JP3960432B2 - Laminated electronic component manufacturing apparatus and manufacturing method of laminated electronic component - Google Patents

Description

  The present invention relates to a multilayer electronic component manufacturing apparatus and a multilayer electronic component manufacturing method.

  Various multilayer electronic components such as multilayer ceramic capacitors, piezoelectric components, PTC thermistors, NTC thermistors, or varistors are manufactured using ceramic green sheets. The ceramic green sheet is manufactured by an extrusion method, a doctor blade method, etc., and a ceramic coating containing ceramic powder, organic binder, plasticizer, etc. is applied to a flexible support fed from a feeding roller and dried. Manufactured.

  The ceramic green sheet is temporarily wound and stored by a winding roller. Next, a conductive paint such as palladium, silver, nickel or the like is formed on the ceramic green sheet by screen printing and dried to produce an internal electrode.

  Next, a plurality of ceramic green sheets with electrodes obtained by drying are laminated one by one so as to have a desired laminated structure, and a ceramic green chip is formed through a press cutting process. The binder in the ceramic green chip thus obtained is burned out and fired at 1000 ° C. to 1400 ° C., and terminal electrodes such as silver, silver-palladium, nickel and copper are formed on the obtained fired body, A laminated electronic component is obtained.

  Incidentally, dust, scraped dust of the flexible support, and the like usually adhere to the front surface of the ceramic green sheet and the back surface of the flexible support that supports the ceramic green sheet. Here, in the method for manufacturing a laminated electronic component, as described above, a ceramic paint is applied to the flexible support fed from the feed roller by a doctor blade method or the like, and the applied ceramic paint is applied. A ceramic green sheet is produced by drying. The ceramic green sheet is temporarily wound and stored by a winding roller.

  On the take-up roller, the back surface of the flexible support overlaps the surface of the ceramic green sheet previously wound. Therefore, if dust, scraped dust or the like of the flexible support adheres to the back surface of the flexible support, when the ceramic green sheet is wound around the take-up roller, the back surface of the flexible support The dust adhering to the side is transferred to the surface of the ceramic green sheet that has been wound first. For this reason, the multilayer electronic component obtained by laminating the ceramic green sheets has a high short-circuit defect rate and breakdown voltage defect rate.

  In particular, in the method of manufacturing a laminated electronic component, the ceramic paint applied on the flexible support is dried by hot air drying in the drying furnace in the subsequent drying process, so that the dust blown up in the drying furnace The probability that the dust and the like of the flexible support adhere to the back surface of the flexible support becomes extremely high.

If the thickness of the ceramic green sheet is thick, the influence of dust or the like will not be a problem, but recently the ceramic green sheet has become extremely thin to meet the demand for smaller size and larger capacity. Very sensitive. Patent Documents 1 to 3 do not disclose anything about such problem recognition and solution means.
Japanese Patent Laid-Open No. 8-130155 JP-A-8-276414 JP 2002-134357 A

  The subject of this invention is providing the manufacturing method of the multilayer electronic component which can reduce the short circuit defect rate of a multilayer electronic component, and a pressure | voltage resistant defect rate, and a multilayer electronic component.

  Moreover, the other subject of this invention is providing the manufacturing method of a laminated electronic component which can improve manufacturing efficiency, and a laminated electronic component.

  In order to solve the above-described problems, the multilayer electronic component manufacturing apparatus according to the present invention includes a ceramic green sheet forming apparatus. The ceramic green sheet forming apparatus includes a flexible support, an application unit, a drying processing unit, a cleaning member, and a winding roller. The surface of the flexible support is used as a ceramic paint application surface. The application unit applies a ceramic paint to the surface side of the flexible support that runs in one direction. The drying processing unit has a drying furnace through which the flexible support is passed. The winding roller winds up the flexible support. The cleaning member is disposed between the drying processing unit and the take-up roller so as to contact the back surface of the flexible support.

  In addition, another multilayer electronic component manufacturing apparatus according to the present invention includes an electrode forming apparatus. The electrode forming apparatus includes a ceramic green sheet, an electrode printing unit, a drying processing unit, a cleaning member, and a winding roller. The ceramic green sheet includes a flexible support and a ceramic coating, and is formed by drying the ceramic coating applied on the flexible support. The electrode printing unit prints the conductive paint on the surface side of the ceramic green sheet traveling in one direction. The drying processing unit has a drying furnace for passing the ceramic green sheet. The winding roller winds the ceramic green sheet. The cleaning member is disposed between the drying processing unit and the take-up roller so as to contact the back surface of the flexible support.

  The multilayer electronic component manufacturing apparatus according to the present invention may include both the ceramic green sheet forming apparatus and the electrode forming apparatus described above.

(1) About laminated electronic component manufacturing apparatus including ceramic green sheet forming apparatus In this laminated electronic component manufacturing apparatus, the ceramic green sheet forming apparatus includes a flexible support, an application unit, and a drying processing unit. The surface of the flexible support is used as a ceramic paint application surface. The application unit applies a ceramic paint to the surface side of the flexible support that runs in one direction. The drying processing unit has a drying furnace through which the flexible support is passed. Accordingly, the multilayer electronic component manufacturing apparatus can obtain a ceramic green sheet by applying a ceramic paint on a flexible support and drying it.

  The laminated electronic component manufacturing apparatus includes a winding roller. The winding roller winds up the flexible support. Thus, the flexible support and the dried ceramic green sheet formed thereon are wound up. On the take-up roller, the back surface of the flexible support overlaps the surface of the ceramic green sheet previously wound. Therefore, if dust, scraped dust or the like of the flexible support adheres to the back surface of the flexible support, the flexible support will be removed when the ceramic green sheet is wound around the take-up roller. Dust or the like adhering to the back side of the sheet is transferred to the surface of the previously wound ceramic green sheet.

  The ceramic green sheet forming apparatus according to the present invention includes a cleaning member as means for solving this problem. The cleaning member is disposed between the drying processing unit and the take-up roller. According to this configuration, even if dust existing in the drying furnace or scraped dust of the flexible support adheres to the back surface of the flexible support due to hot air drying performed in the drying process, This can be reliably removed by the cleaning member before being taken up by the take-up roller.

  Since the cleaning member is disposed so as to come into contact with the back surface of the flexible support, dust and dust attached to the back surface when the flexible support is wound around the take-up roller, and the flexible support. There is no danger that the shaving dust or the like will be transferred to the surface of the previously wound ceramic green sheet. Therefore, it is possible to reduce the short-circuit defect rate and the breakdown voltage defect rate of the multilayer electronic component.

(2) Regarding laminated electronic component manufacturing apparatus including electrode forming apparatus In this laminated electronic component manufacturing apparatus, the electrode forming apparatus includes a ceramic green sheet, an electrode printing unit, and a drying processing unit. The ceramic green sheet is obtained by drying the ceramic paint applied on the flexible support, and the electrode printing unit prints the conductive paint on the surface side of the ceramic green sheet traveling in one direction. The drying processing unit has a drying furnace for passing the ceramic green sheet. Therefore, the multilayer electronic component manufacturing apparatus can apply the conductive paint on the ceramic green sheet and dry it.

  The laminated electronic component manufacturing apparatus includes a winding roller. The winding roller winds up the flexible support. As a result, the flexible support and the dried ceramic green sheet formed thereon are wound up. Electrodes are formed on the surface of the ceramic green sheet. On the take-up roller, the back surface of the flexible support overlaps the surface of the ceramic green sheet previously wound. Therefore, if dust, scraped dust or the like of the flexible support adheres to the back surface of the flexible support, the flexible support will be removed when the ceramic green sheet is wound around the take-up roller. Dust or the like adhering to the back surface of the ceramic is transferred to the surface of the previously wound ceramic green sheet and to the electrode formed on the ceramic green sheet.

  The electrode forming apparatus according to the present invention includes a cleaning member as means for solving this problem. The cleaning member is disposed between the drying processing unit and the take-up roller. According to this configuration, it is assumed that dust existing in the drying furnace, scraped dust of the flexible support, and the like adhere to the back surface of the flexible support by hot air drying performed in the electrode pattern drying process. However, it can be reliably removed by the cleaning member before being taken up by the take-up roller.

  Since the cleaning member is disposed so as to contact the back surface of the flexible support, when the flexible support is wound around the take-up roller, dust or the like attached to the back surface is wound first. There is no danger of being transferred to the surface of the ceramic green sheet and the electrodes formed on the ceramic green sheet. Accordingly, when a laminated electronic component is manufactured by laminating ceramic green sheets provided with electrodes, the short-circuit defect rate and the breakdown voltage defect rate can be reduced.

(3) Other Preferred Aspects The multilayer electronic component manufacturing apparatus according to the present invention can include a ceramic green sheet forming apparatus and an electrode forming apparatus as a preferred aspect. The ceramic green sheet forming apparatus and the electrode forming apparatus are as described above. Therefore, the multilayer electronic component manufacturing apparatus has all the advantages described above.

  Furthermore, as another preferable aspect, the multilayer electronic component manufacturing apparatus according to the present invention includes a ceramic green sheet forming apparatus continuously provided in the electrode forming apparatus without using a winding roller. Therefore, a laminated electronic component can be manufactured easily.

  As still another preferred embodiment of the multilayer electronic component manufacturing apparatus according to the present invention, the cleaning member is urethane foam, nonwoven fabric, or adhesive roll. According to the structure of this cleaning member, the multilayer electronic component manufacturing apparatus can have an excellent foreign matter removing ability.

  Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. The accompanying drawings are merely examples.

  FIG. 1 is a diagram showing a configuration of an embodiment of a multilayer electronic component manufacturing apparatus including a ceramic green sheet forming apparatus according to the present invention. Referring to FIG. 1, the ceramic green sheet forming apparatus includes a flexible support 10, a coating unit 20, a drying processing unit 30, a cleaning member 40, and a winding roller 52.

  The flexible support 10 is a long belt-like body, and the surface side is used as the ceramic coating surface 11. The flexible support 10 is preferably made of a heat resistant synthetic resin such as polyethylene terephthalate.

  The flexible support 10 is preferably subjected to a peeling treatment on the coating surface 11 in consideration of peeling of the ceramic green sheet. The peeling process can be performed by thinly coating the coating surface 11 with a peeling film made of Si or the like. By performing such a peeling process, the ceramic green sheet of the lowest layer formed on the flexible support 10 is attached to the flexible support 10 after the lamination process of the required number of layers is completed. Can be easily peeled off. In FIG. 1, reference numeral F <b> 1 indicates the traveling direction of the flexible support 10.

  The application unit 20 applies the ceramic paint 22 to the application surface 11 of the flexible support 10 that runs in the direction of arrow F1.

  The application unit 20 includes an application head 21 and applies a ceramic coating 22 containing ceramic powder, an organic binder, a plasticizer, a solvent, and the like on the flexible support 10. FIG. 2 shows an example of a ceramic green sheet forming apparatus using a doctor blade type coating head 21. The application head 21 may use an extrusion type or other reverse roll type.

The ceramic paint 22 is an example, but after firing powders of barium titanate, chromium oxide, yttrium oxide, manganese carbonate, barium carbonate, calcium carbonate, silicon oxide and the like having a particle size of about 0.1 μm to 1.0 μm. BaTiO ₃ 100 mol%, converted to Cr ₂ O ₃ , 0.3 mol%, converted to MnO, 0.4 mol%, converted to BaO, 2.4 mol%, converted to CaO, 1 .6 mol%, 4 mol% in terms of SiO ₂ , and 0.1 mol% in terms of Y ₂ O ₃ , and mixed for 24 hours using a ball mill. Obtained. 100 parts by weight of this dielectric material, 5 parts by weight of acrylic resin, 40 parts by weight of methylene chloride, 25 parts by weight of acetone, and 6 parts by weight of mineral spirits were mixed for 24 hours using a commercially available φ10 mm zirconia bead on a pot stand. Is used.

  The drying processing unit 30 includes a drying furnace through which the flexible support 10 having the undried ceramic green sheet 13 is passed, and the applied ceramic paint 22 is dried to form the ceramic green sheet 13. For convenience of explanation, the drying processing unit and the drying furnace are denoted by the same reference numeral 30.

  The drying furnace 30 allows the flexible support 10 to pass inside and causes hot air to flow inside the furnace to dry the undried ceramic green sheet 13 on the flexible support 10 with hot air. According to the hot air drying described above, the drying process can be performed at a low temperature of, for example, 45 to 80 ° C. and with a conventional drying time of about 1/3. In addition, the amount of deformation of the flexible support 10 can be minimized. Specifically, the deformation amount of the flexible support 10 can be suppressed to 20 μm or less.

  The take-up roller 52 constitutes a feeding device for the flexible support 10 together with the feeding roller 51 and a plurality of rollers shown in the figure. More specifically, the feeding roller 51 is driven to rotate in the direction of the arrow R1 by a driving device (not shown) such as a motor, thereby feeding the flexible support 10 in the direction of the arrow F1, and the take-up roller. The flexible support 10 is wound up while 52 cooperates with the feeding roller 51. The winding roller 52 is rotationally driven in the direction of arrow R1 by a driving device (not shown) such as a motor. The flexible support body 10 fed out from the feed roller 51 is wound up via a plurality of rollers.

  The plurality of rollers include a guide roller 61, a suction roller 62, and a meandering correction roller 63, and each of them is in contact with only the surface 12 of the flexible support 10 opposite to the surface 11 to which the ceramic paint 22 is applied. The flexible support 10 is sent in the direction of arrow F1.

  The cleaning member 40 is preferably foamed urethane, non-woven fabric, or adhesive roll. In this specification, the non-woven fabric means a fiber that is produced by accumulating fibers in a certain direction or randomly and bonding them scientifically with an adhesive resin, mechanically entangled, or bonding with heat-welded fibers. Since these nonwoven fabrics have a porous structure, they have an excellent ability to take in and remove dust and foreign matters. The material is preferably polyester or nylon. The adhesive roll is a known cleaning member made of polyvinyl ethyl ether resin and calcium carbonate.

  The cleaning member 40 is disposed between the drying processing unit 30 and the take-up roller 52 so as to come into contact with the surface 12 opposite to the application surface 11 of the flexible support 10. The cleaning member 40 shown in the figure travels in the direction indicated by the arrow F2 by the cooperating cleaning member rollers 41 and 43, and passes through the support roller 42 at an intermediate portion. The support roller 42 is provided in advance in an appropriate position close to the back surface 12 of the flexible support 10, and the cleaning member 40 passes through the outside of the support roller 42 and the back surface 12 of the flexible support 10. To remove dust, shaving dust and the like of the flexible support. As a preferred embodiment, the traveling direction of the cleaning member 40 indicated by the arrow F2 is opposite to the traveling direction F1 of the flexible support 10, and thus the cleaning member 40 has an excellent foreign matter removing ability.

  The multilayer electronic component manufacturing apparatus described above manufactures a multilayer electronic component by the following steps. That is, the flexible support 10 pulled out from the feed roller 51 in the direction indicated by the arrow F 1 has an unfired ceramic coating layer formed on the coating surface 11, and further passes through the guide roller 61 and is guided into the drying furnace 30. It is burned. Next, the ceramic paint 22 is dried to form the ceramic green sheet 13. Next, after the back surface 12 of the flexible support 10 is cleaned using the cleaning member 40, the cleaned flexible support 10 is wound using the winding roller 52.

  As described above, the ceramic green sheet forming apparatus includes the flexible support 10, the coating unit 20, and the drying processing unit 30. As for the flexible support body 10, the surface side is used as the application surface 11. FIG. The application unit 20 applies the ceramic paint 22 to the application surface 11 of the flexible support 10 that travels in one direction. The drying processing unit 30 has a drying furnace through which the flexible support 10 is passed. Therefore, the multilayer electronic component manufacturing apparatus can obtain the ceramic green sheet 13 by applying the ceramic paint 22 on the flexible support 10 and drying it.

  The laminated electronic component manufacturing apparatus includes a winding roller 52. The take-up roller 52 takes up the flexible support 10. As a result, the flexible support 10 and the dried ceramic green sheet 13 formed thereon are wound up. In the winding roller 52, the back surface 12 of the flexible support 10 overlaps the surface of the ceramic green sheet 13 that has been previously wound. Therefore, if dust, scraped dust or the like of the flexible support adheres to the back surface 12, when the ceramic green sheet 13 is wound around the take-up roller 52, dust or the like attached to the back surface 12 Then, it is transferred to the surface of the ceramic green sheet 13 that has been wound first.

  The ceramic green sheet forming apparatus includes a cleaning member 40 as means for solving this problem. The cleaning member 40 is disposed between the drying processing unit 30 and the take-up roller 52. According to this configuration, even if dust existing in the drying oven, scraped dust of the flexible support, or the like adheres to the back surface 12 of the flexible support 10 due to hot air drying performed in the drying process. The dust can be surely removed by the cleaning member 40 before being taken up by the take-up roller 52.

  Since the cleaning member 40 is disposed so as to be in contact with the back surface 12 of the flexible support 10, dust attached to the back surface 12 when the flexible support 10 is wound around the winding roller 52. And the like are not transferred to the surface of the previously wound ceramic green sheet 13. Therefore, it is possible to reduce the short-circuit defect rate and the breakdown voltage defect rate of the multilayer electronic component.

  FIG. 2 is a diagram showing a configuration of a multilayer electronic component manufacturing apparatus including an electrode forming apparatus according to an embodiment of the present invention. In FIG. 2, the same components as those shown in FIG. Referring to FIG. 2, the electrode forming apparatus includes a ceramic green sheet 13, an electrode printing unit 70, a drying processing unit 30, a cleaning member 40, and a take-up roller 52.

  The ceramic green sheet 13 is formed by the ceramic green sheet forming apparatus shown in FIG. 1 and is obtained by drying the ceramic coating 22 applied on the flexible support 10.

  The electrode printing unit 70 prints the electrode 80 on the surface of the ceramic green sheet 13 traveling in the F1 direction using the conductive paint 71. The electrode printing unit 70 prints the electrode 80 preferably by well-known screen printing. The electrode printing unit 70 can also print the electrode 80 by other image processing.

  Referring to FIG. 2, the electrode printing unit 70 includes a conductive paint 71, a screen 72, and a squeegee 73. On the surface 130 of the unfired ceramic layer formed on the surface of the flexible support 10, An electrode 80 having a predetermined pattern is printed. The conductive paint 71 used for electrode printing includes a metal powder such as Ni serving as a conductive component, an ethylcellulose binder, and a solvent. Known metal powder can be used as the conductive component, and besides Ni described above, at least one of palladium and silver, or an alloy thereof can be used. The solvent is a high boiling point solvent such as terpineol.

  After the flexible support 10 on which the electrode 80 is printed is subjected to a drying process by the drying processing unit 30, the back surface 12 of the flexible support 10 is cleaned by the cleaning member 40 and wound by the winding roller 52. Taken.

  The multilayer electronic component manufacturing apparatus described above manufactures the multilayer electronic component by the following process. First, the conductive paint 71 is printed on the surface side of the ceramic green sheet 13 to form the electrode 80. Next, after the back surface 12 of the flexible support 10 is cleaned using the cleaning member 40, the cleaned flexible support 10 is wound using the winding roller 52.

  Although not shown, the ceramic green sheet forming step and the electrode forming step can be alternately repeated a plurality of times. That is, the ceramic green sheet 13 on which the electrode 80 is printed is usually reapplied to the ceramic green sheet forming step including the application unit 20 shown in FIG. The wound ceramic green sheet 13 is attached to the feeding roller 51, and the ceramic green sheet can be formed to a desired thickness through the meandering correction roller 63, and a process of printing the electrode 80 is necessary. It is repeated as many times as the number of layers.

  Thereafter, a well-known process necessary for obtaining a laminated electronic component is performed. For example, after the ceramic green sheet forming step and the electrode printing step are executed a plurality of times, a protective layer is additionally formed on the laminated ceramic green sheet 13 and the laminated ceramic green sheet 13 is peeled off from the flexible support 10. To do. A plurality of laminated ceramic green sheets 13 obtained by peeling are further laminated in a desired arrangement. A protective layer separately formed as a sheet is laminated on the uppermost layer of the laminate thus obtained.

Finally, the multilayer ceramic green sheet 13 obtained as described above is punched, pressed, and cut to obtain a multilayer green chip. The obtained multilayer green chip is subjected to a binder removal treatment under a predetermined temperature condition, then baked, and a terminal electrode is formed by baking. The binder removal and firing conditions are conventionally known. For example, the binder is removed at 280 ° C. for 12 hours and baked at 1300 ° C. for 2 hours in a reducing atmosphere. A terminal electrode is formed on the laminate obtained after firing. The material and forming method of the terminal electrode are also well known. For example, copper is used as a main component, and plating is performed by baking at 800 ° C. for 30 minutes in N ₂ + H ₂ . Through the above necessary steps, a finished product of the laminated electronic component is obtained.

  As described above, the multilayer electronic component manufacturing apparatus according to the present invention includes an electrode forming apparatus, and the electrode forming apparatus includes the ceramic green sheet 13, the electrode printing unit 70, and the drying processing unit 30. The ceramic green sheet 13 is obtained by drying the ceramic paint applied on the flexible support 10, and the electrode printing unit 70 applies the conductive paint 71 to the surface 130 of the ceramic green sheet 13 that runs in one direction. Print. The drying processing unit 30 has a drying furnace through which the ceramic green sheet 13 is passed. Therefore, the multilayer electronic component manufacturing apparatus can apply the conductive paint 71 to the ceramic green sheet 13 and dry it.

  The multilayer electronic component manufacturing apparatus according to the present invention includes a winding roller 52. The take-up roller 52 takes up the flexible support 10. As a result, the flexible support 10 and the dried ceramic green sheet 13 formed thereon are wound up. An electrode 80 is formed on the surface of the ceramic green sheet 13. On the take-up roller 52, the back surface 12 of the flexible support 10 overlaps the front surface 130 of the ceramic green sheet 13 that has been previously wound.

  Here, the electrode forming apparatus in the multilayer electronic component manufacturing apparatus according to the present invention includes a cleaning member 40. The cleaning member 40 is disposed between the drying processing unit 30 and the take-up roller 52. According to the above configuration, dust existing in the drying furnace and scraped dust of the flexible support adhere to the back surface 12 of the flexible support 10 by hot air drying performed in the electrode pattern drying process. Even before this, the cleaning member 40 can reliably remove dust and the like before being taken up by the take-up roller 52.

  Moreover, since the cleaning member 40 is disposed so as to contact the back surface 12 of the flexible support 10, it adheres to the back surface 12 when the flexible support 10 is wound around the take-up roller 52. There is no risk of the transferred dust or the like being transferred to the surface 130 of the ceramic green sheet 13 that has been wound and the electrode 80 formed on the ceramic green sheet 13. Therefore, when the laminated green electronic component is manufactured by laminating the ceramic green sheets 13 including the electrodes 80, the short-circuit defect rate and the breakdown voltage defect rate can be reduced.

  In the case of a conventional configuration that does not include a cleaning member, the ceramic green sheet 13 is wound around the take-up roller 52 if dust, scraped dust, or the like of the flexible support adheres to the back surface 12 of the flexible support 10. When taken, dust or the like adhering to the back surface 12 is transferred to the front surface 130 of the ceramic green sheet 13 and the electrode 80 formed on the ceramic green sheet 13. According to the present invention, it is apparent from the above point that such a problem can be avoided.

  The advantages of the multilayer electronic component manufacturing apparatus according to the present invention will be further described with reference to experimental data. Table 1 shows the short-circuit failure rate for each cleaning member when a short-circuit failure experiment is performed on a multilayer electronic component manufactured using the multilayer electronic component manufacturing apparatus.

表１において、「１００ｍあたりのスジ本数」は、セラミックグリーンシート上に現れる損傷であって、積層電子部品のショート不良の原因となるものである。

In Table 1, “the number of streaks per 100 m” is damage that appears on the ceramic green sheet, and causes a short circuit failure of the multilayer electronic component.

  Referring to Table 1, Comparative Example 1 is a multilayer electronic component manufacturing apparatus according to the prior art, and shows experimental results of the multilayer electronic component obtained using the multilayer electronic component manufacturing apparatus that does not include a cleaning member. . In Comparative Example 1, two stripes are generated per 100 m, and the short-circuit defect rate is 10%. Since this does not have a cleaning member, when the ceramic green sheet 13 is taken up by the take-up roller 52, dust adhered to the back surface of the flexible support, scraped dust of the flexible support, etc. Is presumed to have been transferred to the surface of the ceramic green sheet 13 wound earlier and the electrode 80 formed on the ceramic green sheet 13.

  On the other hand, in Examples 1 to 3, the streaks generated in the ceramic green sheet 13 and the electrode 80 formed on the ceramic green sheet 13 are reduced to 0.2 to 0.03 per 100 m, resulting in a short circuit. The defective rate is reduced to 5% to 2%. This is presumably because the cleaning member 40 removes dust attached to the back surface 12 of the flexible support 10, scraped dust on the flexible support, and the like.

  The multilayer electronic component manufacturing apparatus according to the present invention includes a ceramic green sheet forming apparatus and an electrode forming apparatus as a preferred embodiment, and the ceramic green sheet forming apparatus continues to the electrode forming apparatus without the winding roller 52 interposed therebetween. Can be prepared. According to this configuration, the laminated electronic component can be manufactured with high productivity.

  The multilayer electronic component manufacturing apparatus including the ceramic green sheet forming apparatus and the electrode forming apparatus described above manufactures a multilayer electronic component by the following process. In the method for manufacturing a laminated electronic component, first, a ceramic paint 22 is applied to the surface side of the flexible support 10. Next, the ceramic paint 22 is dried to form the ceramic green sheet 13. Next, the conductive paint 71 is printed on the surface side of the ceramic green sheet 13. Next, the conductive paint 71 is dried. Next, after the back surface 12 of the flexible support 10 is cleaned using the cleaning member 40, the cleaned flexible support 10 is wound using the winding roller 52.

  The production method includes a ceramic layer forming step of forming the ceramic layer by applying the ceramic paint 22 on the flexible support 10, and a printing step of printing the electrode 80 on the ceramic layer. Improves.

  Although the contents of the present invention have been specifically described above with reference to the preferred embodiments, it is obvious that those skilled in the art can take various modifications based on the basic technical idea and teachings of the present invention. It is.

It is a figure which shows the structure of the multilayer electronic component manufacturing apparatus containing the ceramic green sheet forming apparatus which concerns on one Embodiment of this invention. It is a figure which shows the structure of the multilayer electronic component manufacturing apparatus containing the electrode formation apparatus which concerns on one Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Flexible support body 11 Ceramic paint application surface 12 Back surface 13 Ceramic green sheet 20 Application part 22 Ceramic paint 30 Drying process part (drying furnace)
40 Cleaning member 52 Winding roller 70 Electrode printing unit 71 Conductive paint 80 Electrode

Claims (9)

A laminated electronic component manufacturing apparatus including a ceramic green sheet forming apparatus,
The ceramic green sheet forming apparatus includes a flexible support, an application unit, a drying processing unit, a cleaning member, and a winding roller.
The flexible support is used as a ceramic paint application surface,
The application unit applies a ceramic paint to the surface side of the flexible support that travels in one direction,
The drying processing unit has a drying furnace for passing the flexible support,
The drying furnace is for passing the flexible support inside, and circulating hot air inside the furnace to dry the undried ceramic paint on the flexible support,
The winding roller winds the flexible support,
The cleaning member is disposed between the drying unit and the take-up roller so as to contact the back surface of the flexible support.
Multilayer electronic component manufacturing equipment. A laminated electronic component manufacturing apparatus including an electrode forming apparatus,
The electrode forming apparatus includes a ceramic green sheet, an electrode printing unit, a drying processing unit, a cleaning member, and a winding roller.
The ceramic green sheet is obtained by drying a ceramic paint applied on a flexible support,
The electrode printing unit forms an electrode pattern by printing a conductive paint on the surface side of the ceramic green sheet traveling in one direction,
The drying processing unit has a drying furnace for passing the ceramic green sheet on which the electrode pattern is formed,
The drying furnace is for passing the ceramic green sheet inside, circulating hot air inside the furnace, and drying the undried conductive paint on the ceramic green sheet,
The winding roller winds up the ceramic green sheet,
The cleaning member is disposed between the drying unit and the take-up roller so as to contact the back surface of the flexible support.
Multilayer electronic component manufacturing equipment. A multilayer electronic component manufacturing apparatus including a ceramic green sheet forming apparatus and an electrode forming apparatus,
The ceramic green sheet forming apparatus is the one described in claim 1,
The electrode forming apparatus is the one described in claim 2.
Multilayer electronic component manufacturing equipment. The multilayer electronic component manufacturing apparatus according to claim 3,
The ceramic green sheet forming device is provided so as to be continuous with the electrode forming device without passing through the winding roller.
Multilayer electronic component manufacturing equipment. The multilayer electronic component manufacturing apparatus according to any one of claims 1 to 4,
The cleaning member is a urethane foam, a nonwoven fabric, or an adhesive roll.
Multilayer electronic component manufacturing equipment. A method of manufacturing a laminated electronic component including a ceramic green sheet forming step,
The ceramic green sheet forming step includes:
First, apply ceramic paint to the surface of the flexible support,
Next, the flexible support is passed through a drying furnace, and hot air is circulated through the furnace to dry the undried ceramic paint on the flexible support in the drying furnace. Forming a ceramic green sheet,
Next, after cleaning the back surface of the flexible support using a cleaning member, the flexible support is wound up by a winding roller.
A method of manufacturing a laminated electronic component including a process. A method for manufacturing a laminated electronic component including an electrode forming step,
The electrode forming step includes
First, conductive paint is printed on the surface side of the ceramic green sheet to form electrodes,
Next, the ceramic green sheet is passed through a drying furnace and hot air is circulated through the furnace to dry the undried conductive paint on the ceramic green sheet in a drying furnace .
Next, after cleaning the back surface of the flexible support using a cleaning member, the flexible support is wound up by a winding roller.
A method of manufacturing a laminated electronic component including a process. A method for manufacturing a laminated electronic component, comprising:
A method for manufacturing a laminated electronic component including a step of alternately repeating the ceramic green sheet forming step and the electrode forming step a plurality of times. A method for manufacturing a laminated electronic component, comprising:
First, apply ceramic paint to the surface of the flexible support,
Next, the ceramic paint is dried to form a ceramic green sheet,
Next, a conductive paint is printed on the surface side of the ceramic green sheet,
Next, the ceramic green sheet is passed through a drying furnace and hot air is circulated through the furnace to dry the undried conductive paint on the ceramic green sheet in a drying furnace .
Next, after cleaning the back surface of the flexible support using a cleaning member, the flexible support is wound up by a winding roller.
A method of manufacturing a laminated electronic component including a process.

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