CN112676954A - Large-size wafer grinding device - Google Patents
Large-size wafer grinding device Download PDFInfo
- Publication number
- CN112676954A CN112676954A CN202011447572.6A CN202011447572A CN112676954A CN 112676954 A CN112676954 A CN 112676954A CN 202011447572 A CN202011447572 A CN 202011447572A CN 112676954 A CN112676954 A CN 112676954A
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- China
- Prior art keywords
- frame
- support
- wall
- grinding
- size wafer
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- 239000000428 dust Substances 0.000 claims abstract description 23
- 230000005540 biological transmission Effects 0.000 claims abstract description 17
- 238000013016 damping Methods 0.000 claims abstract description 9
- 238000005498 polishing Methods 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims 2
- 230000035939 shock Effects 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Images
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- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention discloses a large-size wafer grinding device which comprises a support, wherein a damping spring is installed on the support, a controller is installed on the outer wall of the support, a control panel is installed on the outer wall of the support, a frame support is installed at the top of the support, a dust outlet frame is installed on the inner wall of the frame support, a fan is installed on the inner wall of the frame support, and a first motor is installed on the inner wall of the frame support. According to the invention, the large-size wafer can be ground through the arrangement of the first motor and the grinding frame, the large-size wafer can be ground through lifting after being clamped through the arrangement of the transmission chamber and the clamping frame, the ground dust can be timely cleaned in the grinding process through the arrangement of the grinding head and the brush head, the ground dust can be timely cleaned through the arrangement of the fan and the dust outlet frame, and the large-size wafer can be conveniently ground through the matching of internal parts.
Description
Technical Field
The invention relates to the technical field of wafer grinding, in particular to a large-size wafer grinding device.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular, and various circuit element structures can be manufactured on the silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with high purity.
However, the existing polishing device cannot clean the dust under the condition that the polishing device cannot polish in time, so that the wafer is damaged secondarily, and the wafer fixing device is inconvenient to use in the polishing process, so that a large-size wafer polishing device is needed.
Disclosure of Invention
The present invention is directed to a large-sized wafer polishing apparatus to solve the above-mentioned problems.
In order to achieve the purpose, the invention provides the following technical scheme: jumbo size wafer grinder, including the support, install damping spring on the support, install the controller on the outer wall of support, install control panel on the outer wall of support, the frame support is installed at the top of support, install out the dirt frame on the inner wall of frame support, install the fan on the inner wall of frame support, install first motor on the inner wall of frame support, the grinding frame is installed to the output of first motor, install the transmission chamber on the inner wall of frame support, install the second motor on the inner wall of transmission chamber, the threaded rod is installed to the output of second motor, threaded connection has the connecting plate on the threaded rod, the centre gripping frame is installed to the one end of connecting plate, install the spring on the inner wall of centre gripping frame, the clamp splice is installed to the one end of spring, the brush head is installed at the top of grinding frame, and a grinding head is arranged at the top of the grinding frame.
Preferably, the top of the dust outlet frame is open, an inclined plane is arranged inside the dust outlet frame, and the output end of the dust outlet frame penetrates through the inner wall of the frame support and extends to the outside of the frame support.
Preferably, the mounting position of the grinding frame is located right below the clamping frame, and the mounting position of the fan is located on the right side of the grinding frame.
Preferably, one end of the connecting plate, which is provided with the clamping frame, penetrates through the side wall of the transmission chamber and extends to the outside of the transmission chamber.
Preferably, the number of the damping springs is two, and the two damping springs are arranged on the support at an oblique angle of forty-five degrees.
Preferably, the springs and the clamping blocks are arranged in the clamping frame in a plurality of groups in an annular array mode, and the outer wall of each clamping block is provided with a protective layer.
Compared with the prior art, the invention has the beneficial effects that: this jumbo size wafer grinder, through the setting of first motor and grinding frame, make and to grind the jumbo size wafer, through the setting of transmission chamber and centre gripping frame, make and grind the back through going up and down to grind the jumbo size wafer, through the setting of grinding head and brush head, make the in-process of grinding just can carry out timely clearance to the dust under grinding, through the setting of fan and play dirt frame, make and to clear up the dust after grinding in time, this device is convenient for grind the jumbo size wafer through the cooperation of inside part.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the internal structure of the transmission chamber according to the present invention;
FIG. 3 is a schematic view of the internal structure of the clamping frame according to the present invention;
FIG. 4 is a schematic view of the internal structure of the polishing frame according to the present invention.
In the figure: 1. a support; 2. a damping spring; 3. a controller; 4. a control panel; 5. a dust outlet frame; 6. a fan; 7. a first motor; 8. grinding the frame; 9. a frame support; 10. a transmission chamber; 11. a clamping frame; 12. a second motor; 13. a threaded rod; 14. a connecting plate; 15. a spring; 16. a clamping block; 17. a brush head; 18. a grinding head.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an embodiment: a large-size wafer grinding device comprises a support 1, wherein two damping springs 2 are arranged on the support 1, the two damping springs 2 are arranged at forty-five-degree oblique angles on the support 1, a controller 3 is arranged on the outer wall of the support 1, a control panel 4 is arranged on the outer wall of the support 1, a frame support 9 is arranged at the top of the support 1, a dust outlet frame 5 is arranged on the inner wall of the frame support 9, the top of the dust outlet frame 5 is in an open shape, an inclined plane is arranged inside the dust outlet frame 5, the output end of the dust outlet frame 5 penetrates through the inner wall of the frame support 9 and extends to the outside of the frame support, a fan 6 is arranged on the inner wall of the frame support 9, a first motor 7 is arranged on the inner wall of the frame support 9, a grinding frame 8 is arranged at the output end of the first motor 7, the mounting position of the grinding frame 8 is positioned right below a clamping frame 11, and the mounting position, a transmission chamber 10 is arranged on the inner wall of the frame bracket 9, a second motor 12 is arranged on the inner wall of the transmission chamber 10, a threaded rod 13 is arranged at the output end of the second motor 12, a connecting plate 14 is connected on the threaded rod 13 in a threaded manner, one end of the connecting plate 14, which is provided with a clamping frame 11, penetrates through the side wall of the transmission chamber 10 and extends to the outside of the transmission chamber 10, a slide bar is arranged inside the transmission chamber 10 and is arranged on two sides of the threaded rod 13, this slide bar runs through connecting plate 14, has played the spacing effect of connecting plate 14, centre gripping frame 11 is installed to the one end of connecting plate 14, install spring 15 on the inner wall of centre gripping frame 11, clamp splice 16 is installed to the one end of spring 15, spring 15 and clamp splice 16 are the multiunit and set up in the inside of centre gripping frame 11 with the form of annular array, install the protective layer on the outer wall of clamp splice 16, grind the top of frame 8 and install brush head 17, grind the top of frame 8 and install grinding head 18.
The working principle is as follows: firstly, a large-size wafer to be ground is placed in a clamping frame 11, the large-size wafer can be clamped on the clamping frame 11 through the matching of a spring 15 and a clamping block 16, then a second motor 12 is started through a controller 3 and a control panel 4, a threaded rod 13 is driven to rotate when the second motor 12 rotates, a connecting plate 14 is driven to do lifting motion in the rotation process of the threaded rod 13, the large-size wafer on the clamping frame 11 is further driven to do lifting motion, when the clamping frame 11 drives the large-size wafer to descend to the top of a grinding frame 8, a first motor 7 is started through the controller 3 and the control panel 4, the grinding frame 8 is driven to rotate by the first motor 7, the large-size wafer is ground through a brush head 18 while the grinding frame 8 rotates, ground dust is brushed away by a grinding head 17, and then a fan 6 is started through the controller 3 and the control panel 4, the fan 6 blows the dust out of the dust frame 5, and then blows away the dust, so that the grinding can be completed.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or scope of the present invention. Accordingly, the embodiments of the invention are exemplary, but not limiting. The scope of the invention is indicated by the appended claims rather than by the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. Jumbo size wafer grinder includes support (1), its characterized in that: the shock absorption device is characterized in that a shock absorption spring (2) is installed on the support (1), a controller (3) is installed on the outer wall of the support (1), a control panel (4) is installed on the outer wall of the support (1), a frame support (9) is installed at the top of the support (1), a dust outlet frame (5) is installed on the inner wall of the frame support (9), a fan (6) is installed on the inner wall of the frame support (9), a first motor (7) is installed on the inner wall of the frame support (9), a grinding frame (8) is installed at the output end of the first motor (7), a transmission chamber (10) is installed on the inner wall of the frame support (9), a second motor (12) is installed on the inner wall of the transmission chamber (10), a threaded rod (13) is installed at the output end of the second motor (12), and a connecting plate (14) is connected to the threaded rod (, centre gripping frame (11) are installed to the one end of connecting plate (14), install spring (15) on the inner wall of centre gripping frame (11), clamp splice (16) are installed to the one end of spring (15), brush head (17) are installed at the top of grinding frame (8), grinding head (18) are installed at the top of grinding frame (8).
2. The large size wafer polishing apparatus as set forth in claim 1, wherein: the top of the dust outlet frame (5) is in an open shape, an inclined plane is arranged inside the dust outlet frame (5), and the output end of the dust outlet frame (5) penetrates through the inner wall of the frame support (9) and extends to the outside of the frame support.
3. The large size wafer polishing apparatus as set forth in claim 1, wherein: the mounting position of the grinding frame (8) is located right below the clamping frame (11), and the mounting position of the fan (6) is located on the right side of the grinding frame (8).
4. The large size wafer polishing apparatus as set forth in claim 1, wherein: one end of the connecting plate (14) provided with the clamping frame (11) penetrates through the side wall of the transmission chamber (10) and extends to the outside of the transmission chamber (10).
5. The large size wafer polishing apparatus as set forth in claim 1, wherein: the number of damping spring (2) is two, two damping spring (2) are forty-five degrees oblique angle and install on support (1).
6. The large size wafer polishing apparatus as set forth in claim 1, wherein: the spring (15) and the clamping block (16) are in multiple groups and are arranged inside the clamping frame (11) in an annular array mode, and a protective layer is arranged on the outer wall of the clamping block (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011447572.6A CN112676954A (en) | 2020-12-09 | 2020-12-09 | Large-size wafer grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011447572.6A CN112676954A (en) | 2020-12-09 | 2020-12-09 | Large-size wafer grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112676954A true CN112676954A (en) | 2021-04-20 |
Family
ID=75448465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011447572.6A Pending CN112676954A (en) | 2020-12-09 | 2020-12-09 | Large-size wafer grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112676954A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040203323A1 (en) * | 2003-04-10 | 2004-10-14 | Samsung Electronics Co., Ltd | Chemical mechanical polishing apparatus |
| CN106938436A (en) * | 2017-05-05 | 2017-07-11 | 苍南博雅科技有限公司 | A kind of grinding wafer equipment for Electronic products manufacturing |
| CN107363696A (en) * | 2016-05-12 | 2017-11-21 | 南通市万通钢管有限公司 | A kind of strip derusting process |
| CN206689856U (en) * | 2017-05-18 | 2017-12-01 | 中建八局第一建设有限公司 | A kind of toilet's large area epoxide terrace construction sanding apparatus |
| CN108908074A (en) * | 2018-08-31 | 2018-11-30 | 江苏英锐半导体有限公司 | A kind of wafer burnishing device |
| CN108922847A (en) * | 2018-09-12 | 2018-11-30 | 江苏英锐半导体有限公司 | A kind of face grinder assembly for wafer production processing |
| CN110788706A (en) * | 2019-10-21 | 2020-02-14 | 大同新成新材料股份有限公司 | Intelligent equipment for semiconductor material production and use method thereof |
| CN210335531U (en) * | 2019-06-20 | 2020-04-17 | 朱慧勇 | Nylon brush roller containing abrasive |
| CN210435941U (en) * | 2019-07-25 | 2020-05-01 | 苏州译品芯半导体有限公司 | Jig for processing semiconductor chip |
| CN210435940U (en) * | 2019-07-18 | 2020-05-01 | 苏州译品芯半导体有限公司 | Semiconductor chip grinding device |
-
2020
- 2020-12-09 CN CN202011447572.6A patent/CN112676954A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040203323A1 (en) * | 2003-04-10 | 2004-10-14 | Samsung Electronics Co., Ltd | Chemical mechanical polishing apparatus |
| CN107363696A (en) * | 2016-05-12 | 2017-11-21 | 南通市万通钢管有限公司 | A kind of strip derusting process |
| CN106938436A (en) * | 2017-05-05 | 2017-07-11 | 苍南博雅科技有限公司 | A kind of grinding wafer equipment for Electronic products manufacturing |
| CN206689856U (en) * | 2017-05-18 | 2017-12-01 | 中建八局第一建设有限公司 | A kind of toilet's large area epoxide terrace construction sanding apparatus |
| CN108908074A (en) * | 2018-08-31 | 2018-11-30 | 江苏英锐半导体有限公司 | A kind of wafer burnishing device |
| CN108922847A (en) * | 2018-09-12 | 2018-11-30 | 江苏英锐半导体有限公司 | A kind of face grinder assembly for wafer production processing |
| CN210335531U (en) * | 2019-06-20 | 2020-04-17 | 朱慧勇 | Nylon brush roller containing abrasive |
| CN210435940U (en) * | 2019-07-18 | 2020-05-01 | 苏州译品芯半导体有限公司 | Semiconductor chip grinding device |
| CN210435941U (en) * | 2019-07-25 | 2020-05-01 | 苏州译品芯半导体有限公司 | Jig for processing semiconductor chip |
| CN110788706A (en) * | 2019-10-21 | 2020-02-14 | 大同新成新材料股份有限公司 | Intelligent equipment for semiconductor material production and use method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210420 |
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| RJ01 | Rejection of invention patent application after publication |