CN112736182B - 发光装置及其制造方法 - Google Patents

发光装置及其制造方法 Download PDF

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Publication number
CN112736182B
CN112736182B CN202011090489.8A CN202011090489A CN112736182B CN 112736182 B CN112736182 B CN 112736182B CN 202011090489 A CN202011090489 A CN 202011090489A CN 112736182 B CN112736182 B CN 112736182B
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wall
groove
light
resin
substrate
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Chinese (zh)
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CN112736182A (zh
Inventor
林欣司
武田重郎
松浦健一
下西正太
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Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
CN202011090489.8A 2019-10-14 2020-10-13 发光装置及其制造方法 Active CN112736182B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-188268 2019-10-14
JP2019188268A JP7196813B2 (ja) 2019-10-14 2019-10-14 発光装置およびその製造方法

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CN112736182A CN112736182A (zh) 2021-04-30
CN112736182B true CN112736182B (zh) 2024-03-08

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CN202011090489.8A Active CN112736182B (zh) 2019-10-14 2020-10-13 发光装置及其制造方法

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JP (1) JP7196813B2 (ja)
CN (1) CN112736182B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107994109A (zh) * 2016-10-27 2018-05-04 佛山市国星光电股份有限公司 一种cob显示模组及其制造方法
CN117317035B (zh) * 2023-10-09 2024-05-24 讯芯电子科技（中山）有限公司 一种光感传感器封装结构及其封装方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138849A (ja) * 2009-12-28 2011-07-14 Nichia Corp 発光装置およびその製造方法
CN108028303A (zh) * 2015-09-18 2018-05-11 西铁城电子株式会社 发光装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3844196B2 (ja) * 2001-06-12 2006-11-08 シチズン電子株式会社 発光ダイオードの製造方法
JP5423475B2 (ja) * 2009-03-06 2014-02-19 日亜化学工業株式会社 光半導体装置の製造方法
JP5896758B2 (ja) * 2012-01-25 2016-03-30 シチズン電子株式会社 Ｌｅｄ発光装置
CN105378952B (zh) * 2013-05-13 2018-01-12 首尔半导体（株） 发光器件封装件及其制造方法以及包含该发光器件封装件的车灯和背光单元
CN204632804U (zh) * 2015-05-29 2015-09-09 广州市鸿利光电股份有限公司 芯片级封装led
CN107994109A (zh) * 2016-10-27 2018-05-04 佛山市国星光电股份有限公司 一种cob显示模组及其制造方法
JP6696521B2 (ja) * 2017-05-12 2020-05-20 日亜化学工業株式会社 発光装置及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138849A (ja) * 2009-12-28 2011-07-14 Nichia Corp 発光装置およびその製造方法
CN108028303A (zh) * 2015-09-18 2018-05-11 西铁城电子株式会社 发光装置

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Publication number Publication date
CN112736182A (zh) 2021-04-30
JP7196813B2 (ja) 2022-12-27
JP2021064698A (ja) 2021-04-22

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