CN215869453U - Shoe lamp packaging structure - Google Patents
Shoe lamp packaging structure Download PDFInfo
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- CN215869453U CN215869453U CN202121385293.1U CN202121385293U CN215869453U CN 215869453 U CN215869453 U CN 215869453U CN 202121385293 U CN202121385293 U CN 202121385293U CN 215869453 U CN215869453 U CN 215869453U
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- packaging structure
- shoe lamp
- output pins
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Abstract
The utility model discloses a shoe lamp packaging structure, which belongs to the technical field of shoe lamps and comprises a metal bracket, a bare wafer and a solid sealing rubber shell; the metal support comprises a metal sheet and a plurality of output pins arranged around the metal sheet, the output pins are S-shaped, the top ends of the output pins are positioned above the metal sheet, and the bottom ends of the output pins and the metal sheet are positioned on the same horizontal plane and are far away from the metal sheet; the bare chip is arranged on the upper bottom surface of the metal sheet, and the bare chip is connected with the end part of the output pin, which is positioned above the metal sheet, through a gold thread; the solid-sealed rubber shell wraps the metal support and the bare chip, and the bottom ends of the output pins and the lower bottom surface of the metal sheet are exposed outside the solid-sealed rubber shell. This shoe lamp packaging structure, the structure that can reduce or stop different materials is because of the produced inside destruction stress of coefficient of expansion difference for this shoe lamp packaging structure can the normal work in wider temperature range, has avoided causing the unable normal work of shoe lamp or the problem that can not work because of the temperature variation.
Description
Technical Field
The utility model belongs to the technical field of shoe lamps, and particularly relates to a shoe lamp packaging structure.
Background
The shoe lamp is a decorative lamp which is made of LED and can be installed on the shoe, and the shoe lamp can be installed on the vamp, the upper and the like, thereby having good decoration and warning effects. The packaging structure of the bare chip of the existing shoe lamp is a bonding packaging structure, the bare chip is adhered to the mounting position of the circuit board, then the bare chip is connected with the corresponding bonding pad on the circuit board through an alloy wire, and finally the bare chip is packaged by bonding glue, and the structure is shown in reference to fig. 1-2. The packaging structure and the matched process are mature and stable, and are the packaging structure uniformly adopted in the shoe lamp industry at present. The packaging structure works stably under the normal temperature condition (-10 ℃ to 40 ℃), but electrical faults are easy to occur when the temperature exceeds the temperature range, so that the shoe lamp cannot work normally or cannot work. This is because different structures adopt different materials to make, and when the shoes lamp placed or during operation under high temperature or low temperature condition, because of the expansion coefficient difference, can produce stress between each structure, this stress can directly be exerted on the face of being connected of bonding glue and PCB board, will lead to the solder joint to break away from the pad when power reaches certain degree, leads to electric can not switch on, and the shoes lamp can not normally or can't work. Meanwhile, the shoe lamp is different from a common decorative lamp and is arranged on a shoe, so that people can continuously walk in the using process to cause external impact on the shoe lamp, and the risk of welding spot collapse is aggravated by the external impact.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the technical problems to be solved by the utility model are as follows: a shoe lamp package structure that can be normally used in a high temperature or low temperature environment is provided.
In order to solve the technical problems, the utility model adopts the technical scheme that: a shoe lamp packaging structure comprises a metal bracket, a bare wafer and a sealing rubber shell;
the metal support comprises a metal sheet and a plurality of output pins arranged around the metal sheet, the output pins are S-shaped, one of two end parts of each output pin is positioned above the metal sheet, and the other output pin and the metal sheet are positioned on the same horizontal plane and are far away from the metal sheet;
the bare chip is arranged on the upper bottom surface of the metal sheet, and the bare chip is connected with the end part of the output pin, which is positioned above the metal sheet, through a gold wire;
the solid-sealed rubber shell wraps the metal support and the bare chip, and the end parts of the output pins and the metal sheet which are positioned on the same horizontal plane and the lower bottom surface of the metal sheet are exposed outside the solid-sealed rubber shell.
The metal support further comprises a reserved bonding pad, the reserved bonding pad and the metal sheet are integrally formed, and the reserved bonding pad is S-shaped.
The shoe lamp packaging structure further comprises a glue fixing mold, wherein the glue fixing mold is in a cuboid shape with an opening at the bottom, and a plurality of glue filling openings are formed in the side face of the glue fixing mold.
The glue fixing mold is composed of an upper shell and a lower shell which are integrally formed, the upper shell and the lower shell are in a trapezoidal platform shape, and wide opening ends of the upper shell and the lower shell are connected.
Wherein, the material of the metal bracket is nickel-plated copper or gold-plated copper.
The utility model has the beneficial effects that: according to the shoe lamp packaging structure provided by the utility model, the metal support forms a three-dimensional surrounding structure, the bare chip is surrounded in the metal support, the packaging structure is formed by the fixing and sealing glue shell, the different structures are different in spatial position and have enough intervals, so that the internal damage stress generated by the structures made of different materials due to the difference of expansion coefficients can be reduced or eliminated, the shoe lamp packaging structure can normally work in an environment with a large temperature difference, and the problem that the shoe lamp cannot normally work or cannot work due to the temperature change is avoided.
Drawings
FIG. 1 is a diagram illustrating a bonding package structure;
FIG. 2 is a side view of a bonding package structure;
FIG. 3 is a schematic view of a shoe lamp package structure mounted on a circuit board according to an embodiment of the present invention;
FIG. 4 is a side view of a shoe lamp package structure mounted to a circuit board according to an embodiment of the present invention;
FIG. 5 is a schematic structural view of a shoe lamp package according to an embodiment of the present invention;
FIG. 6 is a partial schematic structural view of a shoe lamp package according to an embodiment of the present invention;
FIG. 7 is a partial top view of a shoe light package according to an embodiment of the present invention;
FIG. 8 is a side view of a partial structure of a shoe light package structure according to an embodiment of the present invention;
description of reference numerals: 1. a metal bracket; 11. a metal sheet; 12. an output pin; 13. reserving a bonding pad; 2. a bare wafer; 3. sealing the rubber shell; 4. gold thread; 5. a circuit board; 6. and (4) bonding glue.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 3 to 8, the shoe lamp package structure of the present invention includes a metal frame 1, a bare chip 2 and a sealing rubber case 3, wherein the sealing rubber case 3 is formed by curing a sealing rubber;
the metal support 1 comprises a metal sheet 11 and a plurality of output pins 12 arranged around the metal sheet 11, the output pins 12 are S-shaped, one (top end) of the two end parts of the output pins 12 is positioned above the metal sheet 11, and the other (bottom end) of the two end parts of the output pins 12 is positioned on the same horizontal plane with the metal sheet 11 and is far away from the metal sheet 11;
the bare chip 2 is arranged on the upper bottom surface of the metal sheet 11, and the bare chip 2 is connected with the end part of the output pin 12 above the metal sheet 11 through a gold wire 4;
the solid-sealed rubber shell 3 is wrapped by the metal support 1 and the bare chip 2, and the end parts of the output pins 12 and the metal sheet 11 which are positioned on the same horizontal plane and the lower bottom surface of the metal sheet 11 are exposed outside the solid-sealed rubber shell 3.
The working process of the utility model is as follows: fixing a bare chip 2 on the upper bottom surface of a metal sheet 11, then connecting (welding) the bare chip 2 with the top ends of output pins 12 of a metal bracket 1 at the corresponding position through gold wires 4, then pouring a sealing adhesive, and forming a sealing adhesive shell 3 after the sealing adhesive is hardened to obtain a shoe lamp packaging structure; and (3) attaching the shoe lamp packaging structure to the circuit board 5 by using a surface mounting process of a surface mounting processing device.
From the above description, the beneficial effects of the present invention are: different from the bonding packaging structure packaged by using bonding glue 6 in the prior art, the shoe lamp packaging structure provided by the utility model has the advantages that the metal support 1 forms a three-dimensional surrounding structure, the bare wafer 2 is surrounded in the three-dimensional surrounding structure, the packaging structure is formed by the solid sealing glue shell 3, the different structures are different in spatial position and have enough intervals, the internal damage stress generated by the structures made of different materials due to the difference of expansion coefficients can be further reduced or eliminated, the shoe lamp packaging structure can normally work in the environment with larger temperature difference, the shoe lamp packaging structure can normally work within the temperature range of-40 ℃ to 85 ℃ through testing, the problem that the shoe lamp cannot normally work or cannot work due to temperature change is effectively avoided, and the potential safety hazard caused by the fact that part of the shoe lamp cannot normally work suddenly is avoided for the shoe lamp used for warning.
Further, the metal support 1 further comprises a reserved bonding pad 13, the reserved bonding pad 13 and the metal sheet 11 are integrally formed, and the reserved bonding pad 13 is S-shaped.
From the above description, it can be known that the provision of the S-shaped reserved pad is equivalent to providing a spare output pin for standby use, and the structure formed after the S-shaped reserved pad is connected with the metal sheet and matched with the plurality of output pins can effectively enhance the peeling resistance and the external force impact resistance after the shoe lamp packaging structure is attached.
The glue fixing mold is a cuboid with a hollow interior and an opening at the bottom, and a plurality of glue filling openings are formed in the side face of the glue fixing mold.
From the above description, the glue fixing mold has a setting effect when used for pouring glue to form a glue fixing and sealing shell.
Furthermore, the glue fixing mold is composed of an upper shell and a lower shell which are integrally formed, the upper shell and the lower shell are in a trapezoidal table shape, and the wide opening ends of the upper shell and the lower shell are connected.
From the above description, the middle part of the space formed by the glue fixing mold with the above structure is large, and is suitable for accommodating the connected gold wires and the protruded output pins.
Further, the metal bracket 1 is made of nickel-plated copper or gold-plated copper.
Referring to fig. 3 to 8, a first embodiment of the present invention is:
a shoe lamp packaging structure comprises a metal bracket 1, a bare chip 2 and a sealing rubber shell 3;
the metal bracket 1 comprises a metal sheet 11 and a plurality of output pins 12 arranged around the metal sheet 11, wherein the output pins 12 are S-shaped, one of two end parts of each output pin 12 is positioned above the metal sheet 11, and the other output pin is positioned on the same horizontal plane with the metal sheet 11 and is far away from the metal sheet 11;
the bare chip 2 is arranged on the upper bottom surface of the metal sheet 11, and the bare chip 2 is connected with the end part of the output pin 12 above the metal sheet 11 through a gold wire 4;
the solid-sealed rubber shell 3 is used for wrapping the metal bracket 1 and the bare chip 2, and the end parts of the output pins 12 and the metal sheet 11 which are positioned on the same horizontal plane and the lower bottom surface of the metal sheet 11 are exposed outside the solid-sealed rubber shell 3;
the metal bracket 1 is made of gold-plated copper.
Referring to fig. 3 to 8, a second embodiment of the present invention is:
a shoe lamp packaging structure comprises a metal support 1, a bare wafer 2, a glue fixing and sealing shell 3 and a glue fixing mold;
the metal bracket 1 comprises a metal sheet 11 and a plurality of output pins 12 arranged around the metal sheet 11, wherein the output pins 12 are S-shaped, one of two end parts of each output pin 12 is positioned above the metal sheet 11, and the other output pin is positioned on the same horizontal plane with the metal sheet 11 and is far away from the metal sheet 11;
the bare chip 2 is arranged on the upper bottom surface of the metal sheet 11, and the bare chip 2 is connected with the end part of the output pin 12 above the metal sheet 11 through a gold wire 4;
the solid-sealed rubber shell 3 is used for wrapping the metal bracket 1 and the bare chip 2, and the end parts of the output pins 12 and the metal sheet 11 which are positioned on the same horizontal plane and the lower bottom surface of the metal sheet 11 are exposed outside the solid-sealed rubber shell 3;
the metal bracket 1 further comprises a reserved bonding pad 13, the reserved bonding pad 13 and the metal sheet 11 are integrally formed, and the reserved bonding pad is S-shaped;
the glue fixing mould consists of an upper shell and a lower shell which are integrally formed, the upper shell and the lower shell are both in a trapezoidal table shape, wide opening ends of the upper shell and the lower shell are connected, and a plurality of glue filling openings are formed in the side surface of the glue fixing mould;
the metal bracket 1 is made of nickel-plated copper.
In summary, in the shoe lamp package structure provided by the present invention, the metal sheet, the output pins and the reserved bonding pads of the metal support form a three-dimensional surrounding structure for surrounding the bare chip therein, and an integral packaging structure is formed by the sealing glue shell, the different structures are different in spatial position and have enough space, thereby reducing or eliminating the internal damage stress generated by the difference of expansion coefficients of the structures made of different materials, the shoe lamp packaging structure can work normally in the environment with large temperature difference and the abnormal environment, and can work normally in the temperature range of-40 ℃ to 85 ℃ through testing, so that the problem that the shoe lamp cannot work normally or cannot work due to temperature change is effectively solved, and potential safety hazards caused by the fact that the shoe lamp cannot work normally suddenly are avoided for part of the shoe lamps used for warning.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (5)
1. A shoe lamp packaging structure is characterized by comprising a metal bracket, a bare wafer and a sealing rubber shell;
the metal support comprises a metal sheet and a plurality of output pins arranged around the metal sheet, the output pins are S-shaped, one of two end parts of each output pin is positioned above the metal sheet, and the other output pin and the metal sheet are positioned on the same horizontal plane and are far away from the metal sheet;
the bare chip is arranged on the upper bottom surface of the metal sheet, and the bare chip is connected with the end part of the output pin, which is positioned above the metal sheet, through a gold wire;
the solid-sealed rubber shell wraps the metal support and the bare chip, and the end parts of the output pins and the metal sheet which are positioned on the same horizontal plane and the lower bottom surface of the metal sheet are exposed outside the solid-sealed rubber shell.
2. The shoe lamp packaging structure of claim 1, wherein the metal bracket further comprises a reserved pad integrally formed with the metal sheet, the reserved pad being S-shaped.
3. The shoe lamp packaging structure according to claim 1, further comprising a glue fixing mold, wherein the glue fixing mold is in a rectangular parallelepiped shape with an opening at the bottom, and a plurality of glue filling openings are formed in the side surface of the glue fixing mold.
4. The shoe lamp packaging structure according to claim 3, wherein the glue fixing mold comprises an upper shell and a lower shell which are integrally formed, the upper shell and the lower shell are both in a trapezoidal table shape, and wide opening ends of the upper shell and the lower shell are connected.
5. The shoe lamp package structure of claim 1, wherein the metal bracket is made of nickel-plated copper or gold-plated copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121385293.1U CN215869453U (en) | 2021-06-22 | 2021-06-22 | Shoe lamp packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121385293.1U CN215869453U (en) | 2021-06-22 | 2021-06-22 | Shoe lamp packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215869453U true CN215869453U (en) | 2022-02-18 |
Family
ID=80334468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121385293.1U Active CN215869453U (en) | 2021-06-22 | 2021-06-22 | Shoe lamp packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215869453U (en) |
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2021
- 2021-06-22 CN CN202121385293.1U patent/CN215869453U/en active Active
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