshagang 1st Road, Dalang Town, Dongguan City, Guangdong Province, 523000 Applicant after: DONGGUAN BTL Inc. Address before: No. 128, Zhuyuan Road, Jinhu County, Huai'an City, Jiangsu Province Applicant before: Liu Wen |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |