CN112677032A - Grinding fluid conveying module and chemical mechanical grinding device - Google Patents
Grinding fluid conveying module and chemical mechanical grinding device Download PDFInfo
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- CN112677032A CN112677032A CN201910989949.1A CN201910989949A CN112677032A CN 112677032 A CN112677032 A CN 112677032A CN 201910989949 A CN201910989949 A CN 201910989949A CN 112677032 A CN112677032 A CN 112677032A
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Abstract
An abrasive fluid delivery module comprising: an ultrasonic unit for generating ultrasonic waves; a conveying pipe comprising an inlet section, an outlet section opposite to the inlet section, and a main body section located between the inlet section and the outlet section, wherein the grinding fluid flows into the main body section through the inlet section; an ultrasonic wave conducting medium at least covering the main body section, wherein the ultrasonic wave conducting medium is used for conducting the ultrasonic wave generated by the ultrasonic unit to the main body section so as to prevent the grinding particles in the grinding fluid flowing out through the outlet section from agglomerating; wherein, the conveying pipeline is distributed in a bending way in the ultrasonic wave conduction medium. The invention also provides a chemical mechanical polishing device.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a grinding fluid conveying module and a chemical mechanical grinding device.
Background
Chemical Mechanical Polishing (CMP) is a process of polishing a semiconductor wafer on a rotating polishing plane under a specific temperature, pressure and Chemical composition, or rotating the wafer on the polishing plane to achieve the polishing effect. In the CMP process, the polishing plane is first wetted with an aqueous and chemically active polishing solution. The polishing slurry generally includes abrasive particles, active chemical components (e.g., chelating salts of transition metals or oxidizing agents), adjuvants (e.g., solvents, buffers, and/or passivating agents). Specifically, the active chemical components in the slurry are used to chemically etch the wafer, while the polishing particles are used to mechanically polish the wafer.
Generally, the abrasive particles adhere or agglomerate during the polishing process to form large particles with larger diameters, and the large particles may subsequently fall on the surface of the wafer, causing defects (e.g., scratches) on the wafer, thereby reducing the yield of the wafer. In order to solve the above problem, at least one set of filter membranes is generally disposed in an abrasive supply pipe of a CMP apparatus, and large particles present in the abrasive are removed by the filter membranes before the abrasive reaches the polishing plane. However, the performance of the filtering membrane is reduced due to the blockage of the filtering holes during the use process, so that the filtering membrane needs to be replaced continuously, and the cost is increased.
Disclosure of Invention
In view of the above, the present invention provides a slurry transport module capable of effectively removing large particles in a slurry and facilitating cost reduction.
In addition, it is also necessary to provide a chemical mechanical polishing apparatus having the polishing slurry delivery module.
The invention provides a grinding fluid conveying module, which comprises:
an ultrasonic unit for generating ultrasonic waves;
a conveying pipe comprising an inlet section, an outlet section opposite to the inlet section, and a main body section located between the inlet section and the outlet section, wherein the grinding fluid flows into the main body section through the inlet section; and
an ultrasonic wave conducting medium at least covering the main body section, wherein the ultrasonic wave conducting medium is used for conducting the ultrasonic wave generated by the ultrasonic unit to the main body section so as to prevent the grinding particles in the grinding fluid flowing out through the outlet section from agglomerating;
wherein, the conveying pipeline is distributed in a bending way in the ultrasonic wave conduction medium.
In some embodiments of the present invention, the ultrasonic unit includes an ultrasonic generator and an ultrasonic vibrator connected to the ultrasonic generator, and the ultrasonic generator is configured to drive the ultrasonic vibrator to generate the ultrasonic wave when in operation.
In some embodiments of the invention, the slurry delivery module further includes a housing for accommodating the ultrasonic wave conductive medium, and the ultrasonic unit is fixed to the outside of the housing by the ultrasonic vibrator.
In some embodiments of the invention, the ultrasound unit is located below the housing.
In some embodiments of the present invention, the main body section includes a plurality of first connecting sections arranged in parallel and a second connecting section communicating two adjacent first connecting sections, and the inlet section and the outlet section communicate with two outermost first connecting sections, respectively.
The present invention also provides a chemical mechanical polishing apparatus, comprising:
the grinding fluid conveying module is characterized by comprising:
an ultrasonic unit for generating ultrasonic waves;
a conveying pipe comprising an inlet section, an outlet section opposite to the inlet section, and a main body section located between the inlet section and the outlet section, wherein the grinding fluid flows into the main body section through the inlet section; and
an ultrasonic wave conducting medium at least covering the main body section, wherein the ultrasonic wave conducting medium is used for conducting the ultrasonic wave generated by the ultrasonic unit to the main body section so as to prevent the grinding particles in the grinding fluid flowing out of the outlet section from agglomerating, and the conveying pipeline is distributed in a bent manner in the ultrasonic wave conducting medium; and
a grinding table, the outlet section being located above the grinding table such that a grinding fluid is provided to the grinding table through the outlet section.
In some embodiments of the present invention, the ultrasonic unit includes an ultrasonic generator and an ultrasonic vibrator connected to the ultrasonic generator, and the ultrasonic generator is configured to drive the ultrasonic vibrator to generate the ultrasonic wave when in operation.
In some embodiments of the invention, the slurry delivery module further includes a housing for accommodating the ultrasonic wave conductive medium, and the ultrasonic unit is fixed to the outside of the housing by the ultrasonic vibrator.
In some embodiments of the invention, the ultrasound unit is located below the housing.
In some embodiments of the present invention, the main body section includes a plurality of first connecting sections arranged in parallel and a second connecting section communicating two adjacent first connecting sections, and the inlet section and the outlet section communicate with two outermost first connecting sections, respectively.
Compared with the prior art, the conveying pipeline is arranged in a bent distribution mode, so that the circulation time of the grinding fluid in the conveying pipeline can be prolonged, the time of the ultrasonic wave acting on the grinding fluid is prolonged, the decomposition efficiency of grinding particles is improved, and large particles in the grinding fluid are effectively removed. Moreover, the problem that the filtering membrane needs to be frequently replaced when the filtering membrane is used for filtering is effectively avoided, and the cost is favorably reduced.
Drawings
Fig. 1 is a schematic structural diagram of a slurry delivery module according to an embodiment of the present invention.
Fig. 2 is a top view of the slurry delivery module shown in fig. 1.
Fig. 3 is a schematic structural diagram of a chemical mechanical polishing apparatus according to an embodiment of the present invention.
Description of the main elements
Grinding fluid conveying module 1
Conveying pipe 20
Polishing liquid 24
Ultrasonic wave conductive medium 30
Chemical mechanical polishing apparatus 100
Fixing ring 120
Polishing head 130
Third connecting section 233
Semiconductor wafer S1
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The invention will be further explained with reference to the drawings and the embodiments.
Referring to fig. 1 and 2, the embodiment of the invention provides a slurry delivery module 1, which is applied to a chemical mechanical polishing apparatus 100 (see fig. 2). The grinding fluid delivery module 1 comprises an ultrasonic unit 10, a delivery pipe 20 and an ultrasonic wave conductive medium 30.
The ultrasonic unit 10 is used to generate ultrasonic waves.
The conveying duct 20 comprises an inlet section 21, an outlet section 22 opposite the inlet section 21, and a body section 23 located between the inlet section 21 and the outlet section 22. The grinding fluid 24 flows into the main body section 23 through the inlet section 21.
The ultrasound conductive medium 30 at least encases the main body segment 23. The ultrasound conducting medium 30 is used to conduct the ultrasound generated by the ultrasound unit 10 to the main body segment 23. Thus, the abrasive particles of the slurry 24 in the delivery pipe 20 can be decomposed into small particles by the ultrasonic waves, and the abrasive particles in the slurry 24 flowing out through the outlet section 22 are prevented from being agglomerated. In this embodiment, the ultrasonic wave may be transmitted to the medium 30 as deionized water.
Wherein the conveying pipe 20 is distributed in a curved manner in the ultrasonic wave conducting medium 30. By arranging the conveying pipeline 20 to be in bent distribution, the circulation time of the grinding fluid 24 in the conveying pipeline 20 can be prolonged, so that the time of the ultrasonic wave acting on the grinding fluid 24 is prolonged, the decomposition efficiency of grinding particles is improved, and large particles in the grinding fluid 24 are effectively removed. Moreover, the problem that the filtering membrane needs to be frequently replaced when the filtering membrane is used for filtering is effectively avoided, and the cost is favorably reduced.
As shown in fig. 2, in the present embodiment, the main body section 23 is substantially serpentine-shaped and includes a plurality of first connecting sections 231 arranged in parallel and a second connecting section 232 connecting two adjacent first connecting sections 231, and the inlet section 21 and the outlet section 22 are respectively connected to two outermost first connecting sections 231. More specifically, the inlet section 21 and the outlet section 22 communicate with two first connection sections 231 located at the outermost sides, respectively, through a third connection section 233. The third connection section 233 is parallel to the second connection section 232.
In the present embodiment, the ultrasonic unit 10 includes an ultrasonic generator 11 and an ultrasonic vibrator 12 connected to the ultrasonic generator 11, and the ultrasonic generator 11 is configured to drive the ultrasonic vibrator 12 to generate the ultrasonic wave when operating.
The grinding fluid delivery module 1 further includes a housing 40, the housing 40 is configured to accommodate the ultrasonic wave conductive medium 30, and the ultrasonic wave unit 10 is fixed to the outside of the housing 40 through the ultrasonic wave vibrator 12.
Further, the ultrasonic unit 10 is located below the housing 40.
Referring to fig. 3, the embodiment of the invention further provides a chemical mechanical polishing apparatus 100 for processing a semiconductor wafer S1. The chemical mechanical polishing apparatus 100 includes the polishing slurry delivery module 1 and the polishing platen 110. The outlet section 22 is positioned on the polishing platen 110 such that the polishing slurry 24 is provided through the outlet section 22 onto the polishing platen 110.
The polishing platen 110 may be provided with a polishing pad 111 thereon. The slurry 24 may be sprayed onto the polishing pad 111 through a nozzle disposed on the outlet section 22, and the slurry 24 may be supplied to the polishing pad 111 from a container or a storage tank (not shown) by gravity, or may be supplied to the polishing pad 111 by pumping. Alternatively, the polishing liquid 24 may be supplied to the polishing pad 111 from below the polishing platen 110, and the polishing liquid 24 may flow through the polishing pad 111 from the bottom to the top.
Further, the chemical mechanical polishing apparatus 100 further includes a polishing head 130 disposed above the polishing platen 110 and a fixing ring 120 fixed to the polishing head 130. The fixing ring 120 is used for fixing a semiconductor wafer S1. The polishing head 130 is connected to a driving motor 140, and the driving motor 140 is configured to drive the polishing head 130 to rotate continuously along a first direction 141 and to drive the polishing head 130 to rotate reciprocally and transversely along a second direction 142. Therefore, the combination of the lateral movement and the rotation can reduce the difference in removal rate (removalrate) on the surface of the semiconductor wafer S1 during polishing. In other embodiments, the polishing liquid 24 may be supplied to the polishing pad 111 through a nozzle (not shown) disposed in the retaining ring 120.
Also, the polishing platform 110 may rotate in a third direction 112. The polishing platen 110 has a larger surface area than the semiconductor wafer S1 to accommodate lateral movement of the semiconductor wafer S1 held in the retaining ring 120 over the surface of the polishing pad 111.
It should be understood that the above examples are only for illustrating the present invention and are not to be construed as limiting the present invention. It will be apparent to those skilled in the art that various other changes and modifications can be made in the technical spirit of the present invention within the scope of the appended claims.
Claims (10)
1. An abrasive fluid delivery module, comprising:
an ultrasonic unit for generating ultrasonic waves;
a conveying pipe comprising an inlet section, an outlet section opposite to the inlet section, and a main body section located between the inlet section and the outlet section, wherein the grinding fluid flows into the main body section through the inlet section; and
an ultrasonic wave conducting medium at least covering the main body section, wherein the ultrasonic wave conducting medium is used for conducting the ultrasonic wave generated by the ultrasonic unit to the main body section so as to prevent the grinding particles in the grinding fluid flowing out through the outlet section from agglomerating;
wherein, the conveying pipeline is distributed in a bending way in the ultrasonic wave conduction medium.
2. The slurry delivery module of claim 1, wherein the ultrasonic unit comprises an ultrasonic generator and an ultrasonic vibrator coupled to the ultrasonic generator, the ultrasonic generator being configured to drive the ultrasonic vibrator to generate the ultrasonic waves when in operation.
3. The slurry delivery module of claim 2, further comprising a housing for accommodating the ultrasonic conducting medium, wherein the ultrasonic unit is fixed to an outside of the housing by the ultrasonic vibrator.
4. The slurry delivery module of claim 3, wherein the ultrasonic unit is located below the housing.
5. The slurry delivery module according to claim 1, wherein the main body segment includes a plurality of first connecting segments arranged in parallel and a second connecting segment connecting two adjacent first connecting segments, and the inlet segment and the outlet segment are respectively connected to two outermost first connecting segments.
6. A chemical mechanical polishing apparatus, comprising:
the grinding fluid conveying module is characterized by comprising:
an ultrasonic unit for generating ultrasonic waves;
a conveying pipe comprising an inlet section, an outlet section opposite to the inlet section, and a main body section located between the inlet section and the outlet section, wherein the grinding fluid flows into the main body section through the inlet section; and
an ultrasonic wave conducting medium at least covering the main body section, wherein the ultrasonic wave conducting medium is used for conducting the ultrasonic wave generated by the ultrasonic unit to the main body section so as to prevent the grinding particles in the grinding fluid flowing out of the outlet section from agglomerating, and the conveying pipeline is distributed in a bent manner in the ultrasonic wave conducting medium; and
a grinding table, the outlet section being located above the grinding table such that a grinding fluid is provided to the grinding table through the outlet section.
7. A chemical mechanical polishing apparatus as set forth in claim 6, wherein the ultrasonic unit includes an ultrasonic generator and an ultrasonic vibrator connected to the ultrasonic generator, the ultrasonic generator being configured to drive the ultrasonic vibrator to generate the ultrasonic waves when in operation.
8. The chemical mechanical polishing apparatus of claim 7, wherein the slurry delivery module further comprises a housing for accommodating the ultrasonic transmission medium, and the ultrasonic unit is fixed to an outside of the housing by the ultrasonic vibrator.
9. The chemical mechanical polishing apparatus of claim 8, wherein the ultrasonic unit is located below the housing.
10. The chemical mechanical polishing apparatus as claimed in claim 6, wherein the main body section includes a plurality of first connecting sections arranged in parallel and a second connecting section communicating with two adjacent first connecting sections, and the inlet section and the outlet section communicate with two outermost first connecting sections, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910989949.1A CN112677032A (en) | 2019-10-17 | 2019-10-17 | Grinding fluid conveying module and chemical mechanical grinding device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910989949.1A CN112677032A (en) | 2019-10-17 | 2019-10-17 | Grinding fluid conveying module and chemical mechanical grinding device |
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| CN112677032A true CN112677032A (en) | 2021-04-20 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023022818A1 (en) * | 2021-08-18 | 2023-02-23 | Applied Materials, Inc. | Point-of-use ultrasonic homogenizer for cmp slurry agglomeration reduction |
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| CN105895518A (en) * | 2015-02-12 | 2016-08-24 | 旭硝子株式会社 | Polishing agent, polishing method and method for manufacturing semiconductor integrated circuit device |
| CN108067311A (en) * | 2016-11-15 | 2018-05-25 | 杭州绿洁水务科技股份有限公司 | A kind of micro-fluidic chip and detection method for Microcystin detection |
| CN209021758U (en) * | 2018-09-06 | 2019-06-25 | 德淮半导体有限公司 | Lapping liquid supply unit and chemical machinery polishing system |
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2019
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Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11277434A (en) * | 1998-03-30 | 1999-10-12 | Speedfam Co Ltd | Slurry recycle system for cmp device and method therefor |
| CN1286227A (en) * | 1999-08-31 | 2001-03-07 | 三星电子株式会社 | Apparatus for supersonic dispersion of quartz solution |
| TW200416104A (en) * | 2003-02-18 | 2004-09-01 | Nippon Kogaku Kk | Polishing apparatus, method of polishing and process for producing semiconductor device |
| CN101456149A (en) * | 2007-12-11 | 2009-06-17 | 上海华虹Nec电子有限公司 | Feeding device of chemical mechanical polishing liquid and polishing liquid treatment method |
| CN101301735A (en) * | 2008-07-03 | 2008-11-12 | 大连理工大学 | Ultraprecise and low-damage method for polishing large size diamond wafer and device thereof |
| CN201483369U (en) * | 2009-08-21 | 2010-05-26 | 中芯国际集成电路制造(上海)有限公司 | Polishing liquid transmitting device |
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| CN102773804A (en) * | 2011-05-13 | 2012-11-14 | 南亚科技股份有限公司 | CMP slurry mix and delivery system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023022818A1 (en) * | 2021-08-18 | 2023-02-23 | Applied Materials, Inc. | Point-of-use ultrasonic homogenizer for cmp slurry agglomeration reduction |
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Application publication date: 20210420 |