CN101976163A - Wiring method of capacitive touch panel - Google Patents
Wiring method of capacitive touch panel Download PDFInfo
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- CN101976163A CN101976163A CN2010102526723A CN201010252672A CN101976163A CN 101976163 A CN101976163 A CN 101976163A CN 2010102526723 A CN2010102526723 A CN 2010102526723A CN 201010252672 A CN201010252672 A CN 201010252672A CN 101976163 A CN101976163 A CN 101976163A
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Abstract
The invention relates to a wiring method of capacitive touch panel. Special algorithm is adopted, so that distance between each pin of a touch chip on touch panel and corresponding scanning line is shortest and wiring lengths are the same, and influence of parasitic inductive capacitance produced by wiring on the traditional touch panel can be eliminated.
Description
Technical field
The present invention relates to a kind of wiring method of contact panel, refer in particular to layout method at a kind of capacitance type touch-control panel.
Background technology
Contact panel is because volume is little, cost is low, consumed power is low and advantage such as long service life, comparatively be widely used on each electronic product at present, as portable notebook, personal digital assistant even mobile phone etc., be used for as input media, the user only utilizes finger or conductive object such as pointer to touch on contact panel or slide, thereby make cursor produce corresponding absolute or relative moving, thus finish click, double-click, pull, various input actions such as rolling.
And for capacitance type touch-control panel, it is not only because have the fine advantage that need not verification of precision, and the transparency height, durability is strong and support characteristics such as multi-point touch, so the application of capacitance type touch-control panel also more and more widely these years.Because on capacitance type touch-control panel, the transmission line that is connected with sweep trace self has stray capacitance, so-called stray capacitance is meant the setting that need go and be listed as owing to the reason of Butut on contact panel, and this set must make row be listed as between influence each other and produced new inductance capacitance, owing to have a plurality of intrinsic stray capacitances between row and the row, so row is near more with the distance of row, stray capacitance also can be big more.So, existence for above-mentioned inductance capacitance, thereby unavoidably can the scanning result that the sweep trace weak capacitive changes be exerted an influence, particularly when the stray capacitance of each transmission lines is inconsistent, can cause scanning result and the actual very big deviation of result's generation, and how to eliminate or reduce the influence of stray capacitance that this transmission line produces, just becoming needs to be resolved hurrily.
In order to eliminate above-mentioned influence, so we need solve above problem for users provide a kind of easier method.
Summary of the invention
The actual technical matters to be solved of the present invention is the wiring method how a kind of capacitance type touch-control panel is provided.
To achieve these goals, we provide a kind of wiring method of capacitance type touch-control panel, described contact panel is provided with some sweep traces of touch-control chip and row and row, and it may further comprise the steps: detect a pin on the described touch-control chip farthest that root sweep trace to the sweep trace of described row or column; Write down vertical range and the corresponding tie point of the above-mentioned pin of described touch-control chip to described that root sweep trace farthest; Guarantee that other pin that is connected with sweep trace on the described touch-control chip equals above-mentioned vertical range to the length of the respective scan line of described row or column, thereby determine other tie point and then finish whole Butut.
The wiring method of capacitance type touch-control panel of the present invention, not only its method is simple, and owing to each pin on the touch-control chip in the method that adopts is the shortest to the distance of respective scan line; And each pin is identical to the length of respective scan line, because wiring is short more, the parasitic inductance capacitance of its generation is more little, length of arrangement wire equates, every the parasitic inductance capacitance that is produced that connects up also equates, its influence to sweep trace is also identical, is easy to eliminate by the method for the invention the influence of the parasitic inductance capacitance that wiring produced, and therefore can detect the action gesture of touch object more accurately.
Description of drawings
Fig. 1 is the diagrammatic cross-section of described contact panel wire structures;
Fig. 2 is a capacitance type touch-control panel wiring method process flow diagram of the present invention;
Fig. 3 is the wiring synoptic diagram according to the described contact panel of the inventive method.
Embodiment
The present invention is further illustrated below in conjunction with drawings and Examples.
Please refer to a kind of wire structures that Figure 1 shows that capacitance type touch-control panel of the present invention, with printed circuit board (PCB) 10 is example, form by four layers on the described circuit board 10, being followed successively by the X layer is that horizontal scanning line layer 11, Y layer are column scan line layer 12, separation layer 13 and wiring layer 14, the corresponding ground floor, the second layer, the 3rd layer and the 4th layer of setting gradually into.
Described ground floor is to be dielectric layer between X sweep trace layer 11 and the second layer Y sweep trace layer 12, so this two-layer order can exchange, can be set to Y sweep trace layer by ground floor, and the second layer is set to X sweep trace layer.Described separation layer 13 is used to isolate wiring layer 14 and sweep trace layer 12, and some sweep trace pins of the 4th layer of to be wiring layer 14 be provided with chip.The row layer of described contact panel all includes some sweep traces with the row layer, promptly is meant some sweep traces on the X layer and the some sweep traces on the Y layer respectively.
Please in conjunction with referring to figs. 2 and 3 shown in, at first need to determine the position of touch-control chip 140 on the wiring layer 14 of circuit board 10, just can determine each pin of described touch-control chip 140 upper tracers if after under the stationkeeping of described touch-control chip 140; Be chosen on the X layer sweep trace pin Px sweep trace Xn farthest on the described touch-control chip 140 of distance then, this pin Px of record described touch-control chip 140 this moment is to the vertical range Lo of that root sweep trace Xn farthest; Since this moment on the X-axis farthest on sweep trace Xn and the Y-axis this root line segment of vertical range Lo determine that so these two lines just can be determined an intersection point A, the position of intersection point A is exactly the particular location point of a wiring on the X layer sweep trace on the described circuit board 10 thus.
Behind the position of having determined first wiring on this circuit board 10, can continue to determine the position of other wiring on this basis.Below we are concrete again discusses down: by above-mentioned argumentation as can be known, vertical range Lo is that a pin Px of described touch-control chip arrives the distance of that root sweep trace Xn farthest, this Lo is set as a gauged distance, fix because connect the pin of sweep trace on the described touch-control chip 140, so can determine tie point with reference to its gauged distance when other Butut is set thus.So-called tie point is meant and connects described contact panel up or the wiring of column scan line and the intersection point of this sweep trace.
Please refer to shown in Figure 2, for the 5th sweep trace X5, also determine because connect sweep trace pin P5 this moment on the corresponding described touch-control chip 140, so under the certain situation of distance L o, this point of fixity can drop on any place on the sweep trace X5, on tie point B, and the pin P5 that guarantees described touch-control chip 140 gets final product to the length that the length of this tie point B equals distance L o, in order to satisfy above-mentioned condition, the pin P5 of its touch-control chip 140 can be divided into two sections to tie point B, each section is represented with line segment B1 and B2 respectively, promptly need guarantee the length sum of line segment B1 and B2 and the equal in length of gauged distance Lo, is formulated as follows: B1+B2=Lo.In like manner,,, make this pin P15 equal gauged distance Lo, so just this tie point C can be decided to the distance of sweep trace X15 so need only to satisfy because this moment, touch-control chip 140 pairing pins were P15 to the 15th sweep trace X15 on the X layer.As long as equal this condition of length of Lo to the two sections line segment C1 of sweep trace X15 and C2 sum owing to satisfy described touch-control chip 140 pin P15, thus the 9th with on the sweep trace X15 any any all can become tie point.In like manner, other tie point of X layer sweep trace on the described circuit board 10 is equal to the length condition of gauged distance Lo and mutually no intersection point to this tie point apart from length as long as satisfy described touch-control pin of chip.
Because circuit board 10 is provided with the sweep trace of several rows and row, above-mentioned detailed the determining of on X-axis sweep trace tie point of having discussed, in like manner, for the Y-axis sweep trace, it also is same step, certain pin of promptly selecting described touch-control chip 140 earlier farthest that root sweep trace to the Y layer sweep trace calculates this moment this pin then to this vertical range of this root sweep trace farthest; With this vertical range as gauged distance, thereby determine on the touch-control chip 140 other pin to the tie point of Y layer sweep trace according to described this gauged distance.Because only the tie point on Y layer sweep trace that root sweep trace is farthest fixed, so for other sweep trace of Y layer, as long as the pin that satisfies described touch-control chip 140 equals above-mentioned gauged distance and these conditions of no intersection point mutually to the length sum of sweep trace, so tie point can be set arbitrarily, the wire laying mode on the described like this circuit board 10 just has a lot of forms.
After having determined each tie point on X-axis and the Y-axis according to said method, circuit board through-hole technology is passed through in the position at above-mentioned tie point place, the X layer that the connecting line of described wiring layer is corresponding with it or the sweep trace of Y layer connect, and finish the wiring of entire circuit plate 10 with this.
Because wiring is short more, the parasitic inductance capacitance of its generation is more little, and length of arrangement wire equates that the parasitic inductance capacitance of its generation also equates, and the present invention has guaranteed that each pin on the touch-control chip is the shortest to the distance of respective scan line, and each pin is identical to the length of respective scan line.Therefore, the present invention has reduced the influence that stray capacitance produced to the full extent, and can eliminate its influence by the method for the invention, thereby can detect the action gesture of touch object more accurately.
Claims (10)
1. the wiring method of a capacitance type touch-control panel, described contact panel is provided with some sweep traces of touch-control chip and row and row, and it may further comprise the steps:
Select a pin on the described touch-control chip farthest that sweep trace to the sweep trace of described row or column;
Write down vertical range and the corresponding tie point of the above-mentioned pin of described touch-control chip to described that root sweep trace farthest;
Guarantee that other pin that is connected with sweep trace on the described touch-control chip equals above-mentioned vertical range to the length of the respective scan line of described row or column, thereby determine other tie point and then finish whole Butut.
2. the method for claim 1 is characterized in that: a pin on the described selection touch-control chip is meant a pin that is connected with sweep trace of selecting on the touch-control chip.
3. the method for claim 1 is characterized in that: described tie point is meant and connects described contact panel up or the wiring of column scan line and the intersection point of this sweep trace, and described tie point does not have intersection point mutually.
4. the method for claim 1 is characterized in that: if a pin of described touch-control chip on row layer direction, then need be selected above-mentioned pin farthest that root sweep trace to the sweep trace of described row.
5. the method for claim 1 is characterized in that: if a pin of described touch-control chip on line direction, then need be selected above-mentioned pin farthest that root sweep trace to the sweep trace of described row.
6. the method for claim 1 is characterized in that: described contact panel is capable to be meant some sweep traces on the X layer and the some sweep traces on the Y layer with some sweep traces row.
7. the method for claim 1 is characterized in that: other pin can be many length sums that connect line segments to the length of the respective scan line of described row or column on the described touch-control chip.
8. the method for claim 1, it is characterized in that: described contact panel mainly comprises four layers, is followed successively by horizontal scanning line layer or column scan line layer, separation layer and wiring layer.
9. method as claimed in claim 8 is characterized in that: described separation layer is used to isolate wiring layer and sweep trace layer.
10. method as claimed in claim 8 is characterized in that: the connecting line of described contact panel different layers and sweep trace will connect by via process at the tie point place.
Priority Applications (1)
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CN2010102526723A CN101976163A (en) | 2010-08-13 | 2010-08-13 | Wiring method of capacitive touch panel |
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CN2010102526723A CN101976163A (en) | 2010-08-13 | 2010-08-13 | Wiring method of capacitive touch panel |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103076909A (en) * | 2011-10-25 | 2013-05-01 | 瀚宇彩晶股份有限公司 | Touch panel capable of adjusting touch resolution and manufacturing method thereof |
CN103365513A (en) * | 2012-03-28 | 2013-10-23 | 禾瑞亚科技股份有限公司 | Wiring pattern for touch control chip |
CN106339134A (en) * | 2016-11-25 | 2017-01-18 | 京东方科技集团股份有限公司 | Touch control substrate, touch control panel and touch control display device |
CN112685991A (en) * | 2020-12-22 | 2021-04-20 | 北京华大九天科技股份有限公司 | Wiring method meeting constraint |
-
2010
- 2010-08-13 CN CN2010102526723A patent/CN101976163A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103076909A (en) * | 2011-10-25 | 2013-05-01 | 瀚宇彩晶股份有限公司 | Touch panel capable of adjusting touch resolution and manufacturing method thereof |
CN103365513A (en) * | 2012-03-28 | 2013-10-23 | 禾瑞亚科技股份有限公司 | Wiring pattern for touch control chip |
CN103365513B (en) * | 2012-03-28 | 2016-03-30 | 禾瑞亚科技股份有限公司 | The cabling of touch chip |
CN106339134A (en) * | 2016-11-25 | 2017-01-18 | 京东方科技集团股份有限公司 | Touch control substrate, touch control panel and touch control display device |
CN112685991A (en) * | 2020-12-22 | 2021-04-20 | 北京华大九天科技股份有限公司 | Wiring method meeting constraint |
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Application publication date: 20110216 |