CN112764326A - Three-dimensional direct-writing photoetching method and device with high-speed axial scanning capability - Google Patents
Three-dimensional direct-writing photoetching method and device with high-speed axial scanning capability Download PDFInfo
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- CN112764326A CN112764326A CN202110081492.1A CN202110081492A CN112764326A CN 112764326 A CN112764326 A CN 112764326A CN 202110081492 A CN202110081492 A CN 202110081492A CN 112764326 A CN112764326 A CN 112764326A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0875—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more refracting elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides a three-dimensional direct-writing photoetching method and a device with high-speed axial scanning capability, wherein the method comprises the following steps: generating a direct-writing processing light beam, and realizing gray direct-writing processing by controlling the light intensity of the processing light beam; the processing light beam realizes plane two-dimensional scanning through two acousto-optic deflectors which are vertically arranged; the electric control zoom lens controls the convergence and divergence of the processing light beam, and front defocusing and rear defocusing of the processing light spot near the focal plane of the objective lens are respectively and correspondingly generated, so that electric control high-speed axial scanning is realized. Compared with the traditional electric scanning direct-writing photoetching method and device, the invention adopts the electric control zoom lens to realize axial electric control high-speed scanning, thereby further improving the scanning processing speed and the processing efficiency.
Description
Technical Field
The invention belongs to the field of optical engineering, and particularly relates to a three-dimensional direct-writing photoetching method and a three-dimensional direct-writing photoetching device with high-speed axial scanning capability.
Background
The laser direct writing photoetching technology is a micro-nano processing technology with submicron processing precision and three-dimensional printing capability. Mechanical, electronic and optical devices with correspondingly dimensioned structures can be flexibly manufactured. Meanwhile, the processing technology is simplified, and the method is particularly suitable for research and trial production of novel devices.
Laser direct-writing processing technology can be divided into projection direct-writing processing, mechanical scanning direct-writing processing and electrical scanning direct-writing processing according to different processing modes of the laser direct-writing processing technology.
The projection direct-writing processing has the largest single processing area and high processing efficiency, but the resolution of a processed sample is difficult to improve due to the fact that the device of the projection direct-writing light beam is low in resolution and the surface type of the device is not uniform, and the device is not suitable for high-precision processing. Mechanical scanning direct-writing processing is the most widely used direct-writing processing mode at present. The scanning mechanism used in the mechanical scanning direct writing processing comprises a piezoelectric platform, a galvanometer, a rotating mirror and the like. The mechanical scanning is stable in work and large in scanning range, but the scanning speed is slowest, the time for processing a large-scale device is too long, and the processing requirement of the large-scale device cannot be met. The electrical scanning direct-writing processing is characterized in that the scanning speed is higher than that of common mechanical scanning, so that the processing efficiency is higher. However, the conventional electrical scanning machining equipment can only realize two-dimensional scanning in one plane, and the axial scanning is often realized by mechanical scanning, which is a bottleneck for limiting further improvement of the three-dimensional machining speed.
Therefore, aiming at the limitation of the current electric scanning machining, a high-speed axial scanning method needs to be provided to meet the requirement of further improving the direct-writing scanning machining speed.
Disclosure of Invention
The invention aims to provide a three-dimensional direct-writing photoetching method and a three-dimensional direct-writing photoetching device with high-speed axial scanning capability aiming at the defects of the prior art.
In order to achieve the above object, the present invention provides a three-dimensional direct-write lithography method with high speed axial scanning capability, comprising:
generating a direct-writing processing light beam, and realizing gray direct-writing processing by controlling the light intensity of the processing light beam;
the processing light beam realizes plane two-dimensional scanning through two acousto-optic deflectors which are vertically arranged;
the electric control zoom lens controls the convergence and divergence of the processing light beam, and front defocusing and rear defocusing of the processing light spot near the focal plane of the objective lens are respectively and correspondingly generated, so that electric control high-speed axial scanning is realized.
Furthermore, axial scanning realized by the axial forward and backward movement of the focusing processing light spot caused by the electric control zoom lens is combined with two-dimensional plane scanning realized by the two acousto-optic deflectors to realize three-dimensional space scanning.
It is another object of the present invention to provide a three-dimensional direct-write lithography apparatus with high speed axial scanning capability, which can be used to implement the above method, the apparatus comprising:
a laser light source for generating a direct-write processing beam;
the laser power control device is used for changing the light intensity of the processing light beam and realizing gray level direct writing processing;
the high-speed three-dimensional scanning system is used for controlling the three-dimensional space position of the processing light spot and realizing point-by-point scanning of the three-dimensional space; the high-speed three-dimensional scanning system comprises two acousto-optic deflectors for realizing planar two-dimensional scanning and an electric control zoom lens, and the electric control zoom lens is used for controlling the convergence and the divergence of a processing light beam to cause a focusing processing light spot to move back and forth in the axial direction so as to realize high-speed axial scanning;
a focusing device for focusing the processing beam in the lithographic sample;
and the sample moving mechanism is used for moving the photoetching sample in a large range to align with the processing starting position.
Further, the laser power control apparatus includes:
a polarizer for generating linearly polarized light;
a half wave plate for adjusting the polarization direction of the light beam;
the first convex lens, the small hole and the second convex lens are used for beam shrinking and shaping;
an acousto-optic modulator for varying the laser power.
Furthermore, the polarization direction of emergent light of the half-wave plate meets the polarization requirement of the acousto-optic modulator on light beam modulation;
the small hole is arranged at the confocal position of the first convex lens and the second convex lens and is used for spatial filtering;
the first convex lens and the second convex lens form a 4f system;
the beam shrinking width of the first convex lens and the second convex lens to the processing beam meets the width requirement of the acousto-optic modulator to the beam modulation.
Further, the high-speed three-dimensional scanning system comprises:
a first acousto-optic deflector for horizontal direction scanning;
a third convex lens and a fourth convex lens for conjugate imaging of the scanning surface;
a second acoustic light deflector for scanning in a vertical direction;
a fifth convex lens and a sixth convex lens for expanding beams;
an electrically controlled zoom lens for achieving axial scanning.
Furthermore, the two acousto-optic deflectors are arranged in directions which are mutually vertical;
the third convex lens and the fourth convex lens are arranged in a confocal manner to form a 4f system, and the 4f system is arranged between the first acousto-optic deflector and the second acousto-optic deflector to enable the first acousto-optic deflector and the second acousto-optic deflector to form an optical conjugate relation, so that distortion-free plane two-dimensional scanning is realized;
the fifth convex lens and the sixth convex lens expand the emergent light beam of the second acoustic light deflector, the emergent light beam of the sixth convex lens is a divergent light beam, and the divergent light beam is converted into a parallel light beam after passing through the electric control zoom lens with specific bias voltage and is collimated and emergent.
Further, the bias voltage of the electric control zoom lens is reduced, the emergent light beam of the electric control zoom lens is changed into a divergent light beam, and the focusing processing light spot of the objective lens moves backwards in the corresponding axial direction; increasing the bias voltage of the electric control zoom lens, changing the emergent light beam of the electric control zoom lens into a converged light beam, and moving the focusing processing light spot of the objective lens forwards in the corresponding axial direction; the focusing processing light spot caused by the electric control zoom lens moves back and forth in the axial direction to realize axial scanning.
Further, the focusing device comprises a reflecting mirror, a scanning lens, a field lens and an objective lens; the scanning lens is an f-theta lens, and the front focal plane of the scanning lens is superposed with the rear focal plane of a lens group consisting of a sixth convex lens and an electric control zoom lens with specific bias voltage; the field lens and the scanning lens are arranged in a confocal mode to form a 4f system.
Furthermore, the sample moving mechanism is a piezoelectric displacement platform, the piezoelectric displacement platform is connected with the photoetching sample frame, and the photoetching sample is fixed on the photoetching sample frame and is placed at the focal plane position of the objective lens; the piezoelectric displacement platform drives the photoetching sample frame to perform three-dimensional translational motion, and the position of the sample is adjusted to the photoetching position.
The principle of the invention is as follows:
and after the sample moving mechanism moves the sample to the processing initial position, scanning and direct-writing processing are started. The processing laser beam is converged in the processing sample by the objective lens to form a processing light spot. The high-speed three-dimensional scanning system controls the movement of the processing light spot in the sample to realize three-dimensional point-by-point scanning. The first acousto-optic deflector controls the horizontal angle scanning of the processing light beam and correspondingly controls the horizontal movement of a focusing processing light spot behind the objective lens; the second acoustic light deflector controls the vertical angle scanning of the processing light beam and correspondingly controls the focusing processing light spot behind the objective lens to vertically move; the electric control zoom lens controls convergence and divergence of the processing light beam, and front defocusing and rear defocusing of the processing light spot near the focal plane of the objective lens are respectively and correspondingly generated, so that axial scanning is realized. The first acousto-optic deflector, the second acousto-optic deflector, the electric control zoom lens and the acousto-optic modulator synchronously control the processing light beam, and three-dimensional space gray level direct writing photoetching is realized.
Compared with the traditional electric scanning direct-writing photoetching method and device, the invention adopts the electric control zoom lens to realize axial electric control scanning, and further improves the scanning processing speed and the processing efficiency.
Drawings
FIG. 1 is a schematic diagram of a three-dimensional direct-write lithography apparatus with high-speed axial scanning capability according to an embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
The invention generates a direct-writing processing beam by a laser. The processing light beam sequentially passes through an acousto-optic modulator serving as an energy adjusting mechanism, a first acousto-optic deflector and a second acousto-optic deflector serving as a two-dimensional plane scanning mechanism and an electric control zoom lens serving as an axial scanning mechanism, and is finally focused in a processing sample through an objective lens. And the high-speed gray scanning direct-writing photoetching of the sample is realized by synchronously controlling the acousto-optic modulator, the first acousto-optic deflector, the second acousto-optic deflector and the electric control zoom lens.
As shown in fig. 1, the three-dimensional direct-write lithography apparatus with high speed axial scanning capability provided by this embodiment includes: the device comprises a laser 1, a polarizer 2, a half wave plate 3, a first convex lens 4, a small hole 5, a second convex lens 6, an acousto-optic modulator 7, a first acousto-optic deflector 8, a third convex lens 9, a fourth convex lens 10, a second acousto-optic deflector 11, a fifth convex lens 12, a sixth convex lens 13, an electrically controlled zoom lens 14, a reflector 15, a scanning lens 16, a field lens 17, an objective lens 18, a photoetching sample frame 19 and a piezoelectric displacement platform 20.
The method for realizing high-speed laser scanning direct writing by adopting the device shown in FIG. 1 is as follows:
the laser 1 emits direct writing light beams, and the direct writing light beams pass through the polarizer 2 and the half wave plate 3 to become linear polarized light. The half wave plate 3 is used for rotating the polarization direction of the light beam, so that the polarization direction of the light beam is consistent with the modulatable incident polarization direction required by the acousto-optic modulator 7. The linearly polarized light is incident on the acousto-optic modulator 7 through the first convex lens 4, the aperture 5 and the second convex lens 6. The first convex lens 4 and the second convex lens 6 condense and collimate the incident beam to meet the requirement of the acousto-optic modulator 7 on the width of the modulated beam. The small holes 5 carry out spatial filtering to filter out edge stray light and improve the quality of light beams. Wherein, the light intensity of the processing light beam is controlled by the acousto-optic modulator 7 to realize the gray processing of the writing points.
The processing light beam emitted from the acoustic optical modulator 7 is sequentially incident on the first acoustic optical deflector 8, the third convex lens 9, the fourth convex lens 10, and the second acoustic optical deflector 11. Wherein the first acousto-optic deflector 8 and the second acousto-optic deflector 11 are placed in directions perpendicular to each other. The first acousto-optic deflector 8 drives the light beam to perform horizontal scanning, and the second acousto-optic deflector 11 drives the light beam to perform vertical scanning. The third convex lens 9 and the fourth convex lens 10 have the same focal length, are arranged in a confocal manner to form a 4f system, and are arranged between the first acousto-optic deflector 8 and the second acousto-optic deflector 11, so that the first acousto-optic deflector 8 and the second acousto-optic deflector 11 form an optical conjugate relation, and distortion-free planar two-dimensional scanning is realized.
The outgoing light beam of the second acoustic light deflector 11 passes through the fifth convex lens 12, the sixth convex lens 13, and the electrically controlled zoom lens 14 in this order. The fifth convex lens 12 and the sixth convex lens 13 expand the light beam, and the light beam emitted by the sixth convex lens 13 is a diverging light beam. The divergent light beams are converted into parallel light beams after passing through an electric control zoom lens 14 with specific bias voltage, and then are collimated and emitted.
The collimated light beam is aligned by a reflecting mirror 15, enters a scanning lens 16 and a field lens 17 which form a 4f system, and is finally focused on the focal plane of an objective lens 18 to generate a writing focusing writing light spot. Wherein, the front focal plane of the scanning lens 16 is superposed with the back focal plane of the lens group consisting of the sixth convex lens 13 and the electric control zoom lens 14 for setting specific bias voltage.
In the direct writing processing, the bias voltage of the electric control zoom lens 14 is reduced, the emergent light beam of the electric control zoom lens 14 is changed into a divergent light beam, and the focusing processing light spot of the objective lens 18 moves backwards in the corresponding axial direction; the bias voltage of the electrically controlled zoom lens 14 is increased, the emergent light beam of the electrically controlled zoom lens 14 becomes a convergent light beam, and the focusing processing light spot of the objective lens 18 moves forwards in the axial direction correspondingly. The axial forward and backward movement of the focusing processing light spot caused by the electrically controlled zoom lens 14 realizes axial scanning, and three-dimensional space scanning is realized by combining with two-dimensional plane scanning generated by the first acousto-optic deflector 8 and the second acousto-optic deflector 11.
The photoetching sample holder 19 is connected with a piezoelectric displacement platform 20, and the photoetching sample is fixed on the photoetching sample holder 19 and is arranged at the focal plane position of the objective lens 18. The piezoelectric displacement platform 20 drives the photoetching sample holder 19 to perform three-dimensional translational motion, so that the position of the sample is adjusted to the photoetching position.
The above description is only exemplary of the preferred embodiments of the present invention, and is not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A three-dimensional direct-write lithography method with high-speed axial scanning capability is characterized by comprising the following steps:
generating a direct-writing processing light beam, and realizing gray direct-writing processing by controlling the light intensity of the processing light beam;
the processing light beam realizes plane two-dimensional scanning through two acousto-optic deflectors which are vertically arranged;
the electric control zoom lens controls the convergence and divergence of the processing light beam, and front defocusing and rear defocusing of the processing light spot near the focal plane of the objective lens are respectively and correspondingly generated, so that electric control high-speed axial scanning is realized.
2. The three-dimensional direct-write lithography method according to claim 1, wherein the axial scanning by the axial forward and backward movement of the focused processing spot caused by the electrically controlled zoom lens is combined with the two-dimensional planar scanning by the two acousto-optic deflectors to realize the three-dimensional spatial scanning.
3. A three-dimensional direct write lithography apparatus having high speed axial scanning capability, comprising:
a laser light source for generating a direct-write processing beam;
the laser power control device is used for changing the light intensity of the processing light beam and realizing gray level direct writing processing;
the high-speed three-dimensional scanning system is used for controlling the three-dimensional space position of the processing light spot and realizing point-by-point scanning of the three-dimensional space; the high-speed three-dimensional scanning system comprises two acousto-optic deflectors for realizing planar two-dimensional scanning and an electric control zoom lens, and the electric control zoom lens is used for controlling the convergence and the divergence of a processing light beam to cause a focusing processing light spot to move back and forth in the axial direction so as to realize high-speed axial scanning;
a focusing device for focusing the processing beam in the lithographic sample;
and the sample moving mechanism is used for moving the photoetching sample in a large range to align with the processing starting position.
4. The three-dimensional direct write lithography apparatus according to claim 3, wherein said laser power control means comprises:
a polarizer for generating linearly polarized light;
a half wave plate for adjusting the polarization direction of the light beam;
the first convex lens, the small hole and the second convex lens are used for beam shrinking and shaping;
an acousto-optic modulator for varying the laser power.
5. The three-dimensional direct-write lithography apparatus according to claim 4, wherein the polarization direction of the light emitted from the half-wave plate satisfies the polarization requirement of the acousto-optic modulator for beam modulation;
the small hole is arranged at the confocal position of the first convex lens and the second convex lens and is used for spatial filtering;
the first convex lens and the second convex lens form a 4f system;
the beam shrinking width of the first convex lens and the second convex lens to the processing beam meets the width requirement of the acousto-optic modulator to the beam modulation.
6. The three-dimensional direct write lithography apparatus according to claim 3, wherein said high speed three-dimensional scanning system comprises:
a first acousto-optic deflector for horizontal direction scanning;
a third convex lens and a fourth convex lens for conjugate imaging of the scanning surface;
a second acoustic light deflector for scanning in a vertical direction;
a fifth convex lens and a sixth convex lens for expanding beams;
an electrically controlled zoom lens for achieving axial scanning.
7. The three-dimensional direct write lithography apparatus according to claim 6, wherein the first acousto-optic deflector and the second acousto-optic deflector are disposed in directions perpendicular to each other;
the third convex lens and the fourth convex lens are arranged in a confocal manner to form a 4f system, and the 4f system is arranged between the first acousto-optic deflector and the second acousto-optic deflector to enable the first acousto-optic deflector and the second acousto-optic deflector to form an optical conjugate relation, so that distortion-free plane two-dimensional scanning is realized;
the fifth convex lens and the sixth convex lens expand the emergent light beam of the second acoustic light deflector, the emergent light beam of the sixth convex lens is a divergent light beam, and the divergent light beam is converted into a parallel light beam after passing through the electric control zoom lens with specific bias voltage and is collimated and emergent.
8. The three-dimensional direct-write lithography apparatus according to claim 7, wherein the bias voltage of the electrically controlled zoom lens is reduced, the outgoing beam of the electrically controlled zoom lens becomes a diverging beam, and the focused processing spot of the objective lens is shifted backward in the corresponding axial direction; increasing the bias voltage of the electric control zoom lens, changing the emergent light beam of the electric control zoom lens into a converged light beam, and axially moving forward the focusing processing light spot of the objective lens correspondingly; the focusing processing light spot caused by the electric control zoom lens moves back and forth in the axial direction to realize axial scanning.
9. The three-dimensional direct write lithography apparatus according to claim 7, wherein said focusing device comprises a mirror, a scan lens, a field lens, and an objective lens; the scanning lens is an f-theta lens, and the front focal plane of the scanning lens is superposed with the rear focal plane of a lens group consisting of a sixth convex lens and an electric control zoom lens with specific bias voltage; the field lens and the scanning lens are arranged in a confocal mode to form a 4f system.
10. The three-dimensional direct-writing lithography device according to claim 3, wherein the sample moving mechanism is a piezoelectric displacement platform, the piezoelectric displacement platform is connected with the lithography sample holder, and the lithography sample is fixed on the lithography sample holder and placed at the focal plane position of the objective lens; the piezoelectric displacement platform drives the photoetching sample frame to perform three-dimensional translational motion, and the position of the sample is adjusted to the photoetching position.
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| CN113867105A (en) * | 2021-09-18 | 2021-12-31 | 中国科学院上海光学精密机械研究所 | Multi-beam scanning type laser direct writing device and writing method thereof |
| CN114415481A (en) * | 2022-03-30 | 2022-04-29 | 之江实验室 | Laser direct writing system engraving method and device based on rotating mirror |
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| CN114415481B (en) * | 2022-03-30 | 2022-07-12 | 之江实验室 | Laser direct writing system engraving method and device based on rotating mirror |
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