CN112712997A - Method and apparatus for manufacturing electronic component - Google Patents
Method and apparatus for manufacturing electronic component Download PDFInfo
- Publication number
- CN112712997A CN112712997A CN202011074090.0A CN202011074090A CN112712997A CN 112712997 A CN112712997 A CN 112712997A CN 202011074090 A CN202011074090 A CN 202011074090A CN 112712997 A CN112712997 A CN 112712997A
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- electronic component
- stretched film
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- green sheet
- tension
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000010438 heat treatment Methods 0.000 claims abstract description 92
- 230000035882 stress Effects 0.000 claims abstract description 53
- 239000000919 ceramic Substances 0.000 claims abstract description 50
- 230000008646 thermal stress Effects 0.000 claims abstract description 30
- 229920000642 polymer Polymers 0.000 claims abstract description 20
- 230000009477 glass transition Effects 0.000 claims abstract description 15
- 238000007639 printing Methods 0.000 claims description 66
- 230000007246 mechanism Effects 0.000 claims description 28
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000007646 gravure printing Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000001035 drying Methods 0.000 description 5
- 229920006302 stretch film Polymers 0.000 description 5
- -1 polypropylene Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- JXDXDSKXFRTAPA-UHFFFAOYSA-N calcium;barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[Ca+2].[Ti+4].[Ba+2] JXDXDSKXFRTAPA-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/04—Drying; Impregnating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The invention provides a method for manufacturing an electronic component and an electronic component manufacturing apparatus, wherein the electronic component having a dense print pattern can be manufactured by suppressing the reduction of the accuracy of the print shape. A method for manufacturing an electronic component includes: a stress relieving step of relieving thermal stress of the electronic component sheetPrinting an electrode layer or a dielectric layer on a ceramic green sheet disposed on a stretched film, and subjecting the ceramic green sheet to a 1 st heat treatment in a state in which a tension is applied, wherein in the stress relieving step, the stretched film is subjected to a tension lower than the tension applied in the 1 st heat treatment, and at a temperature (Tg) higher than a temperature 10 ℃ lower than a glass transition temperature (Tg) of a polymer constituting the stretched film‑10) The electronic component sheet is heated at the temperature of (2).
Description
Technical Field
The present invention relates to a method for manufacturing an electronic component and an electronic component manufacturing apparatus.
Background
As a method for manufacturing a laminated electronic component such as a laminated ceramic capacitor, there is known a method of printing a conductive paste on a ceramic green sheet to form an electrode pattern and laminating the electrode pattern.
As a method of printing the conductive paste on the ceramic green sheet, there is a method of conveying the ceramic green sheet in a state where the green sheet is held on a mounting film, and printing the conductive paste by screen printing, gravure printing, or the like.
For example, patent document 1 discloses that a tension adjusting mechanism adjusts the tension applied to a long sheet held on a mounting film, thereby suppressing variation in the interval (pitch) of a pattern in a wound body in the winding direction.
Prior art documents
Patent document
Patent document 1: japanese patent laid-open publication No. 2016-132522
However, when printing is performed twice or more on a ceramic green sheet, there is a problem that the printing pattern after the 2 nd printing is shifted from the original printing position, and the printing shape accuracy is lowered. This is presumably due to residual stress (thermal stress) generated by rapidly cooling the mounting film when the mounting film is carried out from a drying furnace for drying the printed conductive paste.
In order to avoid register offset, it is necessary to reserve a printing margin. However, as the size of the electronic component becomes smaller, the proportion of the printing margin becomes larger, and thus there is a problem that a dense printing pattern cannot be formed.
Disclosure of Invention
Problems to be solved by the invention
The invention aims to provide a method for manufacturing an electronic component and an electronic component manufacturing apparatus, wherein the electronic component with a compact printing pattern can be manufactured by inhibiting the reduction of printing shape precision.
Means for solving the problems
Electricity of the inventionThe method for manufacturing a sub-component includes: and a stress relieving step of relieving thermal stress of an electronic component sheet, wherein the electronic component sheet is subjected to a 1 st heat treatment in a state where an electrode layer or a dielectric layer is printed on a ceramic green sheet disposed on a stretched film and a tension is applied, and wherein in the stress relieving step, the stretched film is subjected to a tension lower than the tension applied at the 1 st heat treatment, and at a temperature (Tg) higher than a glass transition temperature (Tg) of a polymer constituting the stretched film by 10 ℃ or higher-10) The electronic component sheet is heated at the temperature of (2).
Further, an electronic component manufacturing apparatus according to the present invention includes: a stress relieving mechanism for relieving thermal stress of an electronic component sheet, the electronic component sheet being subjected to a 1 st heat treatment in a state in which an electrode layer or a dielectric layer is printed on a ceramic green sheet disposed on a stretched film and a tension is applied thereto, the stress relieving mechanism comprising: a tension adjusting means for applying a tension to the stretched film which is smaller than the tension applied in the 1 st heat treatment; and a heating unit which is used for adjusting the tension applied to the stretched film by the tension adjusting unit and has a temperature (Tg) higher than the temperature 10 ℃ lower than the glass transition temperature (Tg) of the polymer forming the stretched film-10) The electronic component sheet is heated at the temperature of (2).
Effects of the invention
According to the present invention, it is possible to provide a method of manufacturing an electronic component and an electronic component manufacturing apparatus, in which it is possible to suppress a decrease in accuracy of a printed shape and to manufacture an electronic component having a dense printed pattern.
Drawings
Fig. 1 is a side view schematically showing an example of a method for manufacturing an electronic component of the present invention.
Fig. 2 is a cross-sectional view schematically showing an example of an electronic component green sheet.
Fig. 3 is a cross-sectional view schematically showing an example of the electronic component sheet subjected to the 1 st heat treatment in a state where a tension is applied.
Fig. 4 is a cross-sectional view schematically showing an example of an electronic component chip in which thermal stress is relieved.
Fig. 5 is a side view schematically showing another example of the method for manufacturing an electronic component of the present invention.
Fig. 6 is a cross-sectional view schematically showing an example of an electronic component chip on which both an electrode layer and a dielectric layer are printed.
Fig. 7 is a side view schematically showing another example of the stress relieving process.
Description of the reference numerals
1: an electronic component chip in which thermal stress is relieved;
1': an electronic component sheet on which an electrode layer and a dielectric layer are printed;
3: an electronic component sheet;
5: green sheets for electronic components;
10: 1, a printing mechanism;
11: a 1 st printing unit;
13: a heating furnace (heat treatment unit);
20a, 20b, 20 c: a stress relief mechanism;
21: a heating furnace (heating unit);
23: a dancer roller (tension adjusting unit);
25: a heated conveying roller (heating means);
30: an uncoiling mechanism;
35: a roll of electronic component sheets;
40: a 2 nd printing mechanism;
41: a 2 nd printing unit;
43: a heating furnace (heat treatment unit);
50: a conveying roller;
55: a fixed roller;
60: a tensiometer;
70: a roll of electronic component sheet in which thermal stress is relieved;
100. 200: an electronic component manufacturing apparatus;
110: stretching the film;
120: a ceramic green sheet;
130: an electrode layer;
140: a dielectric layer;
a: 1, a printing procedure;
B1、B2、B3: a stress relieving procedure;
c: uncoiling;
d: and (2) a printing process.
Detailed Description
Hereinafter, a method for manufacturing an electronic component and an electronic component manufacturing apparatus according to the present invention will be described.
However, the present invention is not limited to the following configuration, and can be applied with appropriate modifications within a scope not changing the gist of the present invention. In addition, the present invention is also a combination of two or more of the preferable configurations of the embodiments of the present invention described below.
[ method for producing electronic component ]
The method for manufacturing an electronic component of the present invention includes a stress relieving step of relieving thermal stress of an electronic component sheet.
The electronic component sheet includes: a stretched film as a carrier film; a ceramic green sheet disposed on the stretched film; and an electrode layer or a dielectric layer printed on the ceramic green sheet.
The stretched film is a film obtained by stretching a polymer in a molten state and molding the stretched film.
The stretched film may be a uniaxially stretched film or a biaxially stretched film.
The thickness of the stretched film is preferably 1 μm or more and 200 μm or less.
Examples of the polymer constituting the stretch film include polyolefins such as PP (polypropylene), and polyesters such as PET (polyethylene terephthalate) and PEN (polyethylene naphthalate).
The glass transition temperature (Tg) of the polymer constituting the stretched film is preferably 30 ℃ or higher and 180 ℃ or lower.
The glass transition temperature (Tg) of the polymer constituting the stretched film can be measured by a Differential Scanning Calorimetry (DSC) apparatus. The glass transition temperature (Tg) was measured in accordance with JIS K7121-.
The stretched film may also contain a filler.
Examples of the filler include oxides, hydroxides, and carbonates of Si, Ca, and the like.
A release layer may be provided between the stretched film and the ceramic green sheet to facilitate the release of the stretched film.
The electronic component sheet is subjected to the 1 st heat treatment in a state where a tension is applied.
The 1 st heat treatment is a treatment performed after an electrode layer or a dielectric layer is printed on a ceramic green sheet.
For example, a paste to be an electrode layer or a dielectric layer is printed on a ceramic green sheet of an electronic component green sheet including a stretched film and a ceramic green sheet disposed on the stretched film, and then the 1 st heat treatment is performed to dry the paste.
The stretched film after the 1 st heat treatment is rapidly cooled, and thus the polymers constituting the stretched film are fixed in a state of being applied with tension.
Therefore, in the electronic component sheet subjected to the 1 st heat treatment, the stretched film has thermal stress.
The paste to be the electrode layer preferably contains at least one metal selected from the group consisting of Ni, Cu, Ag, Pd, Ag, and Au.
The paste to be a dielectric layer preferably contains a dielectric material such as barium titanate, calcium titanate, strontium titanate, barium calcium titanate, or calcium zirconate.
The ceramic green sheet preferably contains the same material as the dielectric material contained in the paste to be the dielectric layer.
An example of a method for manufacturing an electronic component according to the present invention will be described with reference to fig. 1.
Fig. 1 is a side view schematically showing an example of a method for manufacturing an electronic component of the present invention.
The method for manufacturing an electronic component shown in FIG. 1 includes a 1 st printing step A and a stress relieving step B1. By first stamp 1The electronic component piece 3 can be obtained in the brushing step a. By subjecting the electronic component sheet 3 to a stress relieving step B1Thereby, the electronic component chip 1 in which the thermal stress is relieved can be obtained.
Various materials such as the stretched film and the ceramic green sheet disposed on the stretched film are conveyed from the left side to the right side in the direction of the arrow.
The method for manufacturing an electronic component shown in fig. 1 is performed using an electronic component manufacturing apparatus 100 as an example of the electronic component manufacturing apparatus of the present invention.
The electronic component manufacturing apparatus 100 includes the 1 st printing mechanism 10 and a stress relief mechanism 20 a.
The 1 st printing mechanism 10 includes a 1 st printing unit 11 and a heating furnace 13 as a heat treatment unit.
The stress relief mechanism 20a includes a heating furnace 21 as heating means and a dancer roller 23 as tension adjusting means.
First, the 1 st printing step will be described.
In the 1 st printing step a, first, paste to be an electrode layer or a dielectric layer is printed on a ceramic green sheet of the electronic component green sheet 5 including a stretched film and a ceramic green sheet disposed on the stretched film by the 1 st printing unit 11. Next, the 1 st heat treatment is performed in a heating furnace 13 as heat treatment means, and the paste is dried, thereby obtaining an electronic component sheet 3 in which an electrode layer or a dielectric layer is printed on a ceramic green sheet.
In the 1 st printing step, the tension applied to the stretched film is preferably 20N or more and 50N or less.
The tension applied to the stretched film when the 1 st heat treatment is performed is preferably 20N or more and 50N or less.
The temperature in the 1 st heat treatment is preferably 20 ℃ or more and 180 ℃ or less.
That is, the heat treatment unit is preferably a unit that heats the electronic component green sheet at 20 ℃ or higher and 180 ℃ or lower.
In addition, the above temperature in the 1 st heat treatment means a set temperature of the heating unit.
As the 1 st printing unit, an intaglio printing press is preferable.
Since the printing speed of gravure printing is high, the path length (for example, the entire length of the heating furnace) in the 1 st heat treatment for drying the printed paste tends to be long. Therefore, it is necessary to increase the tension applied to the stretched film at the time of printing and the 1 st heat treatment, and thermal stress is likely to be generated in the stretched film.
In contrast, in the method for manufacturing an electronic component according to the present invention, since the stress relieving step of relieving the thermal stress of the stretched film is provided, even when the gravure printing machine is used as the 1 st printing unit, the stretched film in which the thermal stress is relieved can be obtained, and the misalignment is less likely to occur.
In addition, when the gravure printing machine has a drying function (heat treatment unit), the gravure printing machine becomes the 1 st printing mechanism including both the 1 st printing unit and the heat treatment unit, and thus an additional heat treatment unit is not required.
The transport speed of the stretched film in the 1 st printing step is preferably 0.5m/s to 200 m/s.
Next, the stress relieving step will be described.
In the stress relieving step B1In the step (2), the electronic component sheet 3 subjected to the 1 st heat treatment in a state in which the tension is applied is heated while applying a tension smaller than the tension applied at the 1 st heat treatment to the electronic component sheet 3. The heating of the electronic component sheet 3 is performed by a heating furnace 21 as heating means. The electronic component sheet 3 is conveyed by a conveying roller 50, and tension applied to the stretched film is adjusted by a dancer roller 23 as tension adjusting means. In the stress relieving step B1The tension applied to the stretched film in (1) was confirmed by a tension meter 60. The electronic component sheet 3 is subjected to a stress relieving step B1The electronic component sheet 1 with the thermal stress relieved is wound into a roll 70.
In the stress relieving step B1In the stretched film, the temperature (Tg) is higher than the glass transition temperature (Tg) of the polymer constituting the stretched film by 10 ℃ or lower-10) The electronic component piece 3 is heated.
By forming the draw with a higher ratioThe glass transition temperature (Tg) of the polymer of the stretched film is 10 ℃ lower-10) The electronic component sheet 3 is heated to cause rearrangement of the polymers constituting the stretched film. Therefore, by performing the above-described heating in a state where a tension smaller than the tension applied at the 1 st heat treatment is applied to rearrange the polymers, it is possible to relieve the thermal stress generated in the stretched film by the 1 st heat treatment.
In the stress relieving step B shown in FIG. 11The dancer roller 23 is used as a tension adjusting means.
The dancer roller 23 is disposed between two fixed rollers 55, and the tension applied to the stretched film is adjusted by adjusting the position of the dancer roller 23 in the vertical direction and the load applied to the dancer roller 23.
In the stress relieving step B1The tension applied to the stretch film in (1) is smaller than the tension applied to the stretch film in (1) the printing process a.
In the stress relaxation step, the tension applied to the stretched film may be smaller than the tension applied to the stretched film in the 1 st heat treatment, but is preferably 0N or more and less than 20N.
The heating temperature in the stress relaxation step is a temperature (Tg) higher than the glass transition temperature (Tg) of the polymer constituting the stretched film by 10 ℃ or lower-10) May be used, but is preferably a temperature (Tg) higher than a temperature (Tg) lower by 5 ℃ than the glass transition temperature (Tg) of the polymer constituting the stretched film-5) More preferably higher than a temperature (Tg) lower by 3 ℃ than the glass transition temperature (Tg) of the polymer constituting the stretched film-3) More preferably, the temperature of (b) is higher than the glass transition temperature (Tg) of the polymer constituting the stretched film.
The heating temperature in the stress relaxation step may be the same as the heating temperature in the 1 st heat treatment.
Fig. 2 is a cross-sectional view schematically showing an example of an electronic component green sheet.
As shown in fig. 2, the ceramic green sheet 5 for electronic components includes a stretched film 110 and a ceramic green sheet 120 disposed on the stretched film 110.
Fig. 3 is a cross-sectional view schematically showing an example of the electronic component sheet subjected to the 1 st heat treatment in a state where a tension is applied.
As shown in fig. 3, the electronic component sheet 3 having thermal stress due to the 1 st heat treatment in a state in which tension is applied thereto includes a stretched film 110, a ceramic green sheet 120 disposed on the stretched film 110, and an electrode layer 130 printed on the ceramic green sheet 120.
Further, the dielectric layer is printed instead of the electrode layer, and is also an electronic component sheet.
Fig. 4 is a cross-sectional view schematically showing an example of an electronic component chip in which thermal stress is relieved.
As shown in fig. 4, the electronic component sheet 1 includes a stretched film 110, a ceramic green sheet 120 disposed on the stretched film 110, and an electrode layer 130 printed on the ceramic green sheet 120. Unlike the electronic component sheet 3 shown in fig. 3, the thermal stress that the stretch film 110 has is relieved.
Another example of the method for manufacturing an electronic component according to the present invention will be described with reference to fig. 5.
Fig. 5 is a side view schematically showing another example of the method for manufacturing an electronic component of the present invention.
The method for manufacturing an electronic component shown in FIG. 5 includes an unwinding step C and a stress relieving step B2And a 2 nd printing process D.
The direction of conveying the stretched film is the same as that of FIG. 1.
The method for manufacturing an electronic component shown in fig. 5 is performed using an electronic component manufacturing apparatus 200 as an example of the electronic component manufacturing apparatus of the present invention.
The electronic component manufacturing apparatus 200 includes an unwinding mechanism 30, a stress relieving mechanism 20b, and a 2 nd printing mechanism 40.
The stress relief mechanism 20b includes a heating furnace 21 as heating means and a dancer roller 23 as tension adjusting means.
The 2 nd printing mechanism 40 includes a 2 nd printing unit 41 and a heating furnace 43 as a heating unit.
In the unwinding step C, the electronic component sheet 3 is unwound from the wound body 35 of the electronic component sheet by the unwinding mechanism 30.
The roll 35 of the electronic component sheet can be obtained by rolling the electronic component sheet 3 obtained after the 1 st printing step a shown in fig. 1, for example.
In the stress relieving step B2In the method, the stretched film is subjected to a tension lower than the tension applied in the 1 st heat treatment, and the temperature (Tg) is higher than the temperature 10 ℃ lower than the glass transition temperature (Tg) of the polymer constituting the stretched film-10) The electronic component piece 3 is heated.
The heating of the electronic component sheet 3 is performed by a heating furnace 21 as heating means. When the electronic component sheet 3 is heated by the heating furnace 21, the tension applied to the stretched film can be adjusted by the dancer roller 23 as tension adjusting means.
By stress relieving process B2The electronic component chip 1 in which thermal stress is relieved can be obtained.
In the 2 nd printing process D, the stress relieving process B is performed2On the other hand, in the electronic component sheet 1 in which the thermal stress was relieved, the region of the ceramic green sheet on which the electrode layer or the dielectric layer was not printed was printed, and a paste to be a layer not printed on the ceramic green sheet among the electrode layer and the dielectric layer was printed, thereby obtaining an electronic component sheet 1' in which the electrode layer and the dielectric layer were printed.
When an electrode layer is printed on the ceramic green sheet of the electronic component sheet 1 in which the thermal stress is relieved, a paste to be a dielectric layer is printed on a region of the ceramic green sheet where the electrode layer is not printed in the 2 nd printing step D. On the other hand, when the dielectric layer is printed on the ceramic green sheet of the electronic component sheet 1 in which the thermal stress is relieved, the paste to be the electrode layer is printed on the region of the ceramic green sheet where the dielectric layer is not printed in the 2 nd printing step D.
As the 2 nd printing unit, an intaglio printing press is preferable.
Although the printing speed of gravure printing is high, since the electronic component sheet is not fixed at the time of printing, if the stretched film has thermal stress, misalignment is likely to occur.
In contrast, in the method for manufacturing an electronic component according to the present invention, since the stress relieving step is performed before the 2 nd printing step, the thermal stress of the stretch film is relieved, and the misalignment is less likely to occur.
In addition, when the gravure printing machine has a drying function (heating means), the gravure printing machine becomes a 2 nd printing mechanism including both the 2 nd printing means and the heating means, and therefore, an additional heating means is not required.
The conveyance speed of the stretched film in the 2 nd printing step is preferably 0.5m/s to 200 m/s.
Fig. 6 is a cross-sectional view schematically showing an example of an electronic component chip on which both an electrode layer and a dielectric layer are printed.
As shown in fig. 6, the electronic component sheet 1' obtained through the 2 nd printing step D includes a stretched film 110, a ceramic green sheet 120 disposed on the stretched film 110, an electrode layer 130, and a dielectric layer 140.
The heat treatment means used in the stress relieving step is not particularly limited, but is preferably a heating furnace or a heated transport roller.
That is, the heating unit is preferably a heating furnace that heats the electronic component piece or a conveying roller that heats a conveying roller that is in contact with the electronic component piece.
Fig. 7 is a side view schematically showing another example of the stress relieving process.
In the stress relieving step B shown in FIG. 73As the heating means, the heated conveying roller 25 is used.
Further, the stress relieving step B shown in FIG. 11FIG. 5 shows a stress relieving step B2Similarly, in the stress relieving step B3In the step (1), the electronic component sheet 3 is heated in a state where a tension smaller than the tension applied at the time of the 1 st heat treatment is applied to the stretched film. The direction of feeding the stretched film is also the same as in fig. 1 and 5.
Although only one heated transport roller 25 is used in fig. 7, a plurality of heated transport rollers may be used.
The surface temperature of the heated conveying roller is preferably 30 ℃ to 180 ℃.
The temperatures of the plurality of heated conveying rollers may be the same or different.
The conveying speed of the heated conveying roller to the electronic component sheet is preferably 0.5m/s to 200 m/s.
The contact time between the heated transport roller and the electronic component sheet is preferably 10ms to 10 s.
Through the above steps, an electronic component sheet in which an electrode layer or a dielectric layer is printed on a ceramic green sheet is obtained.
When only one of the electrode layer and the dielectric layer is printed on the ceramic green sheet, the above-described 2 nd printing step is performed to print both the electrode layer and the dielectric layer on the ceramic green sheet.
Next, the stretched film is removed from the electronic component sheet, and the electrode layer and the dielectric layer printed on the ceramic green sheet are laminated on the ceramic green sheet to prepare a laminated sheet.
The laminated sheet is pressed in the lamination direction by an isostatic pressing method or the like to produce a laminated block.
The laminated block is cut into a given size, and cut into laminated chips. In this case, the corners and the ridge portions of the laminated chips may be rounded by barrel polishing or the like.
The laminated chips are fired to produce a laminate.
Next, an external electrode is formed on the surface of the laminate body where the electrode layer is exposed.
The external electrode is preferably a structure comprising a fired layer containing a glass frit and a metal plating layer formed on the fired layer.
Through the above steps, an electronic component can be manufactured.
[ electronic component manufacturing apparatus ]
An electronic component manufacturing apparatus according to the present invention includes: a stress relieving mechanism for relieving thermal stress of the electronic component sheet printed with electrode layer or dielectric layer on the ceramic green sheet arranged on the stretching filmAnd subjected to a 1 st heat treatment in a state of being applied with a tensile force, the electronic component manufacturing apparatus being characterized in that the stress relieving mechanism includes: a tension adjusting means for applying a tension to the stretched film which is smaller than the tension applied in the 1 st heat treatment; and a heating unit which is used for adjusting the tension applied to the stretched film by the tension adjusting unit and has a temperature (Tg) higher than the temperature 10 ℃ lower than the glass transition temperature (Tg) of the polymer forming the stretched film-10) The electronic component sheet is heated at the temperature of (2).
The electronic component manufacturing apparatus of the present invention includes a stress relieving mechanism for relieving thermal stress of a tensile film. Therefore, even when the stretched film constituting the electronic component sheet has thermal stress, the thermal stress of the stretched film can be relieved. Therefore, when an electrode layer or a dielectric layer is further printed on the ceramic green sheet of the electronic component sheet, misalignment is less likely to occur. Therefore, the printing margin can be reduced, and an electronic component having a dense print pattern can be manufactured.
The electronic component manufacturing apparatus of the present invention is an electronic component manufacturing apparatus capable of easily performing the electronic component manufacturing method of the present invention. Therefore, the preferred conditions of the electronic component manufacturing apparatus of the present invention are the same as those of the electronic component manufacturing method of the present invention described above.
Claims (18)
1. A method for manufacturing an electronic component includes: a stress relieving step of relieving thermal stress of an electronic component sheet in which an electrode layer or a dielectric layer is printed on a ceramic green sheet disposed on a stretched film and subjected to a 1 st heat treatment in a state in which tension is applied,
the method for manufacturing an electronic component is characterized in that,
in the stress relieving step, the stretched film is subjected to a tension lower than the tension applied in the 1 st heat treatment, and at a temperature Tg higher than a temperature 10 ℃ lower than the glass transition temperature Tg of the polymer constituting the stretched film-10Temperature of the electronic component chipAnd (4) heating.
2. The method for manufacturing an electronic component according to claim 1,
in the stress relieving step, the tension applied to the stretched film is 0N or more and less than 20N.
3. The method for manufacturing an electronic component according to claim 1 or 2,
further provided with: a first printing step of printing paste to be an electrode layer or a dielectric layer on a ceramic green sheet of an electronic component green sheet having the ceramic green sheet disposed on a stretched film, and subjecting the electronic component green sheet to a first heat treatment while applying tension to the stretched film to obtain the electronic component sheet.
4. The method for manufacturing an electronic component according to claim 3,
in the 1 st printing step, the tension applied to the stretched film is 20N or more and 50N or less.
5. The method for manufacturing an electronic component according to claim 3 or 4,
the temperature in the 1 st heat treatment is 20 ℃ or more and 180 ℃ or less.
6. The method for manufacturing an electronic component according to any one of claims 1 to 5,
further provided with: and a 2 nd printing step of printing a paste which is a layer not printed on the ceramic green sheet among the electrode layer and the dielectric layer, on a region where the electrode layer or the dielectric layer is not printed on the ceramic green sheet of the electronic component sheet having undergone the stress relieving step.
7. The method for manufacturing an electronic component according to any one of claims 1 to 6,
further provided with: an unwinding step of unwinding the electronic component sheet from a wound body around which the electronic component sheet subjected to the 1 st heat treatment is wound,
the stress relieving step is performed on the electronic component sheet unwound in the unwinding step.
8. The method for manufacturing an electronic component according to any one of claims 1 to 7,
in the stress relieving step, the electronic component piece is heated by a heating furnace.
9. The method for manufacturing an electronic component according to any one of claims 1 to 7,
in the stress relieving step, the electronic component piece is heated by the heated conveying roller.
10. An electronic component manufacturing apparatus includes: a stress relieving mechanism for relieving thermal stress of an electronic component sheet, wherein the electronic component sheet is printed with an electrode layer or a dielectric layer on a ceramic green sheet disposed on a tensile film and subjected to a 1 st heat treatment in a state of being applied with tension,
the electronic component manufacturing apparatus is characterized in that,
the stress relieving mechanism includes:
a tension adjusting unit that applies a tension to the stretched film that is smaller than a tension applied at the 1 st heat treatment; and
a heating unit which is higher than the Tg of the polymer lower than the Tg by 10 ℃ in the state that the tension applied to the stretched film is adjusted by the tension adjusting unit-10The electronic component piece is heated.
11. The electronic component manufacturing apparatus according to claim 10,
the tension adjusting unit applies a tension to the stretched film of 0N or more and less than 20N.
12. The electronic component manufacturing apparatus according to claim 10 or 11,
further provided with: the 1 st printing mechanism is used for printing,
the 1 st printing mechanism includes:
a first printing unit for printing paste to be an electrode layer or a dielectric layer on a ceramic green sheet of an electronic component green sheet having the ceramic green sheet disposed on a stretched film; and
and a heat treatment unit for performing a 1 st heat treatment on the green sheet for electronic components while applying a tension to the stretched film to obtain the electronic component sheet.
13. The electronic component manufacturing apparatus according to claim 12,
the tension applied to the stretched film when the 1 st heat treatment is performed is 20N or more and 50N or less.
14. The electronic component manufacturing apparatus according to claim 12 or 13,
the heat treatment unit is a unit that heats the electronic component green sheet at 20 ℃ to 180 ℃.
15. The electronic component manufacturing apparatus according to claim 10 or 11,
further provided with: and an unwinding mechanism that unwinds the electronic component sheet from a wound body of the electronic component sheet and conveys the electronic component sheet to the stress relieving mechanism.
16. The electronic component manufacturing apparatus according to any one of claims 10 to 15,
further provided with: and a 2 nd printing unit configured to print a paste to be a layer not printed on the ceramic green sheet out of the electrode layer and the dielectric layer, in a region where the electrode layer or the dielectric layer is not printed on the ceramic green sheet of the electronic component sheet carried out from the stress relieving unit.
17. The electronic component manufacturing apparatus according to any one of claims 10 to 16,
the heating unit is a heating furnace that heats the electronic component piece.
18. The electronic component manufacturing apparatus according to any one of claims 10 to 16,
the heating unit is a heating roller that heats a transport roller that is in contact with the electronic component sheet.
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| JP2019188073A JP7192739B2 (en) | 2019-10-11 | 2019-10-11 | Electronic component manufacturing method and electronic component manufacturing apparatus |
| JP2019-188073 | 2019-10-11 |
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| CN112712997A true CN112712997A (en) | 2021-04-27 |
| CN112712997B CN112712997B (en) | 2022-10-14 |
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| CN112712997B (en) | 2022-10-14 |
| JP7192739B2 (en) | 2022-12-20 |
| JP2021064691A (en) | 2021-04-22 |
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