CN112838184A - Two-stage adsorption photomask and adsorption method thereof - Google Patents

Two-stage adsorption photomask and adsorption method thereof Download PDF

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Publication number
CN112838184A
CN112838184A CN202110108450.2A CN202110108450A CN112838184A CN 112838184 A CN112838184 A CN 112838184A CN 202110108450 A CN202110108450 A CN 202110108450A CN 112838184 A CN112838184 A CN 112838184A
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mask
mask plate
plate
alignment
strips
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金华君
吴聪原
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Fujian Huajiacai Co Ltd
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Fujian Huajiacai Co Ltd
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Priority to CN202110108450.2A priority Critical patent/CN112838184A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention discloses a two-section type adsorption photomask and an adsorption method thereof, wherein the two-section type adsorption photomask comprises a mask frame, a first mask plate, a second mask plate, a substrate and a magnetic plate, the magnetism of the first mask plate is larger than that of the second mask plate, the second mask plate and the first mask plate are sequentially overlapped and are fixed on one surface of the mask frame in a mutually clinging manner, the surface of the first mask plate, which is far away from the second mask plate, is provided with the substrate, and one side of the substrate, which is far away from the first mask plate, is provided with the magnetic plate. The panel area on the first mask plate and the opening on the second mask plate are the same in number and are overlapped in a one-to-one correspondence mode, the panel area can completely cover the corresponding opening, and only one opening is overlapped. During the use, the magnetic sheet adsorbs first mask plate and second mask plate successively, makes the two attached on the base plate, eliminates the mask plate because the flagging of self and the influence of factors such as attached pressure to attached effect at attached base plate in-process, realizes that the mask plate closely laminates with the base plate is closely flat at the coating by vaporization process, guarantees the accurate nature of filming.

Description

Two-stage adsorption photomask and adsorption method thereof
Technical Field
The invention relates to the technical field of OLED manufacturing, in particular to a two-section type adsorption photomask and an adsorption method thereof.
Background
In the conventional Organic Light Emitting Diode (OLED) manufacturing process, the precision of forming the Light Emitting sub-pixels on the substrate becomes the main technical core. Therefore, whether the high-precision metal mask plate can be closely and flatly attached to the substrate or not in the evaporation process is very important. The mode that adopts the support bar to support high fine metal mask strip among the prior art can not solve metal mask strip's flagging and fold problem completely for the mask plate can't closely laminate flatly with the base plate in the coating by vaporization process, has influenced the accurate nature of filming.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the two-section type adsorption photomask and the adsorption method thereof are provided, so that the metal mask plate can be tightly and flatly attached to a substrate in the evaporation process, and the film forming accuracy is ensured.
In order to solve the technical problems, the invention adopts the technical scheme that:
a two-section type adsorption photomask comprises a mask frame, a first mask plate, a second mask plate, a substrate and a magnetic plate;
the magnetism of the first mask plate is larger than that of the second mask plate, the second mask plate and the first mask plate are sequentially overlapped and fixed on one surface of the mask frame in a mutually close-fitting manner, the substrate is arranged on one surface of the first mask plate, which is far away from the second mask plate, and the magnetic plate is arranged on one side of the substrate, which is far away from the first mask plate;
the panel region on the first mask plate is the same with opening quantity on the second mask plate and the position one-to-one overlaps, the panel region can completely cover the correspondence the opening just with one the opening takes place to overlap, the magnetic sheet is used for adsorbing in proper order first mask plate with the second mask plate extremely on the base plate.
In order to solve the technical problem, the invention adopts another technical scheme as follows:
an adsorption method of a two-stage adsorption photomask is applied to the two-stage adsorption photomask, and comprises the following steps:
s1, pushing the magnetic plate to approach the substrate to a first preset position, so that the magnetic plate adsorbs the first mask plate until the first mask plate is attached to the substrate, and the second mask plate is fixed;
s2, pushing the magnetic plate to approach the substrate to a second preset position, so that the magnetic plate adsorbs the second mask plate until the second mask plate is attached to the first mask plate.
In conclusion, the beneficial effects of the invention are as follows: the utility model provides a two segmentation adsorb light shields and adsorption method thereof, divide into the first mask plate and the second mask plate that receive the magnetism difference with the mask plate in original OLED coating by vaporization in-process, make the film formation size on the base plate decide by first mask plate and second mask plate jointly, utilize the magnetic sheet to adsorb first mask plate to it attaches on the base plate, adsorb the second mask plate to it attaches on first mask plate again, eliminated original mask plate because the flagging of self and the influence of factors such as attached pressure to attached effect in the attached base plate in-process, realize that metal mask plate can closely laminate with the base plate in the coating by vaporization process, guarantee the accurate nature of film formation.
Drawings
FIG. 1 is a schematic diagram illustrating the relative positions of the overall structure of a two-stage absorption mask according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a two-stage adsorption mask according to an embodiment of the present invention after a first mask plate is adsorbed;
fig. 3 is a schematic structural view of a two-stage adsorption mask according to an embodiment of the present invention after a second mask plate is adsorbed;
FIG. 4 is a partial schematic structural view of a two-stage absorption mask according to an embodiment of the present invention;
fig. 5 is an installation diagram of a second mask plate of a two-stage absorption mask according to an embodiment of the present invention;
FIG. 6 is a detailed diagram of two mask strips of a two-stage absorption mask according to an embodiment of the present invention;
fig. 7 is a schematic view illustrating an installation process of a first mask plate of a two-stage adsorption mask according to an embodiment of the present invention;
fig. 8 is a schematic view illustrating an installation process of another first mask plate of a two-stage adsorption mask according to an embodiment of the present invention;
FIG. 9 is a schematic structural diagram of a two-stage absorption mask according to an embodiment of the present invention in an alignment mode;
FIG. 10 is a schematic structural diagram of a two-stage absorption mask according to another alignment method of the present invention;
FIG. 11 is a schematic diagram illustrating an adsorption method for a two-stage adsorption mask according to an embodiment of the present invention;
description of reference numerals:
1. a mask frame; 2. a first mask plate; 3. a second mask plate; 4. a substrate; 5. a magnetic plate; 6. a panel region; 7. an opening; 8. welding the strips; 9. welding a groove; 10. opening a hole; 11. a mask strip; 12. a first alignment mask strip; 13. a second alignment mask strip; 14. and aligning holes.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 10, a two-stage absorption mask includes a mask frame 1, a first mask 2, a second mask 3, a substrate 4 and a magnetic plate 5;
the magnetism of the first mask plate 2 is larger than that of the second mask plate 3, the second mask plate 3 and the first mask plate 2 are sequentially overlapped and fixed on one surface of the mask frame 1 in a mutually close-fitting manner, the substrate 4 is arranged on one surface, away from the second mask plate 3, of the first mask plate 2, and the magnetic plate 5 is arranged on one side, away from the first mask plate 2, of the substrate 4;
the panel region 6 on the first mask plate 2 and the opening 7 on the second mask plate 3 are the same in quantity and overlap in position one-to-one correspondence, the panel region 6 can completely cover the corresponding opening 7 and only one the opening 7 overlaps, the magnetic plate 5 is used for successively and sequentially adsorbing the first mask plate 2 and the second mask plate 3 to on the substrate 4.
From the above description, the beneficial effects of the present invention are: the utility model provides a two segmentation adsorb light covers, divide into the mask plate of original OLED coating by vaporization in-process and receive the first mask plate 2 and the second mask plate 3 that magnetism is different, make the film formation size on the base plate 4 decide by first mask plate 2 and second mask plate 3 jointly, utilize magnetic sheet 5 to adsorb first mask plate 2 to its attached on base plate 4, adsorb second mask plate 3 again to its attached on first mask plate 2, eliminated original mask plate because the flagging of self and the influence of factors such as attached pressure to attached effect at attached base plate 4 in-process, realize that metal mask plate can closely flat laminating with base plate 4 in the coating by vaporization process, guarantee the accurate nature of forming film.
Furthermore, the first mask plate 2 is made of a strong magnetic material, and the second mask plate 3 is made of a weak magnetic material;
the area of the second mask plate 3 is larger than that of the first mask plate 2.
As can be seen from the above description, the first mask 2 has a larger magnetic property than the second mask 3, so that it is more easily absorbed by the magnetic plate 5. The area of the second mask 3 is larger than that of the first mask 2, so that the second mask 3 can support the whole first mask 2, and the first mask 2 can be well adsorbed. Although the area of the second mask 3 is larger than that of the first mask 2, the first mask 2 is still larger than the second mask 3 in terms of overall magnetic properties.
Further, the thickness of the second mask 3 is [80 μm,120 μm ], and the thickness of the first mask 2 is [20 μm,30 μm ].
As can be seen from the above description, since the second mask 3 is used to be fixedly matched with the mask frame 1 and also to support the first mask 2, the thickness of the second mask 3 is greater than that of the first mask 2, so that the structure of the second mask 3 is firmer, and the thickness of the first mask 2 is as thin as possible, which is beneficial to reducing the shadow caused by the thickness during film coating.
Furthermore, a plurality of welding strips 8 are arranged at the edge of the second mask plate 3, welding grooves 9 corresponding to the welding strips 8 in number and position are arranged on the frame edge of the mask frame 1, and the welding strips 8 are welded and fixed with the corresponding welding grooves 9;
the depth of the welding groove 9 is equal to the thickness of the second mask plate 3, and the width of the welding groove 9 is equal to the size of the welding strip 8;
the upper surface of the second mask plate 3 close to the first mask plate 2 and the upper surface of the mask frame 1 close to the first mask plate 2 are located on the same horizontal plane.
As can be seen from the above description, the second mask 3 is welded and fixed on the mask frame 1 by the welding strip 8 and the welding groove 9. Because the upper surface of the second mask plate 3 close to the first mask plate 2 and the upper surface of the mask frame 1 close to the first mask plate 2 are positioned at the same horizontal plane, and the groove depth of the welding groove 9 is equal to the thickness of the second mask plate 3, the first mask plate 2 and the mask frame 1 can be tightly attached to each other, and no redundant gap is generated. And, after magnetic sheet 5 pushed down completely, second mask plate 3 also can be by slowly suck and closely laminate together with attached first metal mask plate 2 on base plate 4, reduces the shadow, guarantees the coating film accuracy nature.
Further, the panel region 6 is a net structure formed by arranging more than two openings 10, and the area of the openings 10 is smaller than that of the opening 7.
From the above description, the mesh design in the panel area 6 can be used as the filling position of the light-emitting sub-pixels, and the more meshes, the more light-emitting sub-pixels in the area of the opening 7 of the second mask 3, and finally the higher resolution of the screen.
Further, the first mask 2 is formed by arranging more than two mask strips 11, and all the panel regions 6 are uniformly distributed on the mask strips 11.
As can be seen from the above description, the first mask 2 is composed of a plurality of mask stripes 11.
Further, the first mask 2 includes a first alignment mask strip 12 and a second alignment mask strip 13;
the two ends of the first alignment mask strip 12 and the two ends of the second alignment mask strip 13 are both provided with alignment holes 14;
the first alignment mask strips 12 and the second alignment mask strips 13 are welded and fixed on the mask frame 1 through the alignment holes 14, and the middle parts of the first alignment mask strips 12 and the middle parts of the second alignment mask strips 13 are respectively overlapped with the side edges and the opposite edges of the second mask plate 3.
As can be seen from the above description, the above is an alignment mode, and the first alignment mask strip 12 and the second alignment mask strip 13 respectively attached to the side edge and the opposite edge of the second mask plate 3 are used as reference axes, so as to complete alignment and fixation of the other mask strips 11, and finally complete alignment and overlapping of the first mask plate 2 and the second mask plate 3.
Furthermore, the two ends of one side edge and the two ends of the opposite side edge of the second mask plate 3 are provided with alignment holes 14.
As can be seen from the above description, the above is another alignment method, and the side edge of the second mask 3 with the alignment hole 14 is directly used as a reference axis for alignment, so as to complete alignment and fixing of the other mask strips 11 on the second mask 3.
Referring to fig. 1, fig. 2, fig. 3 and fig. 11, an adsorption method for a two-stage adsorption mask is applied to the two-stage adsorption mask, and includes the steps of:
s1, pushing the magnetic plate 5 to approach the substrate 4 to a first preset position, so that the magnetic plate 5 adsorbs the first mask plate 2 until the first mask plate 2 is attached to the substrate 4 and the second mask plate 3 is not moved;
s2, pushing the magnetic plate 5 to approach the substrate 4 to a second preset position, so that the magnetic plate 5 adsorbs the second mask plate 3 until the second mask plate 3 is attached to the first mask plate 2.
From the above description, the beneficial effects of the present invention are: the utility model provides an adsorption method of two segmentation absorption light covers, utilize magnetic sheet 5 to adsorb first mask plate 2 to its attached on base plate 4, adsorb second mask plate 3 again to its attached on first mask plate 2, eliminated original mask plate because the influence of factors such as flagging and attached pressure of self to attached effect at attached base plate 4 in-process, realize that metal mask plate can closely laminate with base plate 4 at the coating by vaporization process, guarantee the accuracy nature of filming.
Further, step S1 is preceded by:
s0, applying a first preset tension on the first mask plate 2 to perform net stretching;
the step S2 is preceded by:
and applying a second preset tension on the second mask plate 3 to perform screen tensioning.
As can be seen from the above description, since the first mask plate 2 and the second mask plate 3 both have drooping in different degrees, in the adsorption process, in order to ensure the accuracy of film formation, different first preset tension and second preset tension are assisted according to the difference between the first mask plate and the second mask plate 3, so as to ensure that the drooping region of the mask plate is within the adsorption range.
Referring to fig. 1 to fig. 3, a first embodiment of the present invention is:
the utility model provides a two segmentation adsorb light covers, falls into the first mask plate 2 and the second mask plate 3 that receive the magnetism difference with the mask plate for the film forming size on the base plate 4 is decided by first mask plate 2 and second mask plate 3 jointly, utilizes magnetic sheet 5 to carry out two segmentation of succeeding generations to adsorb, eliminates the influence of adverse factor such as fold that the film forming process meets, guarantees the accurate nature of forming film. The invention can be used in the film forming process in OLED vapor deposition, and can also be used in the production process of other panel products with high pixel density.
A two-section type adsorption photomask is shown in figure 1 and comprises a mask frame 1, a first mask plate 2, a second mask plate 3, a substrate 4 and a magnetic plate 5. The magnetism of receiving of first mask plate 2 is greater than second mask plate 3, and second mask plate 3 and first mask plate 2 overlap in proper order and fix in the one side of mask frame 1 hugging closely each other, and the one side that second mask plate 3 was kept away from to first mask plate 2 is provided with base plate 4, and one side that first mask plate 2 was kept away from to base plate 4 is equipped with magnetic sheet 5. The panel area 6 on the first mask plate 2 is the same with the opening 7 on the second mask plate 3 in quantity and the positions are overlapped in a one-to-one correspondence mode, the panel area 6 can completely cover the corresponding opening 7 and only overlaps with one opening 7, and the magnetic plate 5 is used for sequentially adsorbing the first mask plate 2 and the second mask plate 3 to the substrate 4.
In the embodiment, as shown in fig. 2, the magnetic plate 5 is used to adsorb the first mask 2 to be attached to the substrate 4, and then as shown in fig. 3, the second mask 3 is adsorbed to be attached to the first mask 2. Two segmentation adsorbs and has eliminated original mask plate because the flagging of self and factors such as attached pressure to the influence of attached effect at attached 4 in-process bases, realizes that metal mask plate can closely laminate flatly with base plate 4 in the coating by vaporization process, guarantees the accurate nature of filming.
In the present embodiment, the thickness of the second mask 3 is [80 μm,120 μm ], and the thickness of the first mask 2 is [20 μm,30 μm ]. Not only the thickness but also the area of the second mask 3 is larger than that of the first mask 2. This is because the second mask 3 supports the first mask 2 and is fixed to the mask frame 1. Although the area of the second mask plate 3 is larger than that of the first mask plate 2, the magnetism of the second mask plate 3 is weaker than that of the first mask plate 2, so that the overall magnetism of the first mask plate 2 is larger than that of the second mask plate 3, and two-section type adsorption is completed by correspondingly matching the magnetic plate 5. Generally, the second mask 3 is made of a cold-worked 304 stainless steel material, has weak magnetism, and has a size in conformity with the mask frame 1. The number and the positions of the openings 7 of the second mask plate 3 are determined by the circuit design of the film coating substrate. In other equivalent embodiments, the second mask 3 may also be made of other materials with magnetism.
In this embodiment, the second mask 3 has a lower film formation accuracy requirement than the first mask 2 used for attaching to the substrate 4, and is not easily damaged. When the photomask needs to be replaced after being used and cleaned for multiple times, the first mask plate 2 can be only torn off, the second mask plate 3 is reserved, and the first mask plate 2 is manufactured again after being slightly polished on the original second mask plate 3. Therefore, the design of this embodiment is more convenient than adopting the mode that the support bar supported in the tradition, and is high to the utilization ratio of mask plate.
In addition, in the present embodiment, the panel regions 6 can completely cover the corresponding openings 7 and overlap with only one opening 7, so that the light-emitting material and the like passing through any one opening 7 can fall into the same panel region 6 and be completely blocked on the substrate 4 without being divided by a plurality of panel regions 6 in one opening 7, and uniform light emission in each opening 7 can be ensured.
Referring to fig. 4 and 5, a second embodiment of the present invention is:
on the basis of the first embodiment, as shown in fig. 4 and 5, the edge of the second mask plate 3 is provided with a plurality of welding bars 8, the frame edge of the mask frame 1 is provided with welding grooves 9, the number and the positions of the welding grooves 9 correspond to the welding bars 8, and the welding bars 8 are welded and fixed with the corresponding welding grooves 9. The depth of the welding groove 9 is equal to the thickness of the second mask plate 3, and the width of the welding groove 9 is equal to the size of the welding strip 8. The upper surface of the second mask 3 close to the first mask 2 and the upper surface of the mask frame 1 close to the first mask 2 are in the same horizontal plane. In this embodiment, the structure of the second mask 3 welded on the mask frame 1 is just as shown in fig. 5, after welding, the second mask 3 and the mask frame 1 are on the same plane, so that it is ensured that the first mask 2 does not generate excessive gaps when being fixed on the mask frame 1. The width of the welding strip 8 is [10 μm,20 μm ], and the length is consistent with the width of the frame of the mask frame 1. In this embodiment, the welding bar 8 and the welding groove 9 may be fixed by laser welding, and the projection of the welding spot on the welding bar 8 may be reduced by grinding or deepening the welding groove 9.
In this embodiment, the opening 7 on the second mask 3 may be formed by laser cutting after welding, or may be formed by etching or laser before welding. Different modes can be selected according to different specification requirements. The second mask plate 3 can be subjected to force application and expanded before welding so as to reduce the sagging amount and ensure that the flatness is good enough, so that the second mask plate can be normally sucked up by the magnetic plate 5 in the film coating process. If the mode of manufacturing the opening 7 before welding is adopted, the opening 7 needs to be pre-contracted to a certain extent so as to ensure that the size and the position of the opening 7 meet the requirements after the net is expanded.
Referring to fig. 6 to 10, a third embodiment of the present invention is:
on the basis of the first or second embodiment, as shown in fig. 6, the first mask 2 is formed by arranging more than two mask strips 11, and all the panel regions 6 are uniformly distributed on the mask strips 11. In the present embodiment, the first mask 2 is formed by arranging a plurality of mask strips 11. With reference to fig. 6 and 7, the first arrangement of the panel regions 6 on the mask stripes 11 is a single-row arrangement, and when the mask stripes are overlapped on the second mask plate 3, corresponding to the openings 7 arranged in a matrix of 6 × 8 on the second mask plate 3, 8 single-row mask stripes 11 with six panel regions 6 on each row are adopted. Referring to fig. 6 and 8, the second arrangement of the panel regions 6 on the mask stripes 11 is a two-row arrangement, and when the mask stripes are overlapped on the second mask 3, corresponding to the openings 7 arranged in a matrix of 6 × 8 on the second mask 3, 4 two-row mask stripes 11 with six panel regions 6 on each row are used. In other equivalent embodiments, other arrangement modes can be adopted according to the distribution of the openings 7 on the actual second mask plate 3.
In the present embodiment, the mask stripes 11 are made of an iron-nickel alloy having a very small thermal expansion coefficient, have a ferromagnetic property, and have a thickness of about [20 μm,30 μm ]. The mask strips 11 are made of a thin material as much as possible, so that shadow coverage caused by thickness in the coating process can be reduced. Moreover, the material of the mask frame 1 is generally consistent with the mask strip 11, so that the metal appearance deformation caused by the thermal expansion of the mask frame and the mask strip is the same and small in the evaporation heating process, the deformation of the panel area 6 is reduced to the greatest extent, and the coating accuracy is ensured.
In the present embodiment, the panel region 6 is a mesh structure formed by arranging more than two openings 10, and the area of the opening 10 is smaller than that of the opening 7, so that the number of light-emitting sub-pixels in the area of the opening 7 can be increased. In other equivalent embodiments, the panel region 6, the opening 7 or the opening 10 may be designed in any way, such as in terms of shape, size and relative position on the mask, as long as the above-mentioned first embodiment is met.
In the present embodiment, as shown in fig. 9, the first mask plate 2 includes first and second alignment mask stripes 12 and 13. Wherein, both ends of the first alignment mask stripes 12 and both ends of the second alignment mask stripes 13 are provided with alignment holes 14. The first alignment mask strips 12 and the second alignment mask strips 13 are welded and fixed on the mask frame 1 through alignment holes 14, and the middle parts of the first alignment mask strips 12 and the middle parts of the second alignment mask strips 13 are respectively superposed with the side edges and the opposite edges of the second mask plate 3. The above is a kind of alignment method. The plane of the first and second alignment mask stripes 12 and 13 is also the plane of the first mask 2. When other mask strips 11 need to be aligned on the second mask plate 3, the positions of the first alignment mask strip 12 and the second alignment mask strip 13 can be used as reference axes, so that accurate alignment is realized.
Referring to fig. 10, a fourth embodiment of the present invention is:
in a two-stage absorption mask, on the basis of the first or second embodiment, as shown in fig. 10, alignment holes 14 are formed at two ends of one side edge and two ends of the opposite side edge of the second mask 3. The above is another alignment method. The above is another alignment method. The side edge of the second mask plate 3 with the alignment hole 14 is used as a reference axis for alignment, and alignment and fixation of other mask strips 11 on the second mask plate 3 are completed.
Referring to fig. 1, fig. 2, fig. 3 and fig. 11, a fifth embodiment of the present invention is:
a two-section adsorption method for a photomask comprises the steps of sequentially carrying out two-section adsorption on a first mask plate 2 and a second mask plate 3 which are different in magnetism, eliminating the influence of adverse factors such as folds and the like in the film forming process, and ensuring the accuracy of film forming. The invention can be used in the film forming process in OLED vapor deposition, and can also be used in the production process of other panel products with high pixel density.
A two-stage adsorption mask for use in any one of the first to fourth embodiments, comprising:
s1, pushing the magnetic plate 5 to approach the substrate 4 to a first preset position, so that the magnetic plate 5 adsorbs the first mask plate 2 until the first mask plate 2 is attached to the substrate 4 and the second mask plate 3 is not moved;
s2, pushing the magnetic plate 5 to approach the substrate 4 to a second preset position, so that the magnetic plate 5 adsorbs the second mask plate 3 until the second mask plate 3 is attached to the first mask plate 2.
In this embodiment, the first mask 2 is first adsorbed to be attached to the substrate 4, and the corresponding effect is shown in fig. 1 and fig. 2; and then the second mask 3 is adsorbed until it is attached to the first mask 2, and the corresponding effect is shown in fig. 2 and 3. The two-section adsorption of the method eliminates the influence of factors such as self-sagging and attaching pressure on the attaching effect of the original mask plate in the process of attaching the substrate 4, realizes that the metal mask plate can be closely and flatly attached to the substrate 4 in the evaporation process, and ensures the accuracy of film formation.
In this embodiment, step S1 is preceded by:
s0, applying a first preset tension on the first mask plate 2 to perform net stretching;
step S2 is preceded by:
and applying a second preset tension on the second mask plate 3 to perform screen tensioning.
In this embodiment, because first mask plate 2 and second mask plate 3 all have the flagging of different degree, in the adsorption process, in order to guarantee the accuracy nature of filming, according to the difference of first mask and second mask plate 3 self with different first predetermined pulling force and the predetermined pulling force of second, in order to guarantee that the flagging region of mask plate is in adsorbable within range.
In conclusion, the beneficial effects of the invention are as follows: the two-section type adsorption photomask and the adsorption method thereof are provided, the mask plate in the original OLED evaporation process is divided into a first mask plate and a second mask plate which are different in magnetism, so that the size of a formed film on a substrate is jointly determined by the first mask plate and the second mask plate, the second mask plate is welded on a mask frame and keeps the same plane with the mask frame, and two alignment modes are further provided for aligning and fixing the second mask plate. According to the invention, the first mask plate is firstly adsorbed to be attached to the substrate through the magnetic plate, then the second mask plate is adsorbed to be attached to the first mask plate, and proper tension is supplemented in the adsorption process to reduce the original sagging amount of the mask plate, so that the influence of the original mask plate on the attaching effect due to factors such as self sagging and attaching pressure in the substrate attaching process is eliminated, the metal mask plate can be closely and flatly attached to the substrate in the evaporation process, and the film forming accuracy is ensured. And moreover, the grid design is adopted in the panel area of the first mask plate, so that the resolution of the screen is increased. The second mask plate can be used for multiple times, and the practicability is high.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent modifications made by the contents of the present specification and the drawings, or applied to the related technical fields directly or indirectly, are included in the scope of the present invention.

Claims (10)

1. A two-section type adsorption photomask is characterized by comprising a mask frame, a first mask plate, a second mask plate, a substrate and a magnetic plate;
the magnetism of the first mask plate is larger than that of the second mask plate, the second mask plate and the first mask plate are sequentially overlapped and fixed on one surface of the mask frame in a mutually close-fitting manner, the substrate is arranged on one surface of the first mask plate, which is far away from the second mask plate, and the magnetic plate is arranged on one side of the substrate, which is far away from the first mask plate;
the panel region on the first mask plate is the same with opening quantity on the second mask plate and the position one-to-one overlaps, the panel region can completely cover the correspondence the opening just with one the opening takes place to overlap, the magnetic sheet is used for adsorbing in proper order first mask plate with the second mask plate extremely on the base plate.
2. The two-stage adsorption mask of claim 1, wherein the first mask is made of a ferromagnetic material, and the second mask is made of a weakly magnetic material;
the area of the second mask plate is larger than that of the first mask plate.
3. The two-stage adsorption mask of claim 1, wherein the second mask plate has a thickness of [80 μm,120 μm ], and the first mask plate has a thickness of [20 μm,30 μm ].
4. The two-stage adsorption photomask of claim 1, wherein the edge of the second mask plate is provided with a plurality of welding strips, the frame edge of the mask frame is provided with a plurality of welding grooves corresponding to the welding strips in number and position, and the welding strips are welded and fixed with the corresponding welding grooves;
the groove depth of the welding groove is equal to the thickness of the second mask plate, and the width of the welding groove is equal to the size of the welding strip;
the upper surface of the second mask plate close to the first mask plate and the upper surface of the mask frame close to the first mask plate are located at the same horizontal plane.
5. The two-stage adsorption mask according to claim 1, wherein the panel region is a mesh structure formed by arranging more than two openings, and the area of the openings is smaller than that of the openings.
6. The two-stage adsorption mask of claim 4, wherein the first mask comprises two or more mask strips, and all of the panel regions are uniformly distributed on the mask strips.
7. The two-stage adsorption mask of claim 6, wherein the first mask comprises first and second alignment mask strips;
the two ends of the first alignment mask strip and the two ends of the second alignment mask strip are both provided with alignment holes;
the first alignment mask strips and the second alignment mask strips are welded and fixed on the mask frame through the alignment holes, and the middle parts of the first alignment mask strips and the middle parts of the second alignment mask strips are respectively superposed with the side edges and the opposite edges of the second mask plate.
8. The two-stage adsorption mask of claim 6, wherein the second mask has alignment holes at two ends of one side edge and at two ends of the opposite side edge.
9. A two-stage adsorption mask adsorption method applied to the two-stage adsorption mask of any one of claims 1 to 8, comprising the steps of:
s1, pushing the magnetic plate to approach the substrate to a first preset position, so that the magnetic plate adsorbs the first mask plate until the first mask plate is attached to the substrate, and the second mask plate is fixed;
s2, pushing the magnetic plate to approach the substrate to a second preset position, so that the magnetic plate adsorbs the second mask plate until the second mask plate is attached to the first mask plate.
10. The method according to claim 9, further comprising, before the step S1:
s0, applying a first preset tension on the first mask plate to perform net stretching;
the step S2 is preceded by:
and applying a second preset tension on the second mask plate to perform screen tensioning.
CN202110108450.2A 2021-01-27 2021-01-27 Two-stage adsorption photomask and adsorption method thereof Pending CN112838184A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113637940A (en) * 2021-08-30 2021-11-12 重庆翰博显示科技研发中心有限公司 OLED (organic light emitting diode) evaporation mask plate capable of improving evaporation quality and application method thereof
CN114032500A (en) * 2021-11-19 2022-02-11 昆山国显光电有限公司 Mask plate assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113637940A (en) * 2021-08-30 2021-11-12 重庆翰博显示科技研发中心有限公司 OLED (organic light emitting diode) evaporation mask plate capable of improving evaporation quality and application method thereof
CN114032500A (en) * 2021-11-19 2022-02-11 昆山国显光电有限公司 Mask plate assembly

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