CN112752795A - Resin composition for sealing, electronic component device, and method for manufacturing electronic component device - Google Patents
Resin composition for sealing, electronic component device, and method for manufacturing electronic component device Download PDFInfo
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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Abstract
A sealing resin composition for use in narrow-passage filling, the sealing resin composition comprising an epoxy resin, a curing agent and an inorganic filler, the curing agent comprising an active ester compound, the inorganic filler having an average particle diameter of less than 10 μm.
Description
Technical Field
The invention relates to a sealing resin composition, an electronic component device and a method for manufacturing the electronic component device.
Background
The amount of transmission loss generated by thermal conversion of a radio wave transmitted for communication in a dielectric medium is expressed as the product of the frequency and the square root of the relative dielectric constant and the dielectric loss tangent. In other words, since a transmission signal is easily converted into heat in proportion to the frequency, the higher the frequency band is, the lower the dielectric characteristics are required for the material of the communication member in order to suppress the transmission loss.
For example, patent documents 1 to 2 disclose thermosetting resin compositions containing an active ester resin as a curing agent for an epoxy resin, which can suppress the dielectric loss tangent of a cured product to be low.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2012 and 246367
Patent document 2: japanese patent laid-open No. 2014-114352
Disclosure of Invention
Problems to be solved by the invention
In the field of information communication, the frequency of radio waves is becoming higher as the number of channels increases and the amount of information to be transmitted increases. Currently, research on the 5 th generation mobile communication system is being conducted worldwide, and several candidates for a frequency band to be used are in a range of about 30GHz to 70 GHz. Since the mainstream of wireless communication is communication in such a high frequency band in the future, a material for a communication member is required to have a lower dielectric loss tangent.
In addition, as semiconductor devices are miniaturized, made thinner, and made more functional, a resin composition for sealing having excellent narrow-path filling properties is required in order to narrow the bump pitch and the inter-element gap.
The embodiments of the present disclosure are completed based on the above-described situation.
The present disclosure addresses the problem of providing a sealing resin composition that has excellent narrow-path filling properties and a cured product that has a low dielectric loss tangent, an electronic component device sealed using the sealing resin composition, and a method for manufacturing an electronic component device sealed using the sealing resin composition.
Means for solving the problems
Specific means for solving the above problems include the following means.
[1] A sealing resin composition for narrow-path filling, comprising an epoxy resin, a curing agent and an inorganic filler, wherein the curing agent comprises an active ester compound, and the inorganic filler has an average particle diameter of less than 10 [ mu ] m.
[2] The resin composition for sealing according to [1], wherein the inorganic filler has a maximum particle diameter of less than 20 μm.
[3] The resin composition for sealing according to [1] or [2], which is used for mold underfill.
[4] An electronic component device, comprising: a support member; an element disposed on the support member; and a cured product of the sealing resin composition according to any one of [1] to [3] which fills a narrow path around the element.
[5] A method of manufacturing an electronic component device, comprising: disposing the element on the support member; and a step of filling a narrow path around the element with the sealing resin composition according to any one of [1] to [3 ].
ADVANTAGEOUS EFFECTS OF INVENTION
The present disclosure provides a sealing resin composition having excellent narrow-path filling properties and a cured product having a low dielectric loss tangent, an electronic component device sealed using the sealing resin composition, and a method for manufacturing an electronic component device sealed using the sealing resin composition.
Drawings
Fig. 1 is a top view (partial perspective view) illustrating a test chip used in the embodiment.
Fig. 2 is a sectional view illustrating a test chip used in the embodiment.
Detailed Description
In the present disclosure, the term "step" includes a step that is independent from other steps, and also includes a step that is not clearly distinguished from other steps, as long as the purpose of the step is achieved.
In the present disclosure, a numerical range represented by "to" includes numerical values before and after "to" as a minimum value and a maximum value, respectively.
In the numerical ranges recited in the present disclosure, the upper limit or the lower limit recited in one numerical range may be replaced with the upper limit or the lower limit recited in another numerical range recited in a stepwise manner. In the numerical ranges disclosed in the present disclosure, the upper limit or the lower limit of the numerical range may be replaced with the values shown in the examples.
In the present disclosure, each ingredient may contain a plurality of the same substances. When a plurality of substances corresponding to each component are present in the composition, the content or content of each component refers to the total content or content of the plurality of substances present in the composition unless otherwise specified.
In the present disclosure, the particles corresponding to each ingredient may be contained in plural kinds. When a plurality of particles corresponding to each component are present in the composition, the particle diameter of each component is a value for a mixture of the plurality of particles present in the composition unless otherwise specified.
In the present disclosure, when the embodiment is described with reference to the drawings, the configuration of the embodiment is not limited to the configuration shown in the drawings. In addition, the sizes of the members in the drawings are conceptual, and the relative relationship between the sizes of the members is not limited thereto.
< sealing resin composition >
The sealing resin composition of the present disclosure is used for narrow-path filling, and comprises an epoxy resin, a curing agent and an inorganic filler, wherein the curing agent comprises an active ester compound, and the inorganic filler has an average particle diameter of less than 10 μm.
The narrow path using the sealing resin composition of the present disclosure means a gap having at least one of a height and a width of 100 μm or less. The narrow path includes a gap between the support member and the element, a gap between the adjacent elements, and the like.
The sealing resin composition of the present disclosure may be a sealing resin composition for filling a narrow path of an electronic component device and sealing a part of a space other than the narrow path in the electronic component device or the whole electronic component device.
Examples of the above embodiment include: a sealing resin composition for Mold Underfill (MUF) which seals an element disposed on a support member and fills a gap between the support member and the element; and a sealing resin composition for SiP (system in a package).
The active ester compound in the present disclosure means a compound having 1 or more ester groups reactive with an epoxy group in 1 molecule and having a curing action of an epoxy resin.
Conventionally, as a curing agent for an epoxy resin, a phenol curing agent, an amine curing agent, and the like have been generally used, but secondary hydroxyl groups are generated in the reaction of an epoxy resin with a phenol curing agent or an amine curing agent. In contrast, in the reaction of the epoxy resin and the active ester compound, an ester group is generated instead of the secondary hydroxyl group. Since the ester group is less polar than the secondary hydroxyl group, the sealing resin composition of the present disclosure can suppress the dielectric loss tangent of a cured product to be lower than a sealing resin composition containing only a curing agent that generates a secondary hydroxyl group as a curing agent.
Further, the sealing resin composition of the present disclosure has excellent narrow-path filling properties because the average particle diameter of the inorganic filler contained therein is less than 10 μm. The reason is presumed to be that the inorganic filler is less likely to block the narrow passage when the melt of the sealing resin composition flows through the narrow passage.
In the sealing resin composition of the present disclosure, the lower limit of the average particle diameter of the inorganic filler is not particularly limited. For example, from the viewpoint of suppressing aggregation of the inorganic fillers, it is preferably 3 μm or more.
(epoxy resin)
The epoxy resin is not particularly limited in kind as long as it has an epoxy group in a molecule.
Specific examples of the epoxy resin include: epoxy resins obtained by epoxidizing a phenol novolac resin obtained by condensing or co-condensing a phenolic compound selected from at least 1 of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol a, and bisphenol F, and naphthol compounds such as α -naphthol, β -naphthol, and dihydroxynaphthalene, and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, or the like, in an acidic catalyst, that is, a phenol novolac type epoxy resin (such as a phenol novolac type epoxy resin and an o-cresol novolac type epoxy resin); an epoxy resin obtained by epoxidizing a triphenylmethane type phenol resin obtained by condensing or co-condensing the above phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst, that is, a triphenylmethane type epoxy resin; an epoxy resin obtained by epoxidizing a phenol novolac resin obtained by co-condensing the phenol compound, the naphthol compound and the aldehyde compound with an acidic catalyst, that is, a copolymer epoxy resin; diglycidyl ethers of bisphenol a, bisphenol F, and the like, i.e., diphenylmethane-type epoxy resins; diglycidyl ethers of alkyl-substituted or unsubstituted diphenols, i.e. biphenyl-type epoxy resins; diglycidyl ethers of stilbene-based phenol compounds, i.e., stilbene-type epoxy resins; diglycidyl ethers of bisphenol S and the like, that is, epoxy resins containing a sulfur atom; epoxy resins as glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester type epoxy resins, which are glycidyl esters of polycarboxylic acid compounds such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidyl amine type epoxy resins, which are epoxy resins obtained by substituting an active hydrogen bonded to a nitrogen atom of aniline, diaminodiphenylmethane, isocyanuric acid, or the like with a glycidyl group; epoxy resin obtained by epoxidizing co-condensation resin of dicyclopentadiene and phenol compound, namely dicyclopentadiene type epoxy resin; alicyclic epoxy resins such as vinylcyclohexene dioxide, 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexanecarboxylate, and 2- (3, 4-epoxy) cyclohexyl-5, 5-spiro (3, 4-epoxy) cyclohexane-m-dioxane, which are epoxy resins obtained by epoxidizing intramolecular ethylenic bonds; glycidyl ether of p-xylene-modified phenolic resin, namely p-xylene-modified epoxy resin; glycidyl ether of m-xylene-modified phenolic resin, i.e., m-xylene-modified epoxy resin; glycidyl ethers of terpene-modified phenolic resins, i.e., terpene-modified epoxy resins; glycidyl ether of dicyclopentadiene-modified phenol resin, i.e., dicyclopentadiene-modified epoxy resin; glycidyl ether of cyclopentadiene-modified phenol resin, namely cyclopentadiene-modified epoxy resin; glycidyl ether of polycyclic aromatic ring modified phenolic resin, namely polycyclic aromatic ring modified epoxy resin; glycidyl ethers of phenolic resins containing naphthalene rings, namely naphthalene-type epoxy resins; a halogenated phenol novolac type epoxy resin; p-phenylene bisphenol type epoxy resin; trimethylolpropane type epoxy resins; linear aliphatic epoxy resins obtained by oxidizing olefinic bonds with peracids such as peracetic acid; an aralkyl type epoxy resin, which is an epoxy resin obtained by epoxidizing an aralkyl type phenol resin such as a phenol aralkyl resin or a naphthol aralkyl resin; and the like. Epoxy resins such as epoxy resins of acrylic resins can also be cited. These epoxy resins may be used alone in 1 kind, or may be used in combination in 2 or more kinds.
The epoxy equivalent (molecular weight/number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of a balance among various properties such as moldability, reflow resistance and electrical reliability, it is preferably 100 to 1000g/eq, more preferably 150 to 500 g/eq.
The epoxy equivalent of the epoxy resin is set to pass the range according to JIS K7236: 2009 by the method.
In the case where the epoxy resin is a solid, the softening point or melting point thereof is not particularly limited. From the viewpoint of moldability and reflow resistance, it is preferably from 40 ℃ to 180 ℃, and more preferably from 50 ℃ to 130 ℃ from the viewpoint of handling properties in the production of the sealing resin composition.
The melting point of the epoxy resin is a value measured by Differential Scanning Calorimetry (DSC), and the softening point of the epoxy resin is a value measured by a Differential Scanning Calorimetry (DSC) method according to JIS K7234: 1986 (Ring and ball method).
The content of the epoxy resin in the sealing resin composition is preferably 0.5 to 50% by mass, and more preferably 2 to 30% by mass, from the viewpoints of strength, fluidity, heat resistance, moldability, and the like.
(curing agent)
The sealing resin composition of the present disclosure contains at least an active ester compound as a curing agent. The sealing resin composition of the present disclosure may contain a curing agent other than the active ester compound.
As described above, the sealing resin composition of the present disclosure can suppress the dielectric loss tangent of a cured product to be low by using an active ester compound as a curing agent.
In addition, the polar group in the cured product improves the water absorption of the cured product, and the active ester compound is used as the curing agent, so that the concentration of the polar group in the cured product can be suppressed, and the water absorption of the cured product can be suppressed. And, by suppressing the water absorption of the cured product, that is, by suppressing H as a polar molecule2The content of O can suppress the dielectric loss tangent of the cured product to a lower level. The water absorption of the cured product is preferably 0% to 0.35%, more preferably 0% to 0.30%, and still more preferably 0% to 0.25%. The water absorption of the cured product was the mass increase rate determined by the pressure cooker boiling test (121 ℃, 2.1 atm, 24 hours).
The kind of the active ester compound is not particularly limited as long as it has 1 or more ester groups reactive with epoxy groups in the molecule.
Examples of the active ester compound include: phenol ester compounds, thiophenol ester compounds, N-hydroxylamine ester compounds, esters of heterocyclic hydroxyl compounds, and the like.
Examples of the active ester compound include: an ester compound obtained from at least 1 of an aliphatic carboxylic acid and an aromatic carboxylic acid and at least 1 of an aliphatic hydroxy compound and an aromatic hydroxy compound. An ester compound containing an aliphatic compound as a component for polycondensation tends to have excellent compatibility with an epoxy resin because it has an aliphatic chain. Ester compounds containing an aromatic compound as a component for polycondensation tend to have excellent heat resistance because they have an aromatic ring.
Specific examples of the active ester compound include aromatic esters obtained by a condensation reaction of an aromatic carboxylic acid and a phenolic hydroxyl group. Among them, preferred are: an aromatic ester obtained by a condensation reaction of an aromatic carboxylic acid, wherein 2 to 4 hydrogen atoms of an aromatic ring are substituted with carboxyl groups, such as benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, or diphenylsulfonic acid, and a phenolic hydroxyl group, is used as a starting material, and a mixture of an aromatic carboxylic acid component, wherein 1 hydrogen atom of the aromatic ring is substituted with a hydroxyl group, a monohydric phenol, wherein 2 to 4 hydrogen atoms of the aromatic ring are substituted with a hydroxyl group, and a polyhydric phenol, wherein 2 to 4 hydrogen atoms of the aromatic ring are substituted with a hydroxyl group, is used. That is, the aromatic ester preferably has a structural unit derived from the aromatic carboxylic acid component, a structural unit derived from the monohydric phenol, and a structural unit derived from the polyhydric phenol.
Specific examples of the active ester compound include: an active ester resin having a structure obtained by reacting a phenol resin having a molecular structure formed by bonding (Japanese) phenol compounds via an aliphatic cyclic hydrocarbon group, an aromatic dicarboxylic acid or a halide thereof, and an aromatic monohydroxy compound, as described in Japanese patent laid-open No. 2012-246367. As the active ester resin, a compound represented by the following structural formula (1) is preferable.
[ chemical formula 1]
In the structural formula (1), R1Is an alkyl group having 1 to 4 carbon atoms, X is a benzene ring, a naphthalene ring, a benzene ring substituted with an alkyl group having 1 to 4 carbon atoms orA naphthalene ring or a biphenyl group, Y is a benzene ring, a naphthalene ring, or a benzene ring or a naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, k is 0 or 1, and n represents an average of the number of repetitions of 0.25 to 1.5.
Specific examples of the compound represented by the structural formula (1) include the following exemplified compounds (1-1) to (1-10). t-Bu in the structural formula is tert-butyl.
[ chemical formula 2]
[ chemical formula 3]
Another specific example of the active ester compound includes a compound represented by the following structural formula (2) and a compound represented by the following structural formula (3) described in japanese patent application laid-open No. 2014-114352.
[ chemical formula 4]
In the structural formula (2), R1And R2Each independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms, Z represents an ester-forming structural site (Z1) or a hydrogen atom (Z2) selected from the group consisting of a benzoyl group, a naphthoyl group, a benzoyl group or naphthoyl group substituted with an alkyl group having 1 to 4 carbon atoms, and an acyl group having 2 to 6 carbon atoms, and at least 1 of Z represents an ester-forming structural site (Z1).
In the structural formula (3), R1And R2Each independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, and Z represents an ester-forming structural moiety (Z1) selected from the group consisting of a benzoyl group, a naphthoyl group, a benzoyl or naphthoyl group substituted with an alkyl group having 1 to 4 carbon atoms, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atomAnd (Z) an atom (Z2), wherein at least 1 of Z is an ester-forming structural site (Z1).
Specific examples of the compound represented by the structural formula (2) include the following exemplified compounds (2-1) to (2-6).
[ chemical formula 6]
Specific examples of the compound represented by the structural formula (3) include the following exemplified compounds (3-1) to (3-6).
[ chemical formula 7]
As the active ester compound, commercially available products can be used. As the commercially available active ester compounds, examples of the active ester compounds having a dicyclopentadiene type diphenol structure include "EXB 9451", "EXB 9460S" and "HPC-8000-65T" (available from DIC); examples of the active ester compound having an aromatic structure include "EXB 9416-70 BK", "EXB-8" and "EXB-9425" (available from DIC); examples of the active ester compound containing an acetylate of phenol novolac include "DC 808" (manufactured by Mitsubishi Chemical corporation); examples of the active ester compound including a benzoyl compound of phenol novolac include "YLH 1026" (manufactured by Mitsubishi Chemical corporation).
The active ester compounds can be used alone in 1 kind, also can be combined with more than 2 kinds.
The ester group equivalent of the active ester compound is not particularly limited. From the viewpoint of a balance among various characteristics such as moldability, reflow resistance, and electrical reliability, it is preferably from 150 to 400g/eq, more preferably from 170 to 300g/eq, and still more preferably from 200 to 250 g/eq.
The ester group equivalent of the active ester compound is defined by the following formula in accordance with JIS K0070: 1992.
From the viewpoint of suppressing the dielectric loss tangent of the cured product to be low, the equivalent ratio (ester group/epoxy group) of the epoxy resin to the active ester compound is preferably 0.9 or more, more preferably 0.95 or more, and still more preferably 0.97 or more.
From the viewpoint of suppressing the unreacted components of the active ester compound to a small amount, the equivalent ratio (ester group/epoxy group) of the epoxy resin to the active ester compound is preferably 1.1 or less, more preferably 1.05 or less, and still more preferably 1.03 or less.
The curing agent may contain other curing agents than the active ester compound. In this case, the kind of the other curing agent is not particularly limited, and may be selected according to the desired characteristics of the sealing resin composition. Examples of the other curing agent include a phenol curing agent, an amine curing agent, an acid anhydride curing agent, a polythiol curing agent, a polyaminoamide curing agent, an isocyanate curing agent, a blocked isocyanate curing agent, and the like.
Specific examples of the phenol curing agent include: polyhydric phenol compounds such as resorcinol, catechol, bisphenol a, bisphenol F, and substituted or unsubstituted diphenols; phenol novolac resins obtained by condensing or co-condensing aldehyde compounds such as formaldehyde, acetaldehyde and propionaldehyde with an acidic catalyst, wherein the phenolic compounds are at least one selected from phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol a, bisphenol F, phenylphenol and aminophenol, and naphthol compounds such as α -naphthol, β -naphthol and dihydroxynaphthalene; aralkyl phenol resins such as phenol aralkyl resins and naphthol aralkyl resins synthesized from the above phenolic compounds and dimethoxyp-xylene, bis (methoxymethyl) biphenyl and the like; p-xylene modified phenolic resin and m-xylene modified phenolic resin; melamine modified phenolic resin; terpene-modified phenolic resin; dicyclopentadiene type phenol resins and dicyclopentadiene type naphthol resins synthesized by copolymerization of the above-mentioned phenolic compounds with dicyclopentadiene; cyclopentadiene-modified phenol resin; polycyclic aromatic ring-modified phenol resins; biphenyl type phenol resin; a triphenylmethane-type phenol resin obtained by condensing or co-condensing the above phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst; a phenol resin obtained by copolymerizing two or more of these; and the like. These phenol curing agents may be used alone in 1 kind, or may be used in combination in 2 or more kinds.
The functional group equivalent (hydroxyl group equivalent in the case of a phenol curing agent) of the other curing agent is not particularly limited. From the viewpoint of a balance among various properties such as moldability, reflow resistance, and electrical reliability, it is preferably from 70g/eq to 1000g/eq, and more preferably from 80g/eq to 500 g/eq.
The functional group equivalent (hydroxyl group equivalent in the case of a phenol curing agent) of the other curing agent was determined by the following equation in accordance with JIS K0070: 1992.
In the case where the curing agent is a solid, the softening point or melting point thereof is not particularly limited. From the viewpoint of moldability and reflow resistance, it is preferably from 40 ℃ to 180 ℃, and more preferably from 50 ℃ to 130 ℃ from the viewpoint of handling properties in the production of the resin composition for sealing.
The melting point or softening point of the curing agent is measured in the same manner as the melting point or softening point of the epoxy resin.
The equivalent ratio of the epoxy resin to the entire curing agent (active ester compound and other curing agent), that is, the ratio of the number of functional groups in the curing agent to the number of functional groups in the epoxy resin (number of functional groups in the curing agent/number of functional groups in the epoxy resin) is not particularly limited. From the viewpoint of suppressing the amount of unreacted components to a small amount, the amount is preferably set to a range of 0.5 to 2.0, and more preferably 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, the range of 0.8 to 1.2 is more preferable.
From the viewpoint of suppressing the dielectric loss tangent of the cured product to be low, the content of the active ester compound with respect to the total mass of the active ester compound and the other curing agent is preferably 80 mass% or more, more preferably 85 mass% or more, and still more preferably 90 mass% or more.
From the viewpoint of suppressing the dielectric loss tangent of the cured product to be low, the content of the total of the epoxy resin and the active ester compound relative to the total mass of the epoxy resin, the active ester compound and the other curing agent is preferably 70 mass% or more, more preferably 80 mass% or more, and still more preferably 85 mass% or more.
(curing accelerators)
The sealing resin composition may contain a curing accelerator. The type of the curing accelerator is not particularly limited, and may be selected according to the type of the epoxy resin or the curing agent, the desired properties of the sealing resin composition, and the like.
Examples of the curing accelerator include: diazabicycloalkenes such as 1, 5-diazabicyclo [4.3.0] nonene-5 (DBN) and 1, 8-diazabicyclo [5.4.0] undecene-7 (DBU), and cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and 2-heptadecylimidazole; derivatives of the above cyclic amidine compounds; phenol novolac salts of the above cyclic amidine compounds or derivatives thereof; compounds having intramolecular polarization obtained by adding a quinone compound such as maleic anhydride, 1, 4-benzoquinone, 2, 5-toluquinone, 1, 4-naphthoquinone, 2, 3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2, 3-dimethoxy-5-methyl-1, 4-benzoquinone, 2, 3-dimethoxy-1, 4-benzoquinone, phenyl-1, 4-benzoquinone, or a compound having a pi bond such as diazophenylmethane to these compounds; cyclic amidine (アミジ di ウム) compounds such as tetraphenylborate of DBU, tetraphenylborate of DBN, tetraphenylborate of 2-ethyl-4-methylimidazole and tetraphenylborate of N-methylmorpholine, and isocyanate-added compounds; isocyanate adducts of DBU, isocyanate adducts of DBN, isocyanate adducts of 2-ethyl-4-methylimidazole, and isocyanate adducts of N-methylmorpholine; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris (dimethylaminomethyl) phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, tetrapropylammonium hydroxide and the like; tertiary phosphines such as triphenylphosphine, diphenyl (p-tolyl) phosphine, tri (alkylphenyl) phosphine, tri (alkoxyphenyl) phosphine, tri (alkyl-alkoxyphenyl) phosphine, tri (dialkylphenyl) phosphine, tri (trialkylphenyl) phosphine, tri (tetraalkylphenyl) phosphine, tri (dialkoxyphenyl) phosphine, tri (trialkoxyphenyl) phosphine, tri (tetraalkoxyphenyl) phosphine, trialkylphosphine, dialkylarylphosphine, and alkyldiarylphosphine; phosphine compounds such as complexes of the above tertiary phosphines with organic boron compounds; a compound having intramolecular polarization obtained by adding the tertiary phosphine or the phosphine compound to a compound having a pi bond such as maleic anhydride, 1, 4-benzoquinone, 2, 5-toluquinone, 1, 4-naphthoquinone, 2, 3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2, 3-dimethoxy-5-methyl-1, 4-benzoquinone, 2, 3-dimethoxy-1, 4-benzoquinone, phenyl-1, 4-benzoquinone, or the like, or diazophenylmethane; a halogenated phenol compound such as 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodophenol, 3-iodophenol, 2-iodophenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2, 6-dimethylphenol, 4-bromo-3, 5-dimethylphenol, 4-bromo-2, 6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, 4-bromo-4' -hydroxybiphenyl, etc., followed by a dehydrohalogenation step, A compound having intramolecular polarization; tetra-substituted phosphonium such as tetraphenylphosphonium, tetra-p-tolylborate, etc. which are free from phenyl groups bonded to boron atoms; salts of tetraphenylphosphonium with phenolic compounds; salts of partial hydrolyzates of tetraalkylphosphonium and aromatic carboxylic acid anhydrides, and the like.
When the sealing resin composition contains a curing accelerator, the amount thereof is preferably 0.1 to 30 parts by mass, and more preferably 1 to 15 parts by mass, per 100 parts by mass of the resin component (the total amount of the epoxy resin and the curing agent). If the amount of the curing accelerator is 0.1 part by mass or more per 100 parts by mass of the resin component, the curing tends to be good in a short time. If the amount of the curing accelerator is 30 parts by mass or less per 100 parts by mass of the resin component, the curing rate tends not to be too high, and a good molded article tends to be obtained.
(inorganic Filler)
In the sealing resin composition of the present disclosure, the inorganic filler contained therein has an average particle diameter of less than 10 μm. From the viewpoint of improving the narrow-path filling property, the average particle diameter of the inorganic filler is less than 10 μm, preferably less than 9 μm. From the viewpoint of suppressing aggregation of the inorganic fillers, the average particle diameter of the inorganic filler is preferably 3 μm or more, and more preferably 5 μm or more.
From the viewpoint of further improving the narrow-path filling property, the maximum particle diameter of the inorganic filler contained in the sealing resin composition of the present disclosure is preferably less than 30 μm, more preferably less than 25 μm, and still more preferably less than 20 μm.
The average particle diameter of the inorganic filler is a value as follows: in an image obtained by imaging a thin sample of the sealing resin composition or a cured product thereof with a scanning electron microscope, the major axes of 100 inorganic fillers selected at random were measured, and the values were arithmetically averaged. The maximum particle size of the inorganic filler is the maximum of the above-mentioned 100 major diameters.
The kind of the inorganic filler is not particularly limited. Specific examples thereof include inorganic materials such as fused silica, crystalline silica, glass, alumina, talc, clay, and mica. Inorganic filler materials having a flame retardant effect may also be used. Examples of the inorganic filler having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as composite hydroxide of magnesium and zinc, zinc borate, and the like.
Among the inorganic fillers, silica such as fused silica is preferable from the viewpoint of reducing the linear expansion coefficient, and alumina is preferable from the viewpoint of high thermal conductivity. The inorganic filler may be used alone in 1 kind, or may be used in combination in 2 or more kinds. Examples of the form of the inorganic filler include powder, beads obtained by spheroidizing the powder, and fibers.
The content of the inorganic filler contained in the sealing resin composition is not particularly limited. From the viewpoint of fluidity and strength, the volume of the entire sealing resin composition is preferably 30 to 90 vol%, more preferably 35 to 80 vol%, and still more preferably 40 to 70 vol%. If the content of the inorganic filler is 30 vol% or more of the entire sealing resin composition, the properties such as the thermal expansion coefficient, thermal conductivity, and elastic modulus of the cured product tend to be further improved. If the content of the inorganic filler is 90 vol% or less of the entire sealing resin composition, the increase in viscosity of the sealing resin composition is suppressed, the fluidity is further improved, and the moldability tends to be further improved.
[ various additives ]
The sealing resin composition may contain various additives such as a coupling agent, an ion exchanger, a release agent, a flame retardant, and a colorant, which are exemplified below, in addition to the above components. The sealing resin composition may contain, in addition to the additives exemplified below, various additives known in the art as needed.
(coupling agent)
The sealing resin composition may contain a coupling agent. The sealing resin composition preferably contains a coupling agent from the viewpoint of improving the adhesiveness between the resin component and the inorganic filler. Examples of the coupling agent include: known coupling agents such as silane-based compounds such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, vinyl silane, and disilazane, titanium-based compounds, aluminum chelate compounds, and aluminum/zirconium-based compounds.
When the sealing resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 to 5 parts by mass, and more preferably 0.1 to 2.5 parts by mass, per 100 parts by mass of the inorganic filler. If the amount of the coupling agent is 0.05 parts by mass or more per 100 parts by mass of the inorganic filler, the adhesion to the frame tends to be further improved. If the amount of the coupling agent is 5 parts by mass or less based on 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
(ion exchanger)
The sealing resin composition may contain an ion exchanger. The sealing resin composition preferably contains an ion exchanger from the viewpoint of improving moisture resistance and high-temperature storage characteristics of an electronic component device provided with an element to be sealed. The ion exchanger is not particularly limited, and conventionally known ion exchangers can be used. Specifically, there may be mentioned hydrotalcite compounds, and hydrous oxides of at least 1 element selected from magnesium, aluminum, titanium, zirconium and bismuth. The ion exchanger may be used alone in 1 kind, or may be used in combination of 2 or more kinds. Among them, hydrotalcite represented by the following general formula (a) is preferable.
Mg(1-X)AlX(OH)2(CO3)X/2·mH2O……(A)
(0< X < 0.5, m is positive number)
When the sealing resin composition contains an ion exchanger, the content thereof is not particularly limited as long as it is a sufficient amount for capturing halogen ions or the like. For example, the amount is preferably 0.1 to 30 parts by mass, more preferably 1 to 10 parts by mass, per 100 parts by mass of the resin component (total amount of the epoxy resin curing agent).
(mold releasing agent)
The sealing resin composition may contain a release agent from the viewpoint of obtaining good releasability from a mold at the time of molding. The release agent is not particularly limited, and a conventionally known release agent can be used. Specifically, examples thereof include higher fatty acids such as carnauba wax, montanic acid, stearic acid, etc., higher fatty acid metal salts, ester-based waxes such as montanic acid esters, etc., and polyolefin-based waxes such as oxidized polyethylene, non-oxidized polyethylene, etc. The release agent may be used alone in 1 kind, or may be used in combination in 2 or more kinds.
When the sealing resin composition contains a release agent, the amount thereof is preferably 0.01 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass, per 100 parts by mass of the resin component (the total amount of the epoxy resin and the curing agent). When the amount of the release agent is 0.01 parts by mass or more per 100 parts by mass of the resin component, the releasability tends to be sufficiently obtained. When the amount is 10 parts by mass or less, more excellent adhesiveness tends to be obtained.
(flame retardant)
The sealing resin composition may contain a flame retardant. The flame retardant is not particularly limited, and conventionally known flame retardants can be used. Specifically, there may be mentioned: organic or inorganic compounds containing a halogen atom, an antimony atom, a nitrogen atom or a phosphorus atom, metal hydroxides, and the like. The flame retardant may be used alone in 1 kind, or may be used in combination in 2 or more kinds.
When the sealing resin composition contains a flame retardant, the amount thereof is not particularly limited as long as it is an amount sufficient to obtain a desired flame retardant effect. For example, the amount is preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass, per 100 parts by mass of the resin component (the total amount of the epoxy resin and the curing agent).
(coloring agent)
The sealing resin composition may contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The content of the colorant may be appropriately selected depending on the purpose and the like. The colorant may be used alone in 1 kind, or may be used in combination in 2 or more kinds.
(method for producing sealing resin composition)
The method for producing the sealing resin composition is not particularly limited. Typical methods include: a method in which components are sufficiently mixed in a predetermined mixing amount by a mixer or the like, and then melt-kneaded by a grinding roll, an extruder or the like, cooled, and pulverized. More specifically, examples thereof include: a method of uniformly stirring and mixing predetermined amounts of the above components, kneading, cooling, and pulverizing the mixture by a kneader, a roll, an extruder, or the like heated to 70 to 140 ℃.
The sealing resin composition is preferably solid at normal temperature and normal pressure (e.g., 25 ℃ C., atmospheric pressure). The shape of the sealing resin composition in the case of being a solid is not particularly limited, and examples thereof include powder, granule, and sheet. From the viewpoint of handling properties, the size and mass of the sealing resin composition in the form of a sheet are preferably such that they meet the molding conditions of the package.
< electronic component device >
An electronic component device according to an embodiment of the present disclosure includes a support member, an element disposed on the support member, and a cured product of the sealing resin composition of the present disclosure filling a narrow path around the element.
An electronic component device as one embodiment of the present disclosure has a narrow path filled with the sealing resin composition of the present disclosure. The narrow path includes a gap between the support member and the element, a gap between the adjacent elements, and the like. As an electronic component device according to an embodiment of the present disclosure, a part or the whole of the electronic component device other than the narrow path may be sealed with the sealing resin composition of the present disclosure.
Examples of the electronic component device include: a device obtained by sealing an element portion obtained by mounting an element (active element such as a semiconductor chip, a transistor, a diode, or a thyristor, or a passive element such as a capacitor, a resistor, or a coil) on a support member such as a lead frame, a wired tape carrier, a wiring board, glass, a silicon wafer, or an organic substrate with a sealing resin composition.
More specifically, there may be mentioned: a typical resin-sealed IC such as DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier with leads), QFP (Quad Flat Package), SOP (Small Outline Package), SOJ (Small Outline J-lead Package), TSOP (Thin Small Outline Package), TQFP (Thin Quad Flat Package), and TQFP (Thin Quad Flat Package) has a structure in which an element is fixed to a lead frame, and a terminal portion of an element such as a bonding pad and the like is connected to a lead portion by wire bonding, a bump, and the like, and then sealed by transfer molding or the like using a sealing resin composition; a TCP (Tape Carrier Package) having a structure in which a device connected to a Tape Carrier by bumps is sealed with a sealing resin composition; a COB (Chip On Board) module, a hybrid IC, a multi-Chip module, and the like, which have a structure in which an element connected to a wiring formed On a support member by wire bonding, flip Chip bonding, solder, or the like is sealed with a sealing resin composition; BGA (Ball Grid Array), CSP (Chip Size Package), and MCP (Multi Chip Package) having a structure in which a device is mounted on the surface of a support member having terminals for connecting a wiring board formed on the back surface thereof, the device is connected to a wiring formed on the support member by bump or wire bonding, and then the device is sealed with a sealing resin composition; SiP (system in a package) in which a plurality of elements are sealed in 1 package.
< method for producing electronic component device >
The method for manufacturing the electronic component device of the present disclosure includes: a step of disposing the element on the support member, and a step of filling a narrow path around the element with the sealing resin composition of the present disclosure.
The method for carrying out each step is not particularly limited, and can be carried out by a usual method. In addition, the kind of the supporting member and the element used in the manufacture of the electronic component device is not particularly limited, and a supporting member and an element generally used in the manufacture of the electronic component device may be used.
The step of filling the narrow path around the element with the sealing resin composition of the present disclosure may be: and sealing a part of the space other than the narrow path in the electronic component device or the whole electronic component device simultaneously with the narrow path around the filler element.
Examples of a method for filling a narrow path around an element with the sealing resin composition of the present disclosure include a low-pressure transfer molding method, an injection molding method, a compression molding method, and the like. Among them, low-pressure transfer molding is common.
Examples
The above embodiments will be specifically described below by way of examples, but the scope of the above embodiments is not limited to these examples.
< preparation of sealing resin composition >
The components shown below were mixed in the mixing ratios shown in table 1 to prepare sealing resin compositions of examples and comparative examples. The sealing resin composition is solid at normal temperature and pressure.
Epoxy resin 1: biphenylalkyl type epoxy resin, epoxy equivalent 274g/eq (Nippon Kagaku Co., Ltd., trade name "NC-3000")
Epoxy resin 2: triphenylmethane type epoxy resin having an epoxy equivalent of 167g/eq (Mitsubishi Chemical Co., Ltd., trade name "1032H 60")
Epoxy resin 3: biphenyl type epoxy resin having an epoxy equivalent of 192g/eq (Mitsubishi Chemical Co., Ltd., trade name "YX-4000")
Active ester compound 1: DIC corporation, trade name "EXB-8"
Active ester compound 2: DIC corporation, trade name "EXB-9425"
Phenol curing agent 1: phenol aralkyl resin, hydroxyl equivalent 175g/eq (product name "MEH 7800 SS" manufactured by Minghuaji Co., Ltd.)
Curing accelerator 1: triphenylphosphine/1, 4-benzoquinone adduct
Curing accelerator 2: imidazole Compound (product name "CUREZOL 2E4 MZ" available from Situo Kasei Kogyo Co., Ltd.)
Filler 1: fused silica (DENKA, trade name "FB-310 MDC")
Filler 2: fused silica (Micron company, trade name "ST 7010-2")
Filler 3: fused silica (Admatechs corporation, trade name "SO-25R")
Filler 4: fused silica (DENKA, trade name "FB-9454 FC")
Filler 5: fused silica (Micron company, trade name "ST 7010-3")
Coupling agent 1: n-phenyl-3-aminopropyltrimethoxysilane (shin Etsu chemical industry Co., Ltd., trade name "KBM-573")
Coupling agent 2: 3-mercaptopropyltrimethoxysilane (trade name "KBM-803" from shin-Etsu chemical Co., Ltd.)
Mold release agent: montanic acid ester wax (Clariant Japan K.K., trade name "HW-E")
The colorant: carbon Black (Mitsubishi Chemical Co., Ltd., trade name "MA 600")
< evaluation of Properties of sealing resin composition >
(average particle diameter and maximum particle diameter of inorganic filler)
In an image obtained by imaging a thin sample of the sealing resin composition by a scanning electron microscope, the major axes (μm) of 100 inorganic fillers selected at random were measured, and the arithmetic mean of the major axes was determined as an average particle diameter. The maximum value among the 100 major axes (μm) is defined as the maximum particle diameter.
(spiral flow)
The resin composition for sealing was molded at a mold temperature of 180 ℃ under a molding pressure of 6.9MPa for a curing time of 90 seconds using a mold for spiral flow measurement according to EMMI-1-66 to determine a flow distance (cm).
(narrow road filling property)
A test chip of the form shown in fig. 1 and 2 was prepared. That is, 3 chips 3 (10 mm in length × 10mm in width × 250 μm in thickness) obtained by cutting a silicon wafer were placed on a substrate 1 (50 mm in length × 250mm in width × 0.2mm in thickness) with a chip attachment tape 6 (1.0 mm in width, 40 μm in thickness), and pressure-bonded at 200 ℃ for 10 seconds.
Next, the sealing resin composition was charged into a transfer molding machine, and was molded under conditions of a mold temperature of 180 ℃, a molding pressure of 6.9MPa, and a curing time of 150 seconds, and was post-cured at 180 ℃ for 5 hours. The dimensions of the molding were 50mm in the vertical direction, 250mm in the horizontal direction, and 0.5mm in the thickness of the substrate 1.
1mm which is visually observed between the chip 3 and the substrate 1 is measured from the surface opposite to the element mounting surface2The total area is obtained as the area of the above-mentioned voids.
(relative permittivity and dielectric loss tangent)
The sealing resin composition was charged into a vacuum hand press, and was molded at a mold temperature of 175 ℃, a molding pressure of 6.9MPa, and a curing time of 600 seconds, and after-cured at 180 ℃ for 6 hours to obtain a sheet-like cured product (12.5 mm in length, 25mm in width, and 0.2mm in thickness). The plate-like cured product was used as a test piece, and the relative dielectric constant and the dielectric loss tangent at about 60GHz were measured at 25. + -. 3 ℃ using a dielectric constant measuring apparatus (Agilent Technologies, trade name: network analyzer N5227A).
(Water absorption)
Immediately after the production, the plate-like cured product was put into a pressure cooker cooking test apparatus at 121 ℃/2.1 atm, and taken out after 24 hours to determine the rate of increase (%) from the mass immediately before the putting.
[ Table 1]
All documents, patent applications, and technical standards described in the present specification are incorporated by reference to the same extent as if each document, patent application, and technical standard was specifically and individually described, and are incorporated by reference into the present specification to the same extent.
Description of reference numerals
1: substrate
3: chip and method for manufacturing the same
6: chip mounting tape
Claims (5)
1. A sealing resin composition for use in narrow-passage filling,
the sealing resin composition contains an epoxy resin, a curing agent and an inorganic filler,
the curing agent comprises an active ester compound,
the inorganic filler material has an average particle diameter of less than 10 μm.
2. The sealing resin composition according to claim 1, wherein the maximum particle diameter of the inorganic filler is less than 20 μm.
3. The resin composition for sealing according to claim 1 or 2, which is used for mold underfill.
4. An electronic component device, comprising:
a support member;
an element disposed on the support member; and
a cured product of the sealing resin composition according to any one of claims 1 to 3, which fills a narrow gap around the element.
5. A method of manufacturing an electronic component device, comprising:
disposing the element on the support member; and
a step of filling a throat around the element with the sealing resin composition according to any one of claims 1 to 3.
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| Application Number | Priority Date | Filing Date | Title |
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| PCT/JP2018/036100 WO2020065873A1 (en) | 2018-09-27 | 2018-09-27 | Resin composition for encapsulation, electronic component device and method for manufacturing electronic component device |
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| JP (2) | JPWO2020065873A1 (en) |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103328531A (en) * | 2011-01-28 | 2013-09-25 | 住友电木株式会社 | Epoxy resin composition for sealing, and electronic component device |
| CN103517948A (en) * | 2011-05-13 | 2014-01-15 | 日立化成株式会社 | Epoxy resin molding material for encapsulation and electronic component device |
| JP2016117904A (en) * | 2009-11-26 | 2016-06-30 | 味の素株式会社 | Epoxy resin composition |
| JP2017048400A (en) * | 2016-11-29 | 2017-03-09 | 味の素株式会社 | Resin composition |
| JP2018058959A (en) * | 2016-10-03 | 2018-04-12 | 味の素株式会社 | Resin composition |
| JP2018145409A (en) * | 2017-03-03 | 2018-09-20 | 味の素株式会社 | Resin composition |
-
2018
- 2018-09-27 WO PCT/JP2018/036100 patent/WO2020065873A1/en active Application Filing
- 2018-09-27 JP JP2020547759A patent/JPWO2020065873A1/en active Pending
- 2018-09-27 CN CN201880098074.XA patent/CN112752795A/en active Pending
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- 2023-02-07 JP JP2023017064A patent/JP2023059892A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016117904A (en) * | 2009-11-26 | 2016-06-30 | 味の素株式会社 | Epoxy resin composition |
| CN103328531A (en) * | 2011-01-28 | 2013-09-25 | 住友电木株式会社 | Epoxy resin composition for sealing, and electronic component device |
| CN103517948A (en) * | 2011-05-13 | 2014-01-15 | 日立化成株式会社 | Epoxy resin molding material for encapsulation and electronic component device |
| JP2018058959A (en) * | 2016-10-03 | 2018-04-12 | 味の素株式会社 | Resin composition |
| JP2017048400A (en) * | 2016-11-29 | 2017-03-09 | 味の素株式会社 | Resin composition |
| JP2018145409A (en) * | 2017-03-03 | 2018-09-20 | 味の素株式会社 | Resin composition |
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| JP2023059892A (en) | 2023-04-27 |
| JPWO2020065873A1 (en) | 2021-08-30 |
| TW202031781A (en) | 2020-09-01 |
| WO2020065873A1 (en) | 2020-04-02 |
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