CN112025506B - Pulling-up type silicon wafer polishing device capable of stably polishing and polishing method thereof - Google Patents
Pulling-up type silicon wafer polishing device capable of stably polishing and polishing method thereof Download PDFInfo
- Publication number
- CN112025506B CN112025506B CN202010947576.4A CN202010947576A CN112025506B CN 112025506 B CN112025506 B CN 112025506B CN 202010947576 A CN202010947576 A CN 202010947576A CN 112025506 B CN112025506 B CN 112025506B
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- polishing
- silicon wafer
- plate
- rotating shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 146
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 146
- 239000010703 silicon Substances 0.000 title claims abstract description 146
- 238000005498 polishing Methods 0.000 title claims abstract description 129
- 239000002965 rope Substances 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000000694 effects Effects 0.000 claims description 15
- 230000000087 stabilizing Effects 0.000 claims description 11
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 230000001276 controlling effect Effects 0.000 claims description 3
- 230000000875 corresponding Effects 0.000 claims description 2
- 238000007517 polishing process Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 8
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000011111 cardboard Substances 0.000 description 5
- 230000002708 enhancing Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 241000883990 Flabellum Species 0.000 description 2
- 230000004301 light adaptation Effects 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 206010024796 Logorrhoea Diseases 0.000 description 1
- 241000124033 Salix Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000903 blocking Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0007—Movable machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
Abstract
The invention relates to the technical field of silicon wafer polishing devices and discloses a pulling-up type silicon wafer polishing device capable of stably polishing and a polishing method thereof. The invention solves the problems that the prior silicon wafer can not be stably polished when being polished, and the silicon wafer is damaged due to uneven polishing force adjustment in the polishing process, so that the yield of the silicon wafer is reduced in the processing process. According to the silicon wafer polishing machine, the motor B of the pulling-up mechanism works, so that the rotating shaft B rotates, the rotating drum rotates and drives the ropes on the two sides to move, the annular base at the other end of each rope can stably move upwards, polishing is facilitated, polishing is more stable, use is facilitated, silicon wafers are protected from being broken during polishing, and the stability of the polished silicon wafers is improved.
Description
The application is filed on a separate case of a silicon wafer polishing device which is applied for 4-11 th of 2018 and has the application number of CN 201810318096.4 and the name of the invention is a pulling-up type silicon wafer polishing device capable of stably polishing.
Technical Field
The invention relates to the technical field of silicon wafer polishing devices, in particular to a pulling-up type silicon wafer polishing device capable of stably polishing and a polishing method thereof.
Background
Photovoltaic: the solar photovoltaic power generation system is a novel power generation system which directly converts solar radiation energy into electric energy by utilizing the photovoltaic effect of a solar cell semiconductor material and has two modes of independent operation and grid-connected operation. And the silicon element with the content of 25.8 percent in the crust provides an inexhaustible source for the production of monocrystalline silicon. Since silicon is one of the most abundant elements in the earth's crust, the reserve advantage is also one of the reasons that silicon is the main material for photovoltaics for solar cells, such as those products destined for large-scale market.
But the setting of polishing need be carried out in present silicon chip processing, and present silicon chip when polishing, can not be stable polish, often can have the dynamics of polishing adjustment uneven simultaneously and can damage the silicon chip at the in-process of polishing, can lead to the silicon chip in processing, the yield reduces, is unfavorable for becoming the essential material of photovoltaic.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a pulling-up type silicon wafer polishing device capable of stably polishing and a polishing method thereof, and solves the problems that the conventional silicon wafer cannot be stably polished during polishing, and the silicon wafer is damaged due to uneven polishing force adjustment in the polishing process, so that the yield of the silicon wafer is reduced during processing.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a silicon chip grinding device that formula of drawing to rise can stably polish and polishing method thereof, which comprises a working plate, the equal fixedly connected with mounting panel in the left and right sides at working plate top, the top fixedly connected with diaphragm of two mounting panels, five through-holes have been seted up at the top of diaphragm, the inside of through-hole is provided with removes grinding machanism, the equal fixedly connected with curb plate in the left and right sides at the top of diaphragm, one side that two curb plates are close to each other is provided with stabilizing mean, the top of two curb plates is provided with draws high mechanism, the right side fixedly connected with fixed plate of diaphragm and working plate, the right side fixedly connected with handle of fixed plate, the rubber strip has been cup jointed on the surface of handle, the equal fixedly connected with universal wheel in the left and right sides of working plate bottom, the universal wheel is provided with on.
Preferably, the movable polishing mechanism comprises five vertical rods, the bottoms of the corresponding vertical rods penetrate through the through holes and are fixedly connected with U-shaped fixture blocks, the bottom of the inner wall of each U-shaped fixture block is fixedly connected with a servo motor A, the output end of the bottom of the servo motor A is fixedly connected with a rotating shaft A, the bottom of the rotating shaft A is fixedly connected with a polishing cutter, the tops of the five vertical rods are fixedly connected with a long rod, the bottom of the long rod is fixedly connected with a telescopic spring A positioned between every two adjacent vertical rods, the bottom of the telescopic spring A is fixedly connected with the transverse plate, by arranging the telescopic spring A, when the vertical rods move up and down, the telescopic spring A compresses or resets and provides thrust for the long rod, so that the silicon wafer is protected from being broken during polishing, the stability of the polished silicon wafer is improved, annular bases are fixedly connected to the left side and the right side of the top of the long rod, perpendicular bisector with the stock between two annular base sets up as symmetry axis symmetry, through setting up removal grinding machanism, the montant, U type fixture block, servo motor A, pivot A, the cutter of polishing, the stock, annular base, reciprocate under the effect of pulling up the mechanism through the montant, make the cutter of polishing of montant below can change and the silicon chip between the interval, and be convenient for polish the silicon chip, it is more stable when making the silicon chip polish, also hinder process on next step when the rebound simultaneously, the work efficiency that the silicon chip polished has been improved, and the yield of silicon chip has also been improved.
Preferably, stabilizing mean includes U type cardboard, the quantity of U type cardboard is two, and two U type cardboards are close to one side mutually all with between the stock fixed connection, swing joint has pivot C between the both sides of U type cardboard inner wall, pivot C's fixed connection has the gear on the surface, the gear is kept away from one side meshing of stock and is had the pinion rack, the pinion rack keep away from between gear one side and the curb plate fixed connection, through setting up stabilizing mean, U type cardboard, pivot C, the gear, the pinion rack, under the effect of pulling mechanism, make the stock reciprocate, thereby make the gear move on the pinion rack, make this grinding device at work, can not skew about, be convenient for polish, make to polish more stable, conveniently use, also protected the silicon chip can not be by the bits of broken when polishing, the stability of the silicon chip of polishing of improvement.
Preferably, the lifting mechanism comprises a top plate, fixed pulleys are fixedly connected to the left side and the right side of the top plate, two clamping plates are fixedly connected to the center of the top plate, a motor B is fixedly connected between the two clamping plates, a rotating shaft B is fixedly connected to the output end of the bottom of the motor B, a rotating drum is fixedly connected to the surface of the rotating shaft B, ropes are fixedly connected to the left side and the right side of the rotating drum, the other end of each rope penetrates through the top plate through the nearest fixed pulley and is fixedly connected with the annular base, the bottom of the rotating shaft B penetrates through the top plate and is fixedly connected with a fan blade shell, four groups of air flow rate inclined plates are fixedly connected between the top and the bottom of the inner wall of the fan blade shell, 2-5 elastic horizontal rods are fixedly connected between two adjacent air flow rate inclined plates of each group, each elastic horizontal rod has an elastic effect, and cannot cause damage between the air flow rate inclined plates due to air flow, the distance between two adjacent elastic horizontal rods is equal, and the angle Q between the air flow velocity inclined plate and the horizontal plane1The silicon wafer polishing device has the advantages that the silicon wafer polishing device is 75 degrees, a plurality of air flow rate inclined plates are arranged, by utilizing the principle of air flow, when a fan blade shell rotates clockwise, air passes through between the two air flow rate inclined plates and drives the air flow to move downwards, slight heat dissipation can be carried out on the lower part, or anticlockwise rotation is carried out, the air flow upwards carries out heat dissipation, the condition that the motor B does not consume power to damage a machine is ensured, the fan can slightly rotate when the rotating shaft B rotates through the arrangement of the rotating shaft B and the fan blade shell, a slight wind can be generated, electrical elements can be ensured not to be burnt out, the silicon wafer polishing device is convenient to use, the silicon wafer polishing device has the effect of enhancing the practicability, and the silicon wafer polishing device can rotate the rotating shaft B and rotate the rotating drum through the arrangement of a pulling-up mechanism, the top plate, the fixed pulley, the clamping plate, the motor B, the rotating shaft B, the rotating drum, the rope and the fan blade shell work through the pulling-up mechanism, and the rope at two sides is driven to move, so that the annular base at the other end of the rope can move upwards stably, and the rope is convenient to polish and can be used for polishingThe silicon wafer polishing machine has the advantages that polishing is more stable, the use is convenient, the silicon wafer is protected from being broken when being polished, and the stability of the polished silicon wafer is improved.
Preferably, the placing mechanism comprises a connecting base, five notches A are formed in the top of the connecting base, a notch B is formed in the left side and the right side of the inner wall of the notch A, the notch A is located under the polishing cutter, the top of the connecting base is in threaded connection with positioning bolts located in the left side and the right side of the notch A, the base is connected through the arrangement, the notch A, the notch B and the positioning bolts are arranged, the silicon wafer can be inserted through the notch B, the positioning bolts on the two sides are fixed, the polishing cutter can enter the notch A and polish the silicon wafer from the notch A when working, the silicon wafer is not easy to move and is convenient to polish, the polishing is more stable, the use is convenient, the working efficiency of polishing the silicon wafer is improved, and the yield of the silicon wafer is.
Preferably, mutual adaptation between gear and the pinion rack through setting up pinion rack and gear, pinion rack and the gear of mutual adaptation for the gear is in the time of the pivoted, agrees with and can not take place the phenomenon of blocking.
Preferably, the side of the rotating cylinder (706) is concave, 30-40 conical protrusions (711) are fixedly connected to the concave of the rotating cylinder (706), each group of conical protrusions (711) is annularly arranged, the concave is arranged to enable the rope to be not prone to falling off when winding and not prone to being blocked by arranging the rotating cylinder, the conical protrusions (711) are arranged, the plurality of conical protrusions (711) can limit the rope to be not separated, and the phenomenon that the rope is blocked secondarily is avoided.
Preferably, the rope is a thin steel wire rope, and the toughness of the rope is guaranteed by the aid of the rope, so that the rope is not easy to damage and is convenient for normal operation of silicon wafer processing.
Preferably, the number of the fan blade shells is four, and the four fan blade shells are symmetrically arranged by taking the center of the bottom of the rotating shaft B as a symmetric center.
The working principle is as follows: the motor B of the pulling-up mechanism works to enable the rotating shaft B to rotate, the rotating drum rotates and drives the ropes on two sides to move, so that a silicon wafer can be stably moved upwards by the annular base at the other end of each rope, the silicon wafer can be inserted into the notch B and fixed through the positioning bolts on two sides, a polishing cutter can enter from the notch A and can be polished during working, the silicon wafer is not easy to move, meanwhile, the motor B of the pulling-up mechanism works reversely, the telescopic spring A resets and provides a thrust force for the long rod when the vertical rod moves downwards by utilizing the elastic action of the telescopic spring A, the long rod moves up and down under the action of the pulling-up mechanism, so that the gear plate moves on the gear plate, the polishing device cannot deviate left and right during working, the vertical rod moves up and down under the action of the pulling-up mechanism, and the polishing cutter below the vertical rod can change the distance between the gear plate and the silicon wafer, and the silicon wafer is convenient to polish, so that the silicon wafer is more stable to polish, and meanwhile, the next process is not hindered when the silicon wafer moves upwards, the working efficiency of polishing the silicon wafer is improved, and the yield of the silicon wafer is also improved.
(III) advantageous effects
The invention provides a pulling-up type silicon wafer polishing device capable of stably polishing and a polishing method thereof. The method has the following beneficial effects:
(1) according to the silicon wafer polishing machine, the pulling-up mechanism, the top plate, the fixed pulley, the clamping plate, the motor B, the rotating shaft B, the rotating drum, the rope and the fan blade shell are arranged, the motor B of the pulling-up mechanism works to enable the rotating shaft B to rotate, the rotating drum rotates and drives the ropes on two sides to move, the annular base at the other end of each rope can stably move upwards, polishing is facilitated, polishing is more stable, use is facilitated, the silicon wafer is protected from being broken during polishing, and the stability of the polished silicon wafer is improved.
(2) According to the silicon wafer polishing device, the movable polishing mechanism, the vertical rod, the U-shaped clamping block, the servo motor A, the rotating shaft A, the polishing cutter, the long rod and the annular base are arranged, and the vertical rod moves up and down under the action of the lifting mechanism, so that the distance between the polishing cutter below the vertical rod and a silicon wafer can be changed, the silicon wafer is conveniently polished, the silicon wafer is more stable in polishing, meanwhile, the next step of working procedure is not hindered in upward movement, the working efficiency of polishing the silicon wafer is improved, and the yield of the silicon wafer is also improved.
(3) According to the silicon wafer polishing device, the telescopic spring A is arranged, and the elastic action of the telescopic spring A is utilized, so that when the vertical rod moves up and down, the telescopic spring A is compressed or reset, and a thrust is given to the long rod, so that a silicon wafer is protected from being broken during polishing, and the stability of the polished silicon wafer is improved.
(4) According to the silicon wafer polishing device, the stabilizing mechanism, the U-shaped clamping plate, the rotating shaft C, the gear and the toothed plate are arranged, and under the action of the pulling mechanism, the long rod moves up and down, so that the gear moves on the toothed plate, the polishing device cannot deflect left and right during working, polishing is facilitated, polishing is more stable, use is facilitated, the silicon wafer cannot be broken during polishing, and the stability of the polished silicon wafer is improved.
(5) According to the silicon wafer polishing device, the rotating shaft B and the fan blade shell are arranged, so that the fan can slightly rotate when the rotating shaft B rotates, a piece of breeze can be generated, the electric appliance element can be prevented from being burnt out, the silicon wafer polishing device is convenient to use, and the silicon wafer polishing device has the effect of enhancing the practicability.
(6) According to the silicon wafer polishing device, the connecting base, the notch A, the notch B and the positioning bolts are arranged, so that a silicon wafer can be inserted through the notch B and fixed through the positioning bolts on two sides, a polishing cutter can enter from the notch A and polish the silicon wafer in working, the silicon wafer is not easy to move and convenient to polish, the polishing is more stable and convenient to use, the working efficiency of polishing the silicon wafer is improved, and the yield of the silicon wafer is also improved.
(7) The invention ensures the toughness of the rope by arranging the rope, is not easy to damage and is convenient for the normal operation of silicon wafer processing.
(8) The toothed plate and the gear are arranged, and the toothed plate and the gear are matched with each other, so that the gear is matched and cannot be clamped when rotating.
(9) The rope winding machine is provided with the rotary drum, and the concave surface enables the rope not to fall easily when being wound and is not clamped.
(10) Set up a plurality of air flow rate hang plates, utilize the principle that the air flows, flabellum shell is in clockwise rotation, and the air passes between two air flow rate hang plates to drive the air current and move down, can carry out slight heat dissipation to the below, perhaps anticlockwise rotation, the air current upwards dispels the heat, has guaranteed that motor B can not the consumption and damage the machine.
(11) The rope can be limited by the conical bulges, so that the phenomenon of secondary clamping is avoided.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic structural diagram of a mobile polishing mechanism according to the present invention;
FIG. 3 is a schematic structural view of the securing mechanism of the present invention;
FIG. 4 is a schematic structural view of the pulling mechanism of the present invention;
FIG. 5 is a schematic view of the placement mechanism of the present invention;
FIG. 6 is a schematic perspective view of an air willow inclined plate according to the present invention;
fig. 7 is an enlarged view of a portion a in fig. 4.
In the figure: 1 working plate, 2 mounting plates, 3 transverse plates, 4 through holes, 5 moving grinding mechanisms, 501 vertical rods, 502U-shaped fixture blocks, 503 servo motors A, 504 rotating shafts A, 505 grinding cutters, 506 long rods, 507 extension springs A, 508 annular bases, 6 stabilizing mechanisms, 601U-shaped fixture plates, 602 rotating shafts C, 603 gears, 604 toothed plates, 7 pulling mechanisms, top plates 701, 702 fixed pulleys, 703 clamping plates, 704 motors B, 705 rotating shafts B, 706 rotating cylinders, 707 ropes, 708 fan blade shells, 709 air flow rate inclined plates, 710 elastic horizontal rods, 711-shaped protrusions, 8 fixing plates, 9 handles, 10 universal wheels, 11 wheel brakes, 12 placement mechanisms, 1201 connecting bases, 1202 notch A, 1203B, 1204 positioning bolts and 13 side plates.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, the present invention provides a technical solution: the utility model provides a silicon chip grinding device that formula of drawing can stably polish and polishing method thereof, including working plate 1, the equal fixedly connected with mounting panel 2 in the left and right sides at 1 top of working plate, the top fixedly connected with diaphragm 3 of two mounting panels 2, five through-holes 4 have been seted up at the top of diaphragm 3, the inside of through-hole 4 is provided with removes grinding machanism 5, the equal fixedly connected with curb plate 13 in the left and right sides at the top of diaphragm 3, one side that two curb plate 13 are close to each other is provided with stabilizing mean 6, the top of two curb plates 13 is provided with draws and rises mechanism 7, the right side fixedly connected with fixed plate 8 of diaphragm 3 and working plate 1, the right side fixedly connected with handle 9 of fixed plate 8, the rubber strip has been cup jointed on the surface of handle 9, the equal fixedly connected with universal wheel 10 in the left and right sides of 1 bottom of working plate, the universal wheel 10 is provided with wheel on the surface and stops 11, the top of working plate 1 is provided with the placement machine structure 12 that is located between two mounting panels 2.
As shown in fig. 2, the movable polishing mechanism 5 includes five vertical rods 501, the bottom of each vertical rod 501 penetrates through the through hole 4 and is fixedly connected with a U-shaped fixture block 502, the bottom of the inner wall of the U-shaped fixture block 502 is fixedly connected with a servo motor a503, the output end of the bottom of the servo motor a503 is fixedly connected with a rotating shaft a504, the bottom of the rotating shaft a504 is fixedly connected with a polishing cutter 505, the tops of the five vertical rods 501 are fixedly connected with a long rod 506, the bottom of the long rod 506 is fixedly connected with a telescopic spring a507 positioned between two adjacent vertical rods 501, the bottom of the telescopic spring a507 is fixedly connected with the horizontal plate 3, by setting the telescopic spring a507, when the vertical rods 501 move up and down, the telescopic spring a507 compresses or resets, and provides a thrust to the long rod 506, thereby protecting the silicon wafer from being broken during polishing, and improving the stability of the silicon wafer being polished, the equal fixedly connected with annular base 508 in both sides about stock 506 top, use the perpendicular bisector of stock 506 to set up as symmetry axis symmetry between two annular bases 508, through setting up removal grinding machanism 5, montant 501, U type fixture block 502, servo motor A503, pivot A504, the cutter 505 of polishing, stock 506, annular base 508, reciprocate under the effect of pulling up mechanism 7 through montant 501, make the cutter 505 of polishing of montant 501 below can change and the interval between the silicon chip, and be convenient for polish the silicon chip, it is more stable when making the silicon chip polish, also hinder process on next step when the rebound simultaneously, the work efficiency that the silicon chip was polished has been improved, and the yield of silicon chip has also been improved.
As shown in fig. 3, the stabilizing mechanism 6 includes two U-shaped clamping plates 601, the two U-shaped clamping plates 601 are provided, and both sides of the two U-shaped clamping plates 601 close to each other are fixedly connected to the long rod 506, a rotating shaft C602 is movably connected between the two sides of the inner wall of the U-shaped clamping plate 601, a gear 603 is fixedly connected to the surface of the rotating shaft C602, a toothed plate 604 is engaged with one side of the gear 603 away from the long rod 506, the gear 603 and the toothed plate 604 are adapted to each other, by providing the toothed plate 604 and the gear 603, the toothed plate 604 and the gear 603 adapted to each other, the gear 603 is adapted to each other and does not cause a jamming phenomenon when rotating, one side of the gear 603 away from the gear 603 of the toothed plate 604 is fixedly connected to the side plate 13, by providing the stabilizing mechanism 6, the U-shaped clamping plates 601, the rotating shaft C602, the gear 603 and the toothed plate 604, under the action of the lifting mechanism 7, the long rod 506 moves up and down, so that the gear 603 moves on the toothed plate 604, make this grinding device in work, can not be to controlling the skew, be convenient for polish more stably, conveniently use, also protected the silicon chip can not be by the garrulous bad when polishing, the stability of the silicon chip of polishing of improvement.
As shown in fig. 4, 6 and 7, the lifting mechanism 7 includes a top plate 701, fixed pulleys 702 are fixedly connected to left and right sides of the top plate 701, two clamping plates 703 are fixedly connected to a center of a top of the top plate 701, a motor B704 is fixedly connected between the two clamping plates 703, an output end of a bottom of the motor B704 is fixedly connected with a rotating shaft B705, a rotating drum 706 is fixedly connected to a surface of the rotating shaft B705, a side surface of the rotating drum 706 is concave, and 30-40 conical rollers are fixedly connected to a concave surface of the rotating drum 706The circular bulges 711 are annularly arranged between each group of the circular bulges 711, the rotating drum is arranged, the concave surface is arranged to ensure that the rope is not easy to fall off when being wound and can not be blocked, the circular bulges 711 are arranged, the plurality of the circular bulges 711 can limit the rope 707 from separating and can not be blocked for the second time, the left side and the right side of the rotating drum 706 are fixedly connected with the rope 707, the rope 707 is a thin steel wire rope, the toughness of the rope is ensured by arranging the rope 707, the rope 707 of the thin steel wire rope is not easy to damage and is convenient for the normal operation of silicon chip processing, the other end of the rope 707 penetrates through the top plate 701 through the nearest fixed pulley 702 and is fixedly connected with the annular base 508, the bottom of the rotating shaft B705 penetrates through the top plate 701 and is fixedly connected with the fan blade shell 708, and four groups of air flow velocity inclined plates 709 are fixedly connected between the top and the bottom of the inner wall of the fan blade shell 708, and 2-5 elastic horizontal rods 710 are fixedly connected between two adjacent air flow velocity inclined plates 709 of each group, the elastic horizontal rods 710 have elastic effect, the air flow velocity inclined plates 709 cannot be damaged due to air flow, the distance between two adjacent elastic horizontal rods 710 is equal, and the angle Q between the air flow velocity inclined plates 709 and the horizontal plane is equal1For 75 degrees (as shown in fig. 6), a plurality of air velocity inclined plates 709 are arranged, by utilizing the principle of air flow, when the fan blade shell 709 rotates clockwise, air passes through between the two air velocity inclined plates 709 and drives the air flow to move downwards, slight heat dissipation can be carried out on the lower part, or anticlockwise rotation is carried out, the air flow upwards radiates heat, the machine damage caused by power consumption of the motor B is ensured, the number of the fan blade shells 708 is four, the four fan blade shells 708 are symmetrically arranged by taking the center of the bottom of the rotating shaft B705 as a symmetric center, the rotating shaft B705 and the fan blade shells 708 are arranged, the fan 708 can slightly rotate when the rotating shaft B705 rotates, a little wind is generated, electrical components can be ensured not to be burnt out, the silicon wafer polishing device has the effect of enhancing practicability, and the pulling-up mechanism 7 is arranged, The top plate 701, the fixed pulley 702, the clamping plate 703, the motor B704, the rotating shaft B705, the rotary drum 706, the rope 707 and the fan blade shell 708 are operated by the motor B704 of the pulling-up mechanism 7, so that the rotation is realizedAxle B705 rotates, and rotary drum 706 is rotatory to the rope 707 that drives both sides removes, makes the annular base 508 of the rope 707 other end upwards can stable removal, is convenient for polish, makes to polish more stably, conveniently uses, has also protected the silicon chip not broken by the bits of broken glass when polishing, the stability of the silicon chip of polishing of improvement.
As shown in fig. 5, the placing mechanism 12 includes a connecting base 1201, five notches a1202 are opened at the top of the connecting base 1201, notches B1203 have been opened at the left and right sides of the inner wall of the notches a1202, and the notches a1202 are located under the polishing tool 505, the top of the connecting base 1201 is in threaded connection with positioning bolts 1204 located at the left and right sides of the notches a1201, the connecting base 1201 is arranged, the notches a1202, the notches B1203, the positioning bolts 1204 are arranged, so that a silicon wafer can be inserted through the notches B1203, and the positioning bolts 1204 at the two sides are fixed, so that when the silicon wafer is in operation, the polishing tool 505 can enter and polish from the notches a1202, so that the silicon wafer is not easy to move, and is convenient to polish, so that the polishing is more stable, the use is convenient, the work efficiency of polishing the silicon wafer is.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
When the silicon wafer polishing device is used, the motor B704 of the pulling-up mechanism 7 works to enable the rotating shaft B705 to rotate, the rotating drum 706 rotates, the air flow velocity inclined plates 709 rotate, the principle of air flow is utilized, when the fan blade shell 709 rotates clockwise, air passes through the space between the two air flow velocity inclined plates 709 and drives air flow to move downwards, slight heat dissipation can be carried out below the fan blade shell, the ropes 707 on two sides are driven to move, the silicon wafer which can stably move upwards and can move on the annular base 508 on the other end of the rope 707 can be inserted into the notch B1203 and fixed through the positioning bolts 1204 on two sides, when the silicon wafer polishing device works, the polishing cutter 505 can enter from the notch A1202 and polish the silicon wafer, the silicon wafer is not easy to move, meanwhile, the motor B704 of the pulling-up mechanism 7 works in the reverse direction, and the elastic action of the telescopic spring A507 is utilized, when the vertical rod 501 moves downwards, the telescopic spring A507 resets and provides a thrust for the long rod 506, under the effect of pulling up mechanism 7, make stock 506 reciprocate, thereby make gear 603 move on pinion rack 604, make this grinding device in work, can not be to controlling the skew, and reciprocate under the effect of pulling up mechanism 7 through montant 501, make the cutter 505 of polishing of montant 501 below can change and the silicon chip between the interval, and be convenient for polish the silicon chip, it is more stable when making the silicon chip polish, also hinder process on next step when the rebound simultaneously, the work efficiency that the silicon chip was polished has been improved, and the yield of silicon chip has also been improved.
In summary, (1) the silicon wafer polishing machine is provided with the pulling-up mechanism 7, the top plate 701, the fixed pulley 702, the clamping plate 703, the motor B704, the rotating shaft B705, the rotating drum 706, the rope 707 and the fan blade housing 708, wherein the motor B704 of the pulling-up mechanism 7 works to enable the rotating shaft B705 to rotate, the rotating drum 706 to rotate and drive the ropes 707 on two sides to move, so that the annular base 508 on the other end of the rope 707 can stably move upwards, polishing is facilitated, polishing is more stable, use is facilitated, the silicon wafer is protected from being broken during polishing, and the stability of the polished silicon wafer is improved.
(2) According to the silicon wafer polishing device, the movable polishing mechanism 5, the vertical rod 501, the U-shaped fixture block 502, the servo motor A503, the rotating shaft A504, the polishing cutter 505, the long rod 506 and the annular base 508 are arranged, the vertical rod 501 moves up and down under the action of the lifting mechanism 7, so that the distance between the polishing cutter 505 below the vertical rod 501 and a silicon wafer can be changed, the silicon wafer is conveniently polished, the silicon wafer is more stable in polishing, the next process is not hindered when the vertical rod 501 moves up, the working efficiency of silicon wafer polishing is improved, and the yield of the silicon wafer is also improved.
(3) By arranging the extension spring A507 and utilizing the elastic action of the extension spring A507, when the vertical rod 501 moves up and down, the extension spring A507 is compressed or reset, and a thrust is applied to the long rod 506, so that the silicon wafer is protected from being broken during polishing, and the stability of the polished silicon wafer is improved.
(4) According to the silicon wafer polishing device, the stabilizing mechanism 6, the U-shaped clamping plate 601, the rotating shaft C602, the gear 603 and the toothed plate 604 are arranged, and under the action of the pulling mechanism 7, the long rod 506 moves up and down, so that the gear 603 moves on the toothed plate 604, the polishing device cannot deflect left and right during working, polishing is facilitated, polishing is more stable, use is facilitated, a silicon wafer is protected from being broken during polishing, and the stability of the polished silicon wafer is improved.
(5) According to the silicon wafer polishing device, the rotating shaft B705 and the fan blade shell 708 are arranged, so that the fan 708 can slightly rotate when the rotating shaft B705 rotates, a slight wind exists, electrical components can be prevented from being burnt out, the silicon wafer polishing device is convenient to use, and the silicon wafer polishing device has the effect of enhancing practicability.
(6) According to the silicon wafer polishing device, the connecting base 1201, the notch A1202, the notch B1203 and the positioning bolts 1204 are arranged, so that a silicon wafer can be inserted into the notch B1203 and fixed through the positioning bolts 1204 at two sides, the polishing cutter 505 can enter from the notch A1202 and can be polished during working, the silicon wafer is not easy to move and is convenient to polish, the polishing is more stable, the use is convenient, the working efficiency of silicon wafer polishing is improved, and the yield of the silicon wafer is also improved.
(7) According to the silicon wafer processing machine, the ropes 707 are arranged, and the ropes 707 of the thin steel wire ropes ensure the toughness of the ropes 707, are not easy to damage and are convenient for normal operation of silicon wafer processing.
(8) According to the invention, the toothed plate 604 and the gear 603 are arranged, and the toothed plate 604 and the gear 603 are matched with each other, so that the gear 603 is matched and cannot be clamped when rotating.
(9) The drum 706 is arranged, and the concave surface is arranged, so that the rope 707 is not easy to fall off when being wound, and the phenomenon of clamping cannot occur.
(10) Set up a plurality of air flow rate inclined plate 709, utilize the principle that the air flows, flabellum shell 709 passes between two air flow rate inclined plate 709 in clockwise rotation, air to drive the air current downstream, can carry out slight heat dissipation to the below, perhaps anticlockwise rotation, the air current upwards dispels the heat, has guaranteed that motor B can not the consumption and damage the machine.
(11) The plurality of conical protrusions 711 can limit the rope 707 from separating, and the phenomenon of secondary clamping is avoided.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a reference structure" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (1)
1. The utility model provides a silicon chip grinding device that formula of drawing can stabilize and polish, includes working plate (1), its characterized in that: the left side and the right side of the top of the working plate (1) are fixedly connected with mounting plates (2), the top of the two mounting plates (2) is fixedly connected with a transverse plate (3), the top of the transverse plate (3) is provided with five through holes (4), the inside of each through hole (4) is provided with a movable polishing mechanism (5), the left side and the right side of the top of the transverse plate (3) are fixedly connected with side plates (13), one side of each two side plates (13) close to each other is provided with a stabilizing mechanism (6), the top of each two side plates (13) is provided with a pulling mechanism (7), the transverse plate (3) and the right side of the working plate (1) are fixedly connected with a fixed plate (8), the right side of the fixed plate (8) is fixedly connected with a handle (9), a rubber strip is sleeved on the surface of the handle (9), the left side and the right side of the bottom of the working plate (1) are fixedly connected with universal wheels (10), and wheel brakes (11) are arranged on the surface of the universal wheels (10), the top of the working plate (1) is provided with a placing mechanism (12) positioned between the two mounting plates (2);
the lifting mechanism (7) comprises a top plate (701), fixed pulleys (702) are fixedly connected to the left side and the right side of the top plate (701), two clamping plates (703) are fixedly connected to the center of the top plate (701), a motor B (704) is fixedly connected between the two clamping plates (703), a rotating shaft B (705) is fixedly connected to the output end of the bottom of the motor B (704), a rotating drum (706) is fixedly connected to the surface of the rotating shaft B (705), ropes (707) are fixedly connected to the left side and the right side of the rotating drum (706), the other end of each rope (707) penetrates through the top plate (701) through the nearest fixed pulley (702) and is fixedly connected to the annular base (508), the bottom of the rotating shaft B (705) penetrates through the top plate (701) and is fixedly connected to a fan blade shell (708), four groups of air flow velocity inclined plates (709) are fixedly connected between the top and the bottom of the inner wall of the fan blade shell (708), and 2-5 elastic horizontal rods (710) are fixedly connected between two adjacent air flow velocity inclined plates (709) in each group, the distance between two adjacent elastic horizontal rods (710) is equal, and the angle Q between the air flow velocity inclined plates (709) and the horizontal plane1Is 75 degrees;
the rope (707) is a thin steel wire rope;
the fan blade shells (708) are four in number, and the four fan blade shells (708) are symmetrically arranged by taking the center of the bottom of the rotating shaft B (705) as a symmetrical center;
the movable grinding mechanism (5) comprises five vertical rods (501), the number of the vertical rods (501) is five, the bottom of the corresponding vertical rod (501) penetrates through the through hole (4) and is fixedly connected with a U-shaped fixture block (502), the bottom of the inner wall of the U-shaped fixture block (502) is fixedly connected with a servo motor A (503), the output end of the bottom of the servo motor A (503) is fixedly connected with a rotating shaft A (504), the bottom of the rotating shaft A (504) is fixedly connected with a grinding cutter (505), the tops of the five vertical rods (501) are fixedly connected with long rods (506), the bottom of the long rod (506) is fixedly connected with an expansion spring A (507) positioned between two adjacent vertical rods (501), the bottom of the expansion spring A (507) is fixedly connected with the transverse plate (3), the left side and the right side of the top of the long rod (506) are fixedly connected with annular bases (508), and the two annular bases (508) are symmetrically arranged by taking a perpendicular bisector of the long rod (506) as a symmetry axis;
the stabilizing mechanism (6) comprises two U-shaped clamping plates (601), one side, close to each other, of each of the two U-shaped clamping plates (601) is fixedly connected with the long rod (506), a rotating shaft C (602) is movably connected between two sides of the inner wall of each U-shaped clamping plate (601), a gear (603) is fixedly connected to the surface of each rotating shaft C (602), a toothed plate (604) is meshed with one side, far away from the long rod (506), of each gear (603), and one side, far away from the gear (603), of each toothed plate (604) is fixedly connected with the side plate (13);
the placing mechanism (12) comprises a connecting base (1201), five notches A (1202) are formed in the top of the connecting base (1201), notches B (1203) are formed in the left side and the right side of the inner wall of each notch A (1202), the notches A (1202) are located right below the grinding cutter (505), and positioning bolts (1204) located on the left side and the right side of each notch A (1202) are in threaded connection with the top of the connecting base (1201);
the gear (603) and the toothed plate (604) are matched with each other;
the side surface of the rotary drum (706) is concave, 30-40 conical protrusions (711) are fixedly connected to the concave surface of the rotary drum (706), and each group of conical protrusions (711) are annularly arranged;
the polishing method of the pulling-up type silicon wafer polishing device capable of stably polishing comprises the following steps: a motor B (704) of the pulling-up mechanism (7) works, so that a rotating shaft B (705) rotates, a rotating drum (706) rotates and drives ropes (707) at two sides to move, a ring-shaped base (508) at the other end of the rope (707) can be stably inserted upwards to move a silicon wafer through a notch B (1203), and is fixed through positioning bolts (1204) at two sides, so that a grinding cutter (505) can enter from the notch A (1202) and grind the silicon wafer when working, the silicon wafer is not easy to move, meanwhile, the motor B (704) of the pulling-up mechanism (7) works reversely, and the elastic action of an expansion spring A (507) is utilized, when the vertical rod (501) moves downwards, the expansion spring A (507) resets, a thrust is given to the vertical rod (506), the vertical rod (506) moves upwards and downwards under the action of the pulling-up mechanism (7), so that a gear (603) moves on a toothed plate (604), make this grinding device when work, can not to controlling the skew to reciprocate under the effect of pulling up mechanism (7) through montant (501), make the cutter (505) of polishing of montant (501) below can change and the silicon chip between the interval, and be convenient for polish the silicon chip, it is more stable when making the silicon chip polish, also do not hinder process on next step when rebound simultaneously, the work efficiency that the silicon chip was polished has been improved, and the yield of silicon chip has also been improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010947576.4A CN112025506B (en) | 2018-04-11 | 2018-04-11 | Pulling-up type silicon wafer polishing device capable of stably polishing and polishing method thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010947576.4A CN112025506B (en) | 2018-04-11 | 2018-04-11 | Pulling-up type silicon wafer polishing device capable of stably polishing and polishing method thereof |
| CN201810318096.4A CN108515425B (en) | 2018-04-11 | 2018-04-11 | Silicon chip grinding device that formula of drawing can stabilize and polish |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date | |
|---|---|---|---|---|
| CN201810318096.4A Division CN108515425B (en) | 2018-04-11 | 2018-04-11 | Silicon chip grinding device that formula of drawing can stabilize and polish |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112025506A CN112025506A (en) | 2020-12-04 |
| CN112025506B true CN112025506B (en) | 2021-07-27 |
Family
ID=63432332
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010947576.4A Active CN112025506B (en) | 2018-04-11 | 2018-04-11 | Pulling-up type silicon wafer polishing device capable of stably polishing and polishing method thereof |
| CN201810318096.4A Active CN108515425B (en) | 2018-04-11 | 2018-04-11 | Silicon chip grinding device that formula of drawing can stabilize and polish |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810318096.4A Active CN108515425B (en) | 2018-04-11 | 2018-04-11 | Silicon chip grinding device that formula of drawing can stabilize and polish |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN112025506B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109129167A (en) * | 2018-09-18 | 2019-01-04 | 王深洋 | A kind of autogenous mill |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4786233A (en) * | 1986-01-20 | 1988-11-22 | Hitachi, Ltd. | Gas turbine cooled blade |
| CN104128867A (en) * | 2014-07-31 | 2014-11-05 | 广西北流仲礼瓷业有限公司 | Tile polishing machine |
| DE102013014738A1 (en) * | 2013-09-04 | 2015-03-05 | Brigitte Abele | Apparatus and method for adhering samples and coverslips to slides |
| CN204603997U (en) * | 2015-04-07 | 2015-09-02 | 宇宙电路板设备(深圳)有限公司 | End face Plate grinder |
| CN105081913A (en) * | 2015-08-25 | 2015-11-25 | 泉州市佳能机械制造有限公司 | Grinding and polishing device and grinding and polishing machine |
| CN205465519U (en) * | 2016-03-04 | 2016-08-17 | 深圳磨霸智能科技有限公司 | A five -axis machine tool for burnishing and polishing wire drawing |
| CN105922101A (en) * | 2016-06-20 | 2016-09-07 | 苏州华徕光电仪器有限公司 | Polishing device used for lens |
| CN205609987U (en) * | 2016-04-25 | 2016-09-28 | 陈志恭 | Heat dissipation AC low voltage power switch board cabinet |
| CN106346351A (en) * | 2016-12-06 | 2017-01-25 | 无锡昊康通用机械有限公司 | Metal mirror surface polishing machine |
| CN107020556A (en) * | 2017-05-16 | 2017-08-08 | 遵义顺峰汽车零部件制造有限公司 | A kind of automobile sleeve cooling device |
| CN107211645A (en) * | 2017-06-30 | 2017-09-29 | 朱静洁 | It is a kind of to adjust the gardening mower device people of mowing height |
| CN107322426A (en) * | 2017-07-19 | 2017-11-07 | 刘奇美 | A kind of surface of steel plate handling implement being moved easily |
| CN107520726A (en) * | 2017-10-11 | 2017-12-29 | 郑州博尔德磨料磨具有限公司 | A kind of multistation is conveniently replaceable the grinding tool of emery wheel |
| CN206869681U (en) * | 2017-03-31 | 2018-01-12 | 中国燃气涡轮研究院江油天诚实业公司 | A kind of grinding synchronization heat sink |
| CN206912968U (en) * | 2017-07-10 | 2018-01-23 | 吴保霞 | A kind of efficient polisher |
| CN107685259A (en) * | 2017-09-30 | 2018-02-13 | 东莞市松研智达工业设计有限公司 | A kind of aluminium alloy wheel hub grinding apparatus |
| CN107877312A (en) * | 2017-11-08 | 2018-04-06 | 镇江市丹徒区顺发船舶螺旋桨有限公司 | A kind of accurately propeller processing sanding apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9695696B2 (en) * | 2013-07-31 | 2017-07-04 | General Electric Company | Turbine blade with sectioned pins |
| CN105570192B (en) * | 2016-02-29 | 2018-08-17 | 李锦标 | A kind of draught fan impeller and its processing method |
| CN106985045A (en) * | 2017-03-28 | 2017-07-28 | 惠州阿瑞斯智能装备有限公司 | A kind of multi-shaft interlocked grinding apparatus |
| CN107813216A (en) * | 2017-11-28 | 2018-03-20 | 桂阳磊腾新材料科技有限公司 | Series classification burnishing device is used in a kind of artificial quartz in lump production |
-
2018
- 2018-04-11 CN CN202010947576.4A patent/CN112025506B/en active Active
- 2018-04-11 CN CN201810318096.4A patent/CN108515425B/en active Active
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4786233A (en) * | 1986-01-20 | 1988-11-22 | Hitachi, Ltd. | Gas turbine cooled blade |
| DE102013014738A1 (en) * | 2013-09-04 | 2015-03-05 | Brigitte Abele | Apparatus and method for adhering samples and coverslips to slides |
| CN104128867A (en) * | 2014-07-31 | 2014-11-05 | 广西北流仲礼瓷业有限公司 | Tile polishing machine |
| CN204603997U (en) * | 2015-04-07 | 2015-09-02 | 宇宙电路板设备(深圳)有限公司 | End face Plate grinder |
| CN105081913A (en) * | 2015-08-25 | 2015-11-25 | 泉州市佳能机械制造有限公司 | Grinding and polishing device and grinding and polishing machine |
| CN205465519U (en) * | 2016-03-04 | 2016-08-17 | 深圳磨霸智能科技有限公司 | A five -axis machine tool for burnishing and polishing wire drawing |
| CN205609987U (en) * | 2016-04-25 | 2016-09-28 | 陈志恭 | Heat dissipation AC low voltage power switch board cabinet |
| CN105922101A (en) * | 2016-06-20 | 2016-09-07 | 苏州华徕光电仪器有限公司 | Polishing device used for lens |
| CN106346351A (en) * | 2016-12-06 | 2017-01-25 | 无锡昊康通用机械有限公司 | Metal mirror surface polishing machine |
| CN206869681U (en) * | 2017-03-31 | 2018-01-12 | 中国燃气涡轮研究院江油天诚实业公司 | A kind of grinding synchronization heat sink |
| CN107020556A (en) * | 2017-05-16 | 2017-08-08 | 遵义顺峰汽车零部件制造有限公司 | A kind of automobile sleeve cooling device |
| CN107211645A (en) * | 2017-06-30 | 2017-09-29 | 朱静洁 | It is a kind of to adjust the gardening mower device people of mowing height |
| CN206912968U (en) * | 2017-07-10 | 2018-01-23 | 吴保霞 | A kind of efficient polisher |
| CN107322426A (en) * | 2017-07-19 | 2017-11-07 | 刘奇美 | A kind of surface of steel plate handling implement being moved easily |
| CN107685259A (en) * | 2017-09-30 | 2018-02-13 | 东莞市松研智达工业设计有限公司 | A kind of aluminium alloy wheel hub grinding apparatus |
| CN107520726A (en) * | 2017-10-11 | 2017-12-29 | 郑州博尔德磨料磨具有限公司 | A kind of multistation is conveniently replaceable the grinding tool of emery wheel |
| CN107877312A (en) * | 2017-11-08 | 2018-04-06 | 镇江市丹徒区顺发船舶螺旋桨有限公司 | A kind of accurately propeller processing sanding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108515425B (en) | 2020-11-13 |
| CN112025506A (en) | 2020-12-04 |
| CN108515425A (en) | 2018-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107544563B (en) | A solar photovoltaic board strutting arrangement for new forms of energy | |
| CN111015501B (en) | Secondary grinding equipment for producing chip silicon | |
| CN107662057B (en) | A kind of manipulator and laser process equipment | |
| CN112025506B (en) | Pulling-up type silicon wafer polishing device capable of stably polishing and polishing method thereof | |
| CN201900532U (en) | Lifting device for crystal lapping machine | |
| CN108609552B (en) | Intelligent machining operation frame | |
| CN211103125U (en) | Edging device is used in solar panel production | |
| CN213351823U (en) | Photovoltaic panel processing equipment assembly for solar energy | |
| CN213212120U (en) | Double-side cleaning assembly of wafer cleaning equipment | |
| CN208133061U (en) | A kind of cutter device for photovoltaic panel | |
| CN208290220U (en) | A kind of adjustable diameter length HIGH-PURITY SILICON crystal-cut equipment | |
| CN209515629U (en) | A kind of device of horizontal transfer silicium wafer | |
| CN214412634U (en) | Photovoltaic solar panel fixing mechanism | |
| CN214756169U (en) | Wind speed and wind power early warning monitoring station powered by solar energy | |
| CN212050124U (en) | Hoisting device is used in processing of photovoltaic board | |
| CN214519256U (en) | Polishing equipment for semiconductor material production | |
| CN211508979U (en) | Solar cell easy to maintain | |
| CN212681900U (en) | Photovoltaic power generation board cleaning device | |
| CN215468907U (en) | Photovoltaic board wafer silk screen laser cutting device | |
| CN210899046U (en) | Solar cell panel's turning device towards sun | |
| CN108447811B (en) | Silicon wafer flower basket and controller thereof | |
| CN211183889U (en) | Solar power generation cell panel strutting arrangement | |
| CN216682810U (en) | Diamond processing is with cutting device who has protective structure | |
| CN217216429U (en) | Rotary supporting structure of solar photovoltaic module | |
| CN209545501U (en) | Photovoltaic module is used in one elite stand |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |