CN112820670A - Edge searching mechanism suitable for wafer of photoetching machine - Google Patents

Edge searching mechanism suitable for wafer of photoetching machine Download PDF

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Publication number
CN112820670A
CN112820670A CN202110144324.2A CN202110144324A CN112820670A CN 112820670 A CN112820670 A CN 112820670A CN 202110144324 A CN202110144324 A CN 202110144324A CN 112820670 A CN112820670 A CN 112820670A
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CN
China
Prior art keywords
wafer
nitrogen
edge
nitrogen gas
nozzle
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Pending
Application number
CN202110144324.2A
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Chinese (zh)
Inventor
钟敏
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Shanghai Lieth Precision Equipment Co ltd
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Shanghai Lieth Precision Equipment Co ltd
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Filing date
Publication date
Application filed by Shanghai Lieth Precision Equipment Co ltd filed Critical Shanghai Lieth Precision Equipment Co ltd
Priority to CN202110144324.2A priority Critical patent/CN112820670A/en
Publication of CN112820670A publication Critical patent/CN112820670A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

The invention discloses an edge searching mechanism suitable for a wafer of a photoetching machine, which relates to the technical field of semiconductors and comprises a bottom plate, a base, a supporting sleeve, a wafer supporting platform, a lifting ring, a wafer limiting mechanism, a first wafer cleaning mechanism, a second wafer cleaning mechanism, a driving mechanism and a wafer detection unit, wherein the base is arranged on the bottom plate, the supporting sleeve is arranged at the upper end of the base, the wafer supporting platform is arranged at the upper end of the supporting sleeve, the first wafer cleaning mechanism is arranged on the wafer supporting platform, the lifting ring is arranged at the outer edge of the supporting sleeve, the plurality of wafer limiting mechanisms are arranged at the outer edge of the lifting ring, the wafer supporting platform is positioned in an area formed among the plurality of wafer limiting mechanisms, the driving mechanism is arranged at the outer edge of the base, the wafer detection unit is arranged on the driving mechanism, and the second wafer. The wafer edge-searching device can realize the positioning and edge-searching operation of wafers with different sizes under the condition that the wafers do not rotate, and can also clean the upper surface and the lower surface of the wafers.

Description

Edge searching mechanism suitable for wafer of photoetching machine
Technical Field
The invention relates to the technical field of semiconductors, in particular to an edge searching mechanism suitable for a wafer of a photoetching machine.
Background
The semiconductor industry often determines the position of a silicon wafer through notches (notch) to realize the opposite sides of the silicon wafer. Notch refers to a Notch intentionally formed in a wafer (wafer).
The existing positioning edge-searching device is generally placed on a vacuum chuck, the wafer is controlled to rotate through the vacuum chuck, the edge-searching purpose is achieved, however, vibration is easily generated in the wafer rotating process, the wafer is damaged, and then when the wafer is transmitted to the positioning edge-searching device, the wafer needs to be subjected to multiple transmission procedures, so that impurities, particles and the like are easily adhered to the surface of the wafer, and the subsequent wafer treatment is influenced.
Disclosure of Invention
The invention aims to provide an edge searching mechanism suitable for a wafer of a photoetching machine, which is used for solving the technical problem.
The technical scheme adopted by the invention is as follows:
an edge searching mechanism suitable for a wafer of a photoetching machine comprises a bottom plate, a base, a supporting sleeve, a wafer supporting platform, a lifting ring, a wafer limiting mechanism, a first wafer cleaning mechanism, a second wafer cleaning mechanism, a driving mechanism and a wafer detection unit, wherein the base is arranged on the bottom plate, the upper end of the base is provided with the supporting sleeve, the upper end of the supporting sleeve is provided with the wafer supporting platform, the first wafer cleaning mechanism is arranged on the wafer supporting platform, the lifting ring is arranged on the outer edge of the supporting sleeve, the outer edge of the lifting ring is provided with a plurality of wafer limiting mechanisms, the wafer supporting platform is positioned in an area formed among the wafer limiting mechanisms, the outer edge of the base is provided with the driving mechanism, the driving mechanism is provided with the wafer detection unit, and one side of the base is provided with the second wafer cleaning mechanism.
Preferably, each wafer limiting mechanism comprises a first telescopic rod and a second telescopic rod, wherein one end of the first telescopic rod is connected with the outer edge of the lifting ring, one end of the second telescopic rod is connected with the other end of the first telescopic rod, the first telescopic rod is perpendicular to the second telescopic rod, and the second telescopic rod is located at the upper end of the first telescopic rod.
Preferably, the wafer detection unit comprises a telescopic arm, a supporting rod and an edge searching sensor, wherein one end of the telescopic arm is connected with the driving mechanism, the supporting rod is connected with the other end of the telescopic arm and perpendicular to the telescopic arm, the edge searching sensor is arranged at the upper end of the supporting rod, and the edge searching sensor is obliquely arranged from top to bottom close to the direction of the wafer supporting platform.
As a further preferred, the inclination angle of the edge-finding sensor is 45 °.
Preferably, the first wafer cleaning mechanism comprises a first nitrogen sprayer and a second nitrogen sprayer, wherein the mounting hole and the mounting groove are formed in the upper surface of the wafer supporting platform, the mounting groove is annular, the mounting groove is formed in the outer edge of the mounting hole, the first nitrogen sprayer is arranged in the mounting hole, and the second nitrogen sprayers are uniformly arranged in the mounting groove.
Preferably, the first nitrogen nozzles are vertically arranged, the plurality of second nitrogen nozzles are obliquely arranged from right to bottom to up in the direction far away from the first nitrogen nozzles, and the inclination angle of each second nitrogen nozzle is 45 degrees.
Preferably, the upper surfaces of the first nitrogen gas showerhead and each of the second nitrogen gas showerheads are flush with the upper surface of the wafer support platform, respectively.
As further preferred, still include the nitrogen gas conveyer pipe, wherein, wafer supporting platform's inside is equipped with nitrogen gas cushion chamber, the nitrogen gas conveyer pipe is located in the support sleeve, just the nitrogen gas conveyer pipe with nitrogen gas cushion chamber intercommunication, the nitrogen gas cushion chamber respectively with first nitrogen gas shower nozzle and a plurality of second nitrogen gas shower nozzle intercommunication.
Preferably, the second wafer cleaning mechanism comprises a nitrogen conveying pipeline and a nozzle mechanism, wherein one end of the nitrogen conveying pipeline is fixedly connected with the bottom plate, the other end of the nitrogen conveying pipeline extends to the upper side of the wafer supporting platform, and the nozzle mechanism is installed at the other end of the nitrogen conveying pipeline.
As a further preferred option, the nozzle mechanism includes a first nitrogen nozzle and a second nitrogen nozzle, wherein the first nitrogen nozzle is disposed in the middle of the nozzle mechanism, and the outer edge of the first nitrogen nozzle is provided with a plurality of second nitrogen nozzles, wherein the first nitrogen nozzle is opposite to the first nitrogen nozzle, and each of the second nitrogen nozzles is opposite to one of the second nitrogen nozzles.
The technical scheme has the following advantages or beneficial effects:
according to the invention, the positioning and edge searching operations of the wafers with different sizes can be realized under the condition that the wafers do not rotate, and the upper and lower surfaces of the wafers can be cleaned, so that impurity particles and the like can be prevented from being adhered to the surfaces of the wafers, and the adverse effect on the subsequent treatment of the wafers can be prevented.
Drawings
FIG. 1 is a schematic structural diagram of an edge finding mechanism for a wafer of a lithography machine according to the present invention;
FIG. 2 is a top view of the wafer support platform of the present invention.
In the figure: 1. a base plate; 2. a base; 3. a support sleeve; 4. a wafer support platform; 41. mounting holes; 42. mounting grooves; 5. a lifting ring; 6. a wafer limiting mechanism; 61. a first telescopic rod; 62. a second telescopic rod; 7. a first wafer cleaning mechanism; 71. a first nitrogen gas showerhead; 72. a second nitrogen gas shower nozzle; 8. a second wafer cleaning mechanism; 81. a nitrogen gas delivery pipe; 82. a nozzle mechanism; 83. a first nitrogen gas nozzle; 84. a second nitrogen nozzle; 9. a drive mechanism; 10. a wafer detection unit; 101. a telescopic arm; 102. a strut; 103. an edge-searching sensor.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, their indicated orientations or positional relationships are based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" as appearing herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
FIG. 1 is a schematic structural diagram of an edge finding mechanism for a wafer of a lithography machine according to the present invention; fig. 2 is a top view of a wafer supporting platform according to the present invention, please refer to fig. 1 to 2, which illustrate a preferred embodiment of an edge finding mechanism for a wafer of a lithography machine, comprising a bottom plate 1, a base 2, a supporting sleeve 3, a wafer supporting platform 4, a lifting ring 5, a wafer limiting mechanism 6, a first wafer cleaning mechanism 7, a second wafer cleaning mechanism 8, a driving mechanism 9, and a wafer detecting unit 10, wherein the base 2 is disposed on the bottom plate 1, the supporting sleeve 3 is disposed at an upper end of the base 2, the wafer supporting platform 4 is disposed at an upper end of the supporting sleeve 3, the first wafer cleaning mechanism 7 is disposed on the wafer supporting platform 4, the lifting ring 5 is disposed at an outer edge of the supporting sleeve 3, the wafer limiting mechanisms 6 are disposed at an outer edge of the lifting ring 5, the wafer supporting platform 4 is disposed in an area formed between the wafer limiting mechanisms 6, the driving mechanism 9 is disposed at an outer edge of the base 2, the driving mechanism 9 is provided with a wafer detection unit 10, and one side of the base 2 is provided with a second wafer cleaning mechanism 8. In this embodiment, the wafer supporting platform 4 is used for placing a wafer, wherein the wafer limiting mechanism 6 is used for fixing the wafer on the wafer supporting platform 4, so as to prevent the wafer from separating from the wafer supporting platform 4. The first wafer cleaning mechanism 7 is used for cleaning the back face of the wafer, the second wafer cleaning mechanism 8 is used for cleaning the front face of the wafer, the first wafer cleaning mechanism 7 and the second wafer cleaning mechanism 8 work simultaneously, nitrogen is sprayed to the front face and the back face of the wafer, and the wafer can be always in a suspension state. The driving mechanism 9 is used for driving the wafer detection unit 10 to rotate around the area formed among the plurality of wafer limiting mechanisms 6, so as to realize edge searching operation. In this embodiment, a corner defect is formed on the wafer, and the wafer inspection unit 10 is used to inspect the corner defect.
Further, as a preferred embodiment, each wafer limiting mechanism 6 includes a first telescopic rod 61 and a second telescopic rod 62, wherein one end of the first telescopic rod 61 is connected to the outer edge of the lifting ring 5, one end of the second telescopic rod 62 is connected to the other end of the first telescopic rod 61, the first telescopic rod 61 is perpendicular to the second telescopic rod 62, and the second telescopic rod 62 is located at the upper end of the first telescopic rod 61. In this embodiment, as shown in fig. 1, the first telescopic rod 61 and the second telescopic rod 62 can be extended and contracted to accommodate wafers with different sizes. The lifting ring 5 may be driven by an external driving device such that the lifting ring 5 may move in the axial direction of the support sleeve 3 for adjusting the height of the wafer stopper mechanism 6.
Further, as a preferred embodiment, the wafer detecting unit 10 includes a telescopic arm 101, a supporting rod 102 and an edge-searching sensor 103, wherein one end of the telescopic arm 101 is connected to the driving mechanism 9, the supporting rod 102 is connected to the other end of the telescopic arm 101 and perpendicular to the telescopic arm 101, the edge-searching sensor 103 is disposed at the upper end of the supporting rod 102, and the edge-searching sensor 103 is disposed in an inclined manner from top to bottom toward the wafer supporting platform 4. In this embodiment, the edge-finding sensor 103 is used for finding an edge of the wafer to detect a position of a corner defect on the wafer.
Further, as a preferred embodiment, the inclination angle of the edge-finding sensor 103 is 45 °.
Further, as a preferred embodiment, the first wafer cleaning mechanism 7 includes a first nitrogen showerhead 71 and a second nitrogen showerhead 72, wherein the upper surface of the wafer supporting platform 4 is provided with a mounting hole 41 and a mounting groove 42, wherein the mounting groove 42 is annular, the mounting groove 42 is disposed at the outer edge of the mounting hole 41, the first nitrogen showerhead 71 is disposed in the mounting hole 41, and the plurality of second nitrogen showers 72 are uniformly disposed in the mounting groove 42.
Further, as a preferred embodiment, the first nitrogen gas nozzle 71 is vertically disposed, the plurality of second nitrogen gas nozzles 72 are disposed in an inclined manner from the right to the top in a direction away from the first nitrogen gas nozzle 71, and the inclination angle of each second nitrogen gas nozzle 72 is 45 °. In this embodiment, the first nitrogen nozzle 71 vertically sprays nitrogen upward, the nitrogen is sprayed to the middle of the back surface of the wafer and diffused to the outer edge of the wafer, and the first nitrogen nozzle and the second nitrogen nozzle 72 cooperate to completely remove the impurity particles on the back surface of the wafer.
Further, as a preferred embodiment, the upper surfaces of the first nitrogen showerhead 71 and each of the second nitrogen showerheads 72 are flush with the upper surface of the wafer support platform 4, respectively.
Further, as a preferred embodiment, the wafer support platform further includes a nitrogen gas delivery pipe, wherein a nitrogen gas buffer chamber is disposed inside the wafer support platform 4, the nitrogen gas delivery pipe is disposed inside the support sleeve 3, and the nitrogen gas delivery pipe is communicated with the nitrogen gas buffer chamber, and the nitrogen gas buffer chamber is respectively communicated with the first nitrogen gas showerhead 71 and the plurality of second nitrogen gas showerheads 72. In this embodiment, the nitrogen delivery pipe is used to connect to an external nitrogen storage device, and is used to provide nitrogen with a constant pressure in the nitrogen buffer cavity.
Further, as a preferred embodiment, the second wafer cleaning mechanism 8 includes a nitrogen gas delivery pipe 81 and a nozzle mechanism 82, wherein one end of the nitrogen gas delivery pipe 81 is fixedly connected to the bottom plate 1, the other end of the nitrogen gas delivery pipe 81 extends to the upper side of the wafer supporting platform 4, and the nozzle mechanism 82 is installed at the other end of the nitrogen gas delivery pipe 81. As shown in fig. 1, a fixing seat is further disposed at one end of the nitrogen gas delivery pipe 81 for fixing the nitrogen gas delivery pipe 81.
Further, as a preferred embodiment, the nozzle mechanism 82 includes a first nitrogen nozzle 83 and a second nitrogen nozzle 84, wherein the first nitrogen nozzle 83 is disposed at the middle of the nozzle mechanism 82, and a plurality of second nitrogen nozzles 84 are disposed at the outer edge of the first nitrogen nozzle 83, wherein the first nitrogen nozzle 83 faces the first nitrogen nozzle 71, and each of the second nitrogen nozzles 84 faces a second nitrogen nozzle 72. In this embodiment, the nitrogen gas sprayed from the first nitrogen gas nozzle 83 and the second nitrogen gas nozzle 84 acts on the front surface of the wafer, so that the impurity particles on the front surface of the wafer can be removed, and the first nitrogen gas nozzle 83, the second nitrogen gas nozzle 84, the first nitrogen gas showerhead 71, and the second nitrogen gas showerhead 72 are matched with each other, so that the wafer can be in a floating state. Wherein the injection air pressure of the first nitrogen gas nozzle 83 and the second nitrogen gas nozzle 84 is smaller than the injection air pressure of the first nitrogen gas shower head 71 and the second nitrogen gas shower head 72.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.

Claims (10)

1. The edge searching mechanism suitable for the wafer of the photoetching machine is characterized by comprising a bottom plate, a base, a supporting sleeve, a wafer supporting platform, a lifting ring, a wafer limiting mechanism, a first wafer cleaning mechanism, a second wafer cleaning mechanism, a driving mechanism and a wafer detection unit, wherein the base is arranged on the bottom plate, the supporting sleeve is arranged at the upper end of the base, the wafer supporting platform is arranged at the upper end of the supporting sleeve, the first wafer cleaning mechanism is arranged on the wafer supporting platform, the lifting ring is arranged at the outer edge of the supporting sleeve, the wafer limiting mechanisms are arranged at the outer edge of the lifting ring, the wafer supporting platform is positioned in an area formed between the wafer limiting mechanisms, the driving mechanism is arranged at the outer edge of the base, and the wafer detection unit is arranged on the driving mechanism, and one side of the base is provided with the second wafer cleaning mechanism.
2. The edge finder mechanism as claimed in claim 1, wherein each wafer position limiting mechanism comprises a first telescopic rod and a second telescopic rod, wherein one end of the first telescopic rod is connected to the outer edge of the lifting ring, one end of the second telescopic rod is connected to the other end of the first telescopic rod, the first telescopic rod is perpendicular to the second telescopic rod, and the second telescopic rod is located at the upper end of the first telescopic rod.
3. The edge-searching mechanism for a wafer of a lithography machine as claimed in claim 1, wherein the wafer detecting unit comprises a telescopic arm, a supporting rod and an edge-searching sensor, wherein one end of the telescopic arm is connected to the driving mechanism, the supporting rod is connected to the other end of the telescopic arm and perpendicular to the telescopic arm, the edge-searching sensor is disposed at the upper end of the supporting rod, and the edge-searching sensor is disposed in an inclined manner from top to bottom towards the direction close to the wafer supporting platform.
4. An edge-seeking mechanism for a wafer of a lithography machine according to claim 3, wherein the angle of inclination of said edge-seeking sensor is 45 °.
5. The edge finder mechanism as claimed in claim 1, wherein the first wafer cleaning mechanism comprises a first nitrogen nozzle and a second nitrogen nozzle, wherein the wafer supporting platform has a mounting hole and a mounting groove formed on an upper surface thereof, the mounting groove is annular and is formed on an outer edge of the mounting hole, the first nitrogen nozzle is formed in the mounting hole, and the second nitrogen nozzles are uniformly formed in the mounting groove.
6. The edge finder mechanism as claimed in claim 5, wherein the first nitrogen showerhead is vertically disposed, the plurality of second nitrogen showerheads are disposed to be inclined from the bottom right to the top in a direction away from the first nitrogen showerhead, and each of the second nitrogen showerheads is inclined at an angle of 45 °.
7. The edge finder mechanism for lithography wafers of claim 6, wherein the upper surface of each of said first and second nitrogen showerheads is flush with the upper surface of said wafer support platform.
8. The edge finding mechanism for a wafer of a lithography machine as claimed in claim 5, further comprising a nitrogen gas delivery pipe, wherein a nitrogen gas buffer chamber is disposed inside the wafer supporting platform, the nitrogen gas delivery pipe is disposed inside the supporting sleeve, the nitrogen gas delivery pipe is communicated with the nitrogen gas buffer chamber, and the nitrogen gas buffer chamber is respectively communicated with the first nitrogen gas nozzle and the plurality of second nitrogen gas nozzles.
9. The edge finder mechanism as claimed in claim 1, wherein the second wafer cleaning mechanism comprises a nitrogen gas delivery pipe and a showerhead mechanism, wherein one end of the nitrogen gas delivery pipe is fixedly connected to the base plate, the other end of the nitrogen gas delivery pipe extends to the upper side of the wafer support platform, and the showerhead mechanism is mounted at the other end of the nitrogen gas delivery pipe.
10. The edge finder mechanism as claimed in claim 9, wherein the showerhead mechanism comprises a first nitrogen nozzle and a second nitrogen nozzle, wherein the first nitrogen nozzle is disposed at a middle portion of the showerhead mechanism, and a plurality of the second nitrogen nozzles are disposed at an outer edge of the first nitrogen nozzle, wherein the first nitrogen nozzle faces the first nitrogen nozzle, and each of the second nitrogen nozzles faces one of the second nitrogen nozzles.
CN202110144324.2A 2021-02-02 2021-02-02 Edge searching mechanism suitable for wafer of photoetching machine Pending CN112820670A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110144324.2A CN112820670A (en) 2021-02-02 2021-02-02 Edge searching mechanism suitable for wafer of photoetching machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110144324.2A CN112820670A (en) 2021-02-02 2021-02-02 Edge searching mechanism suitable for wafer of photoetching machine

Publications (1)

Publication Number Publication Date
CN112820670A true CN112820670A (en) 2021-05-18

Family

ID=75860570

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110144324.2A Pending CN112820670A (en) 2021-02-02 2021-02-02 Edge searching mechanism suitable for wafer of photoetching machine

Country Status (1)

Country Link
CN (1) CN112820670A (en)

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