CN112708854A - Vacuum coating structure for large-area brazing - Google Patents
Vacuum coating structure for large-area brazing Download PDFInfo
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- CN112708854A CN112708854A CN202011512285.9A CN202011512285A CN112708854A CN 112708854 A CN112708854 A CN 112708854A CN 202011512285 A CN202011512285 A CN 202011512285A CN 112708854 A CN112708854 A CN 112708854A
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- 238000005219 brazing Methods 0.000 title claims abstract description 25
- 238000001771 vacuum deposition Methods 0.000 title claims abstract description 25
- 239000010410 layer Substances 0.000 claims abstract description 157
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000009736 wetting Methods 0.000 claims abstract description 27
- 238000007747 plating Methods 0.000 claims abstract description 25
- 230000007704 transition Effects 0.000 claims abstract description 17
- 238000000576 coating method Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 15
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 13
- 239000000956 alloy Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 239000011247 coating layer Substances 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 5
- 150000002739 metals Chemical group 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 230000008595 infiltration Effects 0.000 claims description 9
- 238000001764 infiltration Methods 0.000 claims description 9
- 238000007733 ion plating Methods 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 7
- 239000004576 sand Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000007888 film coating Substances 0.000 claims description 5
- 238000009501 film coating Methods 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000001020 plasma etching Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000003672 processing method Methods 0.000 claims description 3
- 238000003892 spreading Methods 0.000 claims description 3
- 230000007480 spreading Effects 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 11
- 239000001257 hydrogen Substances 0.000 abstract description 11
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 11
- 238000013329 compounding Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 238000003466 welding Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000006356 dehydrogenation reaction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
The invention discloses a vacuum coating structure for large-area brazing, which comprises a substrate, wherein a brazing coating layer is arranged on the substrate and comprises a bonding layer, a weldable layer and a wetting layer, the bonding layer is arranged on the surface to be plated of the substrate, the weldable layer is arranged on one side, away from the substrate, of the bonding layer, the wetting layer is arranged on one side, away from the bonding layer, of the weldable layer, transition layers are arranged among the bonding layer, the weldable layer and the wetting layer, and the transition layers are formed by co-plating adjacent metals; the bonding layer is used for bonding with a substrate and forming an alloy or a compound with a substrate material; the invention can meet the requirement of large-area solderability by compounding different functional film layers and using a vacuum coating layer which is much thinner than an electroplated layer, has relatively low cost, does not contact with water in the coating process, and does not generate hydrogen embrittlement.
Description
Technical Field
The invention belongs to the technical field of vacuum coating processes, and particularly relates to a vacuum coating structure for large-area brazing.
Background
Common brazable materials are gold, silver, copper, nickel and the like, but the surfaces of ceramics, plastics, aluminum alloys, iron alloys, molybdenum alloys and the like cannot be brazed, but the materials are frequently used in microwave devices as carriers for carrying large-area grounding and large-area heat dissipation of circuit boards through large-area welding. In order to make the surfaces of these materials have solderability, a layer of solderability metal is usually plated on the surface of the conductive non-solderability material; plating a conductive layer on the surface of the non-braze welding material without conductivity by a chemical plating process, and plating a layer of braze welding metal; although metals such as aluminum and the like are conductive, the bonding force of a plating layer directly plated does not meet the requirement, and generally, chemical plating is used for priming, and then a layer of brazeable metal is plated. Electroplating and chemical plating processes are strictly controlled due to pollution discharge, and meanwhile, electroplating and chemical plating are carried out in aqueous solution, hydrogen is easily generated and adsorbed in materials, so that the materials are in danger of gas release and hydrogen embrittlement in vacuum, and strict dehydrogenation treatment and inspection are generally required by aerospace departments in order to eliminate the influence of adsorbed hydrogen.
Vacuum coating is carried out in vacuum, water is not contacted in the whole process, pollution discharge is avoided, hydrogen is not generated, hydrogen is not adsorbed, and compared with electroplating, links such as sewage treatment, dehydrogenation treatment and inspection are omitted, so that the cost is lower, and the reliability is higher. However, the common vacuum coating process can not meet the requirements, and the problems of insufficient binding force, poor welding caused by easy 'gold eating' and bottom penetration of a single coating during brazing and the like mainly exist.
Disclosure of Invention
The invention aims to provide a vacuum coating structure for large-area brazing, so that a novel coating with good bonding force, satisfactory brazing performance, no hydrogen generation or adsorption in the process, no pollution and low cost is obtained on the surface of a non-brazeable material.
The purpose of the invention can be realized by the following technical scheme:
a vacuum coating structure for large-area brazing comprises a base body, wherein a brazing coating layer is arranged on the base body and comprises a bonding layer, a weldable layer and an infiltration layer, the bonding layer is arranged on the surface to be plated of the base body, the weldable layer is arranged on one side, away from the base body, of the bonding layer, the infiltration layer is arranged on one side, away from the bonding layer, of the weldable layer, transition layers are arranged among the bonding layer, the weldable layer and the infiltration layer, and the transition layers are formed by co-plating adjacent metals; the bonding layer is used for bonding with a substrate and forming an alloy or a compound with a substrate material; the weldable layer is used for being combined with the solder during brazing, and the wetting layer is used for spreading the solder and melting into the solder during brazing.
As a further scheme of the invention: the bonding layer is made of chromium, titanium and alloy thereof without solderability.
As a further scheme of the invention: the solderable layer is selected from nickel, copper and alloys thereof.
As a further scheme of the invention: the infiltration layer is made of silver and silver alloy.
As a further scheme of the invention: the processing method of the vacuum coating structure specifically comprises the following steps:
the method comprises the following steps: film coating pretreatment: spraying fine sand on the surface to be plated of the substrate to remove surface attached particles and an oxide layer, wherein the surface has the requirement of smoothness for prohibiting sand spraying, and the metal surface is subjected to chemical polishing and rust removal treatment;
step two: grease removal: ultrasonically cleaning the surface to be plated of the substrate by using alcohol to remove oil;
step three: plasma etching: bombarding the surface to be plated of the substrate by using plasma, removing a surface layer and exposing a fresh layer of the substrate;
step four: vacuum plating a bonding layer, wherein pure ion plating, multi-arc ion plating or magnetron sputtering ion plating is selected according to the property of a material to be plated;
step five: vacuum plating of a solderable layer: co-plating the bonding layer and the earlier stage of film plating for 0-5 minutes to form a transition layer between the bonding layer and the weldable layer;
step six: vacuum plating of a wetting layer: the infiltration layer and the weldable layer are co-plated for 0-5 minutes in the earlier stage of film coating to form a transition layer between the weldable layer and the infiltration layer.
As a further scheme of the invention: the thickness of the coating film of the bonding layer is 0.1-1 um.
As a further scheme of the invention: the thickness of the coating film of the weldable layer is 1-4 um.
As a further scheme of the invention: the thickness of the coating film of the infiltration layer is 0.1-1 um.
The invention has the beneficial effects that:
1. by compounding different functional film layers, the requirement of large-area solderability can be met by using a vacuum coating layer which is much thinner than an electroplated layer, and the cost is relatively low.
2. The solderability coating film is formed in vacuum, no pollution emission is generated in the production process, no hydrogen is generated and adsorbed, no hydrogen embrittlement and dehydrogenation are generated, the reliability is higher than that of electroplating, and the method is particularly suitable for manufacturing aerospace products.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
in the figure: 1. a substrate; 2. a bonding layer; 3. a weldable layer; 4. a wetting layer; 5. and a transition layer.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a vacuum coating structure for large-area brazing comprises a substrate 1, wherein a brazeable coating layer is arranged on the substrate 1, and is characterized in that the brazeable coating layer comprises a bonding layer 2, a weldable layer 3 and a wetting layer 4, the bonding layer 2 is arranged on the surface to be plated of the substrate 1, the weldable layer 3 is arranged on one side of the bonding layer 2, which is far away from the substrate 1, the wetting layer 4 is arranged on one side of the weldable layer 3, which is far away from the bonding layer 2, transition layers 5 are arranged among the bonding layer 2, the weldable layer 3 and the wetting layer 4, and the transition layers 5 are formed by co-plating adjacent metals; the bonding layer 2 is used for bonding with the substrate 1 and forming alloy or compound with the substrate 1; the weldable layer 3 is used for combining with the solder during soldering, and the wetting layer 4 is used for spreading the solder and melting into the solder during soldering.
The bonding layer 2 is made of chromium, titanium and alloy thereof without solderability, has good bonding force with the matrix material, and is beneficial to forming alloy or compound with the matrix material.
The weldable layer 3 is made of nickel, copper and alloys thereof, has solderability, can not be 'gold-eaten' to penetrate through the bottom, has poor binding force with body materials but good binding force with a binding layer, and can also improve the binding force when being co-plated with binding layer metal as a transition layer. Fresh surfaces of nickel, copper and alloys thereof have good wettability to solder, but when left in air, the surfaces are easily oxidized, so that wettability is reduced, and empty soldering and cold soldering are easily formed during large-area soldering.
The wetting layer 4 is made of silver and silver alloy, the wetting layer has good wettability with solder, the wettability cannot be influenced even if the wetting layer is placed in the air for a long time, but the wetting layer is easy to 'eat gold' and penetrate through the bottom, the weldable layer also has weldability, so the welding strength cannot be influenced even if the bottom penetrates through the bottom, and the wetting layer and the weldable layer are co-plated to be used as a transition layer, so that the interface between the two layers is blurred, and the welding strength can also be improved.
The processing method of the vacuum coating structure specifically comprises the following steps:
the method comprises the following steps: film coating pretreatment: fine sand is sprayed on the surface to be plated of the matrix 1 to remove surface attached particles and an oxide layer, sand spraying is prohibited when the surface has the requirement of smoothness, and chemical polishing and rust removal treatment are selected for the metal surface;
step two: grease removal: cleaning the surface to be plated of the substrate 1 by using alcohol ultrasonic waves to remove oil, and removing the excessive oil by using other methods in advance;
step three: plasma etching: bombarding the surface to be plated of the substrate 1 by using plasma, removing a surface layer and exposing a fresh layer of the substrate;
step four: the vacuum plating bonding layer 2 is selected from pure ion plating, multi-arc ion plating or magnetron sputtering ion plating according to the property of the material to be plated;
step five: vacuum plating of the solderable layer 3: co-plating the bonding layer and the earlier stage of film plating for 0-5 minutes to form a transition layer 5 between the bonding layer 2 and the weldable layer 3;
step six: vacuum plating of a wetting layer 4: the wetting layer 4 and the weldable layer are co-plated for 0-5 minutes in the earlier stage of coating to form a transition layer 5 between the weldable layer 3 and the wetting layer 4.
The thickness of the coating film of the bonding layer 2 is 0.1-1 um.
The thickness of the coating film of the weldable layer 3 is 1-4 um.
The thickness of the coating film of the wetting layer 4 is 0.1-1 um.
The combined layer 2, the weldable layer 3 and the wetting layer 4 have different functions respectively, the single-layer coating film can not realize the welding function, the three layers are combined to well meet the requirement of brazeability, the vacuum coating film layer which is much thinner than an electroplated layer can meet the requirement of large-area brazeability through the composition of different functional film layers, the cost is relatively low, the brazeability coating film is formed in vacuum, no pollution emission exists in the production process, no hydrogen is generated and adsorbed, no hydrogen embrittlement or dehydrogenation is generated, the reliability is higher than that of electroplating, and the method is particularly suitable for manufacturing aerospace products.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (8)
1. A vacuum coating structure for large-area brazing comprises a base body (1), wherein a brazing coating layer is arranged on the base body (1), and the vacuum coating structure is characterized in that the brazing coating layer comprises a bonding layer (2), a weldable layer (3) and a wetting layer (4), the bonding layer (2) is arranged on the surface to be plated of the base body (1), the weldable layer (3) is arranged on one side, away from the base body (1), of the bonding layer (2), the wetting layer (4) is arranged on one side, away from the bonding layer (2), of the weldable layer (3), transition layers (5) are arranged among the bonding layer (2), the weldable layer (3) and the wetting layer (4), and the transition layers (5) are formed by co-plating adjacent metals; the bonding layer (2) is used for bonding with the substrate (1) and forming alloy or compound with the substrate (1) material; the weldable layer (3) is used for being combined with the solder during brazing, and the wetting layer (4) is used for spreading the solder and melting into the solder during brazing.
2. The vacuum coating structure for large area brazing according to claim 1, wherein the bonding layer (2) is made of chromium, titanium or their alloys without brazeability.
3. Vacuum coating structure for large area brazing according to claim 1, characterized in that the solderable layer (3) is selected from nickel, copper and their alloys.
4. The vacuum coating structure for large area brazing according to claim 1, wherein the wetting layer (4) is made of silver or its alloy.
5. The vacuum coating structure for large area brazing according to claim 1, wherein the processing method of the vacuum coating structure comprises the following steps:
the method comprises the following steps: film coating pretreatment: fine sand is sprayed on the surface to be plated of the substrate (1) to remove surface attached particles and an oxide layer, sand spraying is prohibited when the surface has the requirement of smoothness, and chemical polishing and rust removal treatment are selected for the metal surface;
step two: grease removal: cleaning the surface to be plated of the substrate (1) by using alcohol ultrasonic waves to remove oil;
step three: plasma etching: bombarding the surface to be plated of the substrate (1) by using plasma, removing a surface layer and exposing a fresh layer of the substrate;
step four: the vacuum plating bonding layer (2) is selected from pure ion plating, multi-arc ion plating or magnetron sputtering ion plating according to the property of the material to be plated;
step five: vacuum-plating a solderable layer (3): the pre-plating stage and the bonding layer are co-plated for 0-5 minutes to form a transition layer (5) between the bonding layer (2) and the weldable layer (3);
step six: vacuum plating wetting layer (4): the infiltration layer (4) and the weldable layer are co-plated for 0-5 minutes in the earlier stage of film coating to form a transition layer (5) between the weldable layer (3) and the infiltration layer (4).
6. A vacuum coating structure for large area brazing according to claim 5, wherein the bonding layer (2) has a coating thickness of 0.1-1 um.
7. The vacuum coating structure for large area brazing according to claim 5, wherein the coating thickness of the weldable layer (3) is 1-4 um.
8. The vacuum coating structure for large area brazing according to claim 5, wherein the thickness of the coating film of the wetting layer (4) is 0.1-1 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011512285.9A CN112708854A (en) | 2020-12-19 | 2020-12-19 | Vacuum coating structure for large-area brazing |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011512285.9A CN112708854A (en) | 2020-12-19 | 2020-12-19 | Vacuum coating structure for large-area brazing |
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| CN112708854A true CN112708854A (en) | 2021-04-27 |
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| CN202011512285.9A Pending CN112708854A (en) | 2020-12-19 | 2020-12-19 | Vacuum coating structure for large-area brazing |
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| US20110180389A1 (en) * | 2008-04-28 | 2011-07-28 | Rainer Cremer | Apparatus and method for pretreating and coating bodies |
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