JP2004103983A - Manufacturing method of ceramic electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic electronic part by which delamination which occurs at baking can be reduced. <P>SOLUTION: A first ceramic coating layer 51 is formed on a base 19. A first group 61 of electrodes is formed. A second ceramic coating layer 52 is formed. A second group 62 of electrodes is formed. A third ceramic coating layer 53 whose thickness t2 is equal to a difference between the thickness t1 of the first ceramic coating layer 51 and the thickness t2 of the second ceramic coating layer 52 is formed. The first ceramic coating layer 51 is peeled off from the base 19 and a multilayer sheet 70 is formed. A plurality of multilayer sheets 70 are stacked on each other. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a multilayer ceramic electronic component.
[0002]
[Prior art]
As a multilayer ceramic electronic component, for example, a multilayer ceramic capacitor is known. In multilayer ceramic capacitors, there is a strong demand for miniaturization and large capacity, and in order to meet this demand, the thickness of one dielectric layer is reduced and the number of stacked layers is increased. For example, in recent multilayer ceramic capacitors, the thickness of the dielectric layer is 2 to 10 μm or less, and the number of stacked layers has reached several hundreds.
[0003]
As a method of manufacturing a multilayer ceramic capacitor, for example, a ceramic paint is applied on a sheet-like flexible support, the ceramic paint is dried to form a ceramic green sheet, and an electrode group is formed on the ceramic green sheet. After the formation, the ceramic green sheets are cut into a predetermined size, and the cut ceramic green sheets are sequentially laminated to form a laminated structure. The laminated structure is cut into small pieces, fired, and the terminal electrodes are formed. 2. Description of the Related Art There is known a manufacturing method for obtaining a finished multilayer ceramic capacitor by mounting the same.
[0004]
However, in this manufacturing method, unevenness occurs between a portion where the electrode is formed and a portion where the electrode is not formed on the ceramic green sheet. Gets worse. For this reason, in the subsequent firing step, there is a problem that delamination occurs in the uneven portions generated between the ceramic green sheets.
[0005]
As means for solving this problem, for example, JP-A-6-168840 discloses that a ceramic green sheet is formed on a sheet-like flexible support, an electrode group is formed on the ceramic green sheet, and an electrode group is formed. After hot pressing the formed ceramic green sheet with a mold having a flat surface, the ceramic green sheet is cut into a predetermined size, and the cut ceramic green sheets are sequentially laminated to form a laminated structure. A method of forming is disclosed.
[0006]
In this manufacturing method, since the surface of the ceramic green sheet on which the electrode group is formed is hot-pressed by a mold having a flat surface, the portion where the electrode is formed and the electrode are not formed on the ceramic green sheet. Irregularities occurring between the portions are reduced. For this reason, poor adhesion between the laminated ceramic green sheets is reduced, and delamination occurring during firing is reduced.
[0007]
However, the manufacturing method disclosed in Japanese Patent Application Laid-Open No. 6-168840 requires a hot press with a mold every time an electrode group is formed.
[0008]
Also, even when hot pressing is performed with a mold, it is extremely difficult to completely flatten the surface of the ceramic green sheet on which the electrode group is formed, Uneven irregularities will remain. The slight unevenness generated on the surface of the ceramic green sheet is accumulated as the ceramic green sheets are stacked, and large unevenness occurs in the uppermost ceramic green sheet.
[0009]
For this reason, even when the manufacturing method disclosed in JP-A-6-168840 is used, there is a problem that as the number of layers increases with the increase in the number of layers, the delamination that occurs during firing becomes significant. there were.
[0010]
[Patent Document 1]
JP-A-6-168840 (page 2-3, FIG. 1)
[0011]
[Problems to be solved by the invention]
An object of the present invention is to provide a method of manufacturing a multilayer ceramic electronic component that can reduce delamination occurring during firing.
Another object of the present invention is to provide a manufacturing method capable of easily manufacturing a multilayer ceramic electronic component.
[0012]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, in a method for manufacturing a ceramic electronic component according to the present invention, a first ceramic paint layer is formed on a support. Next, a first electrode group is formed on the first ceramic paint layer. Next, a ceramic paint is applied on the first ceramic paint layer and the first electrode group to form a second ceramic paint layer having a thickness larger than that of the first ceramic paint layer. Next, a second electrode group is formed on the second ceramic paint layer. Next, a ceramic paint is applied on the second ceramic paint layer and the second electrode group, and the thickness is determined by the difference between the thickness of the first ceramic paint layer and the thickness of the second ceramic paint layer. To form a third ceramic paint layer given by Next, the method includes a step of peeling the first ceramic paint layer from the support to form a laminated sheet, and sequentially laminating a plurality of laminated sheets.
[0013]
In the method for manufacturing a ceramic electronic component according to the present invention, a first ceramic paint layer is formed, a first electrode group is formed on the first ceramic paint layer, and further a first ceramic paint layer is formed. A ceramic paint is applied on the paint layer and the first electrode group to form a second ceramic paint layer. According to this step, the ceramic paint constituting the second ceramic paint layer is applied so as to fill the gap (recess) existing between the first electrode groups due to its fluidity. For this reason, the adhesion of the second ceramic paint layer to the first electrode group is improved, and the problem of delamination, which has been a problem in the past, is less likely to occur.
[0014]
Next, a second electrode group is formed on the second ceramic paint layer, and then a ceramic paint is applied on the second ceramic paint layer and the second electrode group to form a third electrode group. To form a ceramic paint layer. According to this step, the ceramic paint constituting the third ceramic paint layer is applied so as to fill the gap (recess) existing between the second electrode groups due to its fluidity. For this reason, the adhesion of the third ceramic paint layer to the second electrode group is improved, and problems such as delamination, which has been a problem in the past, are less likely to occur.
[0015]
Further, the first ceramic paint layer is formed, for example, by applying a ceramic paint on the support, so that when peeled from the support, the surface facing the support becomes flat.
[0016]
The third ceramic paint layer is formed by applying a ceramic paint on the second ceramic paint layer and the second electrode group, and the electrode group is not formed on the surface. For example, the surface can be made flat by applying a ceramic paint by an extrusion coating method, a doctor blade method, or the like.
[0017]
Thus, the laminated sheet has a flat surface and no irregularities on the surface. Therefore, when a plurality of laminated sheets are sequentially laminated, a problem such as delamination, which has been a problem in the past, is less likely to occur.
[0018]
Further, since there is no unevenness on the surface of the laminated sheet, it is not necessary to perform hot pressing for each laminated sheet. It is sufficient to apply a hot press after sequentially laminating a plurality of laminated sheets. For this reason, the number of times of hot pressing can be reduced, and a ceramic electronic component can be easily and accurately manufactured in a short time.
[0019]
In addition, since the laminated sheet is not composed of a single ceramic paint layer (first to third ceramic paint layers) but is formed by sequentially laminating a plurality of ceramic paint layers, the thickness of the laminated sheet as a whole increases. . For this reason, even when the ceramic paint layer becomes thin, handling becomes easy and peeling from the support becomes easy. In addition, the thickness of the entire laminated sheet is increased and the strength is increased, so that the burden on the ceramic paint layer and the electrode group during handling is reduced, and characteristic defects such as short circuits are reduced.
[0020]
The second ceramic paint layer has a thickness greater than that of the first ceramic paint layer, and the third ceramic paint layer has a thickness equal to the thickness of the first ceramic paint layer and the thickness of the second ceramic paint layer. It is given by the difference from the thickness. Therefore, the sum of the thickness of the first ceramic paint layer and the thickness of the third ceramic paint layer becomes substantially equal to the thickness of the second ceramic paint layer.
[0021]
Therefore, in two adjacent laminated sheets, a plurality of laminated sheets are arranged such that the third ceramic paint layer included in one laminated sheet is adjacent to the first ceramic paint layer included in the other laminated sheet. When sequentially laminated, the sum of the thickness of the third ceramic paint layer included in one laminated sheet and the thickness of the first ceramic paint layer included in the other laminated sheet is equal to the thickness of the second ceramic paint layer. It is almost equal to the thickness. For this reason, the thickness of the paint layer generated between the first electrode group and the second electrode group that face each other via the second ceramic paint layer is reduced via the third ceramic paint layer and the first ceramic paint layer. Since the thickness of the paint layer generated between the opposing first electrode group and the second electrode group is substantially equal, it is possible to manufacture a ceramic electronic component having stable characteristics.
[0022]
Also, for example, when the thickness of the first ceramic paint layer is substantially equal to the thickness of the third ceramic paint layer, the first ceramic sheet included in one of the adjacent two laminated sheets is included in one of the laminated sheets. The third ceramic paint layer included in the first laminated sheet is adjacent to the first ceramic paint layer included in the other laminated sheet, or the third ceramic paint layer included in the first laminated sheet is included in the third laminated sheet. A plurality of laminated sheets can be sequentially laminated so as to be adjacent to the ceramic paint layer. At this time, the sum of the thicknesses of the first ceramic paint layers included in both the laminated sheets or the sum of the thicknesses of the third ceramic paint layers included in the both laminated sheets is substantially equal to the thickness of the second ceramic paint layer. Be equal.
[0023]
For this reason, the thickness of the paint layer generated between the first electrode group and the second electrode group that face each other via the second ceramic paint layer is such that the first ceramic paint layer or the third ceramic paint layer has a thickness different from that of the first ceramic paint layer. Since the thickness of the paint layer generated between the first electrode group and the second electrode group opposed to each other becomes substantially equal, it is possible to manufacture a ceramic electronic component having stable characteristics.
[0024]
Other features of the present invention and the operation and effect thereof will be described in more detail with reference to the accompanying drawings and embodiments.
[0025]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a process diagram showing one embodiment of a method for manufacturing a ceramic electronic component according to the present invention, FIG. 2 is a block diagram showing a method for manufacturing the ceramic electronic component shown in FIG. 1, and FIG. FIG. 4 is a front sectional view showing a step of forming a first ceramic paint layer. In the manufacturing method according to the present embodiment, a multilayer ceramic capacitor is manufactured through the following steps.
[0026]
<Step of forming first ceramic paint layer>
In forming the first ceramic paint layer 51, first, as shown in FIGS. 1 and 3, a ceramic paint 17a, a support 19, an extrusion-type coating head 10, and a dryer 95 are prepared.
[0027]
Then, as shown in FIGS. 1 and 3, the ceramic paint 17 a is applied to one surface of the support 19 using the extrusion-type application head 10, and the first ceramic paint 17 a is passed through a dryer 95. After drying, a first ceramic paint layer 51 having a thickness of t1 is formed.
[0028]
Specifically, BaTiO3 is used as the ceramic paint 17a. ₃ For example, known materials can be used. As the support 19, for example, a flexible support continuously supplied from the roller 97 can be used. Reference numeral F1 indicates the traveling direction of the support 19.
[0029]
It is preferable that the support 19 be subjected to a release treatment on a surface on which the first ceramic paint layer 51 is formed. The peeling treatment can be performed by, for example, thinly coating a peeling film made of Si or the like on one surface of the support 19. By performing such a peeling treatment, the first ceramic paint layer 51 can be easily peeled from the support 19.
[0030]
The extrusion type coating head 10 shown in FIG. 3 includes a slit 46 for discharging the ceramic paint, an upstream nozzle 47, a downstream nozzle 48, and a ceramic paint pool 49. Such extrusion coating heads are known. By using this extrusion type coating head 10, a uniform ceramic paint layer (ceramic green sheet) having very good surface accuracy and little thickness variation can be obtained.
[0031]
<Target mark forming process>
FIG. 4 is a plan view showing a step after the step shown in FIG. In the present embodiment, as shown in FIG. 4, first target marks a1, b1, c1, d1 for image processing and pitch marks are formed on the surface of the support 19 on which the first ceramic paint layer 51 is formed. e1 is formed.
[0032]
The first target marks a1 to d1 and the pitch mark e1 may be marks formed by screen printing, gravure printing, inkjet printing, or the like, or marks capable of image processing such as through holes. Either side may be used. The formation timing of the first target marks a1 to d1 and the pitch mark e1 can be performed simultaneously with, for example, the step of forming the first electrode group shown in FIG.
[0033]
<Step of forming first electrode group>
FIG. 5 is a front sectional view showing a step after the step shown in FIG. 4. In the present embodiment, as shown in FIGS. 1 and 5, a first electrode group 61 is printed on a first ceramic paint layer 51 by a screen printer 91, and the first electrode group 61 is dried. Then, the first electrode group 61 is formed by drying through a machine 95.
[0034]
FIG. 6 is a plan view showing a first electrode group 61 formed on the first ceramic paint layer 51, and FIG. 7 is a partially enlarged view of FIG. 6 and 7, the first electrode group 61 is made of an electrode material mainly composed of, for example, nickel, copper, or the like.
[0035]
In FIG. 7, the individual electrodes 111 to 161, 112 to 152, and 11 m to 15 m constituting the first electrode group 61 are arranged on the first ceramic paint layer 51 at intervals. In this embodiment, each electrode is formed so as to have m columns in the length direction of the first ceramic paint layer 51, and the odd-numbered columns are provided with 6 rows, and the even-numbered columns are provided with 5 rows of electrodes. I have. The first digit of the reference number given to the electrode indicates the column to which the electrode belongs, and the second digit indicates the row to which the electrode belongs. The individual electrodes are arranged such that even rows and odd rows differ by a dimension L. The dimension L is appropriately 1/2 of the electrode pitch 2L.
[0036]
In forming the first electrode group 61, printing positioning can be performed based on information obtained by performing image processing on the above-described first target marks a1 to d1 and the pitch mark e1.
[0037]
In the present embodiment, the second target marks a2, b2, c2, d2 and the pitch mark e2 are printed simultaneously with the printing of the first electrode group 61. The second target marks a2, b2, c2, d2 and the pitch mark e2 can be used when positioning with high precision in a later laminating step or the like.
[0038]
<Step of forming second ceramic paint layer>
FIG. 8 is a front sectional view showing a step after the step shown in FIG. 5. As shown in FIGS. 1 and 8, in forming the second ceramic paint layer 52, the first ceramic paint layer 51 and the first electrode group 61 are formed using the extrusion-type coating head 10 described above. The ceramic paint 17a is applied thereon, and the ceramic paint 17a is dried by passing through a drier 95 to form a second ceramic paint layer 52 having a thickness t2 greater than the thickness t1 of the first ceramic paint layer 51. .
[0039]
<Step of forming second electrode group>
FIG. 9 is a front view showing a step after the step shown in FIG. In the present embodiment, as shown in FIGS. 1 and 9, a second electrode group 62 is printed on the second ceramic paint layer 52, and the second electrode group 62 is passed through a dryer 95. The second electrode group 62 is formed by drying.
[0040]
10 is a plan view showing a second electrode group 62 formed on the second ceramic paint layer 52, FIG. 11 is a partial front sectional view of FIG. 10, and FIG. 12 is a partially enlarged view of FIG. . 10 to 12, the second electrode group 62 is made of the same electrode material as the first electrode group 61 shown in FIGS. 5 to 7, and is spaced apart on the second ceramic paint layer 52. It is provided separately.
[0041]
In the present embodiment, the individual electrodes 211 to 251, 212 to 262, and 21 m to 26 m constituting the second electrode group 62 are formed so as to form m rows in the length direction of the second ceramic paint layer 52. The odd columns are provided with 5 rows of electrodes, and the even columns are provided with 6 rows of electrodes. The first digit of the reference number given to the electrode indicates the column to which the electrode belongs, and the second digit indicates the row to which the electrode belongs.
[0042]
In forming the second electrode group 62, print positioning can be performed based on information obtained by performing image processing on the first target marks a1 to d1 and the pitch mark e1 described above.
[0043]
Further, by forming the second ceramic paint layer 52 to be very thin, the second target marks a2, b2, c2, d2 and the pitch mark e2 can be confirmed through the second ceramic paint layer 52. it can. For this reason, the second target marks a2, b2, c2, d2 and the pitch mark e2 can be used for printing positioning when forming the second electrode group 62.
[0044]
In the present embodiment, the third target marks a3, b3, c3, d3 and the pitch mark e3 are printed simultaneously with the printing of the second electrode group 62. The third target marks a3, b3, c3, d3 and the pitch mark e3 can be used when positioning with high precision in a later laminating step or the like.
[0045]
<Step of forming third ceramic paint layer>
FIG. 13 and FIG. 14 are front cross-sectional views showing processes after the process shown in FIG. 9. As shown in FIGS. 1, 13, and 14, in forming the third ceramic coating layer 53, the second ceramic coating layer 52 and the second electrode are formed by using the above-described extrusion type coating head 10. On the group 62, the ceramic paint 17a is applied, and the ceramic paint 17a is dried by passing through a drier 95. The thickness t3 is the thickness t1 of the first ceramic paint layer 51 and the thickness of the second ceramic paint layer 52. The third ceramic paint layer 53 given by the difference (t2−t1) from t2 is formed. For example, the thickness t3 of the third ceramic paint layer 53 can be equal to the thickness t1 of the first ceramic paint layer 51.
[0046]
<Laminated sheet cutting process>
FIG. 15 is a front sectional view showing a step after the step shown in FIGS. 13 and 14. As shown in FIGS. 1 and 15, when cutting the laminated sheet 70, the first ceramic coating layer 51 is separated from the support 19, and then the first ceramic coating layer 51 and the second ceramic coating layer 51 are separated using a dicer 96. The third ceramic paint layer 52 and the third ceramic paint layer 53 are cut into predetermined dimensions.
[0047]
FIG. 16 is a plan view of the cut laminated sheet 70. As shown in FIG. 16, by forming the third ceramic paint layer 53 very thin, the third target mark a3, b3, c3, d3 and the pitch mark e3 can be seen through the third ceramic paint layer 53. Can be confirmed. For this reason, the third target marks a3, b3, c3, d3 and the pitch mark e3 can be used for positioning with high accuracy in a later laminating step or the like.
[0048]
<Lamination process of laminated sheet>
FIG. 17 is a front sectional view showing a step after the step shown in FIG. 15. As shown in FIG. 17, when laminating the laminated sheets 70, a plurality of laminated sheets 70 are sequentially laminated. Specifically, the plurality of laminated sheets 70 are sequentially arranged such that the third ceramic paint layer 53 included in one laminated sheet 70 is adjacent to the first ceramic paint layer 51 included in the other laminated sheet 70. To be laminated.
[0049]
At this time, each of the laminated sheets 70 is positioned with high accuracy by image processing using the third target marks a3, b3, c3, d3 and the pitch mark e3.
[0050]
In this embodiment, the protective layer 71 is formed on the uppermost layered sheet 70 and below the lowermost layered sheet 70. The protective layer 71 serves as an exterior for protecting the laminated sheet 70.
[0051]
<Process after obtaining the set number of layers>
FIG. 18 is a front sectional view showing a step after the step shown in FIG. 17, and FIG. 19 is a perspective view showing a step after the step shown in FIG. As shown in FIG. 18, the laminated sheet 70 and the protective layer 71 are hot pressed. Then, the laminated sheet 70 and the protective layer 71 that have been hot-pressed are cut to obtain a laminated chip shown in FIG.
[0052]
The finished product of the multilayer capacitor is obtained by subjecting the multilayer chip to a binder removal treatment under a predetermined temperature condition, firing, and forming a terminal electrode by baking. A method of removing the binder chip from the laminated chip, firing the laminated chip, and further baking the terminal electrode is well known.
[0053]
As described above, in the method for manufacturing a ceramic electronic component according to the present embodiment, the first ceramic coating layer 51 is formed by applying the ceramic coating 17 a on the support 19 and forming the first ceramic coating layer 51. A first electrode group 61 is formed on the first electrode group 61, a first ceramic coating layer 51, and a ceramic coating 17 a is applied on the first electrode group 61 to form a second ceramic coating layer 52. I do. According to this step, the ceramic paint constituting the second ceramic paint layer 52 is applied so as to fill the gap (recess) existing between the first electrode groups 61 due to its fluidity. For this reason, the adhesion of the second ceramic paint layer 52 to the first electrode group 61 is improved, and problems such as delamination, which have been a problem in the past, are less likely to occur.
[0054]
Next, a second electrode group 62 is formed on the second ceramic paint layer 52, and a ceramic paint 17a is applied on the second ceramic paint layer 52 and the second electrode group 62. , A third ceramic paint layer 53 is formed. According to this step, the ceramic paint constituting the third ceramic paint layer 53 is applied so as to fill the gap (recess) existing between the second electrode groups 62 due to its fluidity. For this reason, the adhesion of the third ceramic coating layer 53 to the second electrode group 62 is improved, and the problem of delamination, which has been a problem in the past, is less likely to occur.
[0055]
Thus, the first electrode group 61 is formed between the first ceramic paint layer 51 and the second ceramic paint layer 52, and the second ceramic paint layer 52 and the third ceramic paint layer 53 are formed. The laminated sheet 70 on which the second electrode group 62 is formed is formed on the support 19.
[0056]
Since the first ceramic paint layer 51 is formed by applying the ceramic paint 17a on the support 19, when the support 19 is separated, the surface facing the support 19 becomes flat.
[0057]
The third ceramic paint layer 53 is formed by applying the ceramic paint 17a on the second ceramic paint layer 52 and the second electrode group 62 without the electrode group formed on the surface. ing. Therefore, the surface can be flattened by applying the ceramic paint 17a by a known method, for example, an extrusion coating method, a doctor blade method, or the like.
[0058]
Thus, the laminated sheet 70 has a flat surface and no irregularities on the surface. For this reason, when a plurality of laminated sheets 70 are sequentially laminated, problems such as delamination, which have been a problem in the past, are less likely to occur.
[0059]
Further, since there is no unevenness on the surface of the plurality of laminated sheets 70, it is not necessary to perform hot pressing for each laminated sheet 70. Therefore, it is sufficient to apply a hot press after sequentially laminating the plurality of laminated sheets 70. Therefore, before laminating the plurality of laminated sheets 70, the first ceramic paint layer 51, the first electrode group 61, the second ceramic paint layer 52, the second electrode group 62, and the third ceramic paint layer Since it is not necessary to perform hot pressing on the layer 53, the number of times of hot pressing is reduced, and it is possible to easily and accurately manufacture a ceramic electronic component in a short time.
[0060]
Further, the laminated sheet 70 is not composed of a single ceramic paint layer (first to third ceramic paint layers 51 to 53), but is formed by sequentially laminating a plurality of ceramic paint layers. , The thickness increases. Therefore, even when the ceramic paint layers 51 to 53 become thin, handling becomes easy and peeling from the support 19 becomes easy. In addition, since the thickness of the entire laminated sheet 70 is increased and the strength is increased, the burden applied to the ceramic paint layers 51 to 53 and the electrode groups 61 and 62 during handling is reduced, and characteristic defects such as short circuits are reduced. .
[0061]
The thickness t2 of the second ceramic paint layer 52 is greater than the thickness t1 of the first ceramic paint layer 51, and the thickness t3 of the third ceramic paint layer 53 is greater than that of the first ceramic paint layer 51. It is given by the difference (t2−t1) between the thickness t1 and the thickness t2 of the second ceramic paint layer 52.
[0062]
Therefore, the sum (t1 + t3) of the thickness t1 of the first ceramic paint layer 51 and the thickness t3 of the third ceramic paint layer 53 becomes equal to the thickness t2 of the second ceramic paint layer 52.
[0063]
Therefore, in two adjacent laminated sheets 70, the first ceramic paint layer 51 included in the other laminated sheet 70 is adjacent to the third ceramic paint layer 53 included in the one laminated sheet 70 ( 17), when a plurality of laminated sheets 70 are sequentially laminated, the thickness t3 of the third ceramic paint layer 53 included in one laminated sheet 70 and the first ceramic paint included in the other laminated sheet 70 The sum (t1 + t3) of the thickness t1 of the layer 51 becomes equal to the thickness t2 of the second ceramic paint layer 52.
[0064]
For this reason, the paint layer thickness t2 generated between the first electrode group 61 and the second electrode group 62 opposed via the second ceramic paint layer 52 is the third ceramic paint layer 53 and the first ceramic Since the thickness is equal to the thickness (t1 + t3) of the paint layer generated between the first electrode group 61 and the second electrode group 62 that face each other via the paint layer 51, it is possible to manufacture a ceramic electronic component having stable characteristics. Become.
[0065]
For example, when the thickness t1 of the first ceramic paint layer 51 is equal to the thickness t3 of the third ceramic paint layer 53, the thickness t1 is included in one of the two laminated sheets 70 adjacent to each other. The first ceramic paint layer 51 included in the other laminated sheet 70 is adjacent to the first ceramic paint layer 51 included in the other laminated sheet 70, or the third ceramic paint layer 53 included in the one laminated sheet 70 is A plurality of laminated sheets 70 can be sequentially laminated so as to be adjacent to the third ceramic paint layer 53 included in the other laminated sheet 70. At this time, the sum (t1 + t1) of the thicknesses of the first ceramic paint layers 51 included in both the laminated sheets 70 or the sum (t3 + t3) of the thicknesses of the third ceramic paint layers 53 included in the both laminated sheets 70 is: It is equal to the thickness t2 of the second ceramic paint layer 52.
[0066]
For this reason, the paint layer thickness t2 generated between the first electrode group 61 and the second electrode group 62 opposed via the second ceramic paint layer 52 is equal to the first ceramic paint layer 51 or the third paint layer. The thickness of the paint layer (t1 + t1 or t3 + t3) generated between the first electrode group 61 and the second electrode group 62 which are opposed to each other via the ceramic paint layer 53 described above is equal to that of the ceramic electronic component having stable characteristics. It can be manufactured.
[0067]
FIG. 20 is a front cross-sectional view showing a manufacturing method of a comparative example, and FIG. 21 is a front cross-sectional view showing a laminated structure manufactured through the steps of FIG. The manufacturing method of this comparative example is the same as the manufacturing method disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 6-168840.
[0068]
In the manufacturing method of the comparative example, first, as shown in FIG. 20A, a ceramic green sheet 510 is formed on the support 19, an electrode group 610 is formed on the ceramic green sheet 510, and the electrode group 610 is formed. Then, the ceramic green sheet 510 on which is formed is cut. Next, as shown in FIGS. 20B and 20C, the cut ceramic green sheet 510 is hot-pressed by dies 92 and 93 having flat surfaces.
[0069]
Then, as shown in FIG. 20D, hot-pressed ceramic green sheets 510 are sequentially laminated to form a laminated structure 73. In addition, a protective layer 71 is formed on the upper and lower portions of the stacked structure 73 as necessary (see FIG. 21). This laminated structure is cut after hot pressing to form a laminated chip as shown in FIG.
[0070]
In the manufacturing method of the comparative example, as shown in FIGS. 20B and 20C, the ceramic green sheet 510 on which the electrode group 610 is formed is hot-pressed. Slight irregularities remain on the surface of the sheet 510. For this reason, as shown in FIG. 21, slight irregularities generated in the lower layer of the multilayer structure 73 are accumulated according to the number of layers, and large irregularities are generated in the uppermost layer. Therefore, in the laminated structure 73 manufactured by the manufacturing method of the comparative example, delamination occurs during firing.
[0071]
On the other hand, in the above-described method for manufacturing a ceramic electronic component according to the present embodiment, as shown in FIG. 17, the laminated sheet 70 (the laminated structure) does not have irregularities, so that delamination during firing is reduced. Be suppressed.
[0072]
FIG. 22 is a front sectional view showing another embodiment of the method for manufacturing a ceramic electronic component according to the present invention. In the figure, the same components as those shown in FIGS. 1 to 19 are denoted by the same reference numerals, and redundant description will be omitted.
[0073]
In the present embodiment, the process of forming the second ceramic paint layer and forming the second electrode group on the second ceramic paint layer is continuously and repeatedly performed a plurality of times. Specifically, as shown in FIG. 22, the ceramic paint 17a is further applied on the second ceramic paint layer 52 and the second electrode group 62 shown in FIG. The second ceramic paint layer 54 is formed, and another second electrode group 63 is formed on another second ceramic paint layer 54. Then, a third ceramic paint layer 53 is formed on another second ceramic paint layer 54 and another second electrode group 63 as in FIG.
[0074]
FIG. 23 is a front sectional view showing the laminated sheet manufactured through the process shown in FIG. As shown in FIG. 23, in the present embodiment, the laminated sheet 70 has a first electrode group 61 formed between a first ceramic paint layer 51 and a second ceramic paint layer 52, and a second ceramic sheet. A second electrode group 62 is formed between the paint layer 52 and another second ceramic paint layer 54, and another second electrode group 62 is formed between the other second ceramic paint layer 54 and the third ceramic paint layer 53. A second electrode group 63 is formed.
[0075]
According to the manufacturing method according to the present embodiment, similarly to the manufacturing method illustrated in FIGS. 1 to 19, the first electrode group 61, the second electrode group 62, and another second electrode group 63 are formed. Since the interval is t2 (= t1 + t3), it is possible to manufacture a ceramic electronic component having stable characteristics.
[0076]
As described above, the content of the present invention has been specifically described with reference to the preferred embodiments. However, it is obvious that those skilled in the art can adopt various modifications based on the basic technical idea and teaching of the present invention. It is.
[0077]
【The invention's effect】
As described above, according to the present invention, the following effects can be obtained.
(A) It is possible to provide a method for manufacturing a multilayer ceramic electronic component that can reduce delamination and the like generated during firing.
(B) It is possible to provide a manufacturing method capable of easily manufacturing a multilayer ceramic electronic component.
[Brief description of the drawings]
FIG. 1 is a process chart showing one embodiment of a method for manufacturing a ceramic electronic component according to the present invention.
FIG. 2 is a block diagram showing a method for manufacturing the ceramic electronic component shown in FIG.
3 is a front sectional view showing a step of forming a first ceramic paint layer shown in FIG. 2;
FIG. 4 is a plan view showing a step after the step shown in FIG. 3.
FIG. 5 is a front sectional view showing a step after the step shown in FIG. 4;
FIG. 6 is a plan view showing a first electrode group.
FIG. 7 is a partially enlarged view of FIG. 6;
FIG. 8 is a front sectional view showing a step after the step shown in FIG. 5;
FIG. 9 is a front view showing a step after the step shown in FIG. 8.
FIG. 10 is a plan view showing a second electrode group.
FIG. 11 is a partial front sectional view of FIG. 10;
FIG. 12 is a partially enlarged view of FIG. 10;
FIG. 13 is a front sectional view showing a step after the step shown in FIG. 9;
FIG. 14 is another front sectional view showing a step after the step shown in FIG. 9;
FIG. 15 is a front sectional view showing a step after the step shown in FIGS. 13 and 14;
FIG. 16 is a plan view of a laminated sheet.
FIG. 17 is a front sectional view showing a step after the step shown in FIG. 15;
FIG. 18 is a front sectional view showing a step after the step shown in FIG. 17;
FIG. 19 is a perspective view showing a step after the step shown in FIG. 18.
FIG. 20 is a front sectional view illustrating a manufacturing method of a comparative example.
FIG. 21 is a front sectional view showing a laminated structure manufactured through the steps of FIG. 20;
FIG. 22 is a front sectional view showing another embodiment of the method for manufacturing a ceramic electronic component according to the present invention.
FIG. 23 is a front sectional view showing a laminated sheet manufactured through the process shown in FIG. 22.
[Explanation of symbols]
1 Base part
70 laminated sheet
51 first ceramic paint layer
52 Second Ceramic Paint Layer
53 Third Ceramic Paint Layer
61 First electrode group
62 Second electrode group
63 Third electrode group

Claims (6)

A method for manufacturing a ceramic electronic component,
Forming a first ceramic paint layer on the support,
Forming a first electrode group on the first ceramic paint layer;
Applying a ceramic paint on the first ceramic paint layer and the first electrode group to form a second ceramic paint layer thicker than the first ceramic paint layer;
Forming a second electrode group on the second ceramic paint layer;
A ceramic paint is applied on the second ceramic paint layer and the second electrode group, and the thickness of the second ceramic paint layer is equal to the thickness of the first ceramic paint layer and the thickness of the second ceramic paint layer. Forming a third ceramic paint layer given by the difference;
The first ceramic paint layer is peeled from the support to form a laminated sheet,
A method for manufacturing a ceramic electronic component, comprising a step of sequentially laminating a plurality of the laminated sheets. The method for manufacturing a ceramic electronic component according to claim 1, further comprising a step of forming the thickness of the first ceramic paint layer to be equal to the thickness of the third ceramic paint layer. Manufacturing method. It is a manufacturing method of the ceramic electronic component as described in Claim 1 or 2, Comprising:
Sequentially laminating a plurality of the laminated sheets so that the third ceramic paint layer included in one laminated sheet is adjacent to the first ceramic paint layer included in another laminated sheet. Manufacturing method for ceramic electronic components including: It is a manufacturing method of the ceramic electronic component as described in any one of Claims 1 thru | or 3, Comprising:
A method of manufacturing a ceramic electronic component, comprising: after the first ceramic paint layer is peeled off from the support to form the laminated sheet, before sequentially laminating a plurality of the laminated sheets, cutting the laminated sheet. . The method for manufacturing a ceramic electronic component according to claim 1, further comprising: after laminating a plurality of the laminated sheets, performing a hot press in a laminating direction of the laminated sheets. Manufacturing method. A method for manufacturing a ceramic electronic component according to any one of claims 1 to 5,
Forming a second ceramic coating layer and forming the second electrode group on the second ceramic coating layer continuously and repeatedly a plurality of times; .

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