CN112705793B - Method for multi-wire cutting of samarium cobalt magnet by using diamond wire - Google Patents
Method for multi-wire cutting of samarium cobalt magnet by using diamond wire Download PDFInfo
- Publication number
- CN112705793B CN112705793B CN202011486995.9A CN202011486995A CN112705793B CN 112705793 B CN112705793 B CN 112705793B CN 202011486995 A CN202011486995 A CN 202011486995A CN 112705793 B CN112705793 B CN 112705793B
- Authority
- CN
- China
- Prior art keywords
- wire
- samarium cobalt
- cutting
- cut
- diamond wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D79/00—Methods, machines, or devices not covered elsewhere, for working metal by removal of material
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a method for multi-wire cutting of samarium cobalt magnet by using a diamond wire, which comprises the following steps: step 1, fixing a samarium cobalt magnetic material to be cut on a marble plate; step 2, fixing the marble plate bonded with the samarium cobalt magnetic material to be cut obtained in the step 1 on a workbench of the diamond wire multi-wire cutting machine; the workbench is lifted to enable the initial cutting surface of the samarium cobalt magnetic material to be cut to be close to the diamond wire net, and then the cutting program is started to cut. At first will wait to cut samarium cobalt magnetism material and fix on the marble board, then fix the marble board on multi-wire saw's workstation, through the scope of selecting important technological parameter of influence and the corresponding technological parameter of adjustment of pertinence for magnetism material cutting yield is high, and the difficult broken string of diamond wire can guarantee the stable of cutting process and go on.
Description
Technical Field
The invention relates to the technical field of cutting, in particular to a method for multi-wire cutting of samarium cobalt magnetic materials by using a diamond wire.
Background
The multi-wire cutting technology is widely applied to cutting of hard and brittle materials such as semiconductor wafers, optical glass, sintered magnets and the like, has the characteristics of less inter-wafer cutting loss, shallow processing surface damage layer, small roughness, high production efficiency and the like, and the processing size range is generally 0-5 mm. At present, the multi-wire cutting technology has two modes for processing magnetic materials: one is mortar line processing, namely, a blank is ground by using copper-plated steel wire to adhere mortar, and the mortar is a mixture of silicon carbide micro powder (1000 meshes) and cutting oil; one is diamond wire processing, which uses a gold plated diamond wire to directly process the blank. Compared with the two processing modes, the diamond wire has the following three obvious advantages: (1) the cost is low. The mortar of the mortar line needs to be replaced regularly, and the cost of replacement once is about 2000-3000 yuan. And the diamond wire is processed by utilizing the diamond on the surface of the wire, so that the problem of mortar is solved, and the auxiliary material cost is saved. (2) The efficiency is high. The processing speed of the diamond wire can reach 1.5 times of that of a mortar wire, and the processing efficiency is high. (3) Is more environment-friendly. The replaced mortar in the mortar line contains cutting oil, silicon carbide powder and magnetic mud, which can pollute the environment and cannot be discharged at will.
Samarium cobalt magnetic material is hard and brittle, the processing difficulty is high, especially when cutting into thin slices, the diamond wire bears larger pulling force, and the wire is easy to break; meanwhile, as the material is brittle, when the stress born in the product exceeds the bearing capacity of the product in the processing process of the product, the product can crack, so that the product cannot be cut and formed, and the processing fails. The multi-line processed product has small size, and if the processed workpiece is bonded with defects and falls off, the product falls off due to insufficient bonding force after being processed into the product. The product falling off can further cause filament breakage and damage to rollers (rollers), and all processed products are scrapped, with serious consequences.
Therefore, how to provide a method for multi-wire cutting of the samarium cobalt magnet by the diamond wire has very important significance in that the diamond wire is not easy to break and the yield of the samarium cobalt magnet is higher.
Disclosure of Invention
The invention aims to: the method for multi-wire cutting of the samarium-cobalt magnetic material by the diamond wire is high in yield, the diamond wire is not prone to breakage, and the stable operation of the cutting process can be guaranteed.
In order to achieve the purpose, the invention adopts the technical scheme that:
a method for multi-wire cutting of samarium cobalt magnet by using a diamond wire comprises the following steps:
step 1, fixing samarium cobalt magnetic materials to be cut on a marble plate;
step 2, fixing the marble plate bonded with the samarium cobalt magnetic material to be cut obtained in the step 1 on a workbench of the diamond wire multi-wire cutting machine; the workbench is lifted to enable the initial cutting surface of the samarium cobalt magnetic material to be cut to be close to the diamond wire net, and then a cutting program is started to cut;
wherein, the technological parameters set in the cutting process are as follows: the tension of the coiling and uncoiling line is 24-34N, the coiling and uncoiling linear speed of the diamond line is 650-800m/min, the coiling and uncoiling linear quantity of the diamond line is 300-500 m/cycle, and the lifting speed of the workbench is 0.04-0.2 mm/min.
The invention discloses a method for multi-wire cutting of samarium cobalt magnetic materials by a diamond wire, which comprises the steps of firstly bonding the samarium cobalt magnetic materials to be cut on a marble plate by using special glue, then fixing the marble plate on a workbench of a multi-wire cutting machine, finding out that whether the diamond wire is broken, whether the magnetic materials are cracked and the yield are closely related to a plurality of process parameters through a large amount of experimental researches of an inventor, and ensuring the qualified cutting function and the lower wire breakage rate of the diamond wire by selecting important influence process parameters and adjusting the range of the corresponding process parameters in a targeted manner, so that the yield of the brittle and hard samarium cobalt magnetic materials to be cut is high, the wafer cutting can be stably and completely finished, and the qualified cutting function and the lower wire breakage rate of the diamond wire can be ensured.
The inventor finally determines several important influence parameters including the tension of a winding and unwinding line, the winding and unwinding line speed, the winding and unwinding amount of a diamond wire and the ascending speed of a workbench and determines a proper technological parameter range under the synergistic effect of several technological parameters.
Further, in the step 1, the density of the samarium cobalt magnet to be cut is 8.1-8.5 multiplied by 103kg/m3, and the Vickers hardness is 400-600 HV.
Further, in step 1, the samarium cobalt magnet that is ready to be cut is a sintered samarium cobalt magnet.
Further, in step 1, the samarium cobalt magnet to be cut is obtained by grinding the shape, cutting the shape or size of the samarium cobalt magnet by a grinding machine.
Further, in the step 1, the samarium cobalt magnetic material to be cut is bonded on the marble plate by using glue.
Further, in the step 1, the glue is a special 502 instant glue. Further, in the step 1, the tensile strength of the glue is more than or equal to 230kg/cm2The shear strength is more than or equal to 23kg/cm2. Preferably, the tensile strength of the glue is 230-300 kg/cm2The shear strength is 23-30 kg/cm2. The tensile strength and the shear strength of glue also have direct relation with the success of cutting, and when the adhesion of glue was lower, the phenomenon that the samarium cobalt magnetism material of waiting to cut drops and the diamond wire fracture had appeared in the cutting process, and when the adhesion of glue was too high, the samarium cobalt magnetism material that can appear to cut and accomplish was difficult to take off from the marble slab, the degree of difficulty of greatly increased technology.
Further, in the step 1, the surface of the marble plate is subjected to sand blasting. The marble plate that has done sand blasting can improve the roughness on marble plate surface, effectively improves the glue and bonds the stability of waiting to cut samarium cobalt magnetism material.
Further, in the step 1, the thickness of the marble slab is 15mm to 20 mm.
Further, in the step 2, the tension precision of the diamond wire multi-wire cutting machine is less than or equal to 0.5N. Through a large amount of experimental researches of the inventor, the cutting force of the diamond wire is large, the wire is easy to break when the tension control precision is more than 0.5N, and the control difficulty is large.
Further, in the step 2, the diameter of the diamond wire is 20 to 25 wires.
Further, in the step 2, the linear winding and unwinding speed of the diamond wire is 650-700 m/min. Through a large number of experimental researches of the inventor, the wire coiling and uncoiling speed of the diamond wire is closely related to the cutting effect when other process parameters are met within the range of the diamond wire coiling and uncoiling device, and the samarium cobalt magnet is hard, so that the phenomenon of immobility can occur when the coiling and uncoiling linear speed is too low, but the cost is wasted and the operation difficulty is improved when the coiling and uncoiling linear speed is too high. Meanwhile, researches find that the wire take-up and pay-off speed of the diamond wire has a direct relation with the yield of the samarium-cobalt magnetic material, and due to the fact that the samarium-cobalt magnetic material is brittle, the product cracking rate or the unformed rate are improved due to the fact that the wire take-up and pay-off speed is too high or too low in the cutting process of the diamond wire, and processing failure is caused.
Further, in the step 2, the wire retracting amount of the diamond wire is 400-500 m/cycle. Through a large number of experimental researches of the inventor, the wire coiling and uncoiling amount of the diamond wire and the cutting effect have a great influence relationship in each circulation process when other process parameters are met within the range of the diamond wire cutting device, the diamond wire cutting device is not an influence factor which can be easily thought by a person in the field, the phenomenon of cutting can occur when the amount is too low due to the fact that the samarium cobalt magnetic material is hard, and the phenomenon of breakage of the diamond wire can occur easily when the wire coiling and uncoiling amount is too high. Meanwhile, researches find that the wire winding and unwinding amount of the diamond wire has a direct relation with the yield of the samarium cobalt magnetic material, and due to the fact that the samarium cobalt magnetic material is brittle, the cracking rate or the unformed rate of a product are improved when the wire winding and unwinding amount is too large or too small in the cutting process of the diamond wire, and processing failure is caused.
Furthermore, the lifting speed of the worktable in the step 2 is 0.04-0.15 mm/min. Research finds that the speed that the workstation rises has direct relation with the efficiency of cutting the product, also is relevant with the power that produces when samarium cobalt magnetism material and diamond wire contact simultaneously, and the rising speed is too slow, can reduce production efficiency, but has some guarantee to the stability of diamond wire, and the rising speed is too fast, though can improve production efficiency to a certain extent, nevertheless leads to the fact diamond wire fracture very fast very easily for the cutting can't be gone on, causes the cost to rise. Preferably, the lifting speed of the worktable in the step 2 is 0.06-0.12 mm/min.
Further, in the step 2, the cutting thickness of the samarium cobalt magnet is less than 1.5 mm. Preferably, in the step 2, the cut thickness of the samarium cobalt magnet is 1mm or less. The cutting process provided by the invention can stably cut the samarium cobalt magnetic material to be cut into samarium cobalt magnetic material sheets with the thickness of less than 1mm, and the yield can reach more than 99.5%.
Further, in the step 2, when the diamond wire is cut to be 3-5 mm below the surface of the marble, the machine is stopped to finish cutting.
Further, the method also comprises the step 3: and standing the cut samarium cobalt magnetic material and the marble in a sodium hydroxide solution at the temperature of between 90 and 100 ℃, and taking out the samarium cobalt magnetic sheet after the bonded samarium cobalt magnetic sheet is separated from the marble to finish the processing.
Further, the mass concentration of the sodium hydroxide solution is 10-20%.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. through a large number of experimental researches of the inventor, the invention discovers that whether the diamond wire is broken, whether the magnetic material is cracked and the yield is closely related to various process parameters, and by selecting the range of important process parameters influencing the process parameters and adjusting the corresponding process parameters in a targeted manner, the yield of the brittle and hard samarium cobalt magnetic material to be cut is high, the slice cutting can be stably and completely completed, and meanwhile, the qualified cutting function and the lower wire breakage rate of the diamond wire can be ensured.
2. The method for multi-wire cutting of the samarium cobalt magnetic material by the diamond wire is successfully researched, the yield of the magnetic material is high, the diamond wire is not easy to break, the stable operation of the cutting process can be ensured, the cutting cost of the samarium cobalt magnetic material is effectively reduced, the method is environment-friendly and easy to operate, and the method is beneficial to the large-scale industrial popularization.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1
A method for multi-wire cutting of samarium cobalt magnet by using a diamond wire comprises the following steps:
step S1, grinding the sintered samarium cobalt magnetic material blank into a required shape by using a grinding machine, and cutting the sintered samarium cobalt magnetic material blank into the to-be-cut samarium cobalt magnetic material with the length of 60mm, the height of 60mm and the width of 30mm by using wire cutting, wherein the intrinsic coercive force of the samarium cobalt magnetic material is 1450KA/m, and the maximum magnetic energy product is 165KJ/m3The remanence temperature water absorption is-0.065%/deg.C, the maximum working temperature is 250 deg.C, the Curie point is 700 deg.C, and the density is 8.2 × 103Kg/m3Wechsler hardness 450 Hv.
Step S2, adhering the samarium cobalt magnetic material to be cut obtained in the step S1 on a marble plate with the thickness of 15mm by using glue, wherein the glue is parallel to the diamond wire in the width direction of 30mm, the surface of the marble plate is subjected to sand blasting, and the tensile strength of the used glue is 250kg/cm2Shear strength of 25kg/cm2；
S3, selecting a diamond wire multi-wire cutting machine with the tension precision of 0.3N, wherein the diameter of the diamond wire is 20 wires, and fixing the marble plate bonded with the samarium cobalt magnetic material to be cut, obtained in the step S2, on a workbench of the diamond wire multi-wire cutting machine; lifting the workbench to enable the initial cutting surface of the samarium cobalt magnetic material to be cut to be close to the diamond wire net, starting a cutting program to cut, and stopping the machine to finish cutting when the diamond wire is cut to be 5mm below the surface of the marble;
wherein, the technological parameters set in the cutting process are as follows: the tension of the coiling and uncoiling line is 24N, the coiling and uncoiling linear speed of the diamond wire is 650m/min, the coiling and uncoiling amount of the diamond wire is 400 m/cycle, and the ascending speed of the workbench is 0.1 mm/min;
by adopting the process method and the set process parameters, the cutting thickness is 0.5mm, the diamond wire breakage frequency is 0 time and the qualified finished product rate is 99.5% when the diamond wire is continuously cut and produced 24 hours a day in one month, wherein the qualified finished product means that the cut samarium cobalt magnetic material sheet is not cracked and the product is complete.
Example 3
A method for multi-wire cutting of samarium cobalt magnet by using a diamond wire comprises the following steps:
step S1, grinding the sintered samarium cobalt magnetic material blank into a required shape by using a grinding machine, and cutting the sintered samarium cobalt magnetic material blank into the to-be-cut samarium cobalt magnetic material with the length of 55mm, the height of 55mm and the width of 25mm by using wire cutting, wherein the intrinsic coercive force of the samarium cobalt magnetic material is 1592KA/m, and the maximum magnetic energy product is 255KJ/m3The remanence temperature is-0.04%/deg.C, the maximum working temperature is 350 deg.C, the Curie point is 820 deg.C, and the density is 8.4 × 103Kg/m3Wechsler hardness 600 Hv.
Step S2, bonding the samarium cobalt magnetic material to be cut obtained in the step S1 on a marble plate with the thickness of 20mm by using glue, wherein the glue is parallel to a diamond wire in the width direction of 25mm, the surface of the marble plate is subjected to sand blasting treatment, and the tensile strength of the used glue is 230kg/cm2Shear strength of 23kg/cm2；
S3, selecting a diamond wire multi-wire cutting machine with the tension precision of 0.5N, wherein the diameter of the diamond wire is 22 wires, and fixing the marble plate bonded with the samarium cobalt magnetic material to be cut, obtained in the step S2, on a workbench of the diamond wire multi-wire cutting machine; the workbench is lifted to enable the initial cutting surface of the samarium cobalt magnetic material to be cut to be close to the diamond wire net, then a cutting program is started to cut, and when the diamond wire is cut to be 3mm below the surface of the marble, the machine is stopped to finish cutting;
wherein, the technological parameters set in the cutting process are as follows: the tension of the wire is 34N, the wire drawing and releasing speed of the diamond wire is 800m/min, the wire drawing and releasing quantity of the diamond wire is 500 m/cycle, and the lifting speed of the workbench is 0.04 mm/min.
And step S4, standing the samarium cobalt magnetic material and the marble cut in the step S3 in a sodium hydroxide solution with the mass concentration of 15% at 95 ℃, and taking out the samarium cobalt magnetic sheet after the bonded samarium cobalt magnetic sheet is separated from the marble to finish the processing.
By adopting the process method and the set process parameters, the cutting thickness is 0.7mm, the diamond wire breakage frequency is 1 time and the qualified finished product rate is 99.3% when the diamond wire is continuously cut and produced 24 hours a day in one month, wherein the qualified finished product means that the cut samarium cobalt magnetic material sheet is not cracked and the product is complete.
Example 4
A method for multi-wire cutting of samarium cobalt magnet by using a diamond wire comprises the following steps:
step S1, grinding the sintered samarium cobalt magnetic material blank into a required shape by using a grinding machine, and cutting the sintered samarium cobalt magnetic material blank into the to-be-cut samarium cobalt magnetic material with the length of 60mm, the height of 50mm and the width of 22mm by using wire cutting, wherein the intrinsic coercive force of the samarium cobalt magnetic material is 1605KA/m, and the maximum magnetic energy product is 228KJ/m3The remanence temperature is-0.041%/deg.C for water absorption, 350 deg.C for maximum working temperature, 800 deg.C for Curie point, and 8.3 × 10 for density3Kg/m3Wechsler hardness 500 Hv.
Step S2, adhering the samarium cobalt magnetic material to be cut obtained in the step S1 on a marble plate with the thickness of 18mm by using glue, wherein the glue is parallel to the diamond wire in the direction of 22mm width, the surface of the marble plate is subjected to sand blasting, and the tensile strength of the used glue is 300kg/cm2Shear strength of 30kg/cm2；
S3, selecting a diamond wire multi-wire cutting machine with the tension precision of 0.4N, wherein the diameter of a diamond wire is 25 wires, and fixing the marble plate bonded with the samarium cobalt magnetic material to be cut, obtained in the step S2, on a workbench of the diamond wire multi-wire cutting machine; the workbench is lifted to enable the initial cutting surface of the samarium cobalt magnetic material to be cut to be close to the diamond wire net, then a cutting program is started to cut, and when the diamond wire is cut to be 4mm below the surface of the marble, the machine is stopped to finish cutting;
wherein, the technological parameters set in the cutting process are as follows: the tension of the coiling and uncoiling line is 30N, the coiling and uncoiling linear speed of the diamond wire is 750m/min, the coiling and uncoiling amount of the diamond wire is 300 m/cycle, and the ascending speed of the workbench is 0.2 mm/min.
And S4, standing the samarium cobalt magnetic material and the marble cut in the step S3 in a sodium hydroxide solution with the mass concentration of 20% at 90 ℃, and taking out the samarium cobalt magnetic sheet after the bonded samarium cobalt magnetic sheet is separated from the marble to finish the processing.
By adopting the process method and the set process parameters, the cutting thickness is 1.5mm, the diamond wire breakage frequency is 0 time and the qualified finished product rate is 99.6 percent when the diamond wire is continuously cut and produced 24 hours a day in one month, wherein the qualified finished product means that the cut samarium cobalt magnetic material sheet does not crack and the product is complete.
Examples 5 to 7 and comparative examples 1 to 2
Compared with the cutting process of the embodiment 1, the cutting process of the embodiments 5 to 7 and the comparative examples 1 to 2 only changes the winding and unwinding linear speed of the diamond wire, other process parameters and materials to be cut of the embodiments 5 to 7 and the comparative examples 1 to 2 are completely the same as those of the embodiment 1, the cutting thickness is 0.5mm, the diamond wire is continuously cut and produced 24 hours a month every day, the times of wire breakage of the diamond wire and the qualified finished product rate are shown in the table 1, wherein the qualified finished product means that the cut samarium cobalt magnetic material sheet does not crack, and the product is complete.
TABLE 1 cutting results record
From the test data in table 1, it is seen that the wire take-up and pay-off speed of the diamond wire has a close relationship with the cutting effect in the range satisfying other process parameters, and the phenomena of immobility, difficulty in cutting and too high wire breakage frequency can occur at an excessively low take-up and pay-off linear speed due to the fact that the samarium cobalt magnetic material is hard, but the waste of cost and the improvement of operation difficulty can be caused when the take-up and pay-off linear speed is excessively high. Meanwhile, researches find that the wire take-up and pay-off speed of the diamond wire has a direct relation with the yield of the samarium-cobalt magnetic material, and due to the fact that the samarium-cobalt magnetic material is brittle, the product cracking rate or the unformed rate are improved due to the fact that the wire take-up and pay-off speed is too high or too low in the cutting process of the diamond wire, and processing failure is caused. Preferably, the linear winding and unwinding speed of the diamond wire is 650-700 m/min.
Examples 8 to 12
Compared with the cutting process of the embodiment 1, the cutting process of the embodiments 8 to 12 and the comparative examples 3 to 4 only changes the wire winding and unwinding amount of the diamond wire, other process parameters and materials to be cut of the embodiments 8 to 12 and the comparative examples 3 to 4 are completely the same as those of the embodiment 1, the cutting thickness is 0.5mm, the diamond wire is continuously cut and produced 24 hours a month every day, the times of wire breakage of the diamond wire and the qualified yield are shown in the table 2, wherein the qualified finished product means that the cut samarium cobalt magnetic material sheet does not crack, and the product is complete.
TABLE 2 cutting results record
As can be seen from the test data in table 2, in the range of the present invention satisfying other process parameters, the amount of the diamond wire wound and unwound and the cutting effect have a significant influence relationship in each cycle, which is not an influence factor easily expected by those skilled in the art, and as samarium cobalt magnet is hard, the diamond wire is easily broken due to too low amount of samarium cobalt magnet, but due to too high amount of wound and unwound diamond wire. Meanwhile, researches find that the wire coiling and uncoiling amount of the diamond wire has a direct relation with the yield of the samarium cobalt magnetic material, and due to the fact that the samarium cobalt magnetic material is brittle, the cracking rate or the unformed rate of a product is improved when the wire coiling and uncoiling amount is too large or too small in the cutting process of the diamond wire, and processing failure is caused.
Comparative example 5
Comparative example 5 compared with the cutting process of example 1, only the specification of the glue is changed, and the tensile strength of the glue used in comparative example 5 is 180kg/cm2Shear strength of 16kg/cm2Comparative example 5 the other process parameters and the material to be cut were exactly the same as in example 1. Researches find that the tensile strength and the shear strength of the glue are directly related to the success of cutting, and when the bonding force of the glue is low, the phenomena of shedding of the samarium cobalt magnetic material to be cut and breakage of the diamond occur in the cutting process
Comparative example 6
Comparative example 6 the cutting process of example 1 was performed only by changing the marble plate to glass, and other process parameters and the material to be cut of comparative example 6 were identical to those of example 1. Research shows that after the marble plate is replaced by the glass, the diamond wire is wrapped by the generated glass powder after contacting the glass, so that the diamond wire is difficult to cut, and the diamond wire can be broken at any time when not stopping running.
The invention discloses a method for multi-wire cutting of samarium cobalt magnetic material by a diamond wire, which comprises the steps of firstly bonding the samarium cobalt magnetic material to be cut on a marble plate by using special glue, then fixing the marble plate on a workbench of a multi-wire cutting machine, finding out that whether the diamond wire is broken, whether the magnetic material is cracked and the yield are closely related to various process parameters through a large amount of experimental researches of an inventor, and selecting important influence process parameters and pertinently adjusting the range of the corresponding process parameters to ensure that the yield is high when the brittle and hard samarium cobalt magnetic material to be cut is cut into slices, the diamond wire is not easy to be broken, and the stable operation of the cutting process can be ensured.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A method for multi-wire cutting of samarium cobalt magnet by using a diamond wire is characterized by comprising the following steps:
step 1, fixing a samarium cobalt magnetic material to be cut on a marble plate;
step 2, fixing the marble plate bonded with the samarium cobalt magnetic material to be cut obtained in the step 1 on a workbench of the diamond wire multi-wire cutting machine; the workbench is lifted to enable the initial cutting surface of the samarium cobalt magnetic material to be cut to be close to the diamond wire net, and then a cutting program is started to cut;
wherein, the technological parameters set in the cutting process are as follows: the tension of the coiling and uncoiling line is 24-34N, the coiling and uncoiling linear speed of the diamond line is 650-700m/min, the coiling and uncoiling linear quantity of the diamond line is 300-500 m/cycle, and the lifting speed of the workbench is 0.04-0.2 mm/min.
2. The method for multi-wire cutting of the samarium cobalt magnet by using the diamond wire as recited in claim 1, wherein in step 1, the density of the samarium cobalt magnet to be cut is 8.1-8.5 x 103kg/m3The Vickers hardness is 400-600 HV.
3. The method for multi-wire cutting of samarium cobalt magnetic materials by using diamond wires according to claim 1, wherein in step 1, the samarium cobalt magnetic material to be cut is bonded on the marble plate by glue, and the tensile strength of the glue is not less than 230kg/cm2The shear strength is more than or equal to 23kg/cm2。
4. The method of multi-wire cutting a samarium cobalt magnet from a diamond wire of claim 1 wherein in step 1 the surface of the marble plate is grit blasted.
5. The method for multi-wire cutting of samarium cobalt magnet material by using diamond wire according to claim 1, wherein in step 2, the tension precision of the diamond wire multi-wire cutting machine is less than or equal to 0.5N.
6. The method for multi-wire cutting of the samarium cobalt magnet by using the diamond wire as claimed in claim 1, wherein the lifting speed of the worktable in the step 2 is 0.04-0.15 mm/min.
7. The method for multi-wire cutting of the samarium cobalt magnetic material by the diamond wire according to claim 1, wherein in the step 2, the wire retracting amount of the diamond wire is 400-500 m/cycle.
8. The method for multi-wire cutting of a samarium cobalt magnet from a diamond wire of claim 1, wherein in step 2 the samarium cobalt magnet is cut to a thickness of less than 1.5 mm.
9. The method for multi-wire cutting of samarium cobalt magnets by diamond wire according to any of claims 1-8, wherein in step 2, the machine is stopped to complete the cut when the diamond wire is cut to 3mm to 5mm below the surface of the marble.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011486995.9A CN112705793B (en) | 2020-12-16 | 2020-12-16 | Method for multi-wire cutting of samarium cobalt magnet by using diamond wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011486995.9A CN112705793B (en) | 2020-12-16 | 2020-12-16 | Method for multi-wire cutting of samarium cobalt magnet by using diamond wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112705793A CN112705793A (en) | 2021-04-27 |
| CN112705793B true CN112705793B (en) | 2022-05-06 |
Family
ID=75543484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011486995.9A Active CN112705793B (en) | 2020-12-16 | 2020-12-16 | Method for multi-wire cutting of samarium cobalt magnet by using diamond wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112705793B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115475942B (en) * | 2022-09-26 | 2024-05-14 | 安泰环境工程技术有限公司 | Porous titanium plate and preparation method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528954B (en) * | 2012-02-10 | 2014-11-26 | 长沙岱勒新材料科技有限公司 | Method for cutting magnetic material by using diamond wires |
| JP2015009325A (en) * | 2013-06-28 | 2015-01-19 | 株式会社ノリタケカンパニーリミテド | Fixed abrasive grain wire and wire processing method |
| CN105047394B (en) * | 2015-08-11 | 2017-06-20 | 湖南航天磁电有限责任公司 | A kind of processing method of SmCo magnet steel |
| CN105690585B (en) * | 2016-03-22 | 2017-12-19 | 沈丽明 | A kind of multi-line cutting method of tantalic acid gallium lanthanum crystal |
| CN108098550B (en) * | 2017-12-18 | 2020-06-23 | 沈阳中北真空技术有限公司 | Diamond wire cutting machining equipment and cutting method of neodymium iron boron magnet |
| CN108527664A (en) * | 2018-02-09 | 2018-09-14 | 江苏中博钻石科技有限公司 | Annular diamond wire saw cutting device |
| CN109435079A (en) * | 2018-09-17 | 2019-03-08 | 无锡斯贝尔磁性材料有限公司 | A kind of diamond wire saw method |
-
2020
- 2020-12-16 CN CN202011486995.9A patent/CN112705793B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN112705793A (en) | 2021-04-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103722625B (en) | A kind of method and apparatus utilizing diamond wire saw major diameter single-crystal silicon carbide | |
| US6568384B1 (en) | Semiconductor material cutting and processing method | |
| CN101138869A (en) | Monocrystalline silicon high-efficient composite cutting method and cutting system thereof | |
| CN112705793B (en) | Method for multi-wire cutting of samarium cobalt magnet by using diamond wire | |
| CN112192459B (en) | Preparation process of diamond wire saw suitable for cutting large-size semiconductor | |
| CN102241082A (en) | Nickel-based amorphous alloy modified cutting steel wire | |
| CN201900687U (en) | Improved cutting steel wire | |
| CN102225597B (en) | Continuous wire used for cutting hard and crisp materials and preparation method thereof | |
| CN206768249U (en) | Prepare the production equipment of Buddha's warrior attendant nickel plating scroll saw | |
| TW507283B (en) | Method of processing silicon single crystal ingot | |
| CN108032451B (en) | Silicon rod cutting method | |
| JP2012228771A (en) | Wire saw having resin-made protection layer, and cutting method using wire saw | |
| CN102225596A (en) | Solar silicon wafer wire cutting steel wire and manufacturing method thereof | |
| JP2010076070A (en) | Method for manufacturing substrate, and solar cell element | |
| CN202162899U (en) | Continuous wire rod for cutting hard and crisp materials | |
| CN113618939A (en) | Preparation method of crystal material sheet | |
| CN201913714U (en) | Cutting line net system of cutting machine suitable for cutting large-diameter ultra-thin silicon chips | |
| JP2013043268A (en) | Fixed abrasive grain wire and method of manufacturing semiconductor substrate | |
| CN202147322U (en) | Wire distribution structure of multi-wire cutter for silicon chips | |
| CN202727132U (en) | Saw and sawing element with diamond coating | |
| CN202826102U (en) | Diamond wire with non-cut surface | |
| CN103660051B (en) | Comprise crisp hard material cutting diamond wire and the diced system thereof of crystalline silicon | |
| CN112793023B (en) | Multi-line cutting method for machining Faraday rotator | |
| CN114606465B (en) | Method for preparing cutting line and cutting line | |
| CN202120926U (en) | Linear cutting apparatus for making ultrathin monocrystalline silicon piece |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |