CN112845957A - Pin forming device and method for FP chip - Google Patents
Pin forming device and method for FP chip Download PDFInfo
- Publication number
- CN112845957A CN112845957A CN202011642189.6A CN202011642189A CN112845957A CN 112845957 A CN112845957 A CN 112845957A CN 202011642189 A CN202011642189 A CN 202011642189A CN 112845957 A CN112845957 A CN 112845957A
- Authority
- CN
- China
- Prior art keywords
- pin
- chip
- forming
- die
- flanges
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000005452 bending Methods 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims description 20
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000004576 sand Substances 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 238000009966 trimming Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 230000035882 stress Effects 0.000 description 5
- 101100334009 Caenorhabditis elegans rib-2 gene Proteins 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006353 environmental stress Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to a device and a method for forming pins of an FP type chip, which comprises a clamping device, an upper die and a lower die, wherein the lower die comprises a bottom plate, two first convex ribs and convex strips, the convex strips are positioned in the center of the bottom plate, the two first convex ribs are symmetrically distributed on two sides of the convex strips, the upper die comprises a top plate, two first flanges and two second flanges, and the two first flanges and the two second flanges are symmetrically distributed around the central axis of the top plate; the heights of the first convex ribs, the convex strips and the bottom plate of the lower die are sequentially reduced, and the heights of the top plate, the two first flanges and the two second flanges of the upper die are sequentially increased. The forming mode of the invention is one-step forming, and the lateral displacement of the chip pin caused by repeated bending when bending by using tweezers is avoided.
Description
Technical Field
The invention belongs to the field of chip packaging, and particularly relates to a device and a method for forming an FP chip pin.
Background
In recent years, with the rapid development of electronic technology, the types of packages of chips inside an on-board electronic product are increasing, and in the process of repairing the product, the problem of welding of special packaged chips gradually becomes a factor influencing the quality of the product. When various chips, particularly FP chips leave a factory, the chips are not subjected to pin forming, a user needs to manually bend the chips to form the pins, and the main purpose of the pin forming of the chips is to ensure that the pins of the chips can be welded on corresponding bonding pads of a PCB (printed circuit board); on the other hand, the problem of stress release is mainly solved, and after the electronic assembly is welded, a part of stress is eliminated under the use condition that the environmental stress of a product can be met, and the stress is eliminated and is mainly reflected on the pin between the root of the chip pin and the welding point.
If the FP type chip is applied, the pin needs to be formed, tweezers are adopted in the prior art to manually bend and form the chip pin, but the problems that: 1. when manual bending forming is carried out, the shoulder part of the chip has no fixed measure, so that the root part of the pin of the chip is stressed in the forming process, and the risk of cracking exists; 2. the chip pin is bent by using tweezers, which belongs to hard contact between metals, is extremely easy to cause physical damage to the chip pin, and is easy to generate static electricity to damage a chip; 3. the springback of the chip lead can not be controlled by manual bending and forming, so that the formed chip pins are warped or not coplanar, and welding spots are easy to crack after chip welding and environmental tests; 4. the technological parameters of the pin forming shoulder width, the station height, the length of the welding surface and the like are controlled, and the parameters are manually controlled by an operator, so that the difficulty is high; 5. the manual bending and forming also easily causes the lateral displacement of the chip pins, so that the distance between the chip pins is uneven, and because the distance between the chip pins is smaller, the phenomena of insufficient soldering, false soldering and the like can occur when the chip with uneven distance between the pins is soldered on a PCB (printed circuit board), thereby causing the problems of short circuit, electric leakage, ignition and the like and causing adverse effects on the product quality.
Disclosure of Invention
Based on the analysis of the technical difficulty of the manual chip bending and forming process in the prior art, the invention designs the following technical scheme:
a pin forming device for an FP type chip comprises a clamping device, an upper die and a lower die; the lower die comprises a bottom plate, two first convex ribs and a convex strip, wherein the convex strip is positioned in the center of the bottom plate, and the two first convex ribs are symmetrically distributed on two sides of the convex strip; the upper die comprises a top plate, two first flanges and two second flanges, wherein the two first flanges and the two second flanges are symmetrically distributed around the central axis of the top plate; the heights of the first convex ribs, the convex strips and the bottom plate of the lower die are sequentially reduced, and the heights of the top plate, the two first flanges and the two second flanges of the upper die are sequentially increased.
Furthermore, the first flange of the upper die corresponds to the first convex rib of the lower die in position, and a cavity between the first flange and the first convex rib is used for accommodating a chip; the first flange of the upper die corresponds to the edge position of the bottom plate of the lower die and is used for determining a welding surface.
Furthermore, the upper and lower corners of the first convex rib and the upper and lower corners of the second flange are chamfers, and the chamfer radius is the bending radius R of the pin.
Furthermore, the width of the first convex rib and the first flange is equal to the shoulder width of the pins, and the height of the convex strip of the lower die is the standing height of the pins.
Furthermore, the top surface of the upper die and the bottom surface of the lower die are shaped like a concave, wherein the edge of the like concave is positioned at the side edge of the clamping device, and the plane of the like concave is attached to the clamping surface of the clamping device.
Furthermore, the upper die and the lower die further comprise fixing parts, and the fixing parts can be fixed by screws or clamped and fixed.
Furthermore, the material of the forming die adopts industrial plastics.
The invention also provides a method for forming the pin of the FP type chip by using the forming device, which comprises the following steps:
step one, preparing a mould: before forming, the pressing mechanism is clamped in the similar concave grooves of the upper die and the lower die, and the upper die and the lower die are fixed with the clamping device;
step two, pin forming: put into the sand grip of bed die with the chip on, then with the bed die combination compress tightly, the root of first rib and first flange centre gripping pin realizes the fixed of chip pin root, first rib and the common application of force of second flange carry out the shaping with the pin:
step three, trimming redundant pins: after the chip is formed, the clamping device is opened and the excess pins are trimmed with scissors.
Further, the second step further comprises controlling coplanarity of the chip pins, and when the thickness of the lead is less than 0.8mm according to standard regulations, the minimum pin bending radius R is 1 time of the thickness of the pin.
Further, the second step also comprises the steps of adjusting the pin forming shoulder width A, the station height D and the length of the welding surface: the shoulder width of the chip was set to 1.5mm, the station height was set to 0.6mm, and the land length was set to 1.36 mm.
Has the advantages that:
1. the chip pin forming device determines the forming radius and the shoulder width of the chip pin by taking the thickness of the chip pin as a reference.
2. The chip pin is formed at one time by adopting the combined die, so that the coplanarity of the chip pin and no displacement of the chip pin in the lateral direction are ensured
3. The fixing and clamping device for the root of the pin ensures that the chip body and the root of the pin are not damaged in the forming process.
4. The industrial plastic is used as the material of the chip pin forming die to ensure that the chip pin has no physical damage and electrostatic damage.
Description of the drawings:
FIG. 1 is a 14-pin FP type packaged chip structure;
FIG. 2 is a schematic diagram of the shaped FP type packaged chip;
FIG. 3 is a schematic diagram showing basic dimensions of a chip pin formation of an FP type package;
FIG. 4 is a schematic view of a clamping device;
fig. 5 is a schematic view of an upper mold and a lower mold of the chip pin forming apparatus.
Reference numerals: 1-lower die, 2-first convex rib, 3-convex rib, 4-upper die, 5-first flange and 6-second flange.
The specific implementation mode is as follows:
the forming device of the present invention is described in detail below with reference to fig. 1-5, and comprises a clamping device, an upper die 4 and a lower die 1, wherein the lower die 1 comprises a bottom plate, two first ribs 2 and a protruding strip 3, the protruding strip 3 is located at the center of the bottom plate, the two first ribs 2 are symmetrically distributed at two sides of the protruding strip 3, and the heights of the first ribs 2, the protruding strip 3 and the bottom plate are sequentially reduced; correspondingly, the upper die 4 comprises a top plate, two first flanges 5 and two second flanges 6, the heights of the top plate, the two first flanges 5 and the two second flanges 6 are sequentially increased, and the two first flanges 5 and the two second flanges 6 are symmetrically distributed around the central axis of the top plate.
The first flange 5 of the upper die 4 corresponds to the first convex rib 2 of the lower die 1 in position, the first flange and the first convex rib are used for determining the shoulder width of a pin, and a cavity between the first flange and the first convex rib is used for accommodating a chip; the first flange 5 of the upper die 4 corresponds to the edge of the bottom plate of the lower die 1 and is used for determining the welding surface of the pin; the width of the first convex rib 2 and the first flange 5 is the shoulder width of the pin, and the width of the second flange 5 is the welding surface of the pin.
The upper and lower corners of the first convex rib 2 and the upper and lower corners of the second flange 5 are chamfers, and the chamfer radius is the bending radius R of the pin; the height of the convex strip 3 of the lower die is the standing height of the pin; the top surface of the upper die 4 and the bottom surface of the lower die 1 are in a similar concave shape, wherein the edge of the similar concave shape is positioned at the side edge of the clamping device and used for clamping the clamping device, and the plane of the similar concave shape is attached to the clamping surface of the clamping device so as to be convenient for clamping; the upper die and the lower die also comprise fixing parts which fix the upper die and the lower die on the clamping device; the fixing part can be fixed by a screw or a clamping.
The forming die is made of industrial plastics, and the industrial plastics are low in hardness, flexible and insulators, so that physical damage and electrostatic damage to chip pins cannot be caused.
The forming principle of the forming device is as follows: the upper die and the lower die are fixed on the clamping device before forming, the chip is placed into the convex strip of the lower die through tweezers, the upper die and the lower die are combined and compressed through the control of the pressing device, the root of the pin is clamped through the first convex strip and the first flange, the root is not stressed in the forming process, the first convex strip and the second flange apply force together, the pin is formed, the clamping device is opened, the chip is taken out, and the redundant pin is trimmed through scissors after the chip is taken out. The forming mode of the invention is one-step forming, and the lateral displacement of the chip pin caused by repeated bending when bending by using tweezers is avoided.
The invention can inquire the relevant standard of the pin forming of the electronic component according to the size and the pin number of the FP type packaged chip, respectively manufacture the upper die and the lower die with different sizes, and the combined die is matched with the clamping device to carry out one-time forming on the pin of the component.
The invention also provides a method for forming the pin of the FP type chip by using the forming device, which comprises the following steps:
step one, preparing a mould: before forming, the pressing mechanism is clamped in the similar concave grooves of the upper die and the lower die, and the upper die and the lower die are fixed with the clamping device;
step two, pin forming: put into the sand grip of bed die with the chip on, then with the bed die combination compress tightly, the root of first rib and first flange centre gripping pin realizes the fixed of chip pin root, first rib and the common application of force of second flange carry out the shaping with the pin:
step three, trimming redundant pins: after the chip is formed, the clamping device is opened and the excess pins are trimmed with scissors.
In addition, the second step further comprises controlling coplanarity of the chip pins, wherein the coplanarity is a vertical distance between the lowest pin plane and the highest pin. When the chip pin is formed, the pin rebounds to cause the formed chip pin to be warped or not to be coplanar, the welding spot is easy to crack and the like after chip welding and environmental test, and in order to ensure that the coplanarity of the welding surface is good after the chip pin is formed, the bending radius R of the chip pin is well controlled, and when the thickness of the lead is smaller than 0.8mm according to the standard, the minimum pin bending radius is 1 time of the thickness of the pin.
As shown in fig. 2, the second step further includes adjusting the pin forming shoulder width a, the stand height D, and the length of the bonding surface:
and the shoulder width A is the distance from the root of the pin to the first bending point, the pins on two sides of the chip are ensured to be basically symmetrical in the forming process, the chip body is basically parallel to the surface of the printed board, the pin cannot be formed from the root of the chip, the minimum size of the shoulder width is 2 times the thickness of the pin or 0.5mm, under the condition, the size of the corresponding PCB pad is comprehensively considered, and then the shoulder width is properly adjusted according to actual requirements, and is determined to be 1.5mm according to the adjusted size.
Standing height D: namely, the distance between the lower surface of the chip body and the printed circuit board, the maximum standing height is 1mm, and the minimum standing height is 0.5 mm. In the process of forming the chip pins, it is very necessary to provide a standing height of a certain size, and the main reason is to consider the problem of stress release, so as to avoid the problem that the chip body and the surface of the PCB form a hard contact to cause a stress unreleased space and further damage the chip. On the other hand, in the three-proofing and encapsulating processes, the three-proofing paint and the encapsulating adhesive can effectively invade the bottom of the chip body, the adhesion strength of the chip to the PCB is effectively improved after the three-proofing paint and the encapsulating adhesive are solidified, the anti-vibration effect is enhanced, and the standing height of the chip is determined to be 0.6mm according to the standard.
Length of welding surface B: namely the distance from the cutting point of the chip pin to the bending point of the second pin, in order to ensure the welding reliability, for the flat lead, the length of the pin lapped on the bonding pad is ensured to be 3 times of the pin width at the minimum and 5 times of the pin width at the maximum, when the width of the flat pin is less than 0.5mm, the length of the welding surface of the flat lead is not less than 1.25mm, and the length of the welding surface of the chip is determined to be 1.36mm according to the standard.
After the chip forming device provided by the invention is used for forming the pins once, the forming requirements of all FP type packaged chips needing pin forming can be met, and the chip forming device has good universality. After field trial, the device has good reverberation, can greatly improve the working efficiency of chip welding and the welding quality of products, and can design a series of pin forming devices capable of meeting FP chips with different sizes according to the sizes of the chips, thereby having good expansibility.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (10)
1. A FP type chip pin forming device is characterized in that: comprises a clamping device, an upper die and a lower die; the lower die comprises a bottom plate, two first convex ribs and a convex strip, wherein the convex strip is positioned in the center of the bottom plate, and the two first convex ribs are symmetrically distributed on two sides of the convex strip; the upper die comprises a top plate, two first flanges and two second flanges, wherein the two first flanges and the two second flanges are symmetrically distributed around the central axis of the top plate; the heights of the first convex ribs, the convex strips and the bottom plate of the lower die are sequentially reduced, and the heights of the top plate, the two first flanges and the two second flanges of the upper die are sequentially increased.
2. A forming apparatus as defined in claim 1, wherein: the first flange of the upper die corresponds to the first convex rib of the lower die in position, and a cavity between the first flange and the first convex rib is used for accommodating a chip; the first flange of the upper die corresponds to the edge position of the bottom plate of the lower die and is used for determining a welding surface.
3. A forming apparatus as defined in claim 1, wherein: the upper and lower corners of the first convex rib and the upper and lower corners of the second flange are chamfers, and the chamfer radius is the bending radius R of the pin.
4. A forming apparatus as defined in claim 1, wherein: the width of the first convex rib and the first flange is equal to the shoulder width of the pins, and the height of the convex strip of the lower die is the standing height of the pins.
5. A forming apparatus as defined in claim 1, wherein: the top surface of the upper die and the bottom surface of the lower die are shaped like a concave, wherein the edge of the like concave is positioned at the side edge of the clamping device, and the plane of the like concave is attached to the clamping surface of the clamping device.
6. A forming apparatus as defined in claim 1, wherein: the upper die and the lower die further comprise fixing parts which can be fixed by screws or clamped and fixed.
7. A forming apparatus as defined in claim 1, wherein: the material of the forming die adopts industrial plastics.
8. A method of forming a forming apparatus according to any one of claims 1 to 7, comprising the steps of:
step one, preparing a mould: before forming, the pressing mechanism is clamped in the similar concave grooves of the upper die and the lower die, and the upper die and the lower die are fixed with the clamping device;
step two, pin forming: put into the sand grip of bed die with the chip on, then with the bed die combination compress tightly, the root of first rib and first flange centre gripping pin realizes the fixed of chip pin root, first rib and the common application of force of second flange carry out the shaping with the pin:
step three, trimming redundant pins: after the chip is formed, the clamping device is opened and the excess pins are trimmed with scissors.
9. A method of forming as claimed in claim 7, wherein: and step two, controlling coplanarity of the chip pins, wherein when the thickness of the lead is less than 0.8mm according to standard specification, the minimum pin bending radius R is 1 time of the thickness of the pin.
10. A method of forming as claimed in claim 7, wherein: step two also includes adjusting the pin forming shoulder width A, the station height D and the length of the welding surface: the shoulder width of the chip was set to 1.5mm, the station height was set to 0.6mm, and the land length was set to 1.36 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011642189.6A CN112845957A (en) | 2020-12-31 | 2020-12-31 | Pin forming device and method for FP chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011642189.6A CN112845957A (en) | 2020-12-31 | 2020-12-31 | Pin forming device and method for FP chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112845957A true CN112845957A (en) | 2021-05-28 |
Family
ID=76000817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011642189.6A Pending CN112845957A (en) | 2020-12-31 | 2020-12-31 | Pin forming device and method for FP chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112845957A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113751621A (en) * | 2021-09-16 | 2021-12-07 | 浙江日风电气股份有限公司 | Handheld component pin forming device |
| CN114393137A (en) * | 2021-12-07 | 2022-04-26 | 北京无线电计量测试研究所 | Forming process equipment for surface mounting pins of axial element |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120180542A1 (en) * | 2011-01-19 | 2012-07-19 | Ford Global Technologies, Llc | Method and Apparatus for Sharp Flanging and Trimming Sheet Metal Panels |
| JP2015107521A (en) * | 2013-10-25 | 2015-06-11 | Ｊｆｅスチール株式会社 | Press forming method |
| CN107537935A (en) * | 2017-10-25 | 2018-01-05 | 邰学兰 | A kind of high-precision bending and molding diel |
| CN214768517U (en) * | 2020-12-31 | 2021-11-19 | 大连长丰实业总公司 | Pin forming device for FP chip |
-
2020
- 2020-12-31 CN CN202011642189.6A patent/CN112845957A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120180542A1 (en) * | 2011-01-19 | 2012-07-19 | Ford Global Technologies, Llc | Method and Apparatus for Sharp Flanging and Trimming Sheet Metal Panels |
| JP2015107521A (en) * | 2013-10-25 | 2015-06-11 | Ｊｆｅスチール株式会社 | Press forming method |
| CN107537935A (en) * | 2017-10-25 | 2018-01-05 | 邰学兰 | A kind of high-precision bending and molding diel |
| CN214768517U (en) * | 2020-12-31 | 2021-11-19 | 大连长丰实业总公司 | Pin forming device for FP chip |
Non-Patent Citations (1)
| Title |
|---|
| 王凯;: "DSPF240芯片引线弯曲成形冲裁复合模设计", 模具制造, no. 07, 8 July 2012 (2012-07-08), pages 1 - 2 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113751621A (en) * | 2021-09-16 | 2021-12-07 | 浙江日风电气股份有限公司 | Handheld component pin forming device |
| CN114393137A (en) * | 2021-12-07 | 2022-04-26 | 北京无线电计量测试研究所 | Forming process equipment for surface mounting pins of axial element |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112845957A (en) | Pin forming device and method for FP chip | |
| JP3888228B2 (en) | Sensor device | |
| US8114243B2 (en) | Mounting method using thermocompression head | |
| CN214768517U (en) | Pin forming device for FP chip | |
| CN210547638U (en) | QFP chip pin plastic frock | |
| JP4686132B2 (en) | Method for manufacturing optical semiconductor device with protective cover | |
| US6402009B1 (en) | Apparatus and method for shaping lead frame for semiconductor device and lead frame for semiconductor device | |
| CN101312112B (en) | Chip packaging outer lead wire molding die | |
| JP2003197663A (en) | Semiconductor device and its manufacturing method, circuit board, and electronic instrument | |
| CN112701108A (en) | Chip packaging structure and preparation method thereof | |
| CN214185016U (en) | Hand-held axial device lead wire forming tool | |
| CN118146725B (en) | Vertical conductive adhesive manufacturing method for IC test | |
| CN215869453U (en) | Shoe lamp packaging structure | |
| CN211916613U (en) | Mould contour inspection smelting tool | |
| CN218015407U (en) | Universal tool for integrated circuit pin forming | |
| JP3695578B2 (en) | Electronic component lead cutting device and lead cutting method | |
| JP3087395B2 (en) | Electronic component manufacturing method | |
| JP2897396B2 (en) | External lead molding method for resin-encapsulated semiconductor device | |
| JPH05315498A (en) | Molding of outer lead of electronic component and molding device | |
| JPH1131706A (en) | Method for forming mold of semiconductor device and metallic mold for forming mold of semiconductor device | |
| CN115069937A (en) | Winding part quantitative cutting tool and method | |
| JPH0831550B2 (en) | Semiconductor cutting shaping mold | |
| CN114583545A (en) | Mechanism suitable for butterfly laser lead wire takes shape | |
| JPH0129792Y2 (en) | ||
| JPH0645392A (en) | Detecting method for bonding position of wire bonding apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |