CN112739029A - Manufacturing method and control method for manufacturing 3D circuit board based on photocuring - Google Patents
Manufacturing method and control method for manufacturing 3D circuit board based on photocuring Download PDFInfo
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- CN112739029A CN112739029A CN202110021520.0A CN202110021520A CN112739029A CN 112739029 A CN112739029 A CN 112739029A CN 202110021520 A CN202110021520 A CN 202110021520A CN 112739029 A CN112739029 A CN 112739029A
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- circuit board
- resin
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- metal
- photocuring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a manufacturing method and a control method for manufacturing a 3D circuit board based on photocuring. The control method comprises the following steps: firstly, electrifying and starting a system; secondly, judge whether the first resin layer exists on the base layer If yes, entering the next step, and if not, entering the step; forming the resin part; fourthly, cleaning a working plane; fifthly, forming a metal part; sixthly, drying the circuit board; hobbling removes excess; and is it the last layer judged If not, returning to the step three, if yes, entering the next step: and (5) performing final treatment of the self-skin. The invention provides a method and equipment for producing a circuit board by using the existing circuit processing material and 3D printing consumables, and solves the processing and production problems of a three-dimensional, ultra-multilayer, ultra-high speed, radio frequency or ultra-high density circuit board at relatively low cost.
Description
Technical Field
The invention belongs to the technical field of 3D printing, and particularly relates to a manufacturing method and a control method for manufacturing a 3D circuit board based on photocuring.
Background
The existing solutions for manufacturing printed circuit boards by means of 3D printing techniques have various drawbacks. For example, the method for manufacturing the 3D printed circuit board by using the FDM method has poor precision, and the method for manufacturing the 3D printed circuit board by using the SLS method has high cost of processing consumables, high equipment price, short service life and the like. Meanwhile, the traditional circuit board production mode is not suitable for the rapid production and manufacturing of small batches or samples, and the future more precise circuit board or the ultra-many wiring layers within a certain thickness are difficult to manufacture. For example, currently, large small-batch or prototype factories at home and abroad do not usually process high-difficulty and ultra-multilayer circuit boards. With the development of the technology, computers, smart phones, wearable devices, various sensor systems and devices with special structures need a device which is more acceptable in cost and faster in circuit board processing and manufacturing to meet the actual needs.
CN202010786021.6 discloses a photocuring 3D printing resin, a preparation method and application thereof, and a 3D printing product. One of the purposes is to provide photocuring 3D printing resin for manufacturing electronic circuits, solve the problem that the conventional printed circuit board manufacturing technology (PCB) can not manufacture customized three-dimensional electronic circuits, and solve the limitation that molded interconnection device technology (MID) equipment is expensive and is not suitable for small and medium-scale customized production; the second purpose is to provide a preparation method of the photocuring 3D printing resin; the third purpose is to provide the application of the 3D printing resin; the fourth purpose is to provide a 3D printing product.
The preparation method of the photocuring 3D printing resin comprises the following steps:
mixing a cationic photo-curing resin prepolymer and a cationic photo-initiator in proportion, heating and stirring, and then adding a cationic photo-curing resin active diluent to obtain an intermediate product A;
mixing, heating and stirring the free radical type photo-curing resin prepolymer and the free radical type photoinitiator in proportion, and then adding the free radical type photo-curing resin reactive diluent to obtain an intermediate product B;
thirdly, uniformly mixing the intermediate product A and the intermediate product B in a dark place to obtain a photo-curing resin base material;
fourthly, mixing a laser-activatable metal compound with a solvent, performing ball milling treatment, and drying to obtain metal compound powder;
and fifthly, mixing the metal compound powder with the photocuring resin base material, the dispersing agent and the defoaming agent, putting the mixed product into a vacuum kettle, and defoaming in a dark place to obtain the composite material. The method has the defects that the usable metal types are few, the material preparation process is complex, the electrical performance after activation is poor, the mechanical strength of the resin part is influenced in the laser activation process, and the processing precision is difficult to control.
CN201910615328.7 discloses a method for manufacturing a 3D printed circuit board, which aims to provide a method for manufacturing a 3D printed circuit board that can print with a single material, simplify the equipment and process, and effectively avoid the defects of bending, poor connection or scorching, etc. caused by the difference of material properties such as thermal expansion coefficient, etc. when the insulating layer and the conductive layer are printed layer by layer. The preparation method of the 3D printed circuit board comprises the following steps: preparing a conductive circuit: manufacturing a conductive circuit by using a 3D printing technology; coating insulating liquid: immersing the conductive line in an insulating liquid; curing and forming: and carrying out curing molding to make the insulating liquid adhere to the surface of the conductive circuit. The method has the defects that the prefabricated metal wiring can influence the structure which can be processed during subsequent curing, and the wiring can cause the light curing failure and can not be processed when being overlapped.
Disclosure of Invention
The invention aims to provide a method and equipment for producing a circuit board by using the existing circuit processing material and 3D printing consumables, and a method and a control method for producing the 3D circuit board based on photocuring, which solve the processing and production problems of three-dimensional, ultra-multilayer, ultra-high speed, radio frequency or ultra-high density circuit boards at relatively low cost.
The technical scheme of the invention is that the manufacturing method for manufacturing the 3D circuit board based on photocuring is characterized by comprising the following steps of:
the method includes the steps that ultraviolet rays or laser are used for irradiating resin on a platform to generate a solder mask layer, an intermediate resin layer or a support;
removing uncured resin adhered to the circuit board;
judging whether a metal part exists on the solder resist layer, the middle resin layer or the support, if so, entering the next step, and if not, repeating the step until the metal part is generated;
placing a nano metal particle suspension liquid in a set area;
fifthly, heating the whole or the metal area;
sixthly, cleaning the solder mask layer, the middle resin layer or the support to remove the solidified redundant parts of metal, resin and photosensitive film, and cleaning the circuit board to prevent the grinding fluid and waste materials generated by grinding from polluting the resin or influencing the forming;
repeating the steps from the first step to the second step until the last layer;
performing first step, sixth step and sixth step when the last layer is machined, if only metal exists, performing first step, second step and sixth step if only resin exists in the last layer, and performing first step, second step and sixth step if metal and resin exist in the last layer at the same time.
Preferably, the method comprises the following steps: the removal method comprises the following steps: the method comprises the steps of adopting a scraper, high-pressure gas, cleaning liquid spraying and high-pressure liquid flushing.
Preferably, the method comprises the following steps: step four, placing the nano metal particle suspension in the set area by using an extrusion device, selecting a photosensitive dry film or silk plate, a hollow plate and a scraper in a selective or combined mode; the suspension liquid adopts nano copper powder, nano silver powder or nano gold powder as a suspension; the material should have a viscosity set to prevent deformation of the wire due to excessive fluidity.
Preferably, the method comprises the following steps: step fifthly, the heating temperature for heating the whole or the metal area is 70-240 ℃ and the heating time is 10 seconds-10 minutes according to the characteristics of the nano metal suspension.
Preferably, the method comprises the following steps: sixthly, cleaning and removing the solder mask layer, the intermediate resin layer or the support in a physical or chemical grinding mode.
Preferably, the method comprises the following steps: the method further comprises the following steps of: after all layers are processed, carrying out integral cleaning and secondary curing; if the cleaning is carried out, the residual resin and the nano metal particle suspension are cleaned by using high-pressure gas, resin cleaning agent, plate washing water and high-pressure water; if the secondary curing is performed, it should be placed in a container having a rotating platform or capable of uniformly irradiating ultraviolet rays to the whole.
Another technical solution of the present invention is a control method for manufacturing a 3D circuit board based on photocuring, characterized by comprising the steps of:
firstly, electrifying and starting a system;
secondly, judge whether the first resin layer exists on the base layer? If yes, entering the next step, and if not, entering the step;
a resin part molding, comprising: alternatively or in combination, a laser, an ultraviolet projection system and an LCD panel are used for molding the resin in a photocuring 3D printing mode.
Fourth clear up the operation plane, include: removing uncured liquid or semi-cured resin by selecting or combining methods of direct scraping by a scraper, direct blowing by the scraper, high-pressure liquid blowing, spraying, soaking, washing and organic solvent dissolving;
fifthly, forming a metal part, including: after exposure by using a liquid extrusion system or a photosensitive dry film, selecting a metal circuit shape generated by using printing, silk screen printing, stencil printing, photosensitive dry film and scraper or stencil printing technology in a selected or combined mode; placing the suspension containing the nano metal powder on a processing plane and forming a pattern;
sixthly, drying the circuit board, including: heating the metal part by using infrared rays, hot air and laser alternatively or in combination, and removing the solvent in the suspension liquid to fix the pattern on the processing plane and form a part of the circuit;
hobbling removes excess;
and is it the last layer judged? If not, returning to the step three, if yes, entering the next step:
a final treatment of a self-lifting, comprising: cleaning the undried nano metal suspension by using a solvent; alternatively or in combination, removing metals except the circuit and the structural metal component and resin which is not solidified on the surface or is adhered on the surface of the circuit board for other reasons by using a method of soaking, blowing, washing, spraying, mechanically scraping and mechanically grinding by using a solvent; and performing secondary curing on the manufactured circuit board by using an ultraviolet irradiation method.
Compared with the prior art, the invention has the beneficial effects that:
compared with the traditional PCB processing mode, the method for processing by using 3D printing effectively avoids the problems of continuity and power generated by line cross layers in the traditional circuit and effectively improves the performance of the circuit.
Compared with the method for processing the PCB by the SLS, the method has the advantages of small occupied area, easiness in obtaining and storing materials and lower cost.
Compared with the method for processing the PCB by the FDM, the method has the advantages of higher precision, smaller relation between processing speed and size and higher flatness.
Drawings
Fig. 1 is a flow chart of a control method for manufacturing a 3D circuit board based on photocuring according to the present invention.
Detailed Description
The invention will be further described in detail with reference to the following examples:
fig. 1 shows a flow chart of the control method of the present invention.
Referring to fig. 1, the control method for manufacturing a 3D circuit board based on photocuring includes the following steps:
firstly, electrifying and starting a system;
secondly, judge whether the first resin layer exists on the base layer? If yes, entering the next step, and if not, entering the step;
a resin part molding, comprising: molding the resin in a photocuring 3D printing mode by selecting or combining a laser, an ultraviolet projection system and an LCD panel;
fourth clear up the operation plane, include: removing uncured liquid or semi-cured resin by selecting or combining a method of directly scraping by using a scraper, directly blowing by using the scraper, blowing by using high-pressure liquid, spraying, soaking, washing and dissolving by using an organic solvent;
fifthly, forming a metal part, including: after exposure by using a liquid extrusion system or a photosensitive dry film, generating a metal circuit shape by selecting or combining a screen printing process, a photosensitive dry film process and a scraper or a stencil printing process, and placing a suspension containing nano metal powder on a processing plane to form a pattern;
sixthly, drying the circuit board, including: heating the metal part by using infrared rays, hot air and laser, and removing the solvent in the suspension to fix the pattern on the processing plane and form a part of the circuit;
hobbling removes excess;
and is it the last layer judged? If not, returning to the step three, if yes, entering the next step:
a final treatment of a self-lifting, comprising: and cleaning the undried nano metal suspension by using a solvent, and cleaning the uncured resin on the surface of the circuit board by using the solvent in an alternative or combined mode of soaking, blowing and washing, so as to perform secondary curing on the manufactured circuit board and improve the hardness.
The manufacturing method for manufacturing the 3D circuit board based on photocuring comprises the following steps:
the method includes the steps that ultraviolet rays or laser are used for irradiating resin on a platform to generate a solder mask layer, an intermediate resin layer or a support;
removing uncured resin adhered to the circuit board; the removing comprises the following steps: adopting a method of scraping, high-pressure gas, cleaning liquid spraying and high-pressure liquid flushing;
judging whether a metal part exists on the solder resist layer, the middle resin layer or the support, if so, entering the next step, and if not, repeating the step until the metal part is generated;
placing a nano metal particle suspension liquid on a set area through an extrusion device or by utilizing a photosensitive dry film and a scraper; the suspension liquid is selected from nano copper powder, nano silver powder or nano gold powder; the material should have a viscosity set to prevent deformation of the wire due to excessive fluidity;
fifthly, heating the whole or the metal area; according to the characteristics of the nano metal suspension, the heating temperature for heating the whole body or the metal area is 70-240 ℃, and the heating time is 10 seconds-10 minutes;
sixthly, cleaning the solder mask layer, the middle resin layer or the support to remove the solidified redundant parts of metal, resin and photosensitive film, and cleaning the circuit board to prevent the grinding fluid and waste materials generated by grinding from polluting the resin or influencing the forming; the cleaning and removing method adopts a physical or chemical grinding mode;
repeating the steps from the first step to the second step until the last layer;
performing first step, sixth step and sixth step when the last layer is machined, if only metal exists, performing first step, second step and sixth step if only resin exists in the last layer, and performing first step and sixth step if metal and resin exist in the last layer at the same time;
after all the layers of the self-skin are processed, integral cleaning and secondary curing are carried out; if the cleaning is carried out, the residual resin and the nano metal particle suspension are cleaned by using high-pressure gas, resin cleaning agent, plate washing water and high-pressure water; if the secondary curing is performed, it should be placed in a container having a rotating platform or capable of uniformly irradiating ultraviolet rays to the whole.
The above-mentioned embodiments are only preferred embodiments of the present invention, and all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.
Claims (7)
1. A manufacturing method for manufacturing a 3D circuit board based on photocuring is characterized by comprising the following steps:
the method includes the steps that ultraviolet rays or laser are used for irradiating resin on a platform to generate a solder mask layer, an intermediate resin layer or a support;
removing uncured resin adhered to the circuit board;
judging whether a metal part exists on the solder resist layer, the middle resin layer or the support, if so, entering the next step, and if not, repeating the step until the metal part is generated;
placing a nano metal particle suspension liquid in a set area;
fifthly, heating the whole or the metal area;
sixthly, cleaning the solder mask layer, the middle resin layer or the support to remove the solidified redundant parts of metal, resin and photosensitive film, and cleaning the circuit board to prevent the grinding fluid and waste materials generated by grinding from polluting the resin or influencing the forming;
repeating the steps from the first step to the second step until the last layer;
performing first step, sixth step and sixth step when the last layer is machined, if only metal exists, performing first step, second step and sixth step if only resin exists in the last layer, and performing first step, second step and sixth step if metal and resin exist in the last layer at the same time.
2. The method for manufacturing a 3D circuit board based on photocuring as recited in claim 1, wherein the removing step further comprises: the method comprises the steps of adopting a scraper, high-pressure gas, cleaning liquid spraying and high-pressure liquid flushing.
3. The manufacturing method for manufacturing the 3D circuit board based on photocuring according to claim 1, wherein the step of placing the nano metal particle suspension on the set area is performed by using an extrusion device, a photosensitive dry film or silk plate, a stencil plate and a scraper in an alternative or combined mode; the suspension liquid adopts nano copper powder, nano silver powder or nano gold powder as a suspension; the material should have a viscosity set to prevent deformation of the wire due to excessive fluidity.
4. The manufacturing method for manufacturing the 3D circuit board based on photocuring according to claim 1, wherein the heating temperature for heating the whole or the metal region is 70-240 ℃ and the heating time is 10 seconds-10 minutes, depending on the characteristics of the nano metal suspension.
5. The manufacturing method for manufacturing the 3D circuit board based on photocuring as recited in claim 1, wherein the step sixteenth is to clean and remove the solder mask layer, the intermediate resin layer or the support by means of physical or chemical grinding.
6. The manufacturing method for manufacturing a 3D circuit board based on photocuring as recited in claim 1, further comprising the steps of self-tapping: after all layers are processed, carrying out integral cleaning and secondary curing; if the cleaning is carried out, the residual resin and the nano metal particle suspension are cleaned by using high-pressure gas, resin cleaning agent, plate washing water and high-pressure water; if the secondary curing is performed, it should be placed in a container having a rotating platform or capable of uniformly irradiating ultraviolet rays to the whole.
7. A control method for manufacturing a 3D circuit board based on photocuring is characterized by comprising the following steps:
firstly, electrifying and starting a system;
secondly, judge whether the first resin layer exists on the base layer? If yes, entering the next step, and if not, entering the step;
a resin part molding, comprising: alternatively or in combination, a laser, an ultraviolet projection system and an LCD panel are used for molding the resin in a photocuring 3D printing mode.
Fourth clear up the operation plane, include: removing uncured liquid or semi-cured resin by selecting or combining methods of direct scraping by a scraper, direct blowing by the scraper, high-pressure liquid blowing, spraying, soaking, washing and organic solvent dissolving;
fifthly, forming a metal part, including: after exposure by using a liquid extrusion system or a photosensitive dry film, selecting a metal circuit shape generated by using printing, silk screen printing, stencil printing, photosensitive dry film and scraper or stencil printing technology in a selected or combined mode; placing the suspension containing the nano metal powder on a processing plane and forming a pattern;
sixthly, drying the circuit board, including: heating the metal part by using infrared rays, hot air and laser alternatively or in combination, and removing the solvent in the suspension liquid to fix the pattern on the processing plane and form a part of the circuit;
hobbling removes excess;
and is it the last layer judged? If not, returning to the step three, if yes, entering the next step:
a final treatment of a self-lifting, comprising: cleaning the undried nano metal suspension by using a solvent; alternatively or in combination, removing metals except the circuit and the structural metal component and resin which is not solidified on the surface or is adhered on the surface of the circuit board for other reasons by using a method of soaking, blowing, washing, spraying, mechanically scraping and mechanically grinding by using a solvent; and performing secondary curing on the manufactured circuit board by using an ultraviolet irradiation method.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110021520.0A CN112739029A (en) | 2021-01-08 | 2021-01-08 | Manufacturing method and control method for manufacturing 3D circuit board based on photocuring |
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| CN202110021520.0A CN112739029A (en) | 2021-01-08 | 2021-01-08 | Manufacturing method and control method for manufacturing 3D circuit board based on photocuring |
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| CN106954347A (en) * | 2017-04-21 | 2017-07-14 | 北京石油化工学院 | The method that light printing prepares nano-silver thread circuit board |
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| CN109774132A (en) * | 2019-03-04 | 2019-05-21 | 东南大学 | A kind of manufacturing method of the circuit board based on photocuring 3D printing technique |
| CN110430666A (en) * | 2019-07-09 | 2019-11-08 | 广东工业大学 | A kind of preparation method of 3D printing circuit board |
| CN112029236A (en) * | 2020-08-06 | 2020-12-04 | 东南大学 | Photocuring 3D printing resin, preparation method and application thereof, and 3D printing product |
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2021
- 2021-01-08 CN CN202110021520.0A patent/CN112739029A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106507579A (en) * | 2016-11-30 | 2017-03-15 | 上海摩软通讯技术有限公司 | Integrated circuit board manufacturing method and device based on 3D printing technique |
| CN106954347A (en) * | 2017-04-21 | 2017-07-14 | 北京石油化工学院 | The method that light printing prepares nano-silver thread circuit board |
| CN108925056A (en) * | 2018-07-31 | 2018-11-30 | 珠海元盛电子科技股份有限公司 | A kind of manufacturing method of multiple light courcess control printing PCB circuit |
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Application publication date: 20210430 |