CN108925056A - A kind of manufacturing method of multiple light courcess control printing PCB circuit - Google Patents
A kind of manufacturing method of multiple light courcess control printing PCB circuit Download PDFInfo
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- CN108925056A CN108925056A CN201810857134.3A CN201810857134A CN108925056A CN 108925056 A CN108925056 A CN 108925056A CN 201810857134 A CN201810857134 A CN 201810857134A CN 108925056 A CN108925056 A CN 108925056A
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- printing
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- pcb circuit
- multiple light
- printer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Abstract
The invention discloses a kind of manufacturing methods for printing PCB circuit, it is desirable to provide a kind of manufacturing method of process multiple light courcess control printing PCB circuit for being adapted to a variety of substrate print circuits that is simple, easy to control, at low cost and can printing high-precision complexity.The present invention includes：A, base material is fixed on 3D printer platform, designs single circuit structure using three-dimensional software, and import data to 3D printer, carries out photocuring printing, circuit pattern is obtained in substrate；B, reducing metal ion is removed with ultraviolet lamp, obtains metallic particles on solidified resin surface；C, it goes to irradiate using the flash lamp of corresponding wave band, makes loose metallic particles Fast Sintering, and then form highly conductive conductive path in substrate surface.The present invention is applied to the technical field of the manufacture of print circuit.
Description
Technical field
The invention belongs to print circuit fields, are related to a kind of multilayer PCB circuit board printing system based on SLA 3D printer
Method is made, in particular to a kind of manufacturing method of multiple light courcess control printing PCB circuit.
Background technique
In recent years, printing PCB circuit board market emphasis turned to the communications industry from computer field, was even more now to turn to intelligence
The mobile terminals such as mobile phone and plate.With the appearance of these emerging fields, consumer for electronics miniaturization, lightening have
Higher pursuit, and these all be unable to do without flexible printed-circuit boards and the production of rigid and flexibility printed circuit board and manufacture.Traditional
PCB circuit board manufacturing process is the technique of chemical etching after shining cause town and country on copper clad laminate, such as silk-screen printing, coating
Printing and spraying printing.These technique processes are various, and process control is complicated, meanwhile, in entire production process, amount of waste is big,
And adjoint waste liquid includes many toxic components.So the research of printing electronics is paid attention to gradually now.
Printing electronics, which refers to, manufactures circuit and electronic component with the mode of printing, especially on a flexible substrate.At present
Mainly using ink jet type Method of printing, the mode of each drop conductive drop piezoelectric ceramics or hot extrusion is injected in base
Bottom designated position.This processing technology is manufacture circuit board, RFID, ultrathin crystal pipe, luminaire, transparent electrode, touch screen
With the good processing method of flexible display screen.But simultaneously also because the limitation of ink jet type Method of printing, electrically conductive ink is in viscosity
The requirement for meeting inkjet print head is required with parameters such as surface tension, alternative conductive ink type is few.Meanwhile at present
For printing the conductive ink of electronics since metal particle size is small low with ratio, electric conductivity be not generally it is very high, need simultaneously
High temperature reduction, flexible substrates need to bear certain high temperature.So the present invention proposes the new printing of one kind electronically, raising is beaten
Tenor in printing ink obtains high conduction performance metallic circuit in turn, changes metal and restores mode, makes whole process
It is more efficient, more environmentally friendly, and improve a possibility that more substrates carry out print circuit.
Summary of the invention
It is simple, easily-controllable the technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a kind of process
System, the multiple light courcess control at low cost and can printing high-precision complexity for being adapted to a variety of substrate print circuits print PCB circuit
Manufacturing method.
The technical scheme adopted by the invention is that：A kind of manufacturing method of the multiple light courcess control printing PCB circuit includes
Following steps：
A, base material is fixed on 3D printer print platform, designs single circuit structure using three-dimensional software, and by data
3D printer is imported, photocuring printing is carried out, circuit pattern is obtained in substrate；
B, reducing metal ion is removed with ultraviolet lamp, obtains metallic particles on solidified resin surface；
C, it goes to irradiate using the flash lamp of corresponding wave band, makes loose metallic particles Fast Sintering, and then formed in substrate surface
Highly conductive conducting channel.
In the present invention, the 3D sculpting software with no restrictions, such as Solidworks and NX etc.；
Preferably, the mode that 3D printer is imported data to described in step a is：By the data of design with Standard Template Library STL's
Format imports 3D printer.As a kind of method of print circuit, substrate positioning determines the accuracy of circuit position and ensure that
The consistency of cutting, punch position later, and guarantee the smooth integrality and surface quality for being to ensure that print circuit of substrate.
It positions and flattens using screw bolt and nut in the present invention.
Preferably, planar substrates material is fixed on to the print platform of 3D printer；
Preferably, print platform is uniformly arranged bolt hole, and in four bolts of planar substrates edge distribution, height is adjustable；
Preferably, the substrate of printing can be according to material category difference, and corresponding bolt location is punched and positioned or bolt point
Cloth basal edge, is suppressed and is positioned with nut.
This manufacturing process carries out the printing of circuit using photocuring printing technique.
Preferably, selected resin material can dissolve each other with selected metal ion；
Preferably, the material that 3D print procedure is selected is the photosensitive resin containing metal ion, and mass fraction is 1%- 30%,
For example, 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%,
21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29% or 30% etc.；,
Preferably, according to the height of printing route, print platform declines specified altitude assignment；
Preferably, printing calibrated altitude be 0.05- 0.5mm, for example, 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm,
0.3mm, 0.35mm, 0.4mm, 0.45mm or 0.5mm etc.；
Preferably, the method also includes carrying out ultrasound, rinse and dry before the step b after step a；
The step of the ultrasound is：Base material after printing is put into ethanol solution and carries out ultrasound, ultrasonic time is preferably
10 minutes.
It is rinsed in the step of flushing using deionized water.
As the optimal technical scheme of the method for the invention, the process of reducing metal ion is under ultraviolet lamp：It will solidification
Photosensitive resin be placed under the irradiation of ultraviolet lamp, metal ion, which is reduced to obtain loose metallic particles, is attached to resin surface.
Preferably, the ultraviolet lamp preferred bands are in 300-400 nm；The luminous intensity of ultraviolet lamp determine metal reduction when
Between and quality, the preferred 1- 300mW/cm of ultraviolet ray intensity2, for example, 1mW/cm2、50mW/cm2、150mW/cm2、200mW/cm2、
250mW/cm2、300mW/cm2；The luminous intensity and time that the metal ion of various concentration needs are all different, generally to observe resin
The metallic luster on surface judges with measurement surface conductivity.
As another technical solution of the method for the present invention, go to be irradiated using the flash lamp of corresponding wave band described in step c
Cheng Wei：Print circuit obtained by step b is placed under white flash lamp, is taken out after one or many irradiations.
In this preferred embodiment, need to adjust flash of light according to metal species, the difference of concentration and base material heat resistance
The parameters such as the power of lamp and single exposure duration.Preferentially, flash light source is selected as white xenon lamp；The wave-length coverage of light source is
308nm – 1000nm；The energy intensity range of choice of light source is 5J/cm2 – 20J/cm2, for example, 5J/cm2 、6J/cm2 、
7J/cm2 、8J/cm2 、9J/cm2 、10J/cm2 、11J/cm2 、12J/cm2 、13J/cm2 、14J/cm2 、15J/cm2 、
16J/cm2 、17J/cm2 、18J/cm2 、19J/cm2Or 20J/cm2Deng；
Preferably for the substrate of unbearable high temperature, irradiation is repeated several times in the flash lamp that can carry out lower-wattage；
As optimal technical scheme of the present invention, flash lamp sintering method, can mainly for the metallic particles of Nano grade
The process of metal sintering is completed at room temperature.Referred to herein as high temperature, 100 are referred tooThe temperature of C or so.
Second aspect, the present invention provide the print circuit that method is prepared as described in relation to the first aspect, the print circuit
Include substrate and conducting channel.
Preferably, the base material type is alternative big, and whole circuit board can firmly can be soft；Selected resin material flowing
Property is good, can cover substrate surface quickly, it is more uniform to print circuit；It is quickly scanned using laser galvanometer system,
The printing speed circuit in substrate.
As the preferred embodiment of print circuit of the present invention, when the scanning relevant parameter of laser galvanometer can determine printing
Between and precision.The sweep parameter of laser galvanometer includes optical maser wavelength, the size of laser facula, laser scanning speed and laser function
Rate.
Have the advantages that the optimum organization of high-precision, above-mentioned laser galvanometer relevant parameter can be real in optimal technical scheme
Existing high-precision printing.Wherein, the smallest diameter of laser facula can reach 20 μm, so that high-precision and high-density circuit printing
It is possibly realized.
Preferably, photocuring reaction occurs in ultraviolet band, preferably 355nm.
Preferably, laser spot diameter 0.02- 1mm, for example, 0.02mm, 0.04mm, 0.08mm, 0.1mm, 0.2mm,
0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm etc..
Preferably, laser scanning speed variation range be 1000- 10000mm/s, for example, 1000mm/s, 2000mm/s,
3000mm/s, 4000mm/s, 5000mm/s, 6000mm/s, 7000mm/s, 8000mm/s, 9000mm/s or 10000mm/s etc..
Preferably, laser power is 100-600mW/cm according to the different optional ranges of resin material2, for example, 100mW/
cm2, 200mW/cm2, 300mW/cm2, 400mW/cm2, 500mW/cm2Or 600mW/cm2Deng.
This optimal technical scheme restored metal ion by ultraviolet band light from resin, this scheme will print
Pattern directly becomes conducting wire, reduces and enters plate in traditional handicraft, takes off the processes such as film, etching, not only shortens process time, section
About cost, also Environmental Safety is efficient.
Preferably, what the metallic element in the conducting wire was relatively common at present is gold, copper, silver, foil.
These four types of metals have good electric conductivity, wherein copper is the metal that more commonly used print circuit uses.
As the preferred embodiment of the present invention for obtaining ultraviolet metal reduction, obtained conducting wire has conduction substantially
Property, but since metallic particles is still loose in resin surface, in order to further increase the electric conductivity of metal, select flash lamp sintering
Technology.
Flash lamp sintering technology is illumination radioglold metal surface in a very short period of time, and luminous energy converts thermal energy, metallic particles sintering
Process.Metallic particles is because sintering process causes gap between particle to be reduced, between metal more closely, to improve metal
Electric conductivity.Since effect is obvious in the particle of Nano grade for this photo-thermal effect, so base material is hardly heated,
It is not high to base material heat resistant requirements.
Print circuit of the present invention is mainly used in the processing of flexible board, such as flex cable, liquid crystal module etc., phase
Than hardboard, its volume is smaller, and weight is lighter, and bending flexure, the benefits such as stereoscopic three-dimensional assembling may be implemented.
The beneficial effects of the invention are as follows：Due to the printing system of the invention for making script 3D print procedure be applied to 2D circuit
It makes, one side laser scanning speed is fast, precision is high, and on the other hand, the significantly less manufacturing procedure of use of various light sources can be with
It is substantially reduced production cost and substitutes processing technology traditional at present, there are good market prospects.Have compared with the existing technology
It has the following advantages：
1, the present invention directly manufactures circuit pattern with photosensitive resin, and under the action of ultraviolet light and white light flash lamp, obtains height
The conducting channel of electric conductivity.Compared to the manufacturing process of traditional print circuit, it is, for example, into plate, takes off film, etches, takes off Xi Hexia
Process, the present invention provides highly efficient efficiently print circuit manufacturing methods.Entire engineering is used only ethyl alcohol and goes cleaning substrate
Surface is not used strong acid or highly basic, while being based on 3D printing technology, and waste of material is few.Meanwhile using ultraviolet lamp and white
Flash lamp goes to reducing metal and sintering metal as main energy sources, and whole process can be completed within 15 minutes.So this
Invent the scheme efficient quick safety and environmental protection.
2, whole printing process of the present invention is based on 3D print platform, and 3D printing, which possesses size, accurately to be controlled
System.It is height first, in addition to using precision lead screw control Z-direction mobile, print procedure has liquid level direction finder, so that every time
Printing, level errors change between several microns.Meanwhile 3D is printed, the length and width of route is all by print parameters
It determines, so printing route length, width and height control is very accurate, further, obtained route electric conductivity is more stable.
3, the present invention is positioned and is flattened using bolt and nut, as long as ensuring that shapes of substrates is unified, precise positioning can be realized.
Due to the high stability of laser, each pattern print position it is also ensured that.Whole process calibration is simple.
4, the base material of the suitable a variety of materials performance of the present invention has well in flexible PCB circuit board printing field
Using.
5, the present invention uses the photosensitive resin containing metal ion, first photosensitive resin good fluidity, can be with Quick uniform
Cover entire substrate surface.Secondly photosensitive resin type is more, can be selected according to substrate material properties, and resin and base are improved
Adhesion strength between bottom.The selection of last metal ion has consisted essentially of the material of print circuit currently on the market.
6, the present invention is gone using laser galvanometer system in substrate surface curing molding, and laser polarization system scanning speed is fast,
It can print the shape of various complexity.Meanwhile laser spot diameter can be reduced to 20 μm.Currently, print circuit can arrive substantially
It is advanced to can achieve 40 μm up to 60 μm.So the very potential realization high density graph thinning of this technology preferred embodiment prints target.
7, the present invention can be changed to duplex printing and multilayer circuit printing technique, and centre is related to changing resin material and addition is new
The two steps of substrate.
8, fast circuit encapsulation may be implemented in the present invention, and the circuit after printing is placed in new resin storage tank, and it is solid to carry out light
Process, can be by entire circuit protection under macromolecule resin.
Detailed description of the invention
Fig. 1 is the reaction process of embodiment one；
Fig. 2 is the photosensitive resin containing certain proportion metal ion that embodiment two is prepared；
Fig. 3 is the film of photocuring in embodiment two on SLA 3D printing platform, the different straight lines of laser scanning；
Fig. 4 is the nitrogen of straight line surfaces in embodiment two（N）And silver（Ag）The percentage analysis of element；
Fig. 5 is the measurement figure of the resistance of five straight lines in embodiment two.
Specific embodiment
Technical solution of the present invention is further illustrated below with reference to the accompanying drawings and specific embodiments.Characterization：1, respectively
EDX elemental analysis is carried out to five straight lines of SLA scanning, N the and Ag element accounting of straight line surfaces is analyzed；2, it surveys
Measure the resistance of five straight lines.
Embodiment one
The present embodiment provides the structure that circuit after printing is attached to substrate, the platform structure schematic diagram of printing and the present invention relates to
Reaction mechanism（As shown in Figure 1）.
Firstly, photoinitiator decomposes to obtain free radical under SLA laser scanning.These free radicals can be further combined with molten
Oligomer in liquid causes photopolymerization reaction, and liquid resin becomes solid-state structure and is attached on substrate.Under strong ultraviolet band,
Metal ion is reduced；Under xenon lamp flash lamp, the metallic particles of these reduction is sintered and becomes more closely, to be formed highly conductive
The conducting wire of property.
Embodiment two
The present embodiment provides a kind of photosensitive resins containing metal ion, and with SLA 3D printer printing thin film, a length of
40mm, width 30mm, with a thickness of 5mm.It is taken multiple scan, is swept on the membrane surface using the weaker ultraviolet light of luminous intensity
Retouching number is respectively 100 times, 200 times, 300 times, 400 times, 500 times.
Preparation method is as follows：
1, the photosensitive resin containing metal ion is prepared（As described in Figure 2）, which mainly includes oligomer, photoinitiator
And metal ion.Different material is mixed and stirred for uniformly according to a certain percentage, it is stand-by after a night is stood in draught cupboard.
2, by step（1）The photosensitive resin prepared pours into 3D printer, then by the data of design with standard form
The format of library STL imports 3D printer, carries out photocuring 3D printing, obtains the film of 3D printing.
3, by step（2）Obtained film is ultrasonically treated 10min in ethanol and removes remaining photosensitive resin, then spends
Ionized water dries up after washing off ethyl alcohol；
4, by step（3）It handles rear film and places 3D print platform, be not that very strong laser removes scanning film table with luminous intensity
Face forms the straight line of five a length of 30mm（As shown in Figure 3）.Because luminous intensity is low, needs to design multiplicating scanning and realize gold
Belong to the reduction in resin surface.It is scanning 500 times respectively as shown in figure 3, from left to right, 400 times, 300 times, 200 times, 100
It is secondary.
Phenetic analysis part：
The EDX characterize datas of five of the present embodiment different straight lines is as shown in figure 4, photosensitive resin surface after hardening, N and Ag
Element ratio be 1:1, but as scanning times must increase, relative to the content of N, the ratio of Ag obviously increases.
The resistance of five straight lines of the present embodiment is as shown in table 1 and Fig. 5.As scanning times must increase, straight line surfaces
Resistance is reducing, and electric conductivity is increasing.As shown in the table：
Embodiment three
Except in preparation method, the place different from embodiment two is：In the present embodiment, step（1）The Ag used, other preparations
In method, preparation method, condition and the characterizing method of different metal are identical as embodiment two.
The present invention is applied to the technical field of the manufacture of print circuit.
Although the embodiment of the present invention is described with practical solution, the limit to meaning of the present invention is not constituted
It makes, for those skilled in the art, is all to the modification of its embodiment and with the combination of other schemes according to this specification
Obviously.
Claims (10)
1. a kind of manufacturing method of multiple light courcess control printing PCB circuit, it is characterised in that：A kind of multiple light courcess control printing
The manufacturing method of PCB circuit includes the following steps：
A, base material is fixed on 3D printer print platform, designs single circuit structure using three-dimensional software, and by data
3D printer is imported, photocuring printing is carried out, circuit pattern is obtained in substrate；
B, reducing metal ion is removed with ultraviolet lamp, obtains metallic particles on solidified resin surface；
C, it goes to irradiate using the flash lamp of corresponding wave band, makes loose metallic particles Fast Sintering, and then formed in substrate surface
Highly conductive conducting channel.
2. a kind of manufacturing method of multiple light courcess control printing PCB circuit according to claim 1, it is characterised in that：In step
In rapid a, it is by the mode that the base material is fixed on 3D printer print platform：By the print platform of original 3D printer
Four bolts are set, and the bolt location can be adjusted according to size of foundation base, and bolt height is adjustable, not influence photosensitive resin
The substrate of flowing, printing can be according to material category difference, and corresponding bolt location is punched and positioned or bolt distributing base
Edge is suppressed and is positioned with nut.
3. a kind of manufacturing method of multiple light courcess control printing PCB circuit according to claim 1, it is characterised in that：In step
In rapid a, the mode for importing data to 3D printer is：The data of design are imported 3D with the format of Standard Template Library STL to beat
Print machine.
4. a kind of manufacturing method of multiple light courcess control printing PCB circuit according to claim 1, it is characterised in that：It is described
3D printer select material be the photosensitive resin containing metal ion, the 3D printer according to printing route height,
Decline specified altitude assignment by print platform, printing calibrated altitude is 0.05- 0.5mm, and the 3D printer will be folded repeatedly
Add printing.
5. a kind of manufacturing method of multiple light courcess control printing PCB circuit according to claim 1, it is characterised in that：In step
Ultrasound is carried out after rapid a and before step b, rinses and dries；The step of the ultrasound is：Base material after printing is put into
Ultrasound is carried out in ethanol solution, ultrasonic time is preferably 10 minutes；It is rinsed in the step of flushing using deionized water.
6. a kind of manufacturing method of multiple light courcess control printing PCB circuit according to claim 1, it is characterised in that：In step
In rapid b, the ultraviolet lamp reducing metal ion process is：Cured photosensitive resin is placed under the irradiation of ultraviolet lamp, metal from
Son, which is reduced to obtain loose metallic particles, is attached to resin surface；The ultraviolet lamp preferred bands are in 300-400 nm；It is ultraviolet
The luminous intensity of lamp determines time and the quality of metal reduction；The luminous intensity of the metal ion needs of various concentration and time are not
Together, judged with observing metallic luster and the measurement surface conductivity of resin surface.
7. a kind of manufacturing method of multiple light courcess control printing PCB circuit according to claim 1, it is characterised in that：In step
In rapid c, the flash lamp using corresponding wave band goes the irradiation process to be：Print circuit obtained by step b is placed in white flash lamp
Under, it is taken out after one or many irradiations.
8. a kind of manufacturing method of multiple light courcess control printing PCB circuit according to claim 7, it is characterised in that：It is described
White flash lamp is white xenon lamp, and the wave-length coverage of the light source of white xenon lamp is 308nm -1000nm, the energy intensity of light source
Range of choice is 5J/cm2 – 20J/cm2；For the substrate of unbearable high temperature, the flash lamp that can carry out lower-wattage is repeatedly weighed
Note in reply is penetrated.
9. a kind of manufacturing method of multiple light courcess control printing PCB circuit according to any one of claims 1 to 7, feature
It is：The conducting channel has the galvanometer system of SLA 3D printer to complete route manufacture, can be used for manufacturing any complicated circuit.
10. a kind of manufacturing method of multiple light courcess control printing PCB circuit according to claim 8, it is characterised in that：It is described
Conducting wire is made of photosensitive resin；Selected photosensitive resin can dissolve each other with a certain proportion of metal ion；Selected metal from
Son can be reduced under specific light.
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| CN114284058A (en) * | 2021-12-24 | 2022-04-05 | Oppo广东移动通信有限公司 | Electronic equipment, circuit board assembly, inductance device and preparation method thereof |
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