CN112736042A - Double-sided water-cooled power module - Google Patents
Double-sided water-cooled power module Download PDFInfo
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- CN112736042A CN112736042A CN202110160291.0A CN202110160291A CN112736042A CN 112736042 A CN112736042 A CN 112736042A CN 202110160291 A CN202110160291 A CN 202110160291A CN 112736042 A CN112736042 A CN 112736042A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- General Physics & Mathematics (AREA)
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- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a double-sided water-cooled power module which comprises a power module body, wherein the power module body mainly comprises a first insulating substrate, a second insulating substrate and a circuit module, the first insulating substrate and the second insulating substrate are oppositely arranged, the circuit module is arranged between the two insulating substrates, the first insulating substrate and the second insulating substrate are both double-sided copper-clad ceramic insulating substrates and comprise an intermediate layer made of insulating materials, and an upper copper layer and a lower copper layer which are respectively arranged on the upper side and the lower side of the intermediate layer, the upper copper layer is a planar copper layer with a groove, the lower copper layer is a pin fin structure which is convenient for water cooling of the power module body, the circuit module is arranged in the upper copper layers of the two oppositely arranged insulating substrates, and a gap between the circuit module and the two insulating substrates is electrically isolated through an epoxy plastic package body; the circuit module mainly comprises a chip, a conductive connecting block, a metal wire, a power terminal and a control terminal.
Description
Technical Field
The invention relates to the technical field of electronic devices, in particular to a double-sided water-cooled power module.
Background
A power module is a power driver that combines power electronics and integrated circuit technology. The intelligent power module gains a bigger and bigger market due to the advantages of high integration level, high reliability and the like, is particularly suitable for frequency converters of driving motors and various inverter power supplies, and is a common power electronic device for variable-frequency speed regulation, metallurgical machinery, electric traction, servo drive and variable-frequency household appliances. With the increasing miniaturization requirement of new energy automobile industry on power modules, the module heat dissipation condition is more and more severe. The planar double-sided heat dissipation module needs to use heat-conducting silicone grease as an intermediate heat-conducting medium, and compared with a traditional single-sided PINFIN direct water cooling module, the heat dissipation capability of the planar double-sided heat dissipation module is not obviously improved, so that the requirement of double-sided PINFIN direct water cooling arises.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a double-sided water-cooled power module capable of improving the heat dissipation capability of the module, improving the long-time working reliability of the module, and improving the power cycle capability of the module, aiming at the above-mentioned defects of the prior art.
The invention aims to provide a double-sided water-cooled power module which comprises a power module body, wherein the power module body mainly comprises a first insulating substrate, a second insulating substrate and a circuit module, the first insulating substrate and the second insulating substrate are oppositely arranged, the circuit module is arranged between the two insulating substrates, the first insulating substrate and the second insulating substrate are both double-sided copper-clad ceramic insulating substrates and comprise an intermediate layer made of insulating materials, and an upper copper layer and a lower copper layer which are respectively arranged on the upper side and the lower side of the intermediate layer, the upper copper layer is a planar copper layer with a groove, the lower copper layer is a pin fin structure which is convenient for water cooling of the power module body, the circuit module is arranged in the upper copper layers of the two oppositely arranged insulating substrates, and a gap between the circuit module and the two insulating substrates is electrically isolated through an epoxy plastic package body.
Furthermore, the circuit module mainly comprises a chip, a conductive connecting block, a metal wire, a power terminal and a control terminal, wherein the back surface of the chip is welded on the upper copper layer of the first insulating substrate, the front surface of the chip is welded with the conductive connecting block, and one side of the conductive connecting block, which is far away from the chip, is welded on the upper copper layer of the second insulating substrate; the metal wire is connected to the chip and the upper copper layer of the first insulating substrate or the second insulating substrate to realize control electrical connection.
Furthermore, the outer surfaces of the upper copper layers of the first insulating substrate and the second insulating substrate are solderable metal layers made of bare copper or electroplated gold and silver materials, and the surfaces of the upper copper layers are used for soldering or aluminum wire bonding to be used as conductive copper layers; the outer surfaces of the lower copper layers of the first insulating substrate and the second insulating substrate are covered with protective layers made of nickel or chromium or alloy materials of the nickel and the chromium, so that the first insulating substrate and the second insulating substrate are directly immersed in cooling liquid for heat dissipation; the insulating material of the middle layer is aluminum oxide or silicon nitride.
Further, the chip is an IGBT chip or a SiC chip, and the surface of the chip is electroplated with one of gold and silver materials or an alloy material thereof; the chip adopts the mode realization electrical connection of two-sided welding or silver thick liquid sintering, the back of chip weld on first insulation substrate through the soldering, the front of chip is connected with electrically conductive connecting block through the soldering welding.
Furthermore, the power terminal and the control terminal are a complete lead frame before the finished product is subjected to bar cutting, one of gold and silver materials or an alloy material of the gold and silver materials is electroplated on the surface of the complete lead frame, and the power terminal and the control terminal are connected to the upper copper layer of the first insulating substrate in a soldering mode.
Furthermore, the metal wire is made of one of pure aluminum, pure copper and pure gold or an alloy material thereof, the metal wire is in a linear or strip structure, and is bonded and connected to the chip and the corresponding insulating substrate in an ultrasonic mode; the conductive connecting block is made of AlSiC, AlC, Cu or Cu-Mo, and is plated with one of nickel, gold and silver materials or an alloy material thereof on the surface.
The invention has the beneficial technical effects that: according to the invention, the insulating substrate with the PINFIN structure is used for replacing a conventional planar insulating substrate, so that both sides of the module can be directly cooled by water, the heat dissipation capability of the module is effectively improved, the long-time working reliability and the power circulation capability of the module are improved, and the current grade is further improved on the premise of the volume of the existing module.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic view of the backside structure of the present invention;
FIG. 3 is a schematic diagram of the internal structure of the power module according to the present invention;
FIG. 4 is a circuit diagram of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood by those skilled in the art, the present invention is further described with reference to the accompanying drawings and examples.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "inside", "outside", "lateral", "vertical", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, and thus, should not be construed as limiting the present invention.
As shown in fig. 1-4, the double-sided water-cooled power module according to the present invention includes a power module body, the power module body mainly includes a first insulating substrate 1, a second insulating substrate 2, and a circuit module disposed between the two insulating substrates, the first insulating substrate 1 and the second insulating substrate 2 are both double-sided copper-clad ceramic insulating substrates, and include an intermediate layer made of insulating material, and an upper copper layer 3 and a lower copper layer 4 disposed on the upper and lower sides of the intermediate layer, respectively, the upper copper layer 3 is a planar copper layer with a groove, the lower copper layer 4 is a pin fin structure for facilitating water cooling of the power module body, the circuit module is disposed in the upper copper layers 3 of the two opposite insulating substrates, and a gap between the circuit module and the two insulating substrates is electrically isolated by an epoxy molding compound 5.
Referring to fig. 3, the circuit module mainly includes a chip 6, a conductive connection block 7, a metal wire 8, a power terminal 9 and a control terminal 10, wherein the back surface of the chip 6 is welded on the upper copper layer 3 of the first insulating substrate 1, the front surface of the chip 6 is welded with the conductive connection block 7, and one side of the conductive connection block 7, which is far away from the chip 6, is welded on the upper copper layer 3 of the second insulating substrate 2; the metal wire 8 is connected to the chip 6 and the upper copper layer 3 of the first insulating substrate 1 or the second insulating substrate 2 to realize control electrical connection.
Referring to fig. 1-2, the outer surface of the upper copper layer 3 of the first insulating substrate 1 and the second insulating substrate 2 is a solderable metal layer made of bare copper or plated gold and silver materials, and the surface of the upper copper layer 3 is used for soldering or aluminum wire bonding as a conductive copper layer; the outer surfaces of the lower copper layers 4 of the first insulating substrate 1 and the second insulating substrate 2 are covered with protective layers made of nickel or chromium or alloy materials of the nickel and the chromium, so as to be directly immersed in cooling liquid for heat dissipation; the insulating material of the middle layer is aluminum oxide or silicon nitride. The chip 6 is an IGBT chip or a SiC chip, and the surface of the chip is electroplated with one of gold and silver materials or an alloy material thereof; electric connection is realized to chip 6 adoption two-sided welding or silver thick liquid sintering's mode, chip 6 the back weld on first insulating substrate 1 through the soldering, chip 6 openly is connected with electrically conductive connecting block 7 through the soldering welding. The connecting layer is soldered by tin, one of SnPb, SnAg, SnAgCu and PbSnAg Sn-containing soldering materials is adopted for soldering, and the highest soldering temperature is controlled to be between 100 and 400 ℃.
Referring to fig. 1-2, the power terminal 9 and the control terminal 10 are completed lead frames before the finished product is cut into bars, the surfaces of the lead frames are plated with one of gold and silver materials or alloy materials thereof, and the power terminal 9 and the control terminal 10 are connected to the upper copper layer of the first insulating substrate by soldering. The metal wire 8 is made of one of pure aluminum, pure copper and pure gold or an alloy material thereof, the metal wire 8 is in a linear or strip-shaped structure, and is bonded and connected to the chip and the corresponding insulating substrate in an ultrasonic mode; the conductive connecting block is made of AlSiC, AlC, Cu or Cu-Mo, and is plated with one of nickel, gold and silver materials or an alloy material thereof on the surface.
The chips, the chips and the power conducting layers corresponding to the insulating substrate (DBC) are electrically connected through the conducting connecting blocks, and the power terminals, the control terminals and the conducting layers corresponding to the insulating substrate (DBC) are connected through soldering and welding to form a circuit structure shown in figure 3, so that the circuit inversion function is realized. According to the invention, the insulating substrate with the PINFIN structure is used for replacing a conventional planar insulating substrate, so that both sides of the module can be directly cooled by water, the heat dissipation capability of the module is effectively improved, the long-time working reliability and the power circulation capability of the module are improved, and the current grade is further improved on the premise of the volume of the existing module.
The specific embodiments described herein are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (6)
1. The utility model provides a two-sided water-cooled power module, includes the power module body, its characterized in that: the power module body mainly comprises a first insulating substrate, a second insulating substrate and a circuit module, wherein the first insulating substrate and the second insulating substrate are oppositely arranged, the circuit module is arranged between the two insulating substrates, the first insulating substrate and the second insulating substrate are both double-sided copper-clad ceramic insulating substrates, each insulating substrate comprises an intermediate layer made of insulating materials and an upper copper layer and a lower copper layer which are respectively arranged on the upper side and the lower side of the intermediate layer, the upper copper layers are plane copper layers with grooves, the lower copper layers are pin-fin structures facilitating water cooling of the power module body, the circuit module is arranged in the upper copper layers of the two oppositely arranged insulating substrates, and gaps between the circuit module and the two insulating substrates are electrically isolated through epoxy plastic packaging bodies.
2. The two-sided water-cooled power module according to claim 1, wherein: the circuit module mainly comprises a chip, a conductive connecting block, a metal wire, a power terminal and a control terminal, wherein the back surface of the chip is welded on the upper copper layer of the first insulating substrate, the front surface of the chip is welded with the conductive connecting block, and one side of the conductive connecting block, which is far away from the chip, is welded on the upper copper layer of the second insulating substrate; the metal wire is connected to the chip and the upper copper layer of the first insulating substrate or the second insulating substrate to realize control electrical connection.
3. The double-sided water-cooled power module according to claim 1 or 2, wherein: the outer surfaces of the upper copper layers of the first insulating substrate and the second insulating substrate are solderable metal layers made of bare copper or electroplated gold and silver materials, and the upper copper layers
The surface is used for welding or aluminum wire bonding as a conductive copper layer; the outer surfaces of the lower copper layers of the first insulating substrate and the second insulating substrate are covered with protective layers made of nickel or chromium or alloy materials of the nickel and the chromium, so that the first insulating substrate and the second insulating substrate are directly immersed in cooling liquid for heat dissipation; the insulating material of the middle layer is aluminum oxide or silicon nitride.
4. The two-sided water-cooled power module according to claim 3, wherein: the chip is an IGBT chip or a SiC chip, and one of gold and silver materials or an alloy material thereof is electroplated on the surface of the chip; the chip adopts the mode realization electrical connection of two-sided welding or silver thick liquid sintering, the back of chip weld on first insulation substrate through the soldering, the front of chip is connected with electrically conductive connecting block through the soldering welding.
5. The two-sided water-cooled power module according to claim 3, wherein: the power terminal and the control terminal are complete lead frames before finished product bar cutting, one of gold and silver materials or alloy materials of the gold and silver materials are electroplated on the surfaces of the power terminal and the control terminal, and the power terminal and the control terminal are connected to an upper copper layer of the first insulating substrate in a soldering mode.
6. The two-sided water-cooled power module according to claim 3, wherein: the metal wire is made of one of pure aluminum, pure copper and pure gold or an alloy material thereof, is in a linear or strip-shaped structure, and is bonded and connected to the chip and the corresponding insulating substrate in an ultrasonic mode; the conductive connecting block is made of AlSiC, AlC, Cu or Cu-Mo, and is plated with one of nickel, gold and silver materials or an alloy material thereof on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110160291.0A CN112736042A (en) | 2021-02-05 | 2021-02-05 | Double-sided water-cooled power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110160291.0A CN112736042A (en) | 2021-02-05 | 2021-02-05 | Double-sided water-cooled power module |
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| Publication Number | Publication Date |
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| CN112736042A true CN112736042A (en) | 2021-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110160291.0A Pending CN112736042A (en) | 2021-02-05 | 2021-02-05 | Double-sided water-cooled power module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114464583A (en) * | 2022-04-13 | 2022-05-10 | 合肥阿基米德电子科技有限公司 | Novel pin-fin bottom plate heat radiation structure of IGBT module |
-
2021
- 2021-02-05 CN CN202110160291.0A patent/CN112736042A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114464583A (en) * | 2022-04-13 | 2022-05-10 | 合肥阿基米德电子科技有限公司 | Novel pin-fin bottom plate heat radiation structure of IGBT module |
| CN114464583B (en) * | 2022-04-13 | 2022-07-08 | 合肥阿基米德电子科技有限公司 | IGBT module pin-fin bottom plate heat radiation structure |
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