CN112823425A - 光电传感器 - Google Patents

光电传感器 Download PDF

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CN112823425A
CN112823425A CN201980066413.0A CN201980066413A CN112823425A CN 112823425 A CN112823425 A CN 112823425A CN 201980066413 A CN201980066413 A CN 201980066413A CN 112823425 A CN112823425 A CN 112823425A
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radiation
semiconductor region
photosensor
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polarization filter
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丹尼尔·里希特
卢卡·海贝尔格尔
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Ams Osram International GmbH
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Abstract

本发明涉及一种光电传感器(1),包括:发射辐射的半导体区域(2);探测辐射的半导体区域(3);第一偏振过滤器(4),其布置在发射辐射的半导体区域(2)之上并具有第一偏振方向(P1);和第二偏振过滤器(5),其布置在探测辐射的半导体区域(3)之上并具有第二偏振方向(P2),其中第一偏振方向和第二偏振方向彼此垂直,并且其中将反射辐射或吸收辐射层(8)设置在发射辐射的半导体区域(2)的和/或探测辐射的半导体区域(3)的和/或第一偏振过滤器(4)的和/或第二偏振过滤器(5)的侧边处。

Description

光电传感器
技术领域
本申请涉及一种光电传感器、特别是用于在便携式设备中测量生命参数的光电传感器。
背景技术
本专利申请要求德国专利申请10 2018 125 050.9的优先权,其公开内容通过引用结合于此。
借助便携式设备、例如运动手表中的光电传感器对生命参数的监视需要具有高灵敏度的特别紧凑的传感器。
发明内容
因此,要实现的目的是提供一种结构紧凑且灵敏度高的光电传感器。
该目的通过根据权利要求1的光电传感器来实现。本发明的有利的设计方案和改进方案是从属权利要求的主题。
根据至少一个设计方案,光电传感器包括发射辐射的半导体区域和探测辐射的半导体区域。发射辐射的半导体区域尤其具有适合于发射辐射的有源层。有源层可以设计为例如pn结、双异质结构、单量子阱结构或多量子阱结构。术语“量子阱结构”包括在其中电荷载流子通过约束(confinement)来获得其能量状态的量化的任何结构。特别是,术语“量子阱结构”不包含有关量化的规模的任何说明。因此,量子阱结构尤其包括量子阱、量子线和量子点以及这些结构的任何组合。
探测辐射的半导体区域尤其具有适合于探测辐射的有源层、例如光电二极管或适合于探测辐射的另外的半导体层序列。
根据至少一个设计方案,光电传感器包括布置在发射辐射的半导体区域之上的第一偏振过滤器和布置在探测辐射的半导体区域之上的第二偏振过滤器。第一偏振过滤器尤其可以直接布置在发射辐射的半导体区域的辐射出射面上。以类似的方式,第二偏振过滤器可以直接布置在探测辐射的半导体区域的辐射入射面上。偏振过滤器例如以层或层序列的形式直接布置在半导体区域上有利地有助于光电传感器的紧凑的结构。
第一偏振过滤器具有第一偏振方向,第二偏振过滤器具有第二偏振方向。第一偏振方向不同于第二偏振方向,特别是第一偏振方向和第二偏振方向彼此垂直。例如,布置在发射辐射的半导体区域之上的第一偏振过滤器产生具有第一偏振方向的线性偏振辐射,并且布置在探测辐射的半导体区域之上的第二偏振过滤器产生具有第二偏振方向的线性偏振辐射,其中,该第二偏振方向垂直于第一偏振方向。换句话说,第一偏振过滤器和第二偏振过滤器形成交叉偏振器。
通过使第一和第二偏振过滤器具有彼此垂直定向的偏振方向有利地实现了由发射辐射的半导体区域发射的辐射从光电传感器以偏振方向射出,在探测辐射的半导体区域之上的第二偏振过滤器对此是基本不可穿透的。
由发射辐射的半导体区域发射的辐射特别是被提供用于测量生命参数的激发光。发出的辐射可能至少部分地被人体的一部分区域、例如组织或血管吸收和/或反射。探测辐射的半导体区域尤其设置用于探测由于激发而由身体区域发射的辐射。探测的辐射尤其可以用于探测一个或多个重要参数、例如血压和/或心率。探测的辐射通常包括较低能量的辐射、即较长波长的辐射。此外,与激发光的强度相比,待探测的辐射通常仅具有非常低的强度。因为由发射辐射的半导体区域产生的激发光由于其偏振方向基本上不被第二偏振过滤器穿过,所以有利地在激发光到达探测辐射的半导体区域之前将其与要探测的身体区域的辐射分开。因此,由发射辐射的半导体区域发射的光仅非常轻微地有助于由探测辐射的半导体区域探测到的信号光。以这种方式有利地实现了光电传感器的高灵敏度。
根据光电传感器的至少一种设计方案,探测辐射的半导体区域在侧面相邻于发射辐射的半导体区域布置。由此,光电传感器的空间需求保持得很小。
根据光电传感器的至少一个设计方案,发射辐射的半导体区域的辐射出射面和探测辐射的半导体区域的辐射入射面彼此平行地布置。发射辐射的半导体区域和探测辐射的半导体区域尤其布置为,使得发射辐射的半导体区域的主发射方向和探测辐射的半导体区域的主入射方向基本上彼此反向平行。
根据光电传感器的至少一个设计方案,发射辐射的半导体区域和探测辐射的半导体区域布置在公共载体上。公共载体例如可以具有用于与发射辐射的半导体区域和探测辐射的半导体区域接触的电触头。
根据光电传感器的至少一个设计方案,发射辐射的半导体区域和探测辐射的半导体区域被单片式集成。“单片式集成”尤其表示发射辐射的半导体区域和探测辐射的半导体区域具有共同的增长衬底。发射辐射的半导体区域和探测辐射的半导体区域尤其可以在共同的增长衬底上外延增长。发射辐射的半导体区域和探测辐射的半导体区域可以至少在局部具有在相同的外延增长过程中制造的半导体层。发射辐射的半导体区域和/或探测辐射的半导体区域尤其可以具有台式结构。因此,半导体层序列的侧向扩展小于例如是增长衬底的载体衬底的侧向扩展。台式结构可以由蚀刻工艺生产,其中半导体层序列被部分去除以将其结构化成期望的形状和尺寸。
根据光电传感器的至少一个设计方案,发射辐射的半导体区域与探测辐射的半导体区域之间的间距不大于150μm。在此,“间距”应理解为发射辐射的半导体区域与探测辐射的半导体区域之间的最短距离、即发射辐射的半导体区域与探测辐射的半导体之间的间隙的宽度。该间距优选为至少20μm,以减少光学串扰。因此,发射辐射的半导体区域与探测辐射的半导体区域之间的间距优选在20μm至150μm之间。
根据光电传感器的至少一个设计方案,反射辐射或吸收辐射层设置在发射辐射的半导体区域和/或探测辐射的半导体区域的侧边处。发射辐射的半导体区域的侧边和探测辐射的半导体区域的侧边都优选地由反射辐射或吸收辐射层覆盖。以这种方式,可以甚至进一步减小发射辐射的半导体区域与探测辐射的半导体区域之间的光学串扰。反射辐射或吸收辐射层优选是介电层或层序列。替代地或附加地,第一偏振过滤器的侧边和/或第二偏振过滤器的侧边可以由反射辐射或吸收辐射层覆盖。
根据光电传感器的至少一个设计方案,第一偏振过滤器和/或第二偏振过滤器是吸收偏振过滤器。在吸收偏振过滤器中,光以穿透偏振方向透射,并且其他偏振方向的光被吸收在偏振过滤器内。在该设计方案中,第一和/或第二偏振过滤器可以具有例如碘硫酸奎宁。
根据光电传感器的至少一个设计方案,第一偏振过滤器和/或第二偏振过滤器是反射偏振过滤器。利用反射偏振过滤器,光以穿透偏振方向透射,并且其他偏振方向的光被反射。在该设计方案中,第一和/或第二偏振过滤器可以例如具有介电层序列。
根据光电传感器的至少一个设计方案,发射辐射的半导体区域和探测辐射的半导体区域在侧向方向上被塑料造型体包围,该塑料造型体例如具有硅树脂或环氧树脂。可以例如通过喷射注塑、压力注塑或模压成型来设置塑料造型体。塑料造型体有利地是不透明的,即特别是对于所发射的辐射是不透明的。该塑料造型体优选包含吸收辐射和/或反射辐射的颗粒。以这种方式,可以进一步减小发射辐射的半导体区域与探测辐射的半导体区域之间的串扰。替代地或附加地,第一偏振过滤器的侧面和/或第二偏振过滤器的侧面可以被塑料造型体覆盖。
根据至少一个设计方案,光电传感器是可表面安装的构件(SMD,表面安装器件)。在该设计方案中,电触头尤其布置在背离辐射出射面和辐射入射面的后侧上,使得该构件可以安装在后侧上,例如安装在电路板上。在这种情况下,光电传感器的前侧有利地没有电引线、例如接合线,从而避免了由电引线对发射的光或待探测的光的吸收。
根据光电传感器的至少一个设计方案,发射辐射的半导体区域适合于发射红外辐射,并且探测辐射的半导体区域适合于探测红外辐射。在该设计方案中,发射辐射的半导体区域和探测辐射的半导体区域例如可以基于砷化物化合物半导体。在本文中,“基于砷化物化合物半导体”表示有源外延层序列或其至少一层包含砷化物化合物半导体材料、优选AlnGamIn1-n-mAs,其中0≤n≤1,0≤m≤1并且n+m≤1。该材料在此不一定必须具有根据上式的数学方面精确的成分。相反,它可以具有一种或多种掺杂材料和其他成分。然而,为简单起见,上式仅包含晶格的基本成分(Al、Ga、In、As),即使这些成分可以被少量的其他物质部分替代。然而,可替代的是,发射辐射的半导体区域和/或探测辐射的半导体区域也可以基于另外的半导体材料,尤其是基于III-V族半导体材料。
光电传感器尤其可以被设置用于测量至少一个生命参数。生命参数是反映人体基本功能的量度。这样的重要参数可以例如是心率或血压或血液中的氧含量。
根据至少一个设计方案,光电传感器是便携式设备、尤其是用于测量生命参数的便携式设备、例如运动手表或健身手环的组成部分。光电传感器的紧凑设计对于将光电传感器集成在这种设备中特别有利。
附图说明
下面结合图1至图6根据实施例更详细地阐述本发明。
附图示出:
图1是根据第一实施例穿过光电传感器的横截面的示意图,
图2示出了根据另一实施例穿过光电传感器的横截面的示意图,
图3示出了根据另一实施例穿过光电传感器的横截面的示意图,
图4示出了在光电传感器的实施例中的辐射路径的示意图,
图5示出了光电传感器中的辐射路径的示意图,该辐射路径具有发射辐射的半导体区域与探测辐射的半导体区域之间的小的间距,以及
图6示出了光电传感器中的辐射路径的示意图,该辐射路径具有发射辐射的半导体区域与探测辐射的半导体区域之间的大的间距。
具体实施方式
在附图中,相同或作用相同的组件具有相同的附图标记。所示的组件与组件之间的尺寸比例不应视为按比例绘制。
在图1中,以横截面示意性地示出了光电传感器的第一实施例。光电传感器1具有发射辐射的半导体区域2和探测辐射的半导体区域3。发射辐射的半导体区域2和探测辐射的半导体区域3分别由半导体层序列形成,在此未示出层序列的各个层。
发射辐射的半导体区域2和探测辐射的半导体区域3例如可以分别具有基于III-V族半导体材料的半导体层序列,例如具有基于砷化物化合物半导体材料的半导体层序列。发射辐射的半导体区域2尤其可以具有发光二极管层序列。探测辐射的半导体区域3例如可以构造为光电二极管。
发射辐射的半导体区域2和探测辐射的半导体区域3布置在公共载体6上。公共载体6可以特别是公共的增长衬底。换句话说,发射辐射的半导体区域2和探测辐射的半导体区域3被单片式集成。发射辐射的半导体区域2和探测辐射的半导体区域3的半导体层序列尤其可以在公共的增长衬底上外延增长。发射辐射的半导体区域2和探测辐射的半导体区域3尤其具有台式结构,该台式结构例如可以通过蚀刻工艺来制造。
可替代地,发射辐射的半导体区域2和探测辐射的半导体区域3也可以是分开制造的半导体芯片,该半导体芯片借助于诸如焊料层的连接层与公共载体6连接。在这种设计方案中,发射辐射的半导体区域2和探测辐射的半导体区域3尤其可以是所谓的薄膜半导体本体。在薄膜半导体本体的制造中,首先在增长衬底上外延增长尤其包括有源层的功能半导体层序列,然后将载体6设置在与半导体层序列相对的半导体层序列的表面上。增长衬底随后被分离。由于尤其用于氮化物化合物半导体的增长衬底、例如SiC、蓝宝石或GaN比较昂贵,因此该方法具有可以重复使用增长衬底的特殊优点。例如,可以使用激光剥离法将由蓝宝石制成的增长基底与由氮化物化合物半导体制成的半导体层序列分离。
公共载体6在后侧具有用于与发射辐射的半导体区域2和探测辐射的半导体区域3电接触的电极7。为了简单起见,在此未详细示出电极7与发射辐射的半导体区域2以及探测辐射的半导体区域3之间的电连接。这些连接例如可以通过穿过载体6的通孔来实现。公共载体6可以例如是硅基底或玻璃基底。
光电传感器1尤其是可表面安装的构件。光电传感器尤其可以借助于布置在载体6的后侧上的电极7安装在电路板上。光电传感器1可以在电极处尤其与控制单元连接,该控制单元设置用于控制光电传感器并评估信号。
在光电传感器1中,第一偏振过滤器4布置在发射辐射的半导体区域2之上。在该实施例中,第一偏振过滤器4是吸收辐射的偏振过滤器,其仅允许发射的辐射中的一个偏振方向P1的辐射通过并且吸收其他偏振方向的辐射。第一偏振过滤器4尤其可以从发射的辐射中产生具有偏振方向P1的线性偏振的辐射。第一偏振方向P1定向为例如平行于绘图平面。
此外,第二偏振过滤器5布置在探测辐射的半导体区域3之上。在该实施例中,第二偏振过滤器5是仅允许第二偏振方向P2的辐射通过并且吸收其他偏振方向的吸收辐射的偏振过滤器。第二偏振过滤器5可以例如具有用于具有偏振方向P2的线性偏振辐射的穿透方向。第二偏振方向P2定向为例如垂直于绘图平面。
第一偏振过滤器4有利地直接布置在发射辐射的半导体区域2上,并且第二偏振过滤器5有利地直接布置在探测辐射的半导体的区域3上。第一偏振过滤器4和第二偏振过滤器5例如可以是偏振晶体薄片,其借助诸如粘合剂以连接层附接至发射辐射的半导体区域2和探测辐射的半导体区域3。第一偏振过滤器4和/或第二偏振过滤器5可以具有例如碘硫酸奎宁。
第二偏振过滤器5的偏振方向P2垂直于第一偏振过滤器4的偏振方向P1。因此,偏振方向P1和P2交叉。以这种方式,有利地实现了由发射辐射的半导体区域2发射的、已经通过第一偏振过滤器4的辐射不穿过探测辐射的半导体区域3之上的偏振过滤器5。探测辐射的半导体区域3以这种方式在很大程度上被屏蔽以免受发射的辐射的影响。换句话说,减少了发射辐射的半导体区域2与探测辐射的半导体区域3之间的串扰。与用于发射的辐射的灵敏度相比,以这种方式有利地提高了探测辐射的半导体区域3对信号辐射的灵敏度,该灵敏度尤其可以是非偏振的。特别地,以此方式提高了探测器信号的信噪比。
发射辐射的半导体区域2和探测辐射的半导体区域3在侧面被塑料造型体9包围。塑料造型体9有利地是不透明的。在该实施例中,塑料造型体9是不透明的塑料造型体,其在侧向方向上包围发射辐射的半导体区域2、第一偏振过滤器4、探测辐射的半导体区域3、第二偏振过滤器5和公共载体6。不透明的塑料造型体9尤其可以具有基质材料,该基质材料中置入反射辐射的或吸收辐射的颗粒。基质材料可以例如是硅树脂或环氧树脂,并且颗粒可以例如是TiO2颗粒。可以例如通过喷射注塑、压力注塑或模压成型施加不透明的塑料造型体9。塑料造型体9一方面用于保护光电传感器1不受外界影响,例如保护其免于机械损坏、污垢或湿气。因为塑料造型体9是不透明的,所以进一步减小了发射辐射的半导体区域2与探测辐射的半导体区域3之间的串扰。
图2示出了光电传感器1的第二实施例。光电传感器1的结构基本上对应于第一实施例的结构。与第一实施例的区别在于,第一偏振过滤器4和第二偏振过滤器5设计为反射偏振过滤器。布置在发射辐射的半导体区域2上的第一偏振过滤器4设计为,使得其以第一偏振方向P1透射所发射的辐射的辐射分量并且将其他辐射分量反射回去。
以类似的方式,布置在探测辐射的半导体区域3上的第二偏振过滤器5也可以设计为反射偏振过滤器。在这种情况下,探测辐射偏振过滤器5被设置为透射具有第二偏振方向P2的入射信号光的辐射分量并反射回其他辐射分量。
第一偏振过滤器4和第二偏振过滤器5可具有偏振层或层序列、特别是介电层序列。特别地,第一偏振过滤器4和第二偏振过滤器5可以是介电干涉层系统。
第一偏振过滤器4和/或第二偏振过滤器5的反射特性具有的优点是可以进行所谓的光循环。这表示,例如进入探测辐射的半导体区域3的辐射可以在反射偏振过滤器5与朝向载体6的、探测辐射的半导体区域3的背面之间反射一次或多次,直到最终在探测辐射的半导体区域3的光敏的有源层中发生吸收为止。因此,这种辐射在一次穿过有源层之后还未被吸收,因此不会消失,但在单次或多次反射后仍可以被吸收,从而有助于探测器信号。
以类似的方式,例如在首先入射到发射辐射的半导体区域2的反射偏振过滤器4上的情况下还未透射的光子能够在发射辐射的半导体区域2中在单次或多次反射之后尽量透射,并因此有助于发射的辐射。
根据图2的第二实施例与第一实施例之间的另一区别是,发射辐射的半导体区域2和探测辐射的半导体区域3的侧面各自具有反射辐射或吸收辐射层8。特别地,可以在发射辐射的半导体区域和探测辐射的半导体区域3的彼此面对的侧面上设置反射辐射或吸收辐射层8。此外,发射辐射的半导体区域2和探测辐射的半导体区域3的彼此背离的侧面也可以被吸收辐射层8覆盖。反射辐射或吸收辐射层8尤其也可以覆盖第一偏振滤光镜4和第二偏振滤光镜5的侧面。反射辐射或吸收辐射层8进一步减小了发射辐射的半导体区域2与探测辐射的半导体区域3之间的串扰。
图3示出了光电传感器1的第三实施例。第三实施例与第一实施例的区别在于,发射辐射的半导体区域2和探测辐射的半导体区域3不具有公共的但分离的载体6。相反,在该实施例中,发射辐射的半导体区域2和探测辐射的半导体区域3分别是单独的半导体芯片的组成部分。然而,在该实施例中,发射辐射的半导体区域2和探测辐射的半导体区域3也彼此相邻地以小的距离布置,优选地以至少20μm且至多150μm的距离布置。两个半导体芯片均在背面具有电极,使得有利地彼此相邻布置的两个半导体芯片均是可表面安装的半导体芯片。
如在前面的示例中那样,发射辐射的半导体区域2和探测辐射的半导体区域3被不透射辐射的塑料造型体9包围。塑料造型体9有利地是如下的塑料造型体,其将两个相邻的半导体芯片彼此连接以形成一体的光电传感器1。特别地,两个相邻的半导体芯片之间的空间可以由塑料造型体9填充。塑料造型体9表示两个半导体芯片之间的连接,此外,塑料造型体9有利地是不透明的,从而减少了发射辐射的半导体区域2与探测辐射的半导体区域3之间的光学干扰。关于其他可能的设计方案和由此产生的优点,第三实施例在其他方面对应于第一实施例。
图4示意性地示出了穿过为在光电传感器1提供的应用时的光电传感器1的横截面。光电传感器1如在第一实施例中那样设计。然而,可替代地,也可以像例如图2或图3中的实施例之一那样设计光电传感器1。在用于运行光电传感器1的方法中,发射辐射的半导体区域2在垂直于光电传感器1的主表面的主发射方向上发射辐射10。发射的辐射10通过第一偏振过滤器4,然后有利地被线性偏振。
所发射的辐射10可以被对象11吸收为激发光,并且在那里激发信号辐射12的发射,该信号辐射的一部分被探测辐射的半导体区域3探测到。在吸收之后重新发射的信号辐射12通常具有比所发射的辐射10更低的能量并因此具有更大的波长。对象11可以例如是人体组织。对象也可以是液态或气态的,例如可以检查汗液或人体排出的气体。
图5示意性地示出了光电传感器1中的辐射路径,该辐射路径在发射辐射的半导体区域和探测辐射的半导体区域之间具有小的间距。尤其如下地实现小的间距,即将发射辐射的半导体区域2和探测辐射的半导体区域3彼此相邻地布置在共同的载体6上,该间距有利地不大于150μm,尤其在20μm至150μm之间发射的辐射10以不同的角度θ入射到对象11上。信号辐射12也以不同的角度θ入射到探测辐射的半导体区域3。在这种情况下,发射光的辐射强度Ie至少近似与角度θ的余弦成正比,其中θ=0°表示主辐射方向,因此Ie(θ)=I0 cosθ。在此,Ie(θ)是相对于主辐射方向的角度θ的情况下的辐射强度,I0是主辐射方向(θ=0°)中的辐射强度。
入射到待检查对象上的辐射能量A1与辐射强度Ie(θ)在辐射入射到对象上的角度θ的积分成比例。由于Ie(θ)=I0 cosθ至少近似适用,因此辐射能量越大,相对于主辐射方向的角度θ越小。
为了比较,图6示意性地示出了在光电传感器1的情况下的辐射路径,该辐射路径在发射辐射的半导体区域2和探测辐射的半导体区域3之间具有更大的间距。在该示例中,更大的间距尤其基于以下情况,即发射辐射的半导体区域2和探测辐射的半导体区域3是分开的半导体芯片,它们在公共载体上不彼此紧邻地直接布置。在这种情况下,相对于主发射方向的角度θ大于图5的示例。因此,入射到待检查的对象上的辐射能量A2小于图5中的示例。由此可见,发射辐射的半导体区域2和探测辐射的半导体区域3在根据图5的公共载体上彼此相邻的布置是更有利的。
本发明不受基于实施例的描述限制。相反,本发明包括每个新特征和特征的每种组合,尤其包括专利权利要求中的特征的每种组合,即使该特征或该组合本身在专利权利要求或实施方式中未明确提出。
参考标号列表
1 光电传感器
2 发射辐射的半导体区域
3 探测辐射的半导体区域
4 第一偏振过滤器
5 第二偏振过滤器
6 载体
7 电极
8 反射辐射或吸收辐射层
9 塑料造型体
10 发射的辐射
11 对象
12 信号辐射
P1 第一极化方向
P2 第二极化方向。

Claims (14)

1.一种光电传感器(1),包括:
-发射辐射的半导体区域(2),
-探测辐射的半导体区域(3),
-第一偏振过滤器(4),所述第一偏振过滤器布置在所述发射辐射的半导体区域(2)之上并且具有第一偏振方向,
-第二偏振过滤器(5),所述第二偏振过滤器布置在所述探测辐射的半导体区域(3)之上并且具有第二偏振方向,其中,所述第一偏振方向和所述第二偏振方向彼此垂直,
其中,反射辐射或吸收辐射层(8)设置在所述发射辐射的半导体区域(2)的和/或所述探测辐射的半导体区域(3)的和/或所述第一偏振过滤器(4)的和/或所述第二偏振过滤器(5)的侧边处。
2.根据权利要求1所述的光电传感器,其中,所述探测辐射的半导体区域(3)在侧面相邻于所述发射辐射的半导体区域(2)布置。
3.根据前述权利要求中任一项所述的光电传感器,其中,所述发射辐射的半导体区域(2)和所述探测辐射的半导体区域(3)布置在公共载体(6)上。
4.根据前述权利要求中任一项所述的光电传感器,其中,所述发射辐射的半导体区域(2)和所述探测辐射的半导体区域(3)被单片式集成。
5.根据前述权利要求中任一项所述的光电传感器,其中,所述发射辐射的半导体区域(2)与所述探测辐射的半导体区域(3)之间的间距小于150μm。
6.根据前述权利要求中任一项所述的光电传感器,其中,所述第一偏振过滤器(4)和/或所述第二偏振过滤器(5)是吸收偏振过滤器。
7.根据前述权利要求中任一项所述的光电传感器,其中,所述第一偏振过滤器(4)和/或所述第二偏振过滤器(5)是反射偏振过滤器。
8.根据前述权利要求中任一项所述的光电传感器,其中,所述发射辐射的半导体区域(2)和所述探测辐射的半导体区域(3)在侧向方向上被塑料造型体(9)包围。
9.根据前述权利要求中任一项所述的光电传感器,其中,所述第一偏振过滤器(4)和/或所述第二偏振过滤器(5)在侧向方向上被塑料造型体(9)包围。
10.根据权利要求8或9所述的光电传感器,其中,所述塑料造型体(9)包含吸收辐射或反射辐射的颗粒。
11.根据前述权利要求中任一项所述的光电传感器,其中,所述光电传感器(1)是能表面安装的构件。
12.根据前述权利要求中任一项所述的光电传感器,其中,所述发射辐射的半导体区域(2)适合于发射红外辐射,并且所述探测辐射的半导体区域(3)适合于探测红外辐射。
13.根据前述权利要求中任一项所述的光电传感器,其中,所述光电传感器(1)设置用于测量至少一个生命参数。
14.根据前述权利要求中任一项所述的光电传感器,其中,所述光电传感器(1)是便携式设备的组成部分。
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