CN112685991B - Wiring method meeting constraint - Google Patents

Wiring method meeting constraint Download PDF

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CN112685991B
CN112685991B CN202011528148.4A CN202011528148A CN112685991B CN 112685991 B CN112685991 B CN 112685991B CN 202011528148 A CN202011528148 A CN 202011528148A CN 112685991 B CN112685991 B CN 112685991B
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wiring
layer
nodes
pin
expansion
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CN112685991A (en
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黄晔
张亚东
张旋
李起宏
陆涛涛
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Beijing Empyrean Technology Co Ltd
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Beijing Empyrean Technology Co Ltd
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Abstract

A routing method that satisfies a constraint, comprising the steps of: reading the wiring parameters, acquiring grid data and constraint of the wiring layer, and constructing a wiring grid; setting a wiring initial node, and adding the initial node into a priority queue; searching a wiring path, expanding nodes of a priority queue according to a low-cost sequence to a high-cost sequence, and pressing the expanded nodes into the priority queue; and inquiring the expansion area to generate a wiring path which accords with the design rule. The wiring method meeting the constraint can connect the pins in the multi-terminal wire network, and ensures that the wiring result meets the minStepEdgeLength constraint.

Description

Wiring method meeting constraint
Technical Field
The invention relates to the technical field of VLSI (very large scale integrated circuit) design, in particular to a wiring method for satisfying minStepEdgeLength (minimum length of a graphic frame) constraint in the detailed wiring of a very large scale integrated circuit.
Background
With the progress of the process, the ultra-deep submicron process is continuously perfected, the number of devices is rapidly increased under the condition of reducing the area of a chip, the density of the chip is more and more dense, and the difficulty of physical design is continuously increased. The wiring as the back-end node of the physical design in the very large scale integrated circuit is the key stage of the success or failure of the chip design, which makes the application of EDA (electronic design automation) tools an indispensable auxiliary means.
The wiring refers to distributing metal wires among units, pins or other electronic devices to be connected in a physical design stage, so that the connectivity of the pins of the wire network is ensured, the distributed metal wires are not short-circuited, and physical design constraints (design rules) are also met.
With the maturity of the photolithography process, the improvement of the chip performance often means the increase of the chip density, the routing space is further reduced, the number of the critical net constraints is continuously increased, and finally the routing difficulty and complexity are greatly increased, which brings new challenges to the EDA tool.
In the FinFET high-end process of 14nm and below, the wiring density is increased, and the physical design of wiring is considered to be better while the space is minimum. The wiring results of the nets such as the power line (PG Net), the Signal line (Signal Net), and the Clock line (Clock Net) play a key role in the performance of the chip, for example, the power line has a larger width than a normal Net, and even if the power line is turned on, the voltage does not meet the requirement of the driving voltage, and the devices in the region still cannot work. The length of the wire mesh of the signal wire is too large, the signal is attenuated, and the device cannot obtain the signal. The clock line is used in the synchronous circuit and is the key of synchronous operation of the devices. These nets are therefore referred to as critical nets, the routing results of which often determine chip performance.
The minStepEdgeLength constraint is one of many design rules. The minStepEdgeLength constraint is a requirement that the side length of the manufactured graph is not less than a constraint value. The key wire mesh often involves communication among pins, and the first section of metal wire connected with the pins uses the width of the pins until through holes are drilled on the metal wire, so that the wire width is increased for wiring, and in the high-end process manufacturing with more tense wiring space, the constraint requirements are met, and new challenges are brought to wiring tools.
In a high-end process, EDA manufacturers are required to develop a wiring tool aiming at a critical wire network, meeting the design rule of minstepedlength.
Disclosure of Invention
In order to solve the defects in the prior art, the invention aims to provide a wiring method meeting the constraint, which can connect pins in a multi-terminal wire network and ensure that a wiring result meets minStepEdgeLength constraint.
In order to achieve the above object, the present invention provides a wiring method satisfying constraints, including the steps of:
reading the wiring parameters, acquiring grid data and constraint of the wiring layer, and constructing a wiring grid;
setting a wiring starting node, and adding the starting node into a priority queue;
searching a wiring path, expanding nodes of a priority queue according to a low-cost sequence to a high-cost sequence, and pressing the expanded nodes into the priority queue;
and inquiring the expansion area to generate a wiring path which accords with the design rule.
And further, the step of reading the wiring parameters, acquiring the grid data and the constraint of the wiring layer and constructing the wiring grid further comprises the step of adding the grid data parallel to the preset direction to the grid according to the information of the pins.
Further, the step of setting a routing start node further comprises,
taking nodes on the same layer and nodes inside the pins as initial nodes of the pins;
the node on the same layer is the middle point of the pin frame;
the nodes in the pins are the intersection points of the horizontal central line and the vertical central line of the rectangle and the grids, and do not contain points on the frame.
Further, the step of searching for a routing path to expand nodes in the priority queue in order of cost further comprises,
and performing same-layer expansion on the nodes of the pin frame, and performing layer-skipping expansion on the nodes in the pin.
Further, the step of querying the expansion area to generate the routing path that meets the design rule further includes querying whether the metal wire generated at the current position violates the design rule or not when the start node of the frame expands along the specified direction, and if so, increasing the cost value of the expansion node.
Furthermore, the step of querying the expansion region to generate a wiring path meeting the design rule further includes generating rectangles of top metal, bottom metal and a via layer according to the via parameters when nodes inside the pins are subjected to layer-skipping expansion, querying whether the design rule is violated in the rectangular regions of the top metal, the bottom metal and the via layer, and if so, increasing the cost value of the expansion node.
Further, the step of inquiring the expansion area and generating a wiring path according with the design rule further comprises the steps that a metal wire in a wiring result is directly connected with the pin, a starting node of the metal wire is positioned on the middle point of a pin frame, and when the metal wire is vertical, the wiring width is the width of a pin graph; when the metal lines are horizontal, the wiring width is the height of the pin pattern.
Further, the step of querying the expansion area and generating a wiring path according with the design rule further comprises that the through hole in the wiring result is connected with the pin, the first section of metal wire connected with the through hole meets the design rule constraint between the graph of the through hole on the layer where the metal wire is located and the first section of metal wire, and when the first section of metal wire is vertical, the wiring width is the width of the graph of the through hole; when the metal lines are horizontal, the width of the wiring is the height of the via pattern.
To achieve the above object, the present invention further provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program running on the processor, and the processor executes the computer program to execute the steps of the wiring method satisfying the constraints as described above.
To achieve the above object, the present invention also provides a computer-readable storage medium, on which a computer program is stored, the computer program executing the steps of the wiring method satisfying the constraints as described above when executed.
The wiring method, the electronic device and the computer readable storage medium which satisfy the constraints of the present invention have the following advantageous effects:
1) The wiring method meeting the minStepEdgeLength constraint automatically adjusts the grid correspondence of the pins, sets the corresponding starting point and achieves the expected wiring result.
2) The process is broken down into multiple queries, and DRC can be effectively reduced.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a flow diagram of a routing method that satisfies constraints in accordance with the present invention;
FIG. 2 is a schematic diagram of a lead corresponding to an added centerline and a boundary line according to an embodiment of the invention;
FIG. 3 is a diagram illustrating a starting point of a pin according to an embodiment of the invention;
FIG. 4 is a schematic diagram of a pin expansion node according to an embodiment of the invention;
FIG. 5 is a schematic diagram illustrating a set routing parameter according to an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating a width of a first segment of metal lines of a same level out-leads and a height of the leads, according to an embodiment of the present invention;
fig. 7 is a schematic diagram illustrating that the width of a first metal line segment of a same-layer vertical lead-out pin is equal to the width of the pin according to an embodiment of the invention;
FIG. 8 is a schematic diagram of a wiring according to an embodiment of the present invention;
fig. 9 is a diagram illustrating the result of a via out lead and a same layer out lead according to an embodiment of the invention.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it should be understood that they are presented herein only to illustrate and explain the present invention and not to limit the present invention.
Fig. 1 is a flowchart of a routing method satisfying constraints according to the present invention, and the routing method satisfying constraints of the present invention will be described in detail with reference to fig. 1.
First, in step 101, before wiring, the wiring grid is preprocessed, and grids of the lead frame and the center are added.
Preferably, the routing parameters are read, grid data and constraints for each routing layer are obtained, and a preliminary routing 3-D grid is constructed.
Preferably, a new routing grid is added according to the pin information and constraint information.
In this embodiment, the grid graph is an important component of the routing because the path search algorithm works directly on the grid. In the grid graph, various costs and attributes can be given to the attributes of the corresponding points and edges. Based on a classical horizontal-vertical model, one layer is horizontal, two adjacent layers are vertical certainly, and horizontal grids are added necessarily on the horizontal layer; the addition of vertical grids must be added on the vertical layer. The corresponding adding of the central lines and the boundary lines of the pins is shown in fig. 2, the pins add grid data parallel to the preset direction to the grid, and the grid data and the horizontal and vertical 3D structure are displayed in a plane in an overlapping mode.
In step 102, a starting point for the routing is defined and added to the priority queue.
Preferably, the starting points of the pins are of two types: 1) The nodes on the same layer are the middle points of the pin frames; 2) The nodes inside the pins are the intersection points of the horizontal central line and the vertical central line of the rectangle and the grid, and do not contain points on the frame.
In this embodiment, all the intersections on the pins and the grid may be used as nodes in the extended queue, but in order to satisfy minstepedength (minimum length of the graph frame), a start point must be defined, as shown in fig. 3.
At step 103, the least costly node in the queue is preferentially expanded using the a-search routing path.
Preferably, the nodes in the lead frame can be expanded in the same layer, and the nodes in the lead frame can be expanded only in a layer jump manner.
Preferably, the node can perform 6 directional expansion, namely, the node expands to the north, the east, the south and the west at the same layer, and the jump layer expansion direction is to the up and the down respectively. Among them, north, east, south, west are extensions of the same layer, and upward and downward are extensions of the skip layer, and extra through holes are needed to ensure connectivity.
In step 104, the expansion area is queried in real time during the routing process to generate a routing path.
Preferably, when a specific start point node is expanded in a specified direction, it is queried whether DRC (Design Rule Check) is generated when a metal line is generated at the current position.
Preferably, a larger cost value is added to the cost of the expanded nodes if DRC are generated.
Fig. 4 is a schematic diagram of a pin extension node according to an embodiment of the invention.
In this embodiment, the extension of the starting point of the lead frame, for example, the starting point of the right frame of the lead, is only to extend to the east, and the height of the lead is used as the line width of the metal line to construct the outer frame of the metal line, and then the minimum spacing distance is added to construct the query rectangle. As shown in fig. 4, the pin expands the node, determines whether there is a DRC range, and if there is an obstacle in the query rectangle, the cost of this expansion is assigned a larger value.
In this embodiment, the jump layer of the starting point inside the pin is expanded, and the rectangles of the top metal layer, the bottom metal layer, and the via layer are generated according to other parameters of the via. And querying whether barriers exist in the rectangular areas of the top layer, the bottom layer and the through hole layer through the data structure, and judging whether DRC can be generated. After layer jump expansion, expansion in any direction can be performed except for the direction opposite to the previous expansion direction.
In this embodiment, the method further includes generating rectangles of the top metal layer, the bottom metal layer, and the via layer according to the via parameters when the nodes inside the pins perform layer jump expansion, and querying whether the rectangular areas of the top metal layer, the bottom metal layer, and the via layer exceed the pin frame.
Exceeding the lead frame is realized by preprocessing, the lead is retracted inwards to half the width of the outer frame (enclosing wall) of the through hole and half the width of the cut (cut), and if the width is not in the range, the cost is increased.
FIG. 5 is a schematic diagram of setting a wiring parameter according to an embodiment of the invention.
In this embodiment, as shown in fig. 5, two pages are set with metal layer and Via data, respectively.
In step 105, in the stage of converting the found path into a layout, an optimal line width wiring is selected at a position satisfying the constraint, and no DRC is generated.
Preferably, the wiring result is that the metal wire is led out of the pin, the minStepEdgeLength constraint is met, when the starting point of the metal wire is on the middle point of the pin frame, the first section of the metal wire is vertical and is on the same layer with the pin, and the width is the width of the pin graph; the first section of metal wire is horizontal and in the same layer with the pin, and the width is the height of the pin pattern.
Preferably, the wiring result is that the through hole leads out of the pin, the minStepEdgeLength constraint is satisfied, the graph of the through hole on the pin layer does not exceed the range of the pin, and the center of the through hole is positioned on the horizontal or vertical central line of the pin and cannot be positioned on the frame of the pin.
Preferably, the first section of metal line connected to the via hole, in order to satisfy minStepEdgeLength constraint between the pattern of the via hole on the layer where the metal line is located and the first section of metal line, includes that the metal line is vertical, and the width is the width of the via hole pattern; the metal lines are horizontal and the width is the height of the via pattern.
FIG. 8 is a schematic diagram of a layout according to an embodiment of the present invention.
In this embodiment, as shown in fig. 8, the width of the first metal line segment of the skip-level lead is aligned with the via. The width of the metal line from the upper left corner to the lower left corner is equal to the width of the via. The width of the metal line from the lower right corner to the lower left corner is equal to the height of the through hole.
The routing method satisfying the constraints of the present invention is further described below in conjunction with a specific embodiment.
Fig. 9 is a diagram illustrating the result of a via out pin and a same layer out pin according to an embodiment of the invention.
(1) The wiring command is initiated and the wiring parameters are set in fig. 9.
(2) Clicking a mouse to select a starting object or a relay point to be connected for wiring operation, as shown in fig. 9, may click a mouse to select a wiring pin in order to meet design requirements.
(3) Right clicking generates a routing result as in fig. 9.
In an embodiment of the present invention, there is also provided an electronic device, including a memory and a processor, the memory having stored thereon a computer program running on the processor, the processor executing the computer program to perform the steps of the wiring method satisfying the constraints as described above.
In an embodiment of the present invention, there is also provided a computer readable storage medium having stored thereon a computer program which when run performs the steps of the wiring method satisfying the constraints as described above.
Those of ordinary skill in the art will understand that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (4)

1. A routing method satisfying a constraint, comprising the steps of:
reading the wiring parameters, acquiring grid data and constraint of the wiring layer, and constructing a wiring grid;
setting a wiring starting node, and adding the starting node into a priority queue;
the step of setting a routing start node further comprises,
taking nodes on the same layer and nodes inside the pins as initial nodes of the pins;
the node on the same layer is the middle point of the pin frame;
the nodes in the pins are the intersection points of the horizontal central line and the vertical central line of the rectangle and the grids, and do not contain points on the frame;
searching a wiring path, expanding nodes of a priority queue according to a low-cost sequence to a high-cost sequence, and pressing the expanded nodes into the priority queue;
the step of searching for a routing path to expand nodes in the priority queue in order of cost further comprises,
performing same-layer expansion on nodes of a pin frame, and performing layer-skipping expansion on nodes in the pin;
inquiring the expansion area, and generating a wiring path which accords with the design rule;
the step of inquiring the expansion area to generate a wiring path which accords with the design rule also comprises the steps of inquiring whether a metal wire generated at the current position violates the design rule or not when the initial node of the frame expands along the appointed direction, and if so, increasing the cost value of the expansion node;
the step of inquiring the expansion region to generate a wiring path which accords with the design rule further comprises the steps of generating rectangles of top layer metal, bottom layer metal and a through hole layer according to the through hole parameters when nodes in the pins carry out layer jump expansion, inquiring whether the design rule is violated in the rectangular regions of the top layer, the bottom layer and the through hole layer, and if so, increasing the cost value of the expansion node;
the step of inquiring the expansion area and generating a wiring path which accords with the design rule further comprises the steps that a metal wire in a wiring result is directly connected with the pin, the initial node of the metal wire is positioned on the middle point of the frame of the pin, and when the metal wire is vertical, the wiring width is the width of the pin graph; when the metal wire is horizontal, the wiring width is the height of the pin pattern;
the step of inquiring the expansion area and generating a wiring path which accords with the design rule further comprises the steps that the through hole in the wiring result is connected with the pin, the first section of metal wire which is connected with the through hole meets the design rule constraint of the through hole between the graph of the layer where the metal wire is located and the first section of metal wire, and when the first section of metal wire is vertical, the wiring width is the width of the graph of the through hole; when the metal lines are horizontal, the width of the wiring is the height of the via pattern.
2. The method of claim 1, wherein the steps of reading the routing parameters, obtaining the grid data and constraints of the routing layer, and constructing the routing grid further comprise adding grid data parallel to the predetermined direction to the grid according to the pin information.
3. An electronic device, comprising a memory and a processor, wherein the memory stores a computer program running on the processor, and the processor executes the computer program to perform the steps of the wiring method satisfying the constraints of any one of claims 1 to 2.
4. A computer-readable storage medium, on which a computer program is stored, characterized in that the computer program executes the steps of the method of wiring satisfying the constraints of any one of claims 1 to 2 when running.
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