CN112786573A - 交流电固态开关 - Google Patents

交流电固态开关 Download PDF

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Publication number
CN112786573A
CN112786573A CN202011222926.7A CN202011222926A CN112786573A CN 112786573 A CN112786573 A CN 112786573A CN 202011222926 A CN202011222926 A CN 202011222926A CN 112786573 A CN112786573 A CN 112786573A
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state switch
electronic solid
semiconductor dies
solid state
electrically
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R·普拉萨德
C·S·纳穆杜里
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GM Global Technology Operations LLC
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GM Global Technology Operations LLC
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
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    • H02M5/00—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases
    • H02M5/02—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc
    • H02M5/04—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters
    • H02M5/22—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M5/275—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M5/293—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
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Abstract

一种AC电子固态开关包括：电绝缘和导热层；第一导电迹线；第二导电迹线；以及多个半导体管芯，每个半导体管芯电连接到第一导电迹线和第二导电迹线。所述多个半导体管芯中的每个形成MOSFET、IGBT或其他类型的电子可控开关。AC电子固态开关还包括公共漏极导体，该公共漏极导体电连接到所述多个半导体管芯的每个漏极端子。AC电子固态开关被构造成在断开状态下沿第一方向和第二方向在650伏特与1700伏特之间阻断，该第二方向与第一方向相反，并且AC电子固态开关被构造成在导通状态下连续地承载至少500 A，其中压降小于2 V。

Description

交流电固态开关
技术领域
引言
本公开涉及电部件，且更具体地涉及交流电（AC）电子固态开关和组件。
背景技术
现有的高压、大电流机电继电器笨重（即，具有大于0.5 kg的质量），具有慢的切换速度（即，切换速度大于10 ms），并且由于触头弹跳而易于在大电流切换期间接触焊接。进一步地，现有的机电继电器在切换期间产生客户讨厌的可听见的噪声。因此，需要开发一种重量轻、具有快的切换速度并且可靠的开关。进一步地，对于容错和/或双重目的的应用，沿两个方向有效地控制对于一些固态开关可能是有用的。例如，为了在充电和放电两种模式中有效地控制可重构存储（storage），具有低压降的双向可控固态开关是有用的。
发明内容
目前公开的AC电子固态开关能够在断开状态期间至少在650伏特与1700伏特之间双向地阻断。进一步地，AC电子固态开关在导通状态期间连续地承载至少500安培的直流电，其中压降小于2伏特。此外，AC电子固态开关具有等于或小于300克的质量。AC电子固态开关具有在65毫米与70毫米之间的最大宽度、在85毫米与95毫米之间的最大长度、以及25毫米的最大高度，由此使开关组件的尺寸最小化。
在本公开的方面中，AC电子固态开关可包括：基板；电绝缘和导热层，其安置在基板上；第一导电迹线，其安置在电绝缘和导热层上；第二导电迹线，其安置在电绝缘和导热层上；以及多个半导体管芯，每个半导体管芯电连接到第一导电迹线和第二导电迹线。所述多个半导体管芯中的每个形成MOSFET、IGBT或其他类型的电子可控开关。电子可控开关（例如，MOSFET）包括栅极端子、漏极端子和源极端子。AC电子固态开关还包括公共漏极导体，该公共漏极导体电连接到所述多个半导体管芯的每个漏极端子。所述多个半导体管芯中的每个安置在公共漏极导体上。AC电子固态开关具有导通状态和断开状态，其中，AC电子固态开关被构造成在断开状态下沿第一方向和第二方向在650伏特与1700伏特之间阻断，该第二方向与第一方向相反，并且AC电子固态开关被构造成在导通状态下连续地承载至少500 A，其中压降小于2 V。
所述多个半导体管芯的每个漏极端子可直接连接到公共漏极导体。公共漏极导体可以是唯一的漏极导体。所述多个半导体管芯中的每个可与公共漏极导体直接接触。半导体管芯可彼此并联电连接。
AC电子固态开关还可包括多个信号导体。信号导体可电连接到半导体管芯。信号导体可包括多个栅极导体和多个源极导体。
AC电子固态开关还包括多个电结合件。电结合件包括线结合件和带结合件。所述多个半导体管芯的每个源极端子可电连接到所述多个源极导体。带结合件可将所述多个半导体管芯电连接到所述源极导体。
半导体管芯的每个栅极端子可电连接到所述多个栅极导体。线结合件可将半导体管芯电连接到所述多个栅极导体。半导体管芯中的每个具有20平方毫米的最小面积。基板的厚度可在2毫米与3毫米之间，并且基板包括铜。半导体管芯包括在8个与24个之间的半导体管芯，每个半导体管芯所具有的电压额定值在650 V与1700 V之间。每个半导体管芯的比导通电阻小于4.5 mΩ-cm2。AC电子固态开关的质量可小于300克。
在本公开的方面中，AC电子固态开关可包括：基板；电绝缘和导热层，其安置在基板上；以及第一导电迹线，其安置在电绝缘和导热层上。第一导电迹线是第一漏极导体。AC电子固态开关还包括第二导电迹线，该第二导电迹线安置在电绝缘和导热层上。第二导电迹线是第二漏极导体。AC电子固态开关还包括多个半导体管芯，每个半导体管芯电连接到第一导电迹线和第二导电迹线。半导体管芯中的每个形成MOSFET，并且MOSFET包括栅极端子、漏极端子和源极端子。半导体管芯包括第一组半导体管芯和第二组半导体管芯。第一组半导体管芯安置在第一导电迹线上。第二组半导体管芯安置在第二导电迹线上。AC电子固态开关可包括公共源极导体，该公共源极导体电连接到所述多个半导体管芯的每个源极端子。半导体管芯中的每个安置在公共源极导体上。AC电子固态开关具有导通状态和断开状态。AC电子固态开关被构造成在断开状态下沿第一方向和第二方向在650伏特与1700伏特之间阻断。该第二方向与第一方向相反，并且AC电子固态开关被构造成在导通状态下连续地承载至少500 A，其中压降小于2 V。
半导体管芯的每个源极端子可直接连接到公共源极导体。公共源极导体可以是唯一的源极导体。第一组半导体管芯中的每个可与第一导电迹线直接接触。第二组半导体管芯中的每个可与第二导电迹线直接接触。所述多个半导体管芯中的每个可彼此并联电连接。
AC电子固态开关还包括多个信号导体。所述多个信号导体中的每个可电连接到所述多个半导体管芯。信号导体可包括多个栅极导体。AC电子固态开关还可包括多个电结合件。电结合件可包括线结合件和带结合件。半导体管芯的每个源极端子可电连接到公共源极导体。带结合件可将所述多个半导体管芯电连接到公共源极导体。所述多个半导体管芯的每个栅极端子可电连接到所述多个栅极导体。线结合件可将所述多个半导体管芯电连接到所述多个栅极导体。所述多个半导体管芯中的每个可具有20平方毫米的最小面积。基板的厚度可在2毫米与3毫米之间，并且基板可包括铜、铝、钼或其合金或者金属基体复合材料（诸如，AlSiC）。
AC电子固态开关可包括在8个与24个之间的半导体管芯，每个半导体管芯所具有的电压额定值在650 V与1700 V之间。每个半导体管芯的比导通电阻小于4.5 mΩ-cm2。AC电子固态开关的质量小于300克。
方案1. 一种交流电（AC）电子固态开关，所述电子固态开关包括：
电绝缘和导热层；
第一导电迹线，所述第一导电迹线安置在所述电绝缘和导热层上；
第二导电迹线，所述第二导电迹线安置在所述电绝缘和导热层上；
多个半导体管芯，每个半导体管芯电连接到所述第一导电迹线和所述第二导电迹线，其中，所述多个半导体管芯中的每个形成MOSFET，并且所述MOSFET包括栅极端子、漏极端子和源极端子；
公共漏极导体，所述公共漏极导体电连接到所述多个半导体管芯的每个漏极端子，其中，所述多个半导体管芯中的每个安置在所述公共漏极导体上；并且
其中，所述AC电子固态开关具有导通状态和断开状态，其中，所述AC电子固态开关被构造成在所述断开状态下沿第一方向和第二方向在650伏特与1700伏特之间阻断，所述第二方向与所述第一方向相反，并且所述AC电子固态开关被构造成在所述导通状态下连续地承载至少500 A，其中压降小于2 V。
方案2. 根据方案1所述的AC电子固态开关，所述AC电子固态开关还包括基板，其中，所述电绝缘和导热层安置在所述基板上，所述多个半导体管芯的每个漏极端子直接连接到所述公共漏极导体，其中，所述公共漏极导体是唯一的漏极导体，所述多个半导体管芯中的每个与所述公共漏极导体直接接触，并且所述多个半导体管芯彼此并联电连接。
方案3. 根据方案2所述的AC电子固态开关，所述AC电子固态开关还包括多个信号导体，其中，所述多个信号导体电连接到所述多个半导体管芯，并且所述多个信号导体包括多个栅极导体和多个源极导体。
方案4. 根据方案3所述的AC电子固态开关，所述AC电子固态开关还包括多个电结合件，所述多个电结合件包括线结合件和带结合件，其中，所述多个半导体管芯的每个源极端子电连接到所述多个源极导体，并且所述带结合件将所述多个半导体管芯电连接到所述多个源极导体。
方案5. 根据方案4所述的AC电子固态开关，其中，所述多个半导体管芯的每个栅极端子电连接到所述多个栅极导体，并且所述线结合件将所述多个半导体管芯电连接到所述多个栅极导体。
方案6. 根据方案5所述的AC电子固态开关，其中，所述多个半导体管芯中的每个具有20平方毫米的最小面积。
方案7. 根据方案6所述的AC电子固态开关，其中，所述基板的厚度在2毫米与3毫米之间，并且所述基板包括铜。
方案8. 根据方案7所述的AC电子固态开关，其中，所述多个半导体管芯包括在8个与24个之间的半导体管芯，每个半导体管芯具有在650 V与1700 V之间的电压额定值。
方案9. 根据方案8所述的AC电子固态开关，其中，每个半导体管芯的比导通电阻小于4.5 mΩ-cm2。
方案10. 根据方案9所述的AC电子固态开关，其中，所述AC电子固态开关的质量小于300克。
方案11. 一种交流电（AC）电子固态开关，所述交流电电子固态开关包括：
电绝缘和导热层；
第一导电迹线，所述第一导电迹线安置在所述电绝缘和导热层上，其中，所述第一导电迹线是第一漏极导体；
第二导电迹线，所述第二导电迹线安置在所述电绝缘和导热层上，其中，所述第二导电迹线是第二漏极导体；
多个半导体管芯，每个半导体管芯电连接到所述第一导电迹线和所述第二导电迹线，其中，所述多个半导体管芯中的每个形成电子可控开关，所述多个半导体管芯包括第一组半导体管芯和第二组半导体管芯，所述第一组半导体管芯安置在所述第一导电迹线上，并且所述第二组半导体管芯安置在所述第二导电迹线上；
公共源极导体，所述公共源极导体电连接到所述多个半导体管芯的每个源极端子，其中，所述多个半导体管芯中的每个安置在所述公共源极导体上；并且
其中，所述AC电子固态开关具有导通状态和断开状态，其中，所述AC电子固态开关被构造成在所述断开状态下沿第一方向和第二方向在650伏特与1700伏特之间阻断，所述第二方向与所述第一方向相反，并且所述AC电子固态开关被构造成在所述导通状态下连续地承载至少500 A，其中压降小于2 V。
方案12. 根据方案11所述的AC电子固态开关，所述AC电子固态开关还包括基板，其中，所述电绝缘和导热层安置在所述基板上，所述多个半导体管芯的每个源极端子直接连接到所述公共源极导体，其中，所述公共源极导体是唯一的源极导体，所述第一组半导体管芯中的每个与所述第一导电迹线直接接触，所述第二组半导体管芯中的每个与所述第二导电迹线直接接触，并且所述多个半导体管芯中的每个彼此并联电连接，所述电子可控开关至少选自MOSFET和IGBT，并且所述MOSFET包括栅极端子、漏极端子和源极端子。
方案13. 根据方案12所述的AC电子固态开关，所述AC电子固态开关还包括多个信号导体，其中，所述多个信号导体中的每个电连接到所述多个半导体管芯，并且所述多个信号导体包括多个栅极导体。
方案14. 根据方案13所述的AC电子固态开关，所述AC电子固态开关还包括多个电结合件，其中，所述多个电结合件包括线结合件和带结合件，所述多个半导体管芯的每个源极端子电连接到所述公共源极导体，并且所述带结合件将所述多个半导体管芯电连接到所述公共源极导体。
方案15. 根据方案14所述的AC电子固态开关，其中，所述多个半导体管芯的每个栅极端子电连接到所述多个栅极导体，并且所述线结合件将所述多个半导体管芯电连接到所述多个栅极导体。
方案16. 根据方案15所述的AC电子固态开关，其中，所述多个半导体管芯中的每个具有20平方毫米的最小面积。
方案17. 根据方案16所述的AC电子固态开关，其中，所述基板的厚度在2毫米与3毫米之间，并且所述基板包括选自以下各者中的至少一者：铜、铝、钼、其合金、以及金属基体复合材料。
方案18. 根据方案17所述的AC电子固态开关，其中，所述多个半导体管芯包括在8个与24个之间的半导体管芯，每个半导体管芯具有在650 V与1700 V之间的电压额定值。
方案19. 根据方案18所述的AC电子固态开关，其中，每个半导体管芯的比导通电阻小于4.5 mΩ-cm2。
方案20. 根据方案19所述的AC电子固态开关，其中，所述AC电子固态开关的质量小于300克。
当结合附图理解时，本教导的以上特征和优点以及其他特征和优点容易从如所附权利要求中所限定的用于实施本教导的最佳模式和其他实施例中的一些的以下详细描述显而易见。
附图说明
图1是具有公共漏极导体的AC电子固态开关的示意性电路图。
图2是图1的AC电子固态开关的示意性俯视图。
图3是根据本公开的另一方面的具有公共漏极导体的AC电子固态开关的示意性俯视图。
图4是图1的AC电子固态开关的半导体管芯的示意性前视图。
图5是具有公共源极导体的AC电子固态开关的示意性电路图。
图6是图4的AC电子固态开关的示意性俯视图。
图7是根据本公开的另一方面的具有公共漏极导体的AC电子固态开关的示意性俯视图。
具体实施方式
以下详细描述本质上仅仅是示例性的，且并不旨在限制应用和用途。此外，不旨在受前面引言、概述或以下详细描述中呈现的明示或暗示的理论的束缚。
本公开的实施例可在本文中按照功能和/或逻辑块部件和各种处理步骤进行描述。应了解的是，这样的块部件可由被构造成执行指定功能的许多硬件、软件和/或固件部件实现。例如，本公开的实施例可采用各种集成电路部件，例如，存储器元件、数字信号处理元件、逻辑元件、查找表等，这些集成电路部件可在一个或多个微处理器或其他控制装置的控制下实施多种功能。另外，本领域技术人员将了解，可结合许多系统来实践本公开的实施例，并且本文中描述的系统仅仅是本公开的示例性实施例。
为了简洁起见，与信号处理、数据融合、信令、控制和系统（以及系统的各个操作部件）的其他功能方面有关的技术在本文中可不进行详细描述。此外，本文中包含的各种附图中所示的连接线旨在表示各种元件之间的示例功能关系和/或物理性联接。应注意，在本公开的实施例中可存在替代性或附加的功能关系或物理性连接。
参考图1和图2，AC电子固态开关102具有断开状态和导通状态，并且可以是开关组件的一部分。开关组件可附加地包括用于容纳和封装AC电子固态开关102和保持硬件的聚合物罩壳。由于如下文描述的其构型，AC电子固态开关102能够在断开状态期间在650伏特与1700伏特之间双向地阻断（如由双箭头DA指示）。双箭头指示第一方向A1以及与第一方向A2相反的第二方向A1。由于如下文描述的其构型，AC电子固态开关在导通状态期间连续地承载至少500安培的直流电，其中压降小于2伏特。由于如下文描述的其构型，AC电子固态开关102具有等于或小于300克的质量。由于如下文描述的其构型，开关组件（及因此AC电子固态开关102）具有在65毫米与70毫米之间的最大宽度、在85毫米与95毫米之间的最大长度、以及25毫米的最大高度，由此使开关组件的尺寸最小化。
AC电子固态开关102包括基板106，该基板在基板106的相对侧上具有安装孔。基板106的最大厚度可在2毫米与3毫米之间，以使AC电子固态开关102的整体尺寸最小化。进一步地，基板106具有基本为平面状的形状（及因此平坦的构型）以使AC电子固态开关102的整体尺寸最小化。另外，基板106可全部或部分地由导电材料（诸如，金属）制成。例如，基板106可全部或部分地由铜制成，并且可安装到散热器。基板106可最佳地具有钉状翅片（pin-fin）。基板106可包括用于安装到另一结构的孔107。
AC电子固态开关102包括安置在基板106上（尽管不是直接在其上）的电绝缘和导热层108。电绝缘和导热层108可全部地或部分地由陶瓷材料制成。用于电绝缘和导热层108的合适的陶瓷材料包括但不限于氧化铝（Al2O3）、氮化铝（AlN）、碳化硅铝（AlSiC）、氮化硅（Si3N4）、金刚石、氧化镓等等。电绝缘和导热层108可以是直接结合的衬底的一部分，诸如直接结合铝（DBA）衬底或直接结合铜（DBC）衬底，并且其厚度可在0.1毫米与0.4毫米之间。除了电绝缘和导热层108之外，定向结合衬底还包括结合到电绝缘和导热层108的金属片材。
焊料层可安置在基板106与电绝缘和导热层108之间，以将基板106联接到电绝缘和导热层108。术语“焊料”意指用于联结不太易熔的金属的低熔点合金，尤其是基于铅和锡或（对于较高温度）基于黄铜或银的低熔点合金。焊料层可直接安置在基板106上，以有利于和增强焊料层与基板106之间的连接。基板106、电绝缘和导热层108、以及焊料层中的每者可具有平面状的形状以使通过AC电子固态开关102联接的尺寸最小化。
AC电子固态开关102还包括直接安置在电绝缘和导热层108上的第一导电迹线116，以使由AC电子固态开关102所占据的尺寸最小化。第一导电迹线116直接安置在电绝缘和导热层108上（且直接结合到其）以增强AC电子固态开关102的结构完整性。第一导电迹线116具有平面状的形状以使其尺寸最小化，并且直接连接到第一功率端子132a。进一步地，第一导电迹线116全部地或部分地由金属材料（诸如，铜、铝和/或其合金）制成。
AC电子固态开关102还包括直接安置在电绝缘和导热层108上的第二导电迹线118，以使由AC电子固态开关102所占据的空间最小化。例如，第二导电迹线118直接安置在电绝缘和导热层108上（且直接结合到其）。第二导电迹线118具有平面状的形状以使其尺寸最小化，并且直接连接到第二功率端子132b。进一步地，导电迹线118由金属材料（诸如，铜、铝和/或其合金）制成。
AC电子固态开关102还包括直接安置在电绝缘和导热层108上的多个信号导体120（即，源极导体和栅极导体）。信号导体120包括第一源极导体120a、第二源极导体120b、第一栅极导体120c和第二栅极导体120d。第一导电迹线116可具有矩形形状以有利于制造。第二导电迹线118也可具有矩形形状以有利于制造。第一源极导体120a、第二源极导体120b、第一栅极导体120c和第二栅极导体120d全部或部分地由金属材料（诸如，铜或铝）制成，并且直接结合到电绝缘和导热层108（例如，陶瓷层）。通过信号导体120承载的控制输入汲取接近零的功率（即，小于一瓦）来使AC电子固态开关120保持导通或断开，并且AC电子固态开关102被构造成选择性地控制沿任一方向（如由双箭头DA指示）的电流。
AC电子固态开关102还包括直接安置在电绝缘和导热层108上的公共漏极导体121。公共漏极导体121可以是AC电子固态开关102中的唯一的漏极导体，以使AC电子固态开关102的复杂性最小化。公共漏极导体121可具有矩形形状以有利于制造，并且可全部或部分地由金属材料（诸如，铜或铝）制成。第一源极导体120a和第一栅极导体120c安置在第一导电迹线116与公共漏极导体121之间。第二源极导体120b和第二栅极导体120d安置在公共漏极导体121与第二导电迹线118之间。
AC电子固态开关102包括多个半导体管芯122，每个半导体管芯直接安置在公共漏极源121上以有利于电的流动。尽管所描绘的实施例示出了十六个半导体管芯122，但是AC电子固态开关102包括在8个与24个之间的半导体管芯122（每个半导体管芯具有从650伏特至1700伏特的电压额定值）以彼此并联电连接来承载500 A电流并增强可扩展性。所述多个半导体管芯122中的每个形成金属氧化物半导体场效应晶体管（MOSFET）123、绝缘栅双极晶体管（IGBT）或其他类型的电子可控开关。因此，元件123可指代MOSFET、IGBT或其他类型的电子可控开关。MOSFET 123包括源极端子S、栅极端子G和漏极端子D。半导体管芯122中的每个具有20平方毫米的最小面积以承载400 A电流。
所述多个半导体管芯122中的每个包括半导体材料，诸如硅、碳化硅、氧化镓和氮化镓。半导体管芯122布置在直接结合的衬底的顶部上的预定放置点中，以在每个半导体管芯122中的第一功率端子132a和第二功率端子132b之间保持基本上相等的电阻。半导体管芯122中的每个的底侧直接联接到公共漏极导体121。半导体管芯122中的每个具有小于4.5m-Ωcm2的比导通电阻。半导体管芯122的放置点和直接结合的衬底108的图案实现了相等的电流分布和低的寄生电感。AC电子固态开关102可包括多个阻尼电阻器125，每个阻尼电阻器串联电连接到相应的MOSFET 123的栅极端子G，以防止功率振荡或至少使其最小化。所述多个半导体管芯122彼此并联电连接。
AC电子固态开关102包括多个第一电结合件126，每个电结合件电连接到所述多个半导体管芯122中的相应一个。具体地，所述多个第一电结合件126中的每个将相应的MOSFET 123的源极端子S电连接到第一导电迹线116抑或第二导电迹线118。所述多个第一电结合件126中的每个将所述多个半导体管芯122和第二导电迹线118电互连。所述多个第一电结合件126中的每个可以是大电流的铝或铜带结合件或箔结合件，以使寄生电感和电阻最小化。出于简单性，仅仅示出了三个半导体管芯122，其中电结合件126附接到第一导电迹线116抑或第二导电迹线118。然而，半导体管芯122中的每个均附接到两个电接合件126。
AC电子固态开关102还包括多个第二电结合件128，每个电结合件将所述多个信号导体120电连接到所述多个半导体管芯122。具体地，所述多个第二电结合件128中的每个将相应的MOSFET 123的栅极端子G或源极端子S电连接到第一源极导体120a、第二源极导体120b、第一栅极导体120c或第二栅极导体120d。所述多个第二电结合件128可以是短的低电流线结合件，以使寄生电感和电阻最小化。出于简单性，仅仅示出了三个半导体管芯122，其中所述多个第二电结合件128附接到信号导体120。然而，半导体管芯122中的每个均附接到所述多个第二电结合件128中的两个。
AC电子固态开关102可包括多个功率端子132（例如，如图2中所示的第一功率端子132a和第二功率端子132b）。第一功率端子132a直接联接到（且电连接到）第一导电迹线116。第二功率端子132b直接联接到（且电连接到）第二导电迹线118。功率端子132与基板106电隔离。
可选地，AC电子固态开关102可包括如图2中所示的一个或多个热敏电阻134，所述热敏电阻直接连接到直接结合的衬底115以测量（以最佳的准确度）AC电子固态开关102的温度。热敏电阻134测量并监测AC电子固态开关102的温度。
关于图3，除了下文描述的特征以外，AC电子固态开关102a的结构和功能与上文描述的AC电子固态开关102基本上相同。第一导电迹线116安置在第一源极导体120a与公共漏极导体121之间。第二导电迹线118安置在第二源极导体120b与公共漏极导体121之间。这种构型有利于制造并增强了可靠性。
关于图5和图6，除了下文描述的特征以外，AC电子固态开关102b的结构和功能与上文描述的AC电子固态开关102基本上相同。半导体管芯122直接安置在第一导电迹线116和第二导电迹线118上。MOSFET 123的漏极端子D电连接（且直接连接）到第一导电迹线116抑或第二导电迹线迹线118。因此，第一导电迹线116可被称为第一漏极导体，并且第二导电迹线118可被称为第二漏极导体。进一步地，半导体管芯122包括第一组半导体管芯122a和第二组半导体管芯122b。半导体管芯122彼此并联电连接。第一组半导体管芯122a中的每个直接安置在第一导电迹线116上（并与其直接接触），以增强AC电子固态开关102的结构完整性。第二组半导体管芯122b中的每个直接安置在第二导电迹线118上（并与其直接接触），以增强AC电子固态开关102的结构完整性。AC电子固态开关102还包括公共源极导体127，该公共源极导体通过所述多个第一电结合件126（例如，带结合件）电连接到半导体管芯122中的每个。第一源极导体120a和第一栅极导体120c安置在第一导电迹线116与公共源极导体127之间。第二源极导体120b和第二栅极导体120d安置在公共源极导体127与第二导电迹线118之间。公共源极导体127是唯一的源极导体，以使AC电子固态开关102的复杂性最小化。
关于图7，除了下文描述的特征以外，AC电子固态开关102c的结构和功能与上文描述的AC电子固态开关102b基本上相同。第一导电迹线116安置在第一源极导体120a与公共源极导体127之间。第二导电迹线118安置在第二源极导体120b与公共源极导体127之间。这种构型有利于制造并增强了可靠性。
详细描述和附图或图支持并且描述本教导，但是本教导的范围仅仅由权利要求限定。虽然已详细地描述了用于实施本教导的最佳模式和其他实施例中的一些，但是存在用于实践所附权利要求中限定的本教导的各种替代性设计和实施例。

Claims (10)

1.一种交流电（AC）电子固态开关，所述电子固态开关包括：
电绝缘和导热层；
第一导电迹线，所述第一导电迹线安置在所述电绝缘和导热层上；
第二导电迹线，所述第二导电迹线安置在所述电绝缘和导热层上；
多个半导体管芯，每个半导体管芯电连接到所述第一导电迹线和所述第二导电迹线，其中，所述多个半导体管芯中的每个形成MOSFET，并且所述MOSFET包括栅极端子、漏极端子和源极端子；
公共漏极导体，所述公共漏极导体电连接到所述多个半导体管芯的每个漏极端子，其中，所述多个半导体管芯中的每个安置在所述公共漏极导体上；并且
其中，所述AC电子固态开关具有导通状态和断开状态，其中，所述AC电子固态开关被构造成在所述断开状态下沿第一方向和第二方向在650伏特与1700伏特之间阻断，所述第二方向与所述第一方向相反，并且所述AC电子固态开关被构造成在所述导通状态下连续地承载至少500 A，其中压降小于2 V。
2.根据权利要求1所述的AC电子固态开关，所述AC电子固态开关还包括基板，其中，所述电绝缘和导热层安置在所述基板上，所述多个半导体管芯的每个漏极端子直接连接到所述公共漏极导体，其中，所述公共漏极导体是唯一的漏极导体，所述多个半导体管芯中的每个与所述公共漏极导体直接接触，并且所述多个半导体管芯彼此并联电连接。
3.根据权利要求2所述的AC电子固态开关，所述AC电子固态开关还包括多个信号导体，其中，所述多个信号导体电连接到所述多个半导体管芯，并且所述多个信号导体包括多个栅极导体和多个源极导体。
4.根据权利要求3所述的AC电子固态开关，所述AC电子固态开关还包括多个电结合件，所述多个电结合件包括线结合件和带结合件，其中，所述多个半导体管芯的每个源极端子电连接到所述多个源极导体，并且所述带结合件将所述多个半导体管芯电连接到所述多个源极导体。
5.根据权利要求4所述的AC电子固态开关，其中，所述多个半导体管芯的每个栅极端子电连接到所述多个栅极导体，并且所述线结合件将所述多个半导体管芯电连接到所述多个栅极导体。
6.根据权利要求5所述的AC电子固态开关，其中，所述多个半导体管芯中的每个具有20平方毫米的最小面积。
7.根据权利要求6所述的AC电子固态开关，其中，所述基板的厚度在2毫米与3毫米之间，并且所述基板包括铜。
8.根据权利要求7所述的AC电子固态开关，其中，所述多个半导体管芯包括在8个与24个之间的半导体管芯，每个半导体管芯具有在650 V与1700 V之间的电压额定值。
9.根据权利要求8所述的AC电子固态开关，其中，每个半导体管芯的比导通电阻小于4.5 mΩ-cm2。
10.根据权利要求9所述的AC电子固态开关，其中，所述AC电子固态开关的质量小于300克。
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