CN112724920A - 一种低硬度高屏蔽镍碳导电胶及其制备方法 - Google Patents
一种低硬度高屏蔽镍碳导电胶及其制备方法 Download PDFInfo
- Publication number
- CN112724920A CN112724920A CN202011560072.3A CN202011560072A CN112724920A CN 112724920 A CN112724920 A CN 112724920A CN 202011560072 A CN202011560072 A CN 202011560072A CN 112724920 A CN112724920 A CN 112724920A
- Authority
- CN
- China
- Prior art keywords
- nickel
- parts
- low
- hardness
- particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 29
- VMWYVTOHEQQZHQ-UHFFFAOYSA-N methylidynenickel Chemical compound [Ni]#[C] VMWYVTOHEQQZHQ-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 66
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 33
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 31
- 239000010439 graphite Substances 0.000 claims abstract description 31
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000007822 coupling agent Substances 0.000 claims abstract description 12
- 239000004970 Chain extender Substances 0.000 claims abstract description 11
- 239000003085 diluting agent Substances 0.000 claims abstract description 10
- 239000003112 inhibitor Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 14
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims description 7
- 238000009924 canning Methods 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical group N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 239000003350 kerosene Substances 0.000 claims description 2
- 229920002545 silicone oil Polymers 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- LTOKKZDSYQQAHL-UHFFFAOYSA-N trimethoxy-[4-(oxiran-2-yl)butyl]silane Chemical group CO[Si](OC)(OC)CCCCC1CO1 LTOKKZDSYQQAHL-UHFFFAOYSA-N 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 abstract description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000084 colloidal system Substances 0.000 abstract description 2
- 125000003700 epoxy group Chemical group 0.000 abstract description 2
- 238000009396 hybridization Methods 0.000 abstract description 2
- 229910010272 inorganic material Inorganic materials 0.000 abstract description 2
- 239000011147 inorganic material Substances 0.000 abstract description 2
- 239000007769 metal material Substances 0.000 abstract description 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 2
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 2
- 239000011574 phosphorus Substances 0.000 abstract description 2
- 239000000498 cooling water Substances 0.000 description 3
- JQZGUQIEPRIDMR-UHFFFAOYSA-N 3-methylbut-1-yn-1-ol Chemical group CC(C)C#CO JQZGUQIEPRIDMR-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001905 inorganic group Chemical group 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明公开了一种低硬度高屏蔽镍碳导电胶，包括如下重量份的组分：低硬度液体硅橡胶100份、稀释剂50‑70份、扩链剂0.5‑1份、耐热剂1‑3份、偶联剂1‑3份、抑制剂0.1‑0.3份、大粒径镍包石墨50‑80份、中粒径镍包石墨170‑220份和小粒径镍包石墨30‑60份。本发明在保证材料强度情况下降低产品硬度，满足产品硬度45A左右的要求；添加偶联剂和一个亲有机的环氧基，提高粉体与胶体的结合性，同时提升产品固化时对无机材料与金属材料的粘附性，耐热剂中具有独特的磷、氮杂化结构，表现出优异的热稳定性与耐热性的特点，可提高产品阻燃与热稳定性。
Description
技术领域
本发明涉及导电胶领域，尤其涉及一种低硬度高屏蔽镍碳导电胶及其制备方法。
背景技术
目前市场镍碳胶均为70A左右硬度，且屏蔽效能大于90dB产品，随着5G技术的发展，基站的体积越来越大，性能要求越来越高，为了减少由于镍碳胶硬度高导致基站板材的变形，提高镍碳导电胶与基站板材的贴合度与基站长期的屏蔽性能，市场急需一款低硬度高屏蔽性能的镍碳导电胶，导电胶要求硬度在45A左右，初始屏蔽性能大于110dB，老化后屏蔽性能大于60dB。
发明内容
本发明针对上述问题，提供一种低硬度高屏蔽镍碳导电胶，包括如下重量份的组分：低硬度液体硅橡胶100份、稀释剂50-70份、扩链剂0.5-1份、耐热剂1-3份、偶联剂1-3份、抑制剂0.1-0.3份、大粒径镍包石墨50-80份、中粒径镍包石墨170-220份和小粒径镍包石墨30-60份。
具体地，所述低硬度液体硅橡胶的硬度为10A；所述稀释剂为闪点65℃的煤油；所述扩链剂为500cp的双端乙烯基硅油，乙烯基含量为0.01-0.03％；所述耐热剂为六苯氧基环三磷腈；所述抑制剂为甲基丁炔醇；所述偶联剂为3-缩水甘油基丙基三甲氧基硅烷；所述所述大粒径镍包石墨粒径为125-135um；所述中粒径镍包石墨粒径为80-90um；所述小粒径镍包石墨粒径为30-40um。
本发明低硬度高屏蔽镍碳导电胶的制备方法为：按重量份称取各组分，将低硬度液体硅橡胶、稀释剂、扩链剂、耐热剂、偶联剂、抑制剂加入到搅拌釜中搅拌1h，转速为20-40rpm，通冷却循环水，控制料温低于35℃，加入大粒径镍包石墨，搅拌0.5h，转速为20-40rpm，加入中粒径镍包石墨，搅拌0.5h，转速为20-40rpm，加入小粒径镍包石墨，搅拌0.5h，转速为20-40rpm，脱泡罐装即得。
本发明为低硬度高屏蔽镍碳导电胶导电填料选为镍包石墨，通过化学镀的方法在碳粉表面镀镍，提高镍与碳粉的结合度，降低粉体体积电阻率，通过不同粒径粉体搭配提高粉体的搭接效果，降低产品电阻和提高产品屏蔽效能，产品体积电阻率低于0.02ohm.cm，屏蔽效能大于110dB(30MHZ-10GHZ)；再搭配液体硅橡胶，通过添加扩链剂，在保证材料强度情况下降低产品硬度，满足产品硬度45A左右的要求；添加偶联剂Z-6040，Z-6040含有三个亲无机基团(-O-CH3)和一个亲有机的环氧基，提高粉体与胶体的结合性，同时提升产品固化时对无机材料与金属材料的粘附性，产品附着力大于15N/cm；添加耐热剂HPCTP，耐热剂中具有独特的磷、氮杂化结构，表现出优异的热稳定性与耐热性的特点，可提高产品阻燃与热稳定性。
具体实施方式
以下结合实例对本发明进行描述，所举实例只用于解释本发明，并非用于限定本发明的范围。
实施例1
一种低硬度高屏蔽镍碳导电胶的制备方法，其步骤为：将低硬度液体硅橡胶100份、稀释剂50份、扩链剂0.5份、耐热剂2份、偶联剂1份、抑制剂0.2份加入搅拌釜中搅拌1h，转速为20-40r；通好冷却循环水，料温控制在35℃以下，然后添加大粒径镍包石墨60份，搅拌0.5h，转速20-40r；添加中粒径镍包石墨200份搅拌0.5h，转速为20-40r；添加小粒径镍包石墨30份搅拌0.5h，转速为20-40r；然后脱泡罐装即得所述所述低硬度高屏蔽镍碳导电胶。
实施例2
一种低硬度高屏蔽镍碳导电胶的制备方法，其步骤为：将低硬度液体硅橡胶100份、稀释剂60份、扩链剂0.5份、耐热剂5份、偶联剂2份、抑制剂0.2份加入搅拌釜中搅拌1h，转速为20-40r；通好冷却循环水，料温控制在35℃以下，然后添加大粒径镍包石墨80份，搅拌0.5h，转速20-40r；添加中粒径镍包石墨180份搅拌0.5h，转速为20-40r；添加小粒径镍包石墨30份搅拌0.5h，转速为20-40r；然后脱泡罐装即得所述所述低硬度高屏蔽镍碳导电胶。
实施例3
一种低硬度高屏蔽镍碳导电胶的制备方法，其步骤为：将低硬度液体硅橡胶100份、稀释剂65份、扩链剂0.5份、耐热剂2份、偶联剂5份、抑制剂0.2份加入搅拌釜中搅拌1h，转速为20-40r；通好冷却循环水，料温控制在35℃以下，然后添加大粒径镍包石墨70份，搅拌0.5h，转速20-40r；添加中粒径镍包石墨190份搅拌0.5h，转速为20-40r；添加小粒径镍包石墨50份搅拌0.5h，转速为20-40r；然后脱泡罐装即得所述所述低硬度高屏蔽镍碳导电胶。
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
Claims (9)
1.一种低硬度高屏蔽镍碳导电胶，其特征在于，包括如下重量份的组分：
低硬度液体硅橡胶100份、稀释剂50-70份、扩链剂0.5-1份、耐热剂1-3份、偶联剂1-3份、抑制剂0.1-0.3份、大粒径镍包石墨50-80份、中粒径镍包石墨170-220份和小粒径镍包石墨30-60份。
2.根据权利要求1所述的低硬度高屏蔽镍碳导电胶，其特征在于，所述低硬度液体硅橡胶的硬度为10A。
3.根据权利要求1所述的低硬度高屏蔽镍碳导电胶，其特征在于，所述稀释剂为闪点65℃的煤油。
4.根据权利要求1所述的低硬度高屏蔽镍碳导电胶，其特征在于，所述扩链剂为500cp的双端乙烯基硅油，乙烯基含量为0.01-0.03％。
5.根据权利要求1所述的低硬度高屏蔽镍碳导电胶，其特征在于，所述耐热剂为六苯氧基环三磷腈。
6.根据权利要求1所述的低硬度高屏蔽镍碳导电胶，其特征在于，所述抑制剂为甲基丁炔醇。
7.根据权利要求1所述的低硬度高屏蔽镍碳导电胶，其特征在于，所述偶联剂为3-缩水甘油基丙基三甲氧基硅烷。
8.根据权利要求1所述的低硬度高屏蔽镍碳导电胶，其特征在于，所述所述大粒径镍包石墨粒径为125-135um；所述中粒径镍包石墨粒径为80-90um；所述小粒径镍包石墨粒径为30-40um。
9.一种如权利要求1-8任一项所述的低硬度高屏蔽镍碳导电胶的制备方法，其特征在于，其步骤为：按重量份称取各组分，将低硬度液体硅橡胶、稀释剂、扩链剂、耐热剂、偶联剂、抑制剂加入到搅拌釜中搅拌1h，转速为20-40rpm，通冷却循环水，控制料温低于35℃，加入大粒径镍包石墨，搅拌0.5h，转速为20-40rpm，加入中粒径镍包石墨，搅拌0.5h，转速为20-40rpm，加入小粒径镍包石墨，搅拌0.5h，转速为20-40rpm，脱泡罐装即得。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011560072.3A CN112724920A (zh) | 2020-12-25 | 2020-12-25 | 一种低硬度高屏蔽镍碳导电胶及其制备方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011560072.3A CN112724920A (zh) | 2020-12-25 | 2020-12-25 | 一种低硬度高屏蔽镍碳导电胶及其制备方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112724920A true CN112724920A (zh) | 2021-04-30 |
Family
ID=75616093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011560072.3A Pending CN112724920A (zh) | 2020-12-25 | 2020-12-25 | 一种低硬度高屏蔽镍碳导电胶及其制备方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112724920A (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115960579A (zh) * | 2022-12-29 | 2023-04-14 | 深圳德邦界面材料有限公司 | 一种导热导电高屏蔽镍碳胶及其制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106118540A (zh) * | 2016-07-21 | 2016-11-16 | 东莞市雷兹盾电子材料有限公司 | 低硬度的单组分导电胶水及其制备、使用方法 |
| CN111518512A (zh) * | 2020-04-14 | 2020-08-11 | 深圳市飞荣达科技股份有限公司 | 复合导电胶及其制备方法 |
-
2020
- 2020-12-25 CN CN202011560072.3A patent/CN112724920A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106118540A (zh) * | 2016-07-21 | 2016-11-16 | 东莞市雷兹盾电子材料有限公司 | 低硬度的单组分导电胶水及其制备、使用方法 |
| CN111518512A (zh) * | 2020-04-14 | 2020-08-11 | 深圳市飞荣达科技股份有限公司 | 复合导电胶及其制备方法 |
Non-Patent Citations (1)
| Title |
|---|
| 赵浩峰 等: "《物理功能复合材料及其性能》", 31 October 2011, 冶金工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115960579A (zh) * | 2022-12-29 | 2023-04-14 | 深圳德邦界面材料有限公司 | 一种导热导电高屏蔽镍碳胶及其制备方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103131274B (zh) | 一种氟树脂散热涂料及其制备方法 | |
| EP2451881B1 (en) | Electrically conductive adhesives | |
| CN102024505B (zh) | 一种硅油电力复合脂及其制备方法 | |
| CN109627829A (zh) | 一种液态金属导电涂料及其制备方法和应用 | |
| CN105566921B (zh) | 导电有机硅橡胶组合物及其制备方法 | |
| CN106751881A (zh) | 一种室温模压固化导热吸波橡胶材料及其制备方法 | |
| WO2021142752A1 (zh) | 一种有机硅树脂导电胶及其制备方法和应用 | |
| CN112724920A (zh) | 一种低硬度高屏蔽镍碳导电胶及其制备方法 | |
| EP3125254B1 (en) | Conductive paste | |
| CN106752516A (zh) | 一种电子器件用的散热涂料及其制备方法 | |
| CN104530873A (zh) | 一种铜基电磁屏蔽涂料及其制备方法 | |
| CN112694869A (zh) | 导热材料、制备方法及其应用 | |
| CN112625659A (zh) | 一种高导热的导热硅脂及其制备工艺 | |
| CN114105529A (zh) | 一种高导热吸波复合材料及其制备方法及吸波导热垫片 | |
| CN109102962A (zh) | 导电橡胶条的制备方法及用途 | |
| CN108484948A (zh) | 具高导热及电磁屏蔽功能的复合材料及其制备方法 | |
| JP2009019171A (ja) | ダイボンディングペースト | |
| CN113817414B (zh) | 一种耐高温氰酸酯绝缘导热胶及其制备方法 | |
| CN117024707A (zh) | 一种超支化环氧树脂的制备方法以及含该超支化环氧树脂的灌封胶 | |
| CN107471784A (zh) | 一种复合玻纤导热硅胶垫片 | |
| CN104877623B (zh) | 一种高粘接高回弹率的emi界面专用有机硅粘接剂 | |
| CN115083660A (zh) | 一种易磨高导热绝缘塞孔浆料、制备方法及其应用 | |
| CN112708392A (zh) | 一种低挥发高屏蔽银镍导电胶及其制备方法 | |
| CN108504152A (zh) | 一种电子设备外壳用高散热涂料 | |
| CN115960579A (zh) | 一种导热导电高屏蔽镍碳胶及其制备方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210430 |