CN112846537A - Laser low-loss cutting device and method for solar cell - Google Patents
Laser low-loss cutting device and method for solar cell Download PDFInfo
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- CN112846537A CN112846537A CN202110017710.5A CN202110017710A CN112846537A CN 112846537 A CN112846537 A CN 112846537A CN 202110017710 A CN202110017710 A CN 202110017710A CN 112846537 A CN112846537 A CN 112846537A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser low-loss cutting device and method for a solar cell piece, wherein laser of a first optical fiber laser is focused inside the solar cell piece to be cut, the opening and closing of the first optical fiber laser are controlled through a vibrating mirror control module, the first optical fiber laser is controlled to draw a required laser cutting graph on the solar cell piece to be cut, a laser radiation heating module heats along a line drawn by the first optical fiber laser, and an auxiliary cooling module cools along a laser heating straight line of the laser radiation heating module. According to the laser low-loss cutting device and method for the solar cell, a material modification layer is formed inside the solar cell by adopting a mode that laser is focused and scribed inside the solar cell to be cut, the solar cell is automatically cracked by utilizing thermal stress, the damage to the solar cell to be cut in the laser cutting process is reduced, certain help is provided for improving the power generation efficiency of a cell assembly, no dust is generated basically in the cutting process, and the safety of the cutting process is improved.
Description
Technical Field
The invention belongs to the technical field of solar cell slice cutting, and particularly relates to a laser low-loss cutting device and method for a solar cell slice.
Background
In the solar cell manufacturing industry, in order to improve the power generation power of a cell module, the solar cell needs to be cut into a plurality of pieces with equal areas to manufacture the module, but the damage to the solar cell piece is reduced or avoided as much as possible in the process of cutting the solar cell piece.
The mainstream solar cell cutting technology in the market at present is to process a cutting channel penetrating through the surface of a solar cell on the back surface of the solar cell by using laser, and then to break the cell along the laser cutting channel by adopting a mechanical method. The processing method can cause great damage to the battery plate; moreover, the passivation layer on the surface of the cell and the silicon wafer can be damaged by laser cutting, a large amount of dust can be generated, the number of fragments in the cutting process can be increased by the mechanical stress breaking, and the manufacturing cost of the assembly is increased, so that a cutting method which can be used for scribing the solar cell and cannot greatly damage the cell itself is urgently needed.
The Chinese invention patent, publication No. CN111590214A, discloses a method for cutting a photovoltaic cell and a cell manufactured by the method, wherein a first laser is used to form a first cutting line at the edge of the cutting position of the cell, a second laser is used, the light spot of the first laser is locally heated along the front position of the crack of the first cutting line and is moved and extended along the direction of the first cutting line and in the direction far away from the edge, and the heated position is cooled at the same time.
Disclosure of Invention
In order to solve the technical problems that the solar cell piece is damaged greatly in the cutting process and is easy to generate dust in the laser cutting technology of the solar cell piece in the prior art, and the mechanical stress is utilized to break the solar cell piece to increase the fragment rate, the invention aims to provide a laser low-loss cutting device and method of the solar cell piece.
In order to achieve the purpose and achieve the technical effect, the invention adopts the technical scheme that:
the utility model provides a low cutting device that decreases of laser of solar wafer, includes laser cutting module, laser radiation heating module and auxiliary cooling module, the laser cutting module includes first fiber laser and galvanometer control module, the laser that first fiber laser sent focuses on in waiting to cut inside the solar wafer, galvanometer control module is connected with first fiber laser, through the switching of galvanometer control module control first fiber laser and draw required laser cutting figure on waiting to cut solar wafer, form material modification layer in waiting to cut solar wafer heating inside, laser radiation heating module heats along the line that first fiber laser drawn, auxiliary cooling module cools off along the laser heating straight line of laser radiation module.
Further, the laser cutting module still includes beam expander and objective, first fiber laser, beam expander and objective are in the same place in detachable connection of order, and the laser that first fiber laser sent focuses on inside waiting to cut the solar wafer behind beam expander and objective in proper order.
Furthermore, the laser radiation heating module comprises a second optical fiber laser, a collimation module and a focusing module, the second optical fiber laser, the collimation module and the focusing module are detachably connected together in sequence, and laser emitted by the second optical fiber laser is heated along a line drawn by the first optical fiber laser after passing through the collimation module and the focusing module in sequence.
Further, the collimating module comprises a collimating lens, the focusing module comprises a focusing lens, the light outlet of the second fiber laser is located at a focal length one time of the collimating lens, the laser is collimated and then emitted as parallel light, and the parallel light is focused at the back focal length of the focusing lens after being incident.
Furthermore, the laser emitted by the second fiber laser sequentially passes through the collimation module and the focusing module, the diameter of a laser spot is 2-3 mm, the laser heating speed is 400-900 mm/s, and the laser heating power is 200-400W.
The invention discloses a laser low-loss cutting method of a solar cell, which adopts a laser low-loss cutting device of the solar cell to cut the solar cell, and comprises the following steps:
s1, placing the solar cell to be cut on a motion platform;
s2, controlling the opening and closing of a first fiber laser through a galvanometer control module, controlling the first fiber laser to perform laser cutting and scribing on the solar cell piece to be cut according to a required laser cutting pattern, focusing laser emitted by the first fiber laser on the inner part of the solar cell piece to be cut, performing laser cutting and scribing, changing the horizontal position of the laser focused on the inner part of the solar cell piece to be cut, repeating the laser cutting and scribing, and forming a material modified layer on the inner part of the solar cell piece to be cut;
s3, heating the laser radiation heating module along the line marked by the laser cutting module in the step S1;
s4, the auxiliary cooling module cools along the heating line of the laser radiation heating module in the step S3.
Further, in step S2, the galvanometer control module controls the first fiber laser to turn on and off the laser, the laser emitted by the first fiber laser passes through the inside of the solar cell to be cut after passing through the beam expander and the objective lens in sequence and is subjected to laser cutting and scribing once, the moving platform moves in a reciprocating manner along a straight line to drive the solar cell to be cut thereon to move in a reciprocating manner, the horizontal position of the laser focused in the solar cell to be cut is changed, the laser cutting and scribing are repeated, and a material modified layer is formed inside the solar cell to be cut.
Further, in step S3, the laser emitted by the second fiber laser passes through the collimating module and the focusing module in sequence and then is heated to the edge of the solar cell to be cut along the line marked by the laser cutting module in step S1.
Further, in step S3, the laser emitted by the second fiber laser sequentially passes through the collimating module and the focusing module, and then the laser spot diameter is 2mm to 3mm, the laser heating speed is 400mm/S to 900mm/S, and the laser heating power is 200W to 400W.
Further, in step S4, the auxiliary cooling module cools along the laser heating line of the laser radiation heating module using the atomized deionized water.
Compared with the prior art, the invention has the beneficial effects that:
the invention discloses a laser low-loss cutting device and method for a solar cell, and the device comprises a laser cutting module, a laser radiation heating module and an auxiliary cooling module, wherein the laser cutting module comprises a first optical fiber laser and a galvanometer control module, laser emitted by the first optical fiber laser is focused inside the solar cell to be cut, the galvanometer control module is connected with the first optical fiber laser, the galvanometer control module controls the opening and closing of the first optical fiber laser and controls the first optical fiber laser to draw a required laser cutting pattern on the solar cell to be cut, a material modification layer is formed inside the solar cell to be cut, the laser radiation heating module heats along a line drawn by the first optical fiber laser, and the auxiliary cooling module cools along a laser heating straight line of the laser radiation heating module. The invention provides a laser low-loss cutting device and a method of a solar cell piece, which adopt a mode that laser focuses and lines on the inner part of the solar cell piece to be cut and then sequentially carries out laser heating and cooling, the material modified layer is formed inside the solar cell, the solar cell is automatically cracked by utilizing the thermal stress, and the laser facula penetrates through the silicon nitride film on the surface of the solar cell and is focused inside the solar cell, so that the heat influence on the silicon nitride film on the surface is avoided, the damage to the solar cell to be cut in the laser cutting process is reduced, the method has certain help for improving the power generation efficiency of the battery pack, dust, fine lines and the like are basically not generated in the cutting process, the safety of the cutting process is improved, cracks develop according to the crack propagation direction, the linearity is high, the yield is high, the process condition is simple, the feasibility is high, and the method has great industrial application value.
Drawings
FIG. 1 is a simplified structural diagram of a laser cutting module according to the present invention;
FIG. 2 is a simplified schematic structural diagram of the laser radiation heating module and the auxiliary cooling module of the present invention.
Detailed Description
The following detailed description of the embodiments of the present invention is provided to enable those skilled in the art to more easily understand the advantages and features of the present invention, and to clearly and clearly define the scope of the present invention.
As shown in fig. 1-2, a laser low-loss cutting device for solar cell, which mainly includes a laser cutting module 10, a laser radiation heating module 20 and an auxiliary cooling module 31, wherein the laser cutting module 10 mainly includes a first fiber laser 11, a beam expander 12, an objective lens 13 and a galvanometer control module 14, the first fiber laser 11, the beam expander 12 and the objective lens 13 are detachably connected through a thread in sequence, the laser cutting module 10 performs laser cutting and scribing on the solar cell to be cut through the first fiber laser 11, the laser radiation heating module 20 heats along a line scribed by the first fiber laser 11, and the auxiliary cooling module 31 cools along a laser heating line of the laser radiation heating module 20. Specifically, laser emitted by the first optical fiber laser 11 sequentially passes through the beam expander 12 and the objective lens 13 and then is focused inside the solar cell to be cut, the galvanometer control module 14 is connected with the first optical fiber laser 11 and controls on/off laser of the first optical fiber laser 11, so that the laser of the first optical fiber laser 11 is controlled to penetrate through the solar cell to be cut for scribing once, the galvanometer control module 14 can control the first optical fiber laser 11 to draw a required laser cutting pattern (mainly a straight line) on the solar cell to be cut according to requirements, when the solar cell to be cut is translated, the horizontal position of the laser of the first optical fiber laser 11 focused inside the solar cell can be changed, repeated laser cutting scribing is realized, and a material modified layer is formed inside the solar cell to be cut.
The laser radiation heating module 20 comprises a second fiber laser 21, a collimation module 22 and a focusing module 23, the second fiber laser 21, the collimation module 22 and the focusing module 23 are detachably connected through threads in sequence, the collimation module 22 comprises a collimation lens, the focusing module 23 comprises a focusing lens, a light outlet of the second fiber laser 21 is positioned at a focal length one time of the collimation lens, laser is emitted as parallel light after being collimated, the parallel light is focused at a back focal length of the focusing lens after being incident, the laser emitted by the second fiber laser 21 is collimated by the collimation module 22 and focused by the focusing module 23 in sequence, the diameter of the laser spot of the laser radiation heating module 20 is changed to 2 mm-3 mm, the laser heating power is 200W-400W, the laser spot of the second fiber laser 21 is heated along the laser cutting straight line of the first fiber laser 11, and the laser heating speed is 400 mm/s-900 mm/s.
A laser low-loss cutting method of a solar cell slice adopts a laser low-loss cutting device of the solar cell slice to carry out laser low-loss cutting, and comprises the following steps:
s1, placing the solar cell to be cut on a motion platform, wherein the motion platform can perform reciprocating translation along a straight line;
s2, the galvanometer control module 14 controls the start and stop of the first fiber laser 11, the galvanometer control module 14 drives the first fiber laser 11 to emit laser and controls the laser cutting module 10 to perform laser cutting and scribing on the solar cell piece to be cut according to the required laser cutting pattern, the laser emitted by the laser cutting module 10 sequentially passes through the beam expander 12 and the objective lens 13 and then is focused on the inside of the solar cell piece to be cut, the motion platform translates along a straight line to drive the solar cell piece to be cut on the motion platform to translate along a straight line, the laser is scribed to the edge inside the solar cell to be cut, the moving platform drives the solar cell to be cut on the moving platform to linearly and reciprocally translate, the horizontal position of the laser emitted by the laser cutting module 10 focused inside the solar cell to be cut can be changed for multiple times, repeated laser scribing is carried out, and a material modified layer is formed inside the solar cell to be cut;
s3, after passing through the collimation module 22 and the focusing module 23 in sequence, the laser emitted by the second fiber laser 21 of the laser radiation heating module 20 is heated linearly along the line scribed by the laser cutting module 10 in the step S1 to the edge of the solar cell to be cut;
s4, the auxiliary cooling module 31 is linearly cooled to the edge of the solar cell to be cut along the laser heating of the laser radiation heating module 20 in the step S3, the laser radiation heating module 20 and the auxiliary cooling module 31 can enable the surface of the solar cell to be cut to have temperature gradient difference, when the thermal stress is greater than the breaking strength of the solar cell to be cut, the solar cell to be cut can be broken along the straight line marked by the laser cutting module 10, the product quality is easier to ensure by adopting the working mode of heating firstly and then cooling, the yield is improved, and the operation is simple.
In step S2, the galvanometer control module 14 controls the first fiber laser 11 of the laser cutting module 10 to turn on and off the laser, the laser passes through the inside of the solar cell to be cut and is scribed once, the laser scribing depth is the thickness of the silicon nitride film on the surface of the solar cell, generally 160 μm to 200 μm, the laser emitted by the first fiber laser 11 passes through the solar cell to be cut and is scribed each time, the laser is focused inside the solar cell to be cut, the position of the solar cell to be cut is changed, the horizontal position of the laser focused inside the solar cell to be cut is changed, repeated scribing is performed, and a material modified layer is formed inside the solar cell to be cut.
In step S4, the auxiliary cooling module 31 cools along the laser heating line of the laser radiation heating module 20 with the atomized deionized water.
The parts of the invention not specifically described can be realized by adopting the prior art, and the details are not described herein.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The utility model provides a low cutting device that decreases of laser of solar wafer, its characterized in that, including laser cutting module, laser radiation heating module and auxiliary cooling module, the laser cutting module includes first fiber laser and galvanometer control module, and the laser focus that first fiber laser sent is in waiting to cut inside the solar wafer, and galvanometer control module is connected with first fiber laser, controls opening and close and control first fiber laser through galvanometer control module and draws required laser cutting figure on waiting to cut the solar wafer, forms the material modified layer inside waiting to cut the solar wafer, and laser radiation heating module heats along the line that first fiber laser was drawn, and auxiliary cooling module cools off along the laser heating straight line of laser radiation heating module.
2. The laser low-loss cutting device for the solar cell piece according to claim 1, wherein the laser cutting module further comprises a beam expander and an objective lens, the first fiber laser, the beam expander and the objective lens are detachably connected in sequence, and laser light emitted by the first fiber laser sequentially passes through the beam expander and the objective lens and is focused inside the solar cell piece to be cut.
3. The laser low-loss cutting device for the solar cell pieces as claimed in claim 1, wherein the laser radiation heating module comprises a second fiber laser, a collimation module and a focusing module, the second fiber laser, the collimation module and the focusing module are detachably connected in sequence, and laser emitted by the second fiber laser passes through the collimation module and the focusing module in sequence and then is heated along a line drawn by the first fiber laser.
4. The laser low-loss cutting device for the solar cell piece as claimed in claim 3, wherein the collimating module comprises a collimating lens, the focusing module comprises a focusing lens, the light outlet of the second fiber laser is located at a focal length one time that of the collimating lens, the laser is collimated and then emitted as parallel light, and the parallel light is incident and then focused at a back focal length of the focusing lens.
5. The laser low-loss cutting device for the solar cell piece according to claim 3, wherein the laser emitted by the second fiber laser sequentially passes through the collimating module and the focusing module, the laser spot diameter is 2 mm-3 mm, the laser heating speed is 400 mm/s-900 mm/s, and the laser heating power is 200W-400W.
6. A laser low-loss cutting method for solar cell slices is characterized in that the laser low-loss cutting device for the solar cell slices, which is disclosed by any one of claims 1 to 5, is adopted for carrying out laser low-loss cutting, and comprises the following steps:
s1, placing the solar cell to be cut on a motion platform;
s2, controlling the opening and closing of a first fiber laser through a galvanometer control module, controlling the first fiber laser to perform laser cutting and scribing on the solar cell piece to be cut according to a required laser cutting pattern, focusing laser emitted by the first fiber laser on the inner part of the solar cell piece to be cut, performing laser cutting and scribing, changing the horizontal position of the laser focused on the inner part of the solar cell piece to be cut, repeating the laser cutting and scribing, and forming a material modified layer on the inner part of the solar cell piece to be cut;
s3, heating the laser radiation heating module along the line marked by the laser cutting module in the step S1;
s4, the auxiliary cooling module cools along the heating line of the laser radiation heating module in the step S3.
7. The method for low-loss laser cutting of the solar cell according to claim 6, wherein in step S2, the galvanometer control module controls the first fiber laser to turn on and off the laser, the laser emitted by the first fiber laser passes through the beam expander and the objective lens in sequence and then penetrates through the inside of the solar cell to be cut, the laser cutting and scribing are performed once, the moving platform is moved back and forth along a straight line to drive the solar cell to be cut thereon to move back and forth, the horizontal position of the laser focused in the solar cell to be cut is changed, the laser cutting and scribing are performed repeatedly, and the material modified layer is formed inside the solar cell to be cut.
8. The method for cutting solar cell slices with low laser loss according to claim 6, wherein in step S3, the laser emitted from the second fiber laser passes through the collimating module and the focusing module in sequence and then is heated to the edge of the solar cell slice to be cut along the straight line drawn by the laser cutting module in step S1.
9. The method for cutting a solar cell piece with low laser loss according to claim 6, wherein in step S3, the laser beam emitted from the second fiber laser sequentially passes through the collimating module and the focusing module, and then the laser spot diameter is 2mm to 3mm, the laser heating speed is 400mm/S to 900mm/S, and the laser heating power is 200W to 400W.
10. The laser low-loss cutting method for the solar cell piece according to claim 6, wherein in step S4, the auxiliary cooling module is cooled along the laser heating line of the laser radiation heating module by using atomized deionized water.
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070058946A (en) * | 2005-12-05 | 2007-06-11 | 폭스세미콘 인티그리티드 테크놀로지, 인코포레이티드 | Laser cutting apparatus |
WO2007119740A1 (en) * | 2006-04-13 | 2007-10-25 | Toray Engineering Co., Ltd. | Scribing method, scribing apparatus, and scribed substrate scribed by the method or apparatus |
US20080035617A1 (en) * | 2006-08-11 | 2008-02-14 | Foxsemicon Integrated Technology, Inc. | Method for processing brittle substrates without micro-cracks |
CN106944746A (en) * | 2017-04-26 | 2017-07-14 | 深圳迈进自动化科技有限公司 | A kind of laser processing technology and system for actively guiding cutting route |
JP2018525309A (en) * | 2015-08-10 | 2018-09-06 | サン−ゴバン グラス フランスSaint−Gobain Glass France | How to cut a thin glass layer |
CN109926736A (en) * | 2019-04-10 | 2019-06-25 | 英诺激光科技股份有限公司 | A kind of device and method using high frequency nanosecond optical-fiber laser cutting battery pole piece |
CN110480192A (en) * | 2019-08-28 | 2019-11-22 | 业成科技(成都)有限公司 | The cutting method of fragile material |
CN110625267A (en) * | 2019-08-22 | 2019-12-31 | 大族激光科技产业集团股份有限公司 | Method for processing sapphire substrate LED wafer and laser device |
CN110732782A (en) * | 2019-11-20 | 2020-01-31 | 苏州沃特维自动化系统有限公司 | laser equipment for splitting battery piece |
CN111590214A (en) * | 2020-05-12 | 2020-08-28 | 东方日升新能源股份有限公司 | Photovoltaic cell cutting method and cell manufactured by same |
-
2021
- 2021-01-07 CN CN202110017710.5A patent/CN112846537A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070058946A (en) * | 2005-12-05 | 2007-06-11 | 폭스세미콘 인티그리티드 테크놀로지, 인코포레이티드 | Laser cutting apparatus |
WO2007119740A1 (en) * | 2006-04-13 | 2007-10-25 | Toray Engineering Co., Ltd. | Scribing method, scribing apparatus, and scribed substrate scribed by the method or apparatus |
US20080035617A1 (en) * | 2006-08-11 | 2008-02-14 | Foxsemicon Integrated Technology, Inc. | Method for processing brittle substrates without micro-cracks |
JP2018525309A (en) * | 2015-08-10 | 2018-09-06 | サン−ゴバン グラス フランスSaint−Gobain Glass France | How to cut a thin glass layer |
CN106944746A (en) * | 2017-04-26 | 2017-07-14 | 深圳迈进自动化科技有限公司 | A kind of laser processing technology and system for actively guiding cutting route |
CN109926736A (en) * | 2019-04-10 | 2019-06-25 | 英诺激光科技股份有限公司 | A kind of device and method using high frequency nanosecond optical-fiber laser cutting battery pole piece |
CN110625267A (en) * | 2019-08-22 | 2019-12-31 | 大族激光科技产业集团股份有限公司 | Method for processing sapphire substrate LED wafer and laser device |
CN110480192A (en) * | 2019-08-28 | 2019-11-22 | 业成科技(成都)有限公司 | The cutting method of fragile material |
CN110732782A (en) * | 2019-11-20 | 2020-01-31 | 苏州沃特维自动化系统有限公司 | laser equipment for splitting battery piece |
CN111590214A (en) * | 2020-05-12 | 2020-08-28 | 东方日升新能源股份有限公司 | Photovoltaic cell cutting method and cell manufactured by same |
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