CN102398438A - Method for preparing primary circuit by jet-printing metal conductive printing ink by virtue of laser or microwave processing - Google Patents
Method for preparing primary circuit by jet-printing metal conductive printing ink by virtue of laser or microwave processing Download PDFInfo
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- CN102398438A CN102398438A CN2010102819828A CN201010281982A CN102398438A CN 102398438 A CN102398438 A CN 102398438A CN 2010102819828 A CN2010102819828 A CN 2010102819828A CN 201010281982 A CN201010281982 A CN 201010281982A CN 102398438 A CN102398438 A CN 102398438A
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Abstract
The invention belongs to an ink jet printing (jet printing for short) circuit technology, relating to a primary circuit or microwave processing primary circuit prepared by jet-printing metal conductive printing ink by utilizing a laser sintering method, and aiming at degrading organic components in the printing ink and improving conductive properties of the obtained jet printing circuit. In the method for preparing the primary circuit by printing the metal conductive printing ink by virtue of laser or microwave processing, laser continuous scanning, exposing and sintering, selective scanning, exposing and sintering, overall exposing and sintering or selective exposing and sintering are carried out on the primary circuit prepared by jet-printing the metal conductive printing ink, or the primary circuit prepared by jet-printing the metal conductive printing ink is sintered by virtue of microwave processing, so as to improve electric conductivity of the jet-printed circuit; the jet-printed primary circuit is processed by utilizing the laser with high speed, high efficiency and positioning accuracy, thus being applicable to extensive printing boards or films; and requirements on material and shape (hard board or film) of the printing board or film are not strict, and thus the method is applicable to automation.
Description
Technical field
The invention belongs to ink jet printing (abbreviation spray printing) circuit engineering; The post-processing approach that relates to the primary circuit that utilizes the preparation of spray printing metallic conduction printing ink; Specially refer to the primary circuit or the microwave treatment primary circuit that utilize laser sintered method to handle the preparation of spray printing metallic conduction printing ink; With the organic principle in the degraded printing ink, improve the electric conductivity of gained spray printing circuit.
Background technology
Ink jet printing (abbreviation spray printing) circuit engineering is the advanced person's in a forward position a circuit board manufacturing technology; It is the product of computer-aided control printing technology; Be the printing technology of a kind of contactless, no pressure, no forme, compatible various printing plate/films, the particularly flexibility film of undertaking the printing of; Its course of work is earlier the drawing information of Computer Storage to be imported ink-jet printer; Under the control of computer; By the shower nozzle of ink-jet printer to printing plate or film jet surface electrically conductive ink (electric ink); Ink droplet is direct formation line pattern on printing plate or film surface, and then on printing plate or film, obtains the primary circuit that formed by electrically conductive ink (electric ink) material.
Electrically conductive ink is the core material of spray printing circuit board; It mainly is made up of electroconductive stuffing, binder, solvent and other auxiliary agent; Metallic conduction printing ink is meant that electroconductive stuffing is the printing ink of metal nanoparticle or metal organic coordination compounds; Said metal nanoparticle mainly comprises the compound of gold, silver, copper, nickel, platinum, palladium etc. or above-mentioned any two kinds of metal nanoparticles, such as silver-colored copper-clad nano particle etc.; Said metal organic coordination compounds comprises the organic coordination compounds of above-mentioned metal.
Because the electric conductivity of metallic conduction printing ink own is not good or even nonconducting; So it is not good or even nonconducting that the primary circuit of spray printing also is an electric conductivity; Because the accumulation defective tightness of the metal nanoparticle in the metallic conduction printing ink; And the outer field organic surface active agent of metal nanoparticle exists as insulating materials, also has the adding of other organic substances (as: auxiliary agents such as binder, dispersant) simultaneously, hindered the transmission of electronics.Therefore, need to introduce aftertreatment technology, realize the spray printing circuit of high conduction performance with deposite metal nano particle and degraded organic substance wherein.
Post-processing technology for the primary circuit that adopts the metallic conduction ink material to form; Its principle mainly is based on the nanometer size effect of metal nanoparticle; The fusing point that is metal nanoparticle reduces along with reducing of its particle diameter; Such as the metal nanoparticle about 10 nanometers, its fusing point about 200 ℃, thereby therefore generally can improve adhesive, the accumulation degree of metal through temperature control sintering deposite metal nano particle; Degraded is coated on the outer field surfactant of metal nanoparticle as far as possible simultaneously, to improve the electric conductivity of spray printing circuit.
To the post-processing approach of primary circuit, like the method for the disclosed formation metallic article of United States Patent (USP) (US No.6582651), the IV of the said method step, at 500～1450 ℃ of said metallic articles of following sintering, the basic simultaneously geometry that keeps nonmetal product; United States Patent (USP) (US No.5147446) discloses and has used high pressure and low temperature to make the method for fine and close stampings by nanometer particle, and wherein sintering step is to carry out 1000～1500 ℃ temperature range; The conductive nano ink sintering temperature of Chinese patent (CN03815904) report is to carry out sintering at 100～300 ℃, continues sintering 0.5～2 hour.Above temperature control sintering method can only be applied to high temperature resistant printable fabrics such as glass, pottery, metal, polyimides, still is difficult to be suitable for for the film of undertaking the printing of of low Tgs such as PET, PVC, PC, paper.Document (Chem.Phys.Lett.2007,441,305-308.) reported the circuit that utilizes methyl alcohol equal solvent cleaning printing; To wash the organic substance in the circuit off; This method has improved the electric conductivity of printed circuit, just utilizes the organic solvent cleaning circuit, is not suitable for mass preparation; Also improved solvent resistance requirement, increased the pressure of organic solvent environmental pollution simultaneously printing plate.2008, people (VTT Technical Research Centre of Finland, Nanotechnology such as Finland scientist Mark L.Allen; 19 (2008) 175201 (4pp)) directly apply voltage through circuit two ends to elementary printing; Utilize electric current and thermal resistance to melt metallic, significantly improved the electric conductivity of elementary printed wiring yet, but it is not easy to operate directly to apply voltage method; High pressure punctures printing plate/film easily, and high pressure is also dangerous.
2009; With the Germany headed by the Ulrich S.Schubert and Dutch scientists (J.Mater.Chem., 2009,19; 3384-3388) utilize the processing of circuit of plasma to elementary printing; Obtained the circuit of high conduction performance equally, but plasma has determined it can only rest on laboratory level to vacuum requirements and fancy price.
Therefore; In order to enlarge printing plate/film scope of application, reduce or avoid high-temperature process, take into account easy to operate and low-cost; Improve the electric conductivity of the prepared printed circuit of spray printing metallic conduction printing ink; We propose a kind of fast, and implement easily and the scheme of operation, promptly utilize laser accurately the location and fast scanning can significantly improve the electric conductivity of spray printing circuit by the primary circuit of spray printing metallic conduction printing ink preparation or microwave treatment primary circuit by the preparation of metallic conduction printing ink.
Summary of the invention
The objective of the invention is deficiency to traditional high temperature sintering post-processing approach and solvent wash method etc.; Propose a kind of convenient and practical sintering process and handle the primary circuit of spray printing metallic conduction printing ink preparation; Promptly utilize the primary circuit laser sintered or preparation of microwave treatment sintering spray printing metallic conduction printing ink; With the organic principle in the degraded printing ink, improve the electric conductivity of gained spray printing circuit.Utilize the primary circuit after laser is handled spray printing, speed is fast, and efficient is high, accurate positioning, and the printing plate or the film that are suitable for are extensive, the material and the form (hardboard or film) of printing plate or film are not had the requirement of strictness.
The method of the primary circuit of laser of the present invention or the preparation of microwave treatment spray printing metallic conduction printing ink; Be to utilize laser continuity scan exposure sintering, selective scanning exposure sintering, overall exposing sintering or selectivity exposure sintering primary circuit by the preparation of spray printing metallic conduction printing ink; Or utilize the primary circuit of microwave treatment sintering by the preparation of spray printing metallic conduction printing ink, to improve the electric conductivity of said spray printing circuit.
The primary circuit of described spray printing metallic conduction printing ink preparation is a method of utilizing spray printing metallic conduction printing ink, and according to the spray printing preparation on printing plate or film of preset circuit pattern.
The described primary circuit that utilizes laser continuity scan exposure sintering by the preparation of spray printing metallic conduction printing ink:
1) by ink-jet printer according to preset circuit pattern, metallic conduction printing ink spray printing on printing plate or film, is obtained the primary circuit that formed by metallic conduction printing ink on printing plate or film, the printing plate or the film that will have primary circuit are fixed on the objective table;
2) laser beam that utilizes laser head and sent carries out continuity scan exposure sintering to printing plate that has primary circuit on the step 1) objective table or film; Wherein, when carrying out continuity scan exposure sintering, utilize computer program control objective table to move or control the laser beam that sends by laser head and move; Translational speed by the laser beam that laser head sent is preferably 0.1mm/s～2m/s, and the translational speed of objective table is preferably 0.1mm/s～2m/s; By the laser beam that laser head sent drop on the diameter of hot spot on the primary circuit be spray printing primary circuit in the step 1) ink-jet printer the shower nozzle internal diameter 50%～1000%.
The said hot spot that is dropped on the primary circuit by the laser beam that laser head sent is that the laser beam direct irradiation that is sent by laser head obtains on primary circuit, or is shone after through the speculum individual reflection by laser beam that laser head sent and on primary circuit, to obtain.
Described laser beam is the laser beam of wall scroll or the linear laser light beam of being made up of the laser beam of a plurality of wall scrolls.
Primary circuit carried out the square resistance of gained spray printing circuit is 0.01～10 Ω/ behind the continuity scanning sintering.
The described primary circuit that utilizes laser selective scan exposure sintering by the preparation of spray printing metallic conduction printing ink:
1) by ink-jet printer according to preset circuit pattern, metallic conduction printing ink spray printing on printing plate or film, is obtained the primary circuit that formed by metallic conduction printing ink on printing plate or film, the printing plate or the film that will have primary circuit are fixed on the objective table;
2) laser head is positioned the starting point of step 1) primary circuit; Utilize computer program control objective table or control laser beam by laser head sent; The track that is moved when the spray printing circuit pattern according to the step 1) ink-jet printer moves; Close LASER Light Source when being chosen in no primary circuit; When primary circuit is arranged, open LASER Light Source, the laser beam that utilizes laser head to send places printing plate that has primary circuit or the primary circuit on the film on the objective table to carry out selective scanning exposure sintering to step 1); Or
Laser head is positioned the starting point of step 1) primary circuit; Utilizing computer program control objective table to move or control the laser beam that is sent by laser head moves; The laser beam step 1) of utilizing laser head to send places printing plate that has primary circuit or the film on the objective table to carry out continuity scanning; Through the computer program control laser beam that laser head sent; Open LASER Light Source when being chosen in primary circuit, primary circuit is carried out selective scanning exposure sintering, when no primary circuit, close LASER Light Source;
Translational speed by the laser beam that laser head sent is preferably 0.1mm/s～2m/s, and the translational speed of objective table is preferably 0.1mm/s～2m/s;
The said hot spot that is dropped on the primary circuit by the laser beam that laser head sent is that the laser beam direct irradiation that is sent by laser head obtains on primary circuit, or is shone after through the speculum individual reflection by laser beam that laser head sent and on primary circuit, to obtain.
Above-mentioned by the laser beam that laser head sent drop on the diameter of hot spot on the primary circuit be spray printing primary circuit in the step 1) ink-jet printer the shower nozzle internal diameter 50%～1000%.
Described laser beam is the laser beam of wall scroll or the linear laser light beam of being made up of the laser beam of a plurality of wall scrolls.
Primary circuit carried out the square resistance of gained spray printing circuit is 0.01～10 Ω/ behind the selective scanning sintering.
The described primary circuit that utilizes laser overall exposing sintering or utilize the microwave treatment sintering to prepare by spray printing metallic conduction printing ink:
According to preset circuit pattern, metallic conduction printing ink spray printing on printing plate or film, is obtained the primary circuit that is formed by metallic conduction printing ink by ink-jet printer on printing plate or film; Regulate LASER Light Source or microwave light source and have printing plate or the distance between the film of primary circuit that (preferred distance is 5～30cm), and printing plate or the film that has primary circuit carried out laser overall exposing sintering or carry out the microwave treatment sintering; The organic component that the time of said laser overall exposing sintering or microwave treatment sintering looks in the electrically conductive ink that is adopted to be comprised and deciding, the time of preferred laser overall exposing sintering is 1～10 minute, the time of preferred microwave treatment sintering is 10～180 seconds.
Primary circuit carried out the square resistance of gained spray printing circuit is 0.01～10 Ω/ behind laser overall exposing sintering or the microwave treatment sintering.
The described primary circuit that utilizes laser selective exposure sintering by the preparation of spray printing metallic conduction printing ink:
According to preset circuit pattern, metallic conduction printing ink spray printing on printing plate or film, is obtained the primary circuit that is formed by metallic conduction printing ink by ink-jet printer on printing plate or film; Select the laser array light source; Regulate LASER Light Source and have printing plate or the distance between the film of primary circuit that (preferred distance is 5～30cm); The shape that the laser beam that control is used to make public is produced on primary circuit is corresponding fully with the shape of said primary circuit, and optionally exposure is sintered in the primary circuit of spray printing on printing plate or the film; 1～10 minute time of preferred laser selective exposure sintering.
Primary circuit carried out the square resistance of gained spray printing circuit is 0.01～10 Ω/ behind the laser selective exposure sintering.
In the above-mentioned laser continuity scan exposure sintering and laser selective scan exposure sintering that carries out; When laser head emission laser beam direct irradiation is on primary circuit, laser head and have the printing plate of primary circuit or the distance between the film remains unchanged during sintering; When the laser head emission laser beam when shining on primary circuit behind the speculum individual reflection, the distance of laser head and speculum and speculum and have the printing plate of primary circuit or the distance between the film remains unchanged during sintering.
When the above-mentioned overall exposing sintering that carries out and selectivity exposure sintering, LASER Light Source and have the printing plate of primary circuit or the distance between the film remains unchanged during sintering.
When the above-mentioned microwave treatment sintering that carries out, microwave light source and have the printing plate of primary circuit or the distance between the film remains unchanged.
Described laser is selected from a kind of in ultraviolet laser, visible light laser and the infrared light laser, and the power of above-mentioned three kinds of laser all is 0.1～50w.The power of described microwave treatment is 600～2000w.
When laser is ultraviolet laser or visible light laser, but especially to containing ultraviolet light or visible photodegradative organic matter in the metallic conduction printing ink.
When laser facula acts on the primary circuit, the acting as of laser: at first be in the electrically conductive ink of deposite metal metal nanoparticle, increase the adhesion between the metal nanoparticle, secondly be the organic principle in the degraded metallic conduction printing ink.
As when laser is infrared light laser; The heat energy that is produced when utilizing infrared light laser emission is ablated the organic principle in the metallic conduction printing ink; Can also melt the metal nanoparticle in the metal electrically conductive ink; And the adhesion degree between the enhancing metal nanoparticle, further improve the electric conductivity of spray printing circuit.
When selecting microwave to handle primary circuit, be directed against the metal nanoparticle of polymer overmold especially with high dielectric loss coefficient.When on microwave action and the primary circuit, it is inner that microwave can be transmitted to the polymer molecule with high dielectric loss coefficient, with high hunting of frequency, causes the effects such as electromagnetic viscosimeter of molecule, increases the motion of molecule, thereby cause the generation of heat; When thermal accumlation arrived to a certain degree, polymer molecule was degraded, and simultaneously, this heat also is enough to melt the adhesion metal nanoparticle.
Above-mentioned by ink-jet printer with metallic conduction printing ink spray printing on printing plate or film; On printing plate or film, obtain the primary circuit that formed by metallic conduction printing ink, its ink-jet printer particularly utilizes piezoelectric type spray printing technology to print on printing plate or film according to the preset circuit pattern that is stored in the computer and prepares primary circuit.Described metallic conduction printing ink is commercially available or known product, comprises metal nanoparticle or metal organic coordination compounds in its component.
Content like the conductive component in the metallic conduction printing ink can be 10～50wt%, and conductive component is metal nanoparticle or metal organic coordination compounds.The non-special qualification of said metal nanoparticle be the nano particle of gold, silver, palladium, platinum, nickel, cobalt, copper, iron etc., or above-mentioned any two kinds of metal nanoparticles is compound, such as multiple compound metal nanoparticles such as silver-colored copper-clad nano particles.Said metal organic coordination compounds is infinite fatty acid metal complex that to be gold, silver, palladium, platinum, nickel, cobalt, copper, iron etc. form with organic aliphatic acid.
The material of described printing plate or film is this area material commonly used, generally is rigid sheet material or flexible film, as is preferably polyesters, polyimide, polycarbonate-based, polyethylene, polypropylene board or film.
Technical scheme of the present invention has following characteristics:
1. than high temperature sintering or solvent wash, laser can carry out the selectivity hi-Fix to the ink jet printing zone to be handled.
2. laser treatment improves the purity of metal except the organic principle in the metallic conduction printing ink of can degrading, and can also melt metal nanoparticle, increases the adhesion between the particle, further improves the electric conductivity of spray printing circuit.
3. utilize the primary circuit after laser is handled spray printing, speed is fast, and efficient is high, and accurate positioning, and the printing plate or the film that are suitable for are extensive does not have strict requirement, suitable automation to the material and the form (hardboard or film) of printing plate or film.
Description of drawings
Fig. 1. the PET polyester film that will be loaded with primary circuit of the embodiment of the invention 1 is fixed in the schematic top plan view on the reversible controller objective table.
Fig. 2. the continuity scan exposure sintering primary circuit and the equipment therefor sketch map of the embodiment of the invention 1.
Reference numeral
1. primary circuit 2. printing plates/film 3. clips
4.X direction motorized precision translation stage 5.Y direction motorized precision translation stage 6. optical tables
7. base 8. laser heads 9. laser beams
10. bracing frame 11. speculums
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is done further to set forth in detail, said embodiment is convenient to understand the present invention, but not limitation of the present invention.
See also the device that is used for continuity scan exposure sintering primary circuit shown in Figure 2: a base 7 is installed, laser instrument 8 is installed on base 7 on one side of an optical table 6; The objective table that has directions X motorized precision translation stage 4 and Y direction motorized precision translation stage 5 is installed on the another side of said optical table 6; On this objective table, place and be loaded with the printing plate/film 2 of primary circuit 1, and the printing plate/film 2 that is loaded with primary circuit 1 can be fixed in through clip 3 can be on the objective table of directions X and Y direction electric translation; One bracing frame 10 is installed on the optical table 6 of loading edge of table; One speculum 11 is installed on the support frame as described above 10, and described speculum 11 is positioned at said objective table top, and can make the light of laser beam 9 after this mirror reflects that laser head 8 sends perpendicular to objective table.It is following to utilize this device to carry out the method for continuity scan exposure sintering primary circuit:
1) by ink-jet printer according to preset circuit pattern; To contain mass fraction is 10%; Particle diameter is the electrically conductive ink (NanoMas Technologies, Inc., NMTI NanoSilver Inks (NTS05)) of the Nano silver grain of 2～10nm; Is on the PET polyester film with piezoelectricity mode spray printing in printing plate/film 2; On the PET polyester film, obtain being about by the thickness that above-mentioned electrically conductive ink forms the primary circuit 1 (pattern form for preset circuit pattern shape) of 7 μ m, the PET polyester film that is loaded with primary circuit is fixed in through clip 3 can be on the objective table of directions X and Y direction electric translation, as shown in Figure 1;
2) wavelength that utilizes laser head 8 to be sent is 808nm, and power is that the PET polyester film that has primary circuit on 9 pairs of step 1) objective tables of infrared light laser beam of 0.7w carries out continuity scan exposure sintering; Wherein, When carrying out continuity scan exposure sintering; Laser head 8, speculum 11 and bracing frame 10 keep fixing, and the distance of laser head and speculum and speculum and primary circuit remains unchanged, and utilize moving of computer program control objective table; The translational speed of the directions X motorized precision translation stage 4 of objective table is 0.4m/s, and the translational speed of the Y direction motorized precision translation stage 5 of objective table is 0.1mm/s; The diameter of the hot spot that on primary circuit 1, is produced by the laser beam that laser head sent be spray printing primary circuit in the step 1) ink-jet printer the shower nozzle internal diameter 200%, dropping on hot spot on the primary circuit by the laser beam that laser head sent is that the laser beam that sent by laser head shines on primary circuit after through speculum 11 individual reflections and obtains.After primary circuit carried out continuity scan exposure sintering, the square resistance of measuring spray printing circuit on the PET polyester film was 0.29 Ω/.
If the PET polyester film that is loaded with primary circuit that will prepare according to the step 1) method fully places the Muffle furnace insulation of 150 ℃ (because PET film multipotency bear 150 ℃ of high temperature) to take out after 30 minutes, the square resistance of measuring spray printing circuit on the PET polyester film is up to 170 Ω/.
1) by ink-jet printer according to preset circuit pattern; To contain mass fraction is 20%; Particle diameter be the argent electrically conductive ink (NanoMas Technologies, Inc., NMTI NanoGold Inks (NTG05)) of 20nm with electrostatic spray printing on polycarbonate film; The thickness that on polycarbonate film, obtains being formed by above-mentioned electrically conductive ink is the primary circuit of 0.4 μ m, and the PET polyester film that is loaded with primary circuit is fixed on the objective table;
2) laser head is positioned the starting point of the primary circuit of step 1), utilizes the computer program control laser beam (wavelength: 432nm that laser head sent; Power: 1w), the track that is moved when the spray printing circuit pattern according to the step 1) ink-jet printer moves, and is 30cm/s by the translational speed of the laser beam that laser head sent; The laser beam that utilizes laser head to send only carries out selective scanning exposure sintering (unlatching LASER Light Source) to the primary circuit on the polycarbonate film on the step 1) objective table, does not have the part of primary circuit not carry out scanning sintering (closing LASER Light Source) on the polycarbonate film;
The hot spot that is dropped on the primary circuit by the laser beam that laser head sent is that the laser beam direct irradiation that is sent by laser head obtains on primary circuit; 150% of the shower nozzle internal diameter of the ink-jet printer that the above-mentioned diameter that drops on the hot spot on the primary circuit by the laser beam that laser head sent is a spray printing primary circuit in the step 1), laser beam is the laser beam of wall scroll.After primary circuit carried out the selective scanning sintering, the square resistance that obtains spray printing circuit on the polycarbonate film was 0.07 Ω/.
Place the Muffle furnace of 120 ℃ (because polycarbonate film high energy bear 120 ℃ of high temperature) if will be fully according to the polycarbonate film sample that is loaded with primary circuit of method preparation in the step 1); And under this temperature, kept 30 minutes; Take out sample, the square resistance of measuring spray printing circuit on the polycarbonate film is up to 13 Ω/.
1) by ink-jet printer according to preset circuit pattern; To contain mass fraction is 10%; Particle diameter is the metallic copper electrically conductive ink (NovaCentrix.Inc. of 140nm; Metalon ICI-003) with the thermal bubble type spray printing on polyimide plate, the thickness that on polyimide plate, obtains being formed by above-mentioned electrically conductive ink is the primary circuit of 40 μ m, and the polyimide plate that is loaded with primary circuit is fixed on the objective table;
2) laser head is positioned the starting point of step 1) primary circuit, utilizes the computer program control laser beam (wavelength: 1064nm that laser head sent; Power: 1.5w), be 50cm/s by the translational speed of the laser beam that laser head sent, the hot spot that is dropped on the primary circuit by the laser beam that laser head sent is that the vertical direct irradiation of laser beam that is sent by laser head obtains on primary circuit;
The laser beam that utilizes laser head to send carries out continuity scanning to the polyimide plate that is loaded with primary circuit on the step 1) objective table; Through the computer program control laser beam that laser head sent; Open LASER Light Source when being chosen in primary circuit; Primary circuit is carried out selective scanning exposure sintering, when no primary circuit, close LASER Light Source;
Above-mentioned by the laser beam that laser head sent drop on the diameter of hot spot on the primary circuit be spray printing primary circuit in the step 1) ink-jet printer the shower nozzle internal diameter 1000%, laser beam is the laser beam of wall scroll.Primary circuit carried out the square resistance of gained spray printing circuit is 0.14 Ω/ behind the selective scanning sintering.
By ink-jet printer according to preset circuit pattern; To contain mass fraction is 12%; Particle diameter is that conductive ink (solvent is that volume ratio is 1: 3 ethylene glycol and an ethanol mixed solvent) spray printing of the polyacrylic acid coated with silver nano particle of 10nm obtains the primary circuit that is formed by above-mentioned electrically conductive ink on the PET film on the PET film; The PET film that is loaded with primary circuit is carried out laser overall exposing sintering, and optical maser wavelength is 980nm, and power is 10w; Regulate LASER Light Source and distance between the PET film that has primary circuit and be 5cm (during laser overall exposing sintering apart from remaining unchanged), laser overall exposing sintering time is 5 minutes.Primary circuit carried out the square resistance of gained spray printing circuit is 0.09 Ω/ behind the laser overall exposing sintering.
By ink-jet printer according to preset circuit pattern; To contain mass fraction is 15%; Particle diameter is that conductive ink (solvent is that volume ratio is 1: 5 the ethylene glycol and the mixed solvent of the water) spray printing of the polyvinyl alcohol coated with silver nano particle of 20nm obtains the primary circuit that is formed by above-mentioned electrically conductive ink on PEN (PEN) film on the PEN film; The PEN film that is loaded with primary circuit is carried out microwave treatment sintering (power is the microwave (2450MHz) of 800w); Regulate microwave light source and distance between the PEN film that has primary circuit and be 30cm (during the microwave treatment sintering apart from remaining unchanged), the time of microwave treatment sintering is 120 seconds.Primary circuit carried out the square resistance of gained spray printing circuit is 0.11 Ω/ behind the microwave treatment sintering.
Utilize ink-jet printer according to preset circuit pattern; To contain mass fraction is 15%; Particle diameter be 80nm silver-colored electrically conductive ink (NovaCentrix.Inc.Metalon, JS-015) with little point type spray printing on printing paper, on printing paper, obtain the primary circuit that forms by above-mentioned electrically conductive ink; The thickness of primary circuit is 15 μ m.
Selecting power is large tracts of land (the infrared laser array light source (1064nm) of 30cm * 30cm) of 1.3w; Regulate LASER Light Source and distance between the printing paper that is loaded with primary circuit and be 15cm (during laser selective exposure sintering apart from remaining unchanged); The shape that the laser beam that control is used to make public is produced on primary circuit is corresponding fully with the shape of said primary circuit; Optionally exposure is sintered in the primary circuit of spray printing on the printing paper, the 5 minutes time of laser selective exposure sintering.
Primary circuit carried out the square resistance of gained spray printing circuit is 0.10 Ω/ behind the laser selective exposure sintering.
Claims (10)
1. the method for the primary circuit of laser or microwave treatment spray printing metallic conduction printing ink preparation; It is characterized in that: utilize laser continuity scan exposure sintering, selective scanning exposure sintering, overall exposing sintering or selectivity exposure sintering primary circuit, or utilize the primary circuit of microwave treatment sintering by the preparation of spray printing metallic conduction printing ink by the preparation of spray printing metallic conduction printing ink.
2. method according to claim 1 is characterized in that: the said laser that utilizes carries out to primary circuit that the square resistance of gained spray printing circuit is 0.01～10 Ω/ behind continuity scan exposure sintering, selective scanning exposure sintering, overall exposing sintering or the selectivity exposure sintering;
The said microwave that utilizes carries out to primary circuit that the square resistance of gained spray printing circuit is 0.01～10 Ω/ behind the microwave treatment sintering.
3. method according to claim 1 and 2; It is characterized in that the described laser continuity scan exposure sintering that utilizes by the primary circuit of spray printing metallic conduction printing ink preparation is: printing plate that has primary circuit or film that the laser beam that utilizes laser head to send is opposite on the objective table carry out continuity scan exposure sintering; Wherein, when carrying out continuity scan exposure sintering, utilize computer program control objective table to move or control the laser beam that sends by laser head and move;
The described laser selective scan exposure sintering that utilizes by the primary circuit of spray printing metallic conduction printing ink preparation is: the starting point that laser head is positioned primary circuit; Utilize computer program control objective table or control laser beam by laser head sent; The track that is moved when the spray printing circuit pattern according to ink-jet printer moves; Close LASER Light Source when being chosen in no primary circuit; When primary circuit is arranged, open LASER Light Source, printing plate that has primary circuit or the primary circuit on the film that the laser beam that utilizes laser head to send is opposite on the objective table carry out selective scanning exposure sintering; Or
Laser head is positioned the starting point of primary circuit; Utilizing computer program control objective table to move or control the laser beam that is sent by laser head moves; Printing plate that has primary circuit or film that the laser beam that utilizes laser head to send is opposite on the objective table carry out continuity scanning; Through the computer program control laser beam that laser head sent; Open LASER Light Source when being chosen in primary circuit, primary circuit is carried out selective scanning exposure sintering, when no primary circuit, close LASER Light Source;
The said hot spot that is dropped on the primary circuit by the laser beam that laser head sent is that the laser beam direct irradiation that is sent by laser head obtains on primary circuit, or is shone after through the speculum individual reflection by laser beam that laser head sent and on primary circuit, to obtain;
Above-mentioned by the laser beam that laser head sent drop on the diameter of hot spot on the primary circuit be the spray printing primary circuit ink-jet printer the shower nozzle internal diameter 50%～1000%;
Described laser beam is the laser beam of wall scroll or the linear laser light beam of being made up of the laser beam of a plurality of wall scrolls.
4. method according to claim 1 and 2 is characterized in that, describedly utilizes laser overall exposing sintering or utilizes the microwave treatment sintering by the primary circuit of spray printing metallic conduction printing ink preparation to be:
The printing plate or the distance between the film of regulating LASER Light Source or microwave light source and having a primary circuit are 5～30cm, and printing plate or the film that has primary circuit carried out laser overall exposing sintering or carry out the microwave treatment sintering; The time of said laser overall exposing sintering is 1～10 minute, and the time of microwave treatment sintering is 10～180 seconds;
Above-mentioned when carrying out laser overall exposing sintering, LASER Light Source and have the printing plate of primary circuit or the distance between the film remains unchanged during sintering;
Above-mentioned when carrying out the microwave treatment sintering, microwave light source and have the printing plate of primary circuit or the distance between the film remains unchanged.
5. method according to claim 1 and 2 is characterized in that, the described laser selective exposure sintering that utilizes by the primary circuit of spray printing metallic conduction printing ink preparation is:
The printing plate or the distance between the film of regulating laser head and having a primary circuit are 5～30cm; The shape that the laser beam that control is used to make public is produced on primary circuit is corresponding fully with the shape of said primary circuit, and optionally exposure is sintered in the primary circuit of spray printing on printing plate or the film; 1～10 minute time of laser selective exposure sintering;
Above-mentioned when carrying out selectivity exposure sintering, LASER Light Source and have the printing plate of primary circuit or the distance between the film remains unchanged during sintering.
6. method according to claim 3; It is characterized in that: in carrying out laser continuity scan exposure sintering and laser selective scan exposure sintering; When laser head emission laser beam direct irradiation is on primary circuit, laser head and have the printing plate of primary circuit or the distance between the film remains unchanged during sintering; When the laser head emission laser beam when shining on primary circuit behind the speculum individual reflection, the distance of laser head and speculum and speculum and have the printing plate of primary circuit or the distance between the film remains unchanged during sintering.
7. method according to claim 3 is characterized in that: described translational speed by the laser beam that laser head sent is 0.1mm/s～2m/s, and the translational speed of objective table is 0.1mm/s～2m/s.
8. method according to claim 3 is characterized in that: described laser is selected from a kind of in ultraviolet laser, visible light laser and the infrared light laser, and the power of above-mentioned three kinds of laser all is 0.1～50w.
9. method according to claim 4 is characterized in that: described laser is selected from a kind of in ultraviolet laser, visible light laser and the infrared light laser, and the power of above-mentioned three kinds of laser all is 0.1～50w;
The power of described microwave treatment is 600～2000w.
10. method according to claim 5 is characterized in that: described laser is selected from a kind of in ultraviolet laser, visible light laser and the infrared light laser, and the power of above-mentioned three kinds of laser all is 0.1～50w.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102819828A CN102398438A (en) | 2010-09-15 | 2010-09-15 | Method for preparing primary circuit by jet-printing metal conductive printing ink by virtue of laser or microwave processing |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010102819828A CN102398438A (en) | 2010-09-15 | 2010-09-15 | Method for preparing primary circuit by jet-printing metal conductive printing ink by virtue of laser or microwave processing |
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| CN102398438A true CN102398438A (en) | 2012-04-04 |
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Cited By (4)
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| CN102612271A (en) * | 2012-04-09 | 2012-07-25 | 深圳市泛友科技有限公司 | Three-dimensional circuit on structure member and manufacturing method thereof |
| CN104183335A (en) * | 2014-09-17 | 2014-12-03 | 北京印刷学院 | Method for fast sintering printing nano-silver paste at low temperature through laser to form pure-silver conductive image and text |
| CN105073416A (en) * | 2013-03-29 | 2015-11-18 | 太阳控股株式会社 | Thermoplastic resin film base for optical firing, conductive circuit board using same, and method for manufacturing said conductive circuit board |
| CN110892796A (en) * | 2017-08-01 | 2020-03-17 | 惠普发展公司，有限责任合伙企业 | Chipless RFID printing method |
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| CN1314829A (en) * | 1998-08-21 | 2001-09-26 | 斯里国际 | Printing of electronic circuit and components |
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| US20090191358A1 (en) * | 2005-09-28 | 2009-07-30 | Jolke Perelaer | Method for Generation of Metal Surface Structures and Apparatus Therefor |
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| CN1314829A (en) * | 1998-08-21 | 2001-09-26 | 斯里国际 | Printing of electronic circuit and components |
| US20050074589A1 (en) * | 2003-09-18 | 2005-04-07 | Pan Alfred I-Tsung | Printable compositions having anisometric nanostructures for use in printed electronics |
| US20090191358A1 (en) * | 2005-09-28 | 2009-07-30 | Jolke Perelaer | Method for Generation of Metal Surface Structures and Apparatus Therefor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102612271A (en) * | 2012-04-09 | 2012-07-25 | 深圳市泛友科技有限公司 | Three-dimensional circuit on structure member and manufacturing method thereof |
| CN102612271B (en) * | 2012-04-09 | 2015-06-03 | 深圳市泛友科技有限公司 | Three-dimensional circuit on structure member and manufacturing method thereof |
| CN105073416A (en) * | 2013-03-29 | 2015-11-18 | 太阳控股株式会社 | Thermoplastic resin film base for optical firing, conductive circuit board using same, and method for manufacturing said conductive circuit board |
| CN105073416B (en) * | 2013-03-29 | 2018-01-23 | 太阳控股株式会社 | Light sintering thermoplastic resin membrane base material, conducting channel substrate and its manufacture method using it |
| CN104183335A (en) * | 2014-09-17 | 2014-12-03 | 北京印刷学院 | Method for fast sintering printing nano-silver paste at low temperature through laser to form pure-silver conductive image and text |
| CN110892796A (en) * | 2017-08-01 | 2020-03-17 | 惠普发展公司，有限责任合伙企业 | Chipless RFID printing method |
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