CN114284058A - Electronic equipment, circuit board assembly, inductance device and preparation method thereof - Google Patents
Electronic equipment, circuit board assembly, inductance device and preparation method thereof Download PDFInfo
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- CN114284058A CN114284058A CN202111601629.8A CN202111601629A CN114284058A CN 114284058 A CN114284058 A CN 114284058A CN 202111601629 A CN202111601629 A CN 202111601629A CN 114284058 A CN114284058 A CN 114284058A
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Abstract
The application provides an electronic device, a circuit board assembly, an inductance device and a preparation method thereof; the preparation method of the inductance device comprises the following steps: placing a metal coil in a printing solution having photo-curing properties; irradiating the projection area and the projection peripheral area of the metal coil on the liquid level of the printing solution by using ultraviolet laser so as to enable the irradiated printing solution to form a solidified layer; and controlling the metal coil to move along the direction vertical to the liquid level of the printing solution, and further printing layer by layer to form an inductance device wrapping the metal coil. According to the preparation method of the inductor, the inductor is integrally formed in a 3D printing mode, and the preparation method has the advantages of being short in preparation period, high in forming precision, low in cost and capable of forming the inductor with a complex shape.
Description
Technical Field
The invention relates to the technical field of inductance processing technology, in particular to a preparation method of an inductance device, a circuit board assembly comprising the inductance device and electronic equipment comprising the circuit board assembly.
Background
The common inductor manufacturing technology at present comprises the traditional winding inductor manufactured by magnetic core forming and coil winding; the laminated inductor is widely applied to a printed circuit board, and is prepared by exposing and developing silver paste routing and through hole lamination on a magnetic substrate; and an integrally formed inductor (also called a molded inductor) formed by simultaneously processing and forming a coil and a magnetic powder core, which are gradually emerging at present.
Although the scheme of firstly forming the magnetic core, then winding the magnetic core, exposing, developing and punching the through hole to form the circuit is quite mature, the efficiency is relatively low. The molding inductance adopted for solving the problem of 'walking step by step' organically integrates the winding completed inductance and the molding of the magnetic core, effectively solves the efficiency problem, but also introduces the related problems of the mold: if the machining precision is limited by the precision of the die (the conventional machining is about +/-30 mu m), and the precision is gradually reduced along with the use of the die; in addition, the die sinking period is long, the cost is high and the like for the inductance press fitting jig with the unconventional size.
Disclosure of Invention
A first aspect of an embodiment of the present application provides a method for manufacturing an inductor device, where the method includes:
placing a metal coil in a printing solution having photo-curing properties;
irradiating the projection area and the projection peripheral area of the metal coil on the liquid level of the printing solution by using ultraviolet laser so as to enable the irradiated printing solution to form a solidified layer;
and controlling the metal coil to move along the direction vertical to the liquid level of the printing solution, and further printing layer by layer to form an inductance device wrapping the metal coil.
In a second aspect, embodiments of the present application provide a circuit board assembly, which includes a substrate and an inductance device formed on the substrate by using the manufacturing method of any one of the above embodiments; the substrate comprises any one of a PCB (printed Circuit Board) board and an FPC (Flexible printed Circuit) board.
In addition, this application embodiment still provides an electronic equipment, electronic equipment include casing, display screen and above-mentioned embodiment circuit board assembly, the casing with the display screen cooperation forms accommodation space, circuit board assembly locates in the accommodation space, and with the display screen electricity is connected.
According to the preparation method of the inductor, the inductor is integrally formed in a 3D printing mode, and the preparation method has the advantages of being short in preparation period, high in forming precision, low in cost and capable of forming the inductor with a complex shape.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart diagram of one embodiment of a method for manufacturing an inductive device according to the present application;
fig. 2 is a schematic structural view of an overall apparatus to which the method for manufacturing an inductance device in this embodiment is applied;
fig. 3 is a schematic structural diagram of an inductive device formed by the manufacturing method in the embodiment of the present application;
fig. 4 is a schematic structural diagram of another inductor device formed by the manufacturing method in the embodiment of the present application;
FIG. 5 is a schematic flow chart diagram of another embodiment of a method for making an inductive device according to the present application;
FIG. 6 is a schematic flow chart diagram illustrating a further embodiment of a method for fabricating an inductive device according to the present application;
fig. 7 is another schematic structural view of an overall apparatus to which the manufacturing method of the inductance device in this embodiment is applied;
FIG. 8 is a schematic diagram of the distribution of components of a circuit board in a conventional solution;
fig. 9 is a schematic diagram of an on-board device distribution of a circuit board assembly formed using the inductive device fabrication method of the present embodiment;
FIG. 10 is a schematic structural diagram of an embodiment of an electronic device of the present application;
FIG. 11 is a schematic cross-sectional view taken along line A-A of the electronic device of FIG. 10;
fig. 12 is a block diagram illustrating a structural composition of an embodiment of an electronic device according to the present application.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only illustrative of the present invention, and do not limit the scope of the present invention. Likewise, the following examples are only some but not all examples of the present invention, and all other examples obtained by those skilled in the art without any inventive step are within the scope of the present invention.
The terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly.
The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.
Referring to fig. 1, fig. 1 is a schematic flow chart illustrating an embodiment of a method for manufacturing an inductor device according to the present application; it should be noted that the inductance device formed by the preparation method in the present application may be used in a circuit board assembly of an electronic device, such as a mobile phone, a tablet computer, a notebook computer, and a wearable device. The preparation method includes, but is not limited to, the following steps.
Step S100, a metal coil is placed in a printing solution having a photo-curing property.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an overall apparatus suitable for the method for manufacturing an inductor device in this embodiment, specifically, a container 101 may contain a printing solution 102 with a photosensitive curing property. The metal coil 103 which is pre-coiled with the required number of turns is placed in the printing solution by means of a mechanical clamping jig and the like.
Alternatively, the printing solution 102 employed in the present embodiment includes a metal magnetic powder and a photosensitive resin. The metal magnetic powder may be a magnetic material such as FeSiAl, FeSi, FeNi, or the like. The particle size of the metal magnetic powder may be 1-10um, specifically 1um, 2um, 5um, 10um, etc., and is selected according to the requirement of printing precision, which is not specifically limited herein.
Optionally, the photosensitive resin mainly comprises a photosensitive prepolymer, an active diluent, a photoinitiator, a photosensitizer and the like. The photosensitive prepolymer can comprise one or a mixture of more of acrylic acid esterification epoxy resin, unsaturated polyester and polyurethane; the reactive diluent may include one or more of n-butyl acrylate, isooctyl acrylate, isodecyl acrylate, lauryl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, styrene, vinyl acetate, n-vinyl pyrrolidone, ethylene glycol diacrylates, propylene glycol diacrylates; the photoinitiator can comprise one or more of benzoin and derivatives, acetophenone and derivatives; the photosensitizer may comprise a mixture of one or more of benzophenone, michaelis-ler-ketone, and imidazole derivatives.
Alternatively, the mass ratio of the metal magnetic powder in the printing solution is greater than 80%, that is, the mass ratio of the photosensitive resin in the printing solution is generally less than 20%. The mass ratio of the metal magnetic powder to the photosensitive resin in the printing solution is dependent on the magnetic permeability of the inductor, the granularity of the metal magnetic powder and the specific selection of the photosensitive resin, and generally the metal magnetic powder is distributed in the photosensitive resin at a high density without being adhered to each other in a large scale. Referring to the following table, the following table shows the mass ratio of each material in a printing solution.
The preparation method further comprises a step S200 of irradiating the projection area of the metal coil on the liquid surface of the printing solution and the projection peripheral area by using ultraviolet laser so that the irradiated printing solution forms a solidified layer.
The printing solution has photosensitive curing property, so that polymerization reaction can occur and the printing solution can be rapidly cured under the irradiation of ultraviolet laser. Before printing, the lifting platform 104 is positioned at the height of a section layer (primary illumination curing thickness) below the liquid level, and the focused ultraviolet laser is irradiated on a projection area of the metal coil on the liquid level of the printing solution and a projection peripheral area (the size and the position of the area are determined according to the structure of the inductance device after printing and molding) under the control of a computer, so that the irradiated printing solution forms a curing layer. In the scanned area, the resin is cured, resulting in a thin sheet of resin of this cross-section. Wherein, the wavelength of the ultraviolet laser can be 250-400 nm. Reference 108 is shown as an ultraviolet laser transmitter.
The preparation method further comprises a step S300 of controlling the metal coil to move along a direction vertical to the liquid level of the printing solution, and further printing layer by layer to form the inductance device wrapping the metal coil.
The elevator table 104 is lowered a layer thickness distance to re-expose the liquid resin to light, and the scanning is again performed to cure, and so on until the entire product is formed. Based on the advantages of 3D printing, the shape of the inductor device can be more various without being limited to a square, regular molded inductor shape, and the size specification is also more various. Referring to fig. 3 and 4 together, fig. 3 is a schematic structural diagram of an inductor device formed by a manufacturing method in an embodiment of the present application, and fig. 4 is a schematic structural diagram of another inductor device formed by a manufacturing method in an embodiment of the present application, in which one or more metal coils 103 are enclosed in an inductor device 105.
The molded inductor in the traditional technology is basically manufactured by adopting a mold designed based on the size of the traditional inductor, the type of the general mold is limited, the mold opening period is long (the service life of the mold is generally 10k-20k pieces), the molding precision of an inductor device is limited by the mold precision (the conventional processing is about +/-30 mu m), and the molding precision is gradually reduced along with the use precision of the mold; in addition, an inductance device with a special-shaped structure cannot be processed, an abnormal size mold is not common, mold opening is needed again, and the cost is extremely high.
In comparison, the inductor formed by the method in this embodiment has the advantages of short manufacturing cycle, high forming precision (the forming precision can be ± 10 μm), good precision consistency (not limited by the precision of the mold (± 30 μm) which fluctuates with the service life), low cost, and capability of forming an inductor with a complex shape.
Referring to fig. 5, fig. 5 is a schematic flow chart of another embodiment of a method for manufacturing an inductor device according to the present application; the preparation method in this embodiment includes, but is not limited to, the following steps.
Step S100, a metal coil is placed in a printing solution having a photo-curing property.
With continued reference to fig. 2, a container 101 holds a printing solution 102 having photo-curing properties. The metal coil 103 which is pre-coiled with the required number of turns is placed in the printing solution by means of a mechanical clamping jig and the like. Alternatively, the printing solution 102 employed in the present embodiment includes a metal magnetic powder and a photosensitive resin. The metal magnetic powder may be a magnetic material such as FeSiAl, FeSi, FeNi, or the like. The particle size of the metal magnetic powder may be 1-10um, specifically 1um, 2um, 5um, 10um, etc., and is selected according to the requirement of printing precision, which is not specifically limited herein. Optionally, the photosensitive resin mainly includes a photosensitive prepolymer, a reactive diluent, a photoinitiator, a photosensitizer, and the like, as described above. Alternatively, the mass ratio of the metal magnetic powder in the printing solution is greater than 80%, that is, the mass ratio of the photosensitive resin in the printing solution is generally less than 20%. The mass ratio of the metal magnetic powder to the photosensitive resin in the printing solution is dependent on the magnetic permeability of the inductor, the granularity of the metal magnetic powder and the specific selection of the photosensitive resin, and generally the metal magnetic powder is distributed in the photosensitive resin at a high density without being adhered to each other in a large scale.
The preparation method further comprises a step S200 of irradiating the projection area of the metal coil on the liquid surface of the printing solution and the projection peripheral area by using ultraviolet laser so that the irradiated printing solution forms a solidified layer.
The printing solution has photosensitive curing property, so that polymerization reaction can occur and the printing solution can be rapidly cured under the irradiation of ultraviolet laser. Before printing, the lifting platform 104 is positioned at the height of a section layer (primary illumination curing thickness) below the liquid level, and the focused ultraviolet laser is irradiated on a projection area of the metal coil on the liquid level of the printing solution and a projection peripheral area (the size and the position of the area are determined according to the structure of the inductance device after printing and molding) under the control of a computer, so that the irradiated printing solution forms a curing layer. In the scanned area, the resin is cured, resulting in a thin sheet of resin of this cross-section. Wherein, the wavelength of the ultraviolet laser can be 250-400 nm.
The preparation method further comprises a step S300 of controlling the metal coil to move along a direction vertical to the liquid level of the printing solution, and further printing layer by layer to form the inductance device wrapping the metal coil.
The elevator table 104 is lowered a layer thickness distance to re-expose the liquid resin to light, and the scanning is again performed to cure, and so on until the entire product is formed. Based on the advantages of 3D printing, the shape of the inductor device can be more various without being limited to a square, regular molded inductor shape, and the size specification is also more various.
Unlike the previous embodiment, the manufacturing method in this embodiment further includes a step S400 of performing sintering hardening on the printed inductor device.
Through the steps, although the inductance device is molded, the internal organic content is still high, but the compactness is not enough, and part of the stress which is not dissipated exists, so that the comprehensive permeability of the device is low, and the relative permeability mu r is about 15-20. In order to further increase the compactness of the forming and the structural rigidity, the internal stress of the structure can be reduced in a high-temperature annealing mode to improve the magnetic conductivity of the inductor, so that the inductance of the inductor is increased, and the printed finished product is subjected to sintering treatment. The sintering temperature can be 500-800 deg.C for 1-5hr, and different sintering temperatures can be selected for different powder (metal magnetic powder) and photosensitive resin compositions, and low-temperature sintering at below 500 deg.C can also be adopted. So far, the coil and the metal magnetic powder basically achieve the effect of integral molding by the process of printing and sintering, the processing precision can be close to +/-10 mu m, and the magnetic permeability mu r can reach 50-100H/m.
Optionally, a certain pressure may be applied to the inductor during the sintering process, the pressure value may be 300-800Mpa, specifically 300Mpa, 350Mpa, 400Mpa, 500Mpa, 600Mpa, 800Mpa, and the like, and the pressure value is determined according to the sintering temperature, the material of the metal magnetic powder, the mass fraction of the photosensitive resin, and the like, and is not specifically limited here, so as to ensure that the metal magnetic powder is further shrunk and compressed without generating voids after the decomposition of part of the organic resin, thereby improving the compactness and rigidity of the inductor.
In the preparation method in this embodiment, the step of sintering is added, so that the compactness and the structural rigidity of the inductor can be improved, and the magnetic permeability of the inductor can be improved.
Referring to fig. 6, fig. 6 is a schematic flow chart of a manufacturing method of an inductor device according to still another embodiment of the present application; the preparation method in this embodiment includes, but is not limited to, the following steps.
Step S500, the metal coil is fixedly disposed on the substrate.
The manufacturing method in this embodiment is to realize integral molding of the inductor device and the substrate. The substrate can be made of ceramic sheets, PCB (printed Circuit Board), FPC (Flexible printed Circuit) raw material boards, PI (polyimide), PET (polyethylene terephthalate) and the like. When the substrate is made of a PCB board or an FPC board, the metal coil may be electrically connected and fixed to the substrate, so that the formed inductor device is electrically connected to the substrate, and a circuit board assembly at least having an inductance function is formed. More complex circuit board assembly structures can be formed when the substrate already has other devices on it. The specific material selected for the substrate also needs to be considered, such as the subsequent sintering temperature.
The manufacturing method further includes a step S600 of placing the substrate together with the metal coil in a printing solution having a photo-curing property.
In step S600, please refer to fig. 7, fig. 7 is another schematic structural diagram of the overall apparatus to which the method for manufacturing an inductor device according to the present embodiment is applied; the substrate 106 is fixed on the lift table 104 together with the metal coil 103 and placed in the printing solution 102 having a photo-curing property. For the components of the printing solution 102, please refer to the description of the foregoing embodiments, which is not repeated herein.
The preparation method further comprises a step S200 of irradiating the projection area of the metal coil on the liquid surface of the printing solution and the projection peripheral area by using ultraviolet laser so that the irradiated printing solution forms a solidified layer.
And S700, controlling the metal coil and the substrate to move along a direction vertical to the liquid level of the printing solution, and further printing layer by layer to form an inductance device wrapping the metal coil.
The printed inductor is connected with the substrate, and the inductor and the substrate are integrally formed.
The manufacturing method further comprises a step S400 of sintering and hardening the printed inductance device.
In the preparation method of this embodiment, the substrate is selected according to the subsequent sintering temperature, if high-temperature sintering is selected, the substrate is preferably made of high-temperature resistant materials such as ceramics, and if low-temperature sintering or non-sintering is selected subsequently, the PCB board, the FPC raw material, PI, PET, and the like can be directly used as the substrate. The specific manner and parameters of sintering can be selected by those skilled in the art, and are not described herein.
The method for manufacturing the inductance device in the embodiment can be used for forming the inductance device with the abnormal shape and the unconventional size, and is beneficial to improving the utilization rate of the circuit board substrate on the board. Referring to fig. 8 and 9 together, fig. 8 is a schematic diagram of device distribution of a circuit board in a conventional technical solution, and fig. 9 is a schematic diagram of device distribution on a circuit board assembly formed by using the inductance device manufacturing method in this embodiment, it can be seen that the printing and forming method in this embodiment can better utilize the area of the corner or gap on the board to increase the utilization rate on the board. Reference numeral 105 denotes an inductance device formed by the manufacturing method in the example of the present application. Reference 105a indicates an inductive device of the conventional technical solution. By using the method in this embodiment, the inductance device 105 in the embodiment of the present application can be formed at a gap position (that is, a gap position marked with 105b in fig. 8) where the inductance device cannot be formed by a conventional method, so that the on-board utilization rate of the circuit board assembly is improved, and a possibility is provided for the miniaturization design of the circuit board assembly.
Further, an electronic device is provided in an embodiment of the present application, please refer to fig. 10 and 11 together, fig. 10 is a schematic structural diagram of an embodiment of the electronic device in the present application; fig. 11 is a schematic cross-sectional structure view at a-a of the electronic device shown in fig. 10. The electronic device may include a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like, and the mobile phone is taken as an example in this embodiment for description. The electronic device in this embodiment may include a display screen 30, a housing 10, and a circuit board assembly 20.
Optionally, the display screen 30 and the housing 10 cooperate to form an accommodating space 1000, the circuit board assembly 20 is disposed in the accommodating space 1000, the circuit board assembly 20 is electrically connected to the display screen 30, and the circuit board assembly 20 is configured to control a working state of the display screen 30. The detailed technical features of other parts of the electronic device are within the understanding of those skilled in the art, and are not described herein.
Referring to fig. 12, fig. 12 is a block diagram illustrating a structural composition of an embodiment of an electronic device according to the present application, where the electronic device may be a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like, and the embodiment illustrates a mobile phone as an example. The electronic device may have a structure including an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display screen 30 in the above-described embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; power supply 990 is operable to provide power to the entire electronic device 10. The inductor device and the circuit board assembly obtained by the method in the foregoing embodiments may be applied to a main control circuit board of an electronic device and sub-control circuit boards of various functional devices, such as a main control circuit board on which the processor 980 is located and an audio control board on which the audio circuit 960 is located, or a driving IC of the display unit 940.
Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941; the sensor 950 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone 962 are connected to the processor 980 through the audio circuit 960 for emitting and receiving sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the electronic device. For specific structural features of the electronic device, please refer to the related description of the above embodiments, and detailed descriptions thereof will not be provided herein.
The above description is only a part of the embodiments of the present invention, and not intended to limit the scope of the present invention, and all equivalent devices or equivalent processes performed by the present invention through the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A method for manufacturing an inductor device, the method comprising:
placing a metal coil in a printing solution having photo-curing properties;
irradiating the projection area and the projection peripheral area of the metal coil on the liquid level of the printing solution by using ultraviolet laser so as to enable the irradiated printing solution to form a solidified layer;
and controlling the metal coil to move along the direction vertical to the liquid level of the printing solution, and further printing layer by layer to form an inductance device wrapping the metal coil.
2. The method of manufacturing according to claim 1, further comprising: and sintering and hardening the printed inductor.
3. The method as claimed in claim 2, wherein in the step of sintering and hardening the printed inductor device, a pressure of 300-800Mpa is applied during sintering.
4. The method according to claim 3, wherein the magnetic permeability of the sintered inductor is 50-100H/m.
5. The production method according to claim 1, wherein the printing solution includes a metal magnetic powder and a photosensitive resin, and a mass ratio of the metal magnetic powder in the printing solution is greater than 80%.
6. The preparation method according to claim 5, wherein the photosensitive resin comprises a photosensitive prepolymer, a reactive diluent, a photoinitiator and a photosensitizer;
the photosensitive prepolymer comprises one or more of acrylic acid esterified epoxy resin, unsaturated polyester and polyurethane;
the active diluent comprises one or more of n-butyl acrylate, isooctyl acrylate, isodecyl acrylate, lauryl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, styrene, vinyl acetate, n-vinyl pyrrolidone, ethylene glycol diacrylate and propylene glycol diacrylate;
the photoinitiator comprises one or more of benzoin and derivatives, acetophenone and derivatives;
the photosensitizer comprises one or more of benzophenone, michaelis-ler ketone and imidazole derivatives.
7. The method according to claim 6, wherein the printing solution comprises 80-90% by mass of the metallic magnetic powder, 5-10% by mass of the acrylate, 2-5% by mass of the epoxy resin, 0.1-0.5% by mass of the radical initiator, 0.1-0.5% by mass of the cationic initiator, and 2-5% by mass of the diluent.
8. The method of manufacturing of claim 1, wherein prior to the step of placing the metal coil in a printing solution having photo-curing properties, the method of manufacturing further comprises: fixedly arranging a metal coil on a substrate;
the step of placing the metal coil in a printing solution having photo-curing properties comprises: placing the substrate with the metal coil in a printing solution having photo-curing properties; so that the printed inductive device is connected with the substrate.
9. A circuit board assembly comprising a substrate and an inductive device formed on the substrate using the manufacturing method of any one of claims 1 to 8; the substrate comprises any one of a PCB (printed Circuit Board) board and an FPC (Flexible printed Circuit) board.
10. An electronic device, comprising a housing, a display screen, and the circuit board assembly of claim 9, wherein the housing and the display screen cooperate to form an accommodating space, and the circuit board assembly is disposed in the accommodating space and electrically connected to the display screen.
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| CN202111601629.8A CN114284058A (en) | 2021-12-24 | 2021-12-24 | Electronic equipment, circuit board assembly, inductance device and preparation method thereof |
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| CN202111601629.8A CN114284058A (en) | 2021-12-24 | 2021-12-24 | Electronic equipment, circuit board assembly, inductance device and preparation method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105632893A (en) * | 2015-12-23 | 2016-06-01 | 清华大学 | Three-dimensional (3D) printing based method for producing micro-inductor |
| CN108925056A (en) * | 2018-07-31 | 2018-11-30 | 珠海元盛电子科技股份有限公司 | A kind of manufacturing method of multiple light courcess control printing PCB circuit |
| CN109676125A (en) * | 2019-01-08 | 2019-04-26 | 北京科技大学 | A kind of method that 3D printing prepares Sintered NdFeB magnet |
| CN110483064A (en) * | 2019-08-20 | 2019-11-22 | 深圳德智达科技有限公司 | A kind of 3D printing high solids content light sensitive ceramics raw material based on solid material Stereolithography, ceramic member and preparation method thereof |
| CN110714199A (en) * | 2019-09-11 | 2020-01-21 | 福建工程学院 | Method for preparing coating by using 3D printing and lapping electron beam |
| CN110756805A (en) * | 2019-11-06 | 2020-02-07 | 北京科技大学 | 3D printing device for selective laser metal solidification and using method thereof |
| CN110842204A (en) * | 2019-11-06 | 2020-02-28 | 北京科技大学 | 3D printing method for selective laser solidified metal |
-
2021
- 2021-12-24 CN CN202111601629.8A patent/CN114284058A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105632893A (en) * | 2015-12-23 | 2016-06-01 | 清华大学 | Three-dimensional (3D) printing based method for producing micro-inductor |
| CN108925056A (en) * | 2018-07-31 | 2018-11-30 | 珠海元盛电子科技股份有限公司 | A kind of manufacturing method of multiple light courcess control printing PCB circuit |
| CN109676125A (en) * | 2019-01-08 | 2019-04-26 | 北京科技大学 | A kind of method that 3D printing prepares Sintered NdFeB magnet |
| CN110483064A (en) * | 2019-08-20 | 2019-11-22 | 深圳德智达科技有限公司 | A kind of 3D printing high solids content light sensitive ceramics raw material based on solid material Stereolithography, ceramic member and preparation method thereof |
| CN110714199A (en) * | 2019-09-11 | 2020-01-21 | 福建工程学院 | Method for preparing coating by using 3D printing and lapping electron beam |
| CN110756805A (en) * | 2019-11-06 | 2020-02-07 | 北京科技大学 | 3D printing device for selective laser metal solidification and using method thereof |
| CN110842204A (en) * | 2019-11-06 | 2020-02-28 | 北京科技大学 | 3D printing method for selective laser solidified metal |
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Application publication date: 20220405 |