CN112739071A - Novel preparation method of rigid-flex printed circuit board prepreg - Google Patents
Novel preparation method of rigid-flex printed circuit board prepreg Download PDFInfo
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- CN112739071A CN112739071A CN202011242313.XA CN202011242313A CN112739071A CN 112739071 A CN112739071 A CN 112739071A CN 202011242313 A CN202011242313 A CN 202011242313A CN 112739071 A CN112739071 A CN 112739071A
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- prepreg
- rigid
- board
- flex board
- flex
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention discloses a preparation method of a novel rigid-flex board prepreg, belongs to the technical field of circuit board manufacturing, is suitable for windowing manufacturing of the prepreg of a rigid-flex board product, and comprises the following steps: s1, fixing the prepreg to be windowed; s2, aligning the windowing position of the prepreg to the windowing position of the rigid-flex board; s3, punching the semi-solidified sheet by using the drill hole, and carrying out primary forming; s4, pressing the formed prepreg with a hard board and a soft board in the rigid-flex board; and S5, after checking that no abnormity exists, finishing the preparation of the soft-hard combination board prepreg. This novel rigid-flex board prepreg preparation method through optimizing prepreg preparation flow, by original drilling + cutting die flow, changes drilling into and directly accomplishes, not only practices thrift half time and cost, still can practice thrift cutting die expense, also provides convenience for manufacturing simultaneously, has improved the efficiency of prepreg production preparation.
Description
Technical Field
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a preparation method of a novel rigid-flex printed circuit board prepreg.
Background
The prepreg, also called as "PP sheet", is one of the main materials in the production of multilayer boards, and mainly comprises resin and reinforcing materials, the reinforcing materials are classified into several types such as glass fiber cloth, paper base, composite materials, and the like, and most prepregs (bonding sheets) used for manufacturing multilayer printed boards adopt glass fiber cloth as the reinforcing materials.
The treated glass fiber cloth is soaked with resin glue solution, and then the resin enters the B stage through heat treatment (pre-drying), so that the prepared sheet material is called a prepreg, which can be softened under the heating and pressurizing condition and can be reacted and solidified after cooling.
The main appearance requirements of prepregs for multilayer boards are: the cloth should be smooth, free of oil, smut, foreign matter or other imperfections, free of cracks and excess resin powder, but allow for micro-cracking. In the design process of the circuit board, if the design of the multilayer board is adopted, a prepreg is required.
In the prior art, the current industry soft and hard combines board inlayer prepreg preparation flow all uses drilling + cutting die to accomplish, along with market competition is more and more intense, product production cycle and cost management and control are constantly compressing, current prepreg preparation flow drilling + cutting die mode, and the preparation flow is longer, prolongs customer's hand-over period and increase cost, and the die-cut position that easily produces after the cutting die preparation prepreg in addition has the wire drawing phenomenon, appears the bad hidden danger of excessive glue after the pressfitting.
Therefore, a novel preparation method of the rigid-flexible printed circuit board prepreg is provided to solve the problems.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a novel preparation method of a rigid-flex prepreg, which aims to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a preparation method of a novel rigid-flex board prepreg is suitable for windowing manufacture of the rigid-flex board product prepreg and comprises the following steps:
s1, fixing the prepreg to be windowed;
s2, aligning the windowing position of the prepreg to the windowing position of the rigid-flex board;
s3, punching the semi-solidified sheet by using the drill hole, and carrying out primary forming;
s4, pressing the formed prepreg with a hard board and a soft board in the rigid-flex board;
and S5, after checking that no abnormity exists, finishing the preparation of the soft-hard combination board prepreg.
Further optimize this technical scheme, in S1, the equipment that the prepreg fixed including be used for placing the base plate of prepreg, the base plate is the sunk structure and designs for the prepreg is placed and is stabilized the preparation in the sunken department of base plate.
In step S2, the windowing position of the prepreg is not only required to be aligned with the windowing position of the rigid-flex board, but also the windowing size is required to be the same as that of the rigid-flex board.
Further optimizing the technical scheme, the output end of the drilling hole is perpendicular to the substrate, and the width range of the drilling hole is larger than that of the prepreg.
Further optimize this technical scheme, in S3, drilling carries out fixed mounting based on the punch press, drilling is located the cover half of punch press, the punch press is located prepreg and places the position directly over.
Further optimizing the technical scheme, in the step S3, the drill hole dense drill is additionally arranged on the surface inside the drill hole, and the drill hole is directly drilled by a large drill pin with the diameter of 3.0 mm.
Compared with the prior art, the invention provides a preparation method of a novel rigid-flex board prepreg, which has the following beneficial effects:
this novel rigid-flex board prepreg preparation method through optimizing prepreg preparation flow, by original drilling + cutting die flow, changes drilling directly into and accomplishes now, not only practices thrift half time and cost, still can practice thrift cutting die expense, also provides convenience for manufacturing simultaneously, has improved the efficiency of prepreg production preparation.
Drawings
Fig. 1 is a comparison diagram of a technical method of a novel rigid-flex board prepreg preparation method provided by the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1, a method for preparing a novel rigid-flex board prepreg is suitable for windowing of a rigid-flex board product prepreg, and includes the following steps:
s1, fixing the prepreg to be windowed;
s2, aligning the windowing position of the prepreg to the windowing position of the rigid-flex board;
s3, punching the semi-solidified sheet by using a drill hole, and performing primary molding on the semi-solidified sheet by using the drill hole under the driving of a punch;
s4, pressing the formed prepreg with a hard board and a soft board in the rigid-flex board;
and S5, after checking that no abnormity exists, finishing the preparation of the soft-hard combination board prepreg.
Specifically, in S1, the prepreg fixing device includes a substrate for placing the prepreg, and the substrate is designed to be a recessed structure, so that the prepreg is placed in a recess of the substrate for stable manufacturing.
Specifically, in S2, the windowing position of the prepreg is not only required to be aligned with the windowing position of the rigid-flex board, but also the windowing size is required to be the same as the windowing of the rigid-flex board.
Specifically, the output end of the drilling hole is perpendicular to the substrate, and the width range of the drilling hole is larger than that of the prepreg.
Specifically, in S3, the drill hole is fixedly installed on the basis of a punch, the drill hole is located on a fixed die of the punch, and the punch is located right above a prepreg placement position.
Specifically, in S3, the prepreg blanking process is directly completed by drilling instead of the original drilling and cutting die process, the original prepreg needs to be densely drilled by additionally drilling at the cutting die position, and the prepreg is directly drilled by using a large 3.0mm drill bit, according to multiple test data, the original drilling and cutting die manufacturing time is 4H/LOT, and only 2H/LOT is needed to directly complete the drilling by directly changing the original drilling and cutting die into the large drill bit.
Through a plurality of tests, the manufacturing scheme is adopted to successfully optimize the manufacturing process of the prepregs in batches, no abnormity is found after pressing is completed, the problem of poor glue overflow is avoided, the manufacturing efficiency is high, a good effect is achieved, half of time and cost are saved, the cost of a cutting die can be saved, convenience is provided for production and manufacturing, and the efficiency is more than 2 times that of the original drilling and cutting die manufacturing.
Example two:
a preparation method of a novel rigid-flex board prepreg is suitable for windowing manufacture of the rigid-flex board product prepreg and comprises the following steps:
s1, fixing the prepreg to be windowed;
s2, aligning the windowing position of the prepreg to the windowing position of the rigid-flex board;
s3, punching the semi-solidified sheet by using a drill hole, and performing primary molding on the semi-solidified sheet by using the drill hole under the driving of a punch;
s4, pressing the formed prepreg with a hard board and a soft board in the rigid-flex board;
and S5, after checking that no abnormity exists, finishing the preparation of the soft-hard combination board prepreg.
Specifically, in S1, the prepreg fixing device includes a substrate for placing the prepreg, and the substrate is designed to be a recessed structure, so that the prepreg is placed in a recess of the substrate for stable manufacturing.
Specifically, in S2, the windowing position of the prepreg is not only required to be aligned with the windowing position of the rigid-flex board, but also the windowing size is required to be the same as the windowing of the rigid-flex board.
Specifically, the output end of the drilling hole is perpendicular to the substrate, and the width range of the drilling hole is larger than that of the prepreg.
Specifically, in S3, the drill hole is fixedly installed on the basis of a punch, the drill hole is located on a fixed die of the punch, and the punch is located right above a prepreg placement position.
Specifically, in S3, the prepreg blanking process is directly completed by drilling instead of the original drilling and cutting die process, the original prepreg needs to be densely drilled by additionally drilling at the cutting die position, and the prepreg is directly drilled by using a large 3.5mm drill bit, according to multiple test data, the original drilling and cutting die manufacturing time is 4H/LOT, and only 1.5H/LOT is needed for directly completing the drilling by directly changing the original drilling and cutting die into the large drill bit.
Through a plurality of tests, the manufacturing scheme is adopted to successfully optimize the prepreg manufacturing process in batches, the wire drawing phenomenon does not exist in the blanking position, abnormality is not found after the pressing, the problem of poor glue overflow is not caused, the manufacturing efficiency is high, the good effect is achieved, half time and cost are saved, the cost of the cutting die can be saved, convenience is provided for manufacturing, and the efficiency is more than 1.5 times that of the original drilling and cutting die manufacturing.
Example three:
a preparation method of a novel rigid-flex board prepreg is suitable for windowing manufacture of the rigid-flex board product prepreg and comprises the following steps:
s1, fixing the prepreg to be windowed;
s2, aligning the windowing position of the prepreg to the windowing position of the rigid-flex board;
s3, punching the semi-solidified sheet by using a drill hole, and performing primary molding on the semi-solidified sheet by using the drill hole under the driving of a punch;
s4, pressing the formed prepreg with a hard board and a soft board in the rigid-flex board;
and S5, after checking that no abnormity exists, finishing the preparation of the soft-hard combination board prepreg.
Specifically, in S1, the prepreg fixing device includes a substrate for placing the prepreg, and the substrate is designed to be a recessed structure, so that the prepreg is placed in a recess of the substrate for stable manufacturing.
Specifically, in S2, the windowing position of the prepreg is not only required to be aligned with the windowing position of the rigid-flex board, but also the windowing size is required to be the same as the windowing of the rigid-flex board.
Specifically, the output end of the drilling hole is perpendicular to the substrate, and the width range of the drilling hole is larger than that of the prepreg.
Specifically, in S3, the drill hole is fixedly installed on the basis of a punch, the drill hole is located on a fixed die of the punch, and the punch is located right above a prepreg placement position.
Specifically, in S3, the prepreg blanking process is directly completed by drilling instead of the original drilling and cutting die process, the original prepreg needs to be densely drilled by additionally drilling at the cutting die position, and the prepreg is directly drilled by using a large 4.0mm drill bit, according to multiple test data, the original drilling and cutting die manufacturing time is 4H/LOT, and only 1H/LOT is needed for directly completing the drilling by directly changing the original drilling and cutting die into the large drill bit.
Through a plurality of tests, the manufacturing scheme is adopted to successfully optimize the prepreg manufacturing process in batches, the wire drawing phenomenon does not exist in the blanking position, abnormality is not found after the pressing, the problem of poor glue overflow is not caused, the manufacturing efficiency is high, the good effect is achieved, half time and cost are saved, the cost of the cutting die can be saved, convenience is provided for manufacturing, and the efficiency is more than 1.2 times that of the original drilling and cutting die manufacturing.
The invention has the beneficial effects that: this novel rigid-flex board prepreg preparation method through optimizing prepreg preparation flow, by original drilling + cutting die flow, changes drilling directly into and accomplishes now, not only practices thrift half time and cost, still can practice thrift cutting die expense, also provides convenience for manufacturing simultaneously, has improved the efficiency of prepreg production preparation.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A novel preparation method of a rigid-flex board prepreg is suitable for windowing manufacture of the rigid-flex board product prepreg and is characterized by comprising the following steps:
s1, fixing the prepreg to be windowed;
s2, aligning the windowing position of the prepreg to the windowing position of the rigid-flex board;
s3, punching the semi-solidified sheet by using the drill hole, and carrying out primary forming;
s4, pressing the formed prepreg with a hard board and a soft board in the rigid-flex board;
and S5, after checking that no abnormity exists, finishing the preparation of the soft-hard combination board prepreg.
2. The method according to claim 1, wherein in step S1, the equipment for fixing the prepreg includes a substrate for placing the prepreg, and the substrate is designed to be a recessed structure, so that the prepreg is placed in a recess of the substrate for stable manufacturing.
3. The method for preparing the novel rigid-flex board prepreg according to claim 1, wherein in step S2, the windowing position of the prepreg is not only required to be aligned with the windowing position of the rigid-flex board, but also required to be the same as the windowing position of the rigid-flex board.
4. The method for preparing the novel rigid-flex board prepreg according to claim 2, wherein the output end of the drilling hole is vertical to the substrate, and the width range of the drilling hole is larger than that of the prepreg.
5. The method for preparing the novel rigid-flex board prepreg according to claim 1, wherein in the step S3, the drill hole is fixedly installed on the basis of a punch press, the drill hole is located on a fixed die of the punch press, and the punch press is located right above a position where the prepreg is placed.
6. The method for preparing a novel rigid-flex printed circuit board prepreg according to claim 1, wherein in the step S3, the drill holes are densely drilled on the surface inside the drill holes, and the drill holes are directly drilled by using a 3.0mm large drill pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011242313.XA CN112739071A (en) | 2020-11-09 | 2020-11-09 | Novel preparation method of rigid-flex printed circuit board prepreg |
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| CN202011242313.XA CN112739071A (en) | 2020-11-09 | 2020-11-09 | Novel preparation method of rigid-flex printed circuit board prepreg |
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Application publication date: 20210430 |