CN112672490B - Preparation method of multilayer circuit board for 5G terminal network card and 5G network card thereof - Google Patents
Preparation method of multilayer circuit board for 5G terminal network card and 5G network card thereof Download PDFInfo
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Abstract
A method for preparing a multilayer circuit board for a 5G terminal network card and the 5G network card thereof are disclosed. The method comprises the steps of providing a substrate, forming a flow guide channel for circulating a phase-change heat exchange medium in the substrate, wherein an inlet and an outlet of the flow guide channel are respectively positioned on the side face of the substrate, a first circuit layer and a second circuit layer are respectively arranged on the top surface and the bottom surface of the substrate, a plurality of through holes are drilled in the first circuit layer and sequentially penetrate through the first circuit layer, the substrate and the second circuit layer, the through holes are communicated with the flow guide channel, heat conduction columns are hermetically arranged in the through holes so as to enable the first circuit layer and the second circuit layer to be electrically connected, the heat conduction columns are in contact with the phase-change heat exchange medium in the flow guide channel, a first electronic element and a first solder mask layer are arranged on at least one first heat conduction column on the top surface of the multilayer circuit board, and a second electronic element and a second solder mask layer are arranged on a second heat conduction column, different from the first heat conduction column, on the bottom surface of the multilayer circuit board.
Description
Technical Field
The invention relates to the technical field of 5G communication circuit boards, in particular to a preparation method of a multilayer circuit board for a 5G terminal network card and the 5G network card.
Background
The fifth generation mobile communication technology (5G) has higher speed and wider bandwidth, the functions of electronic components are more and more, the packaging volume is smaller and smaller, the surface mounting technology increases the mounting density of the electronic components, the effective heat dissipation area is reduced, the processing capacity is stronger and stronger, the 5G network card can generate heat in the working process, the 5G network card is easy to burn due to heat accumulation, the circuit board is required to have higher heat conductivity and heat dissipation capacity, and in addition, the 5G network card needs a high-speed multilayer board to support higher speed and wider bandwidth.
The PCB board is a copper-clad/epoxy glass cloth substrate or a phenolic resin glass cloth substrate, which has excellent electrical performance and processability, but has poor heat dissipation, and generally employs heat dissipation from the surface of the component to the ambient air, and circuit board components are usually radiated outward and flowed through the ambient air by heat dissipation, and other methods such as water cooling, fans, etc. are also available. In the prior art, the addition of a thermal interface to one side of the PCB to improve heat dissipation, such as a large heavy copper block, has prevented the use of a specific side of the board to add components to increase the complexity and functionality of the PCB, thereby limiting the design and use of 5G network cards. Moreover, copper and similar metal blocks are heavy, which may be undesirable for payload-sensitive operations, and they may become detached under rough shipping or other use conditions, thereby preventing efficient transfer of excess heat. The prior art does not transfer heat away through the PCB substrate by a heat sink in thermal communication with the overheating producing components. But this only removes heat from a single side of the PCB, e.g. fans, water cooled equipment, requiring the use of larger and heavier heat sinks to maximize the surface area in thermal communication with excess heat sources, thereby promoting better heat removal. It is still difficult to dissipate the excess heat due to the poor thermal conductivity of the PCB substrate and the limited space available for mounting the heat sink.
With the advent of 5G, which has entered the era of miniaturized, high-density mounting, and high-heat generation assembly, due to the large amount of surface mount components, the heat generated by 5G electronic components is largely transferred to the PCB, and the low thermal conductivity value of the PCB substrate makes it quite difficult to remove the excessive heat from the electronic system. Therefore, the method of removing the excess heat from the PCB in the prior art is less and less effective, thereby hindering the service life and stability of the 5G network card.
The above information disclosed in this background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art.
Disclosure of Invention
The present inventors have conducted intensive studies to achieve the above object, and specifically, a method for manufacturing a multilayer circuit board for a 5G terminal network card includes the steps of:
the method comprises the steps of providing a substrate, forming a flow guide channel for circulating a phase-change heat exchange medium in the substrate, wherein an inlet and an outlet of the flow guide channel are respectively positioned on the side surface of the substrate, the side wall of the inlet is provided with a capillary flow guide structure, the phase-change heat exchange medium is heated and then converted from a liquid state to a gaseous state,
a second step of respectively arranging a first circuit layer and a second circuit layer on the top surface and the bottom surface of the substrate, drilling a plurality of through holes on the first circuit layer, wherein the through holes sequentially penetrate through the first circuit layer, the substrate and the second circuit layer, the through holes are communicated with the flow guide channel, the sectional area of the flow guide channel is larger than that of the through holes,
a third step of hermetically arranging a heat conduction column in the through hole to electrically connect the first circuit layer and the second circuit layer, wherein the heat conduction coefficient of the heat conduction column is greater than that of the first circuit layer or the second circuit layer, the heat conduction column is in contact with the phase change heat exchange medium in the flow guide channel,
a fourth step of repeating the first to third steps several times to form a multilayer circuit board having at least two substrates, two first circuit layers and two second circuit layers, the flow guide channels of each substrate being connected to a condensing unit via an inlet and an outlet respectively to form a cooling flow path through which a phase change heat transfer medium flows, the cooling flow path being connected to a condensing unit for cooling the phase change heat transfer medium, the condensing unit being higher than the multilayer circuit board in a gravity direction,
and fifthly, arranging a first electronic element and bonding a first solder mask layer at least one first heat conduction column on the top surface of the multilayer circuit board, arranging a second electronic element and bonding a second solder mask layer at a second heat conduction column, different from the first heat conduction column, on the bottom surface of the multilayer circuit board, wherein the first electronic element comprises a 5G mobile communication module for 5G communication, a SIM card slot and an Ethernet wiring interface, the second electronic element comprises a power supply module, an MCU chip, a wireless baseband chip, a memory chip and an Ethernet wiring interface, and an antenna interface and a USB interface are arranged on the side surface of the multilayer circuit board.
In the preparation method of the multilayer circuit board for the 5G terminal network card, in the first step, a lower half substrate is provided, a first diversion trench for circulating a phase change heat exchange medium is formed on the upper surface of the lower half substrate, a capillary diversion structure is arranged on the inner wall of an inlet of the first diversion trench,
providing an upper half substrate, forming a second diversion trench for circulating a phase change heat exchange medium on the lower surface of the upper half substrate, arranging a capillary diversion structure on the inner wall of an inlet of the second diversion trench, laminating the first substrate and the second substrate, wherein the first diversion trench and the second diversion trench are overlapped to form a diversion channel.
In the preparation method of the multilayer circuit board for the 5G terminal network card, the first diversion trench is paved with the heat conduction pipe, the first diversion trench and the second diversion trench are overlapped to wrap the heat conduction pipe, the heat conduction pipe forms a diversion channel for circulating a phase change heat exchange medium, and the heat conduction pipe is connected with an inlet at the capillary diversion structure.
In the preparation method of the multilayer circuit board for the 5G terminal network card, in the second step, an insulating layer is pasted on the first circuit layer, the pulse carbon dioxide laser ablates the insulating layer at the position of the through hole to be drilled to expose the copper foil of the first circuit layer, the copper foil is electroplated to form a first metal enhancement layer, similarly, the insulating layer is pasted on the second circuit layer, the pulse carbon dioxide laser ablates the insulating layer at the position of the through hole to be drilled to expose the copper foil of the second circuit layer, then the second metal enhancement layer is electroplated to form a second metal enhancement layer, the pulse carbon dioxide laser drills a hole at the position of the tin layer to sequentially penetrate through the first metal enhancement layer, the first circuit layer, the substrate, the second circuit layer and the second metal enhancement layer, and finally the through hole is cleaned by ethanol.
In the preparation method of the multilayer circuit board for the 5G terminal network card, in the third step, the heat conducting column is a solid silver column, the solid silver column is thermally sealed in the through hole so as to be electrically connected with the first circuit layer and the second circuit layer, and the solid silver column is respectively sealed with the first circuit layer and the first metal enhancement layer thereof, the second circuit layer and the second metal enhancement layer thereof.
In the preparation method of the multilayer circuit board for the 5G terminal network card, the inlet of the flow guide channel of each substrate is connected with the condensation unit through a first header pipe, and the outlet of the flow guide channel of each substrate is connected with the condensation unit through a second header pipe.
In the preparation method of the multilayer circuit board for the 5G terminal network card, the condensation unit is a snake-shaped condensation pipe, and the snake-shaped condensation pipe is provided with radiating fins.
In the preparation method of the multilayer circuit board for the 5G terminal network card, the even layer or odd layer of the substrate in the multilayer circuit board is provided with a flow guide channel.
In the preparation method of the multilayer circuit board for the 5G terminal network card, the substrate comprises an organic insulating medium layer and a prepreg layer, and the flow guide channels are S-shaped channels formed by staggered groove walls uniformly distributed in the substrate.
According to another aspect of the invention, a 5G network card comprises a multilayer circuit board, wherein the multilayer circuit board is manufactured by the preparation method of the multilayer circuit board for the 5G terminal network card.
ADVANTAGEOUS EFFECTS OF INVENTION
The method for preparing the multilayer circuit board for the 5G terminal network card is characterized in that a flow guide channel for circulating the phase-change heat exchange medium is arranged in a substrate, the valuable use space of the upper surface and the lower surface of the multilayer circuit board is not occupied, the inlet and the outlet of the flow guide channel are respectively positioned on the side surface of the substrate, the high-density installation is further facilitated, the side wall of the inlet is provided with a capillary flow guide structure, the flowability of the liquid phase-change heat exchange medium flowing into the flow guide channel is enhanced, a plurality of through holes are drilled on a first circuit layer and sequentially penetrate through the first circuit layer, the substrate and a second circuit layer, the through holes are communicated with the flow guide channel, heat conduction columns are hermetically arranged in the through holes so as to enable the first circuit layer to be electrically connected with the second circuit layer, the heat conduction columns are in contact with the phase-change heat exchange medium in the flow guide channel, and the heat generated by electronic components on the upper surface and the lower surface is transferred into the phase-change heat exchange medium to be rapidly cooled, the sectional area of the flow guide channel is larger than that of the through hole, so that the heat conduction column is immersed in the phase-change heat exchange medium, the heat conductivity coefficient of the heat conduction column is larger than that of the first circuit layer or the second circuit layer, the heat conduction efficiency is improved, the flow guide channel of each substrate is respectively connected with the condensing unit through the inlet and the outlet to form a cooling flow path for circulating the phase-change heat exchange medium, the phase-change heat exchange medium absorbing heat flows out through the cooling flow path, a new phase-change heat exchange medium enters the flow guide channel again through the inlet, the condensing unit cools and converts the gaseous phase-change heat exchange medium into the liquid phase-change heat exchange medium, the condensing unit is higher than the multilayer circuit board in the gravity direction, and the gaseous phase-change heat exchange medium is favorably lifted into the condensing unit for cooling, and the first electronic element and the second electronic element on the upper surface and the lower surface can be cooled simultaneously, the heat dissipation effect of the multilayer circuit board for 5G communication is obviously improved, the upper surface space position and the lower surface space position of the circuit board are prevented from being obstructed, the design and the use of a PCB are not limited, the weight of the multilayer circuit board cannot be increased, the sensitive operation of an effective load cannot be influenced, the applicability of the multilayer circuit board is improved, in addition, the flow guide channels of all substrates of the multilayer circuit board share one cooling flow path, and the heat dissipation efficiency is further improved.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly apparent, and to make the implementation of the content of the description possible for those skilled in the art, and to make the above and other objects, features and advantages of the present invention more obvious, the following description is given by way of example of the specific embodiments of the present invention.
Drawings
FIG. 1 shows a schematic step diagram of a method for manufacturing a multilayer circuit board for a 5G terminal network card according to the present invention.
Fig. 2 shows a schematic structural diagram of an embodiment of a multilayer circuit board for 5G communications of the present invention.
Fig. 3 is a schematic structural view showing one embodiment of a flow guide channel of a multilayer circuit board for 5G communications according to the present invention.
Fig. 4 is a schematic structural view showing one embodiment of a condensing unit of a multilayer circuit board for 5G communication of the present invention.
Detailed Description
Specific embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While specific embodiments of the invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
It should be noted that certain terms are used throughout the description and following claims to refer to particular components. As one skilled in the art will appreciate, various names may be used to refer to a component. The description and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. The description which follows is a preferred embodiment of the present invention, but is made for the purpose of illustrating the general principles of the invention and not for the purpose of limiting the scope of the invention. The scope of the present invention is defined by the appended claims.
For the purpose of facilitating an understanding of the embodiments of the present invention, the following description will be made in terms of several specific embodiments with reference to the accompanying drawings, and the drawings are not intended to limit the embodiments of the present invention.
Specifically, as shown in fig. 1, a schematic diagram of steps of a method for manufacturing a multilayer circuit board for a 5G terminal network card according to the present invention is a method for manufacturing a multilayer circuit board for a 5G terminal network card, comprising:
the method comprises the following steps of firstly, providing a substrate 1, forming a flow guide channel 2 for circulating a phase-change heat exchange medium in the substrate 1, wherein an inlet 11 and an outlet 12 of the flow guide channel 2 are respectively located on the side surface of the substrate 1, a capillary flow guide structure is arranged on the side wall of the inlet 11, the phase-change heat exchange medium is heated and then converted from a liquid state to a gaseous state, and optionally, the phase-change heat exchange medium comprises chlorodifluoromethane and trifluoromethane (CH) 2 F 2 ) Tetrafluoroethane (CF) 3 CH 2 F) Pentafluoropropane (CHF) 2 CF 2 CH 2 F) Octafluorocyclobutane (cyclo-C) 4 F 8 ) Dichlorotetrafluoroethane (CClF) 2 CClF 2 ) Tetrafluoromonochloroethane (CHClFCF) 3 ) Pentafluoroethane (CHF) 2 CF 3 ) trans-Chlorotrifluoropropene (CF) 3 CH ═ CHCl), isobutane (CH) 3 ) 3 ) And combinations thereof.
A second step of respectively arranging a first circuit layer 3 and a second circuit layer 4 on the top surface and the bottom surface of the substrate 1, drilling a plurality of through holes 5 on the first circuit layer 3, wherein the through holes 5 sequentially penetrate through the first circuit layer 3, the substrate 1 and the second circuit layer 4, the through holes 5 are communicated with the flow guide channel 2, the sectional area of the flow guide channel 2 is larger than that of the through holes 5,
thirdly, a heat conduction column 6 is hermetically arranged in the through hole 5 to electrically connect the first circuit layer 3 and the second circuit layer 4, the heat conduction coefficient of the heat conduction column 6 is greater than that of the first circuit layer 3 or the second circuit layer 4, the heat conduction column 6 is contacted with the phase change heat exchange medium in the flow guide channel 2,
a fourth step of repeating the first to third steps several times to form a multilayer circuit board having at least two substrates 1, two first circuit layers 3 and two second circuit layers 4, the guide channels 2 of each substrate 1 being connected to a condensing unit via an inlet 11 and an outlet 12, respectively, to form a cooling flow path through which a phase change heat transfer medium flows, the condensing unit being higher than the multilayer circuit board in a gravity direction,
and a fifth step of arranging a first electronic element 7 and bonding a first solder mask layer at least one first heat conduction column 6 on the top surface of the multilayer circuit board, arranging a second electronic element 8 and bonding a second solder mask layer at a second heat conduction column 6 on the bottom surface of the multilayer circuit board, wherein the second heat conduction column 6 is different from the first heat conduction column 6, the first electronic element 7 comprises a 5G mobile communication module for 5G communication, a SIM card slot and an Ethernet wiring interface, the second electronic element 8 comprises a power supply module, an MCU chip, a wireless baseband chip, a memory chip and an Ethernet wiring interface, and an antenna interface and a USB interface are arranged on the side surface of the multilayer circuit board.
In a preferred embodiment of the method for manufacturing the multilayer circuit board for the 5G terminal network card, in the first step, a lower half substrate 1 is provided, a first diversion trench for circulating a phase change heat exchange medium is formed on the upper surface of the lower half substrate 1, and a capillary diversion structure is arranged on the inner wall of an inlet 11 of the first diversion trench.
Providing an upper half substrate 1, forming a second diversion trench for circulating a phase change heat exchange medium on the lower surface of the upper half substrate 1, arranging a capillary diversion structure on the inner wall of an inlet 11 of the second diversion trench, laminating the first substrate 1 and the second substrate 1, wherein the first diversion trench and the second diversion trench are overlapped to form a diversion channel 2.
In the preferred embodiment of the method for manufacturing the multilayer circuit board for the 5G terminal network card, a heat conduction pipe is laid on the first diversion trench, the first diversion trench and the second diversion trench are overlapped to wrap the heat conduction pipe, the heat conduction pipe forms a diversion channel 2 for circulating a phase change heat exchange medium, and the heat conduction pipe is connected with an inlet 11 at a capillary diversion structure.
In the preferred embodiment of the method for manufacturing the multilayer circuit board for the 5G terminal network card, in the second step, an insulating layer is pasted on the first circuit layer 3, the insulating layer at the position of the through hole 5 to be drilled is ablated by the pulsed carbon dioxide laser to expose the copper foil of the first circuit layer 3, the copper foil is electroplated to form the first metal enhancement layer 9, similarly, the insulating layer is pasted on the second circuit layer 4, the insulating layer at the position of the through hole 5 to be drilled is ablated by the pulsed carbon dioxide laser to expose the copper foil of the second circuit layer 4, then the second metal enhancement layer 10 is electroplated, the pulsed carbon dioxide laser drills a hole at the position of the tin layer to sequentially penetrate through the first metal enhancement layer 9, the first circuit layer 3, the substrate 1, the second circuit layer 4 and the second metal enhancement layer 10, and finally the through hole 5 is cleaned by ethanol.
In a preferred embodiment of the method for manufacturing the multilayer circuit board for the 5G terminal network card, in the third step, the heat conducting pillar 6 is a solid silver pillar, the solid silver pillar is heat-sealed in the through hole 5 so as to be electrically connected with the first circuit layer 3 and the second circuit layer 4, and the solid silver pillar is respectively sealed with the first circuit layer 3 and the first metal enhancement layer 9 thereof, and the second circuit layer 4 and the second metal enhancement layer 10 thereof.
In the preferred embodiment of the method for manufacturing a multilayer circuit board for a 5G terminal network card, the inlet 11 of the flow guide channel 2 of each substrate 1 is connected to the condensation unit through a first manifold, and the outlet 12 of the flow guide channel 2 of each substrate 1 is connected to the condensation unit through a second manifold.
In a preferred embodiment of the method for manufacturing the multilayer circuit board for the 5G terminal network card, a condensing unit is connected in the cooling flow path, and the condensing unit is a serpentine condenser pipe, and the serpentine condenser pipe is provided with heat dissipation fins.
In the preferred embodiment of the preparation method of the multilayer circuit board for the 5G terminal network card, in the multilayer circuit board, the even-numbered layer or the odd-numbered layer of the substrate 1 is provided with the flow guide channel 2.
In the preferred embodiment of the preparation method of the multilayer circuit board for the 5G terminal network card, the substrate 1 comprises an organic insulating medium layer and a prepreg layer, and the flow guide channels 2 are S-shaped channels formed by staggered groove walls uniformly distributed in the substrate 1.
For further understanding of the present invention, as shown in fig. 2, in an embodiment, a method for manufacturing a multilayer circuit board for a 5G terminal network card includes the steps of:
a first step, as shown in fig. 3, providing a substrate 1, forming a flow guide channel 2 for circulating a phase-change heat exchange medium inside the substrate 1, wherein an inlet 11 and an outlet 12 of the flow guide channel 2 are respectively located at a side surface of the substrate 1, a capillary flow guide structure is disposed on a side wall of the inlet 11, optionally, in the flow guide channel 2 for circulating the phase-change heat exchange medium formed inside the substrate 1, providing a lower substrate half 1, forming a first flow guide groove for circulating the phase-change heat exchange medium on an upper surface of the lower substrate half 1, providing a capillary flow guide structure on an inner wall of the inlet 11 of the first flow guide groove, providing an upper substrate half 1, forming a second flow guide groove for circulating the phase-change heat exchange medium on a lower surface of the upper substrate half 1, providing a capillary flow guide structure on an inner wall of the inlet 11 of the second flow guide groove, laminating the first substrate 1 and the second substrate 1, wherein, the first diversion trench and the second diversion trench are overlapped to form a diversion channel 2. Further, in order to improve the heat dissipation effect, especially for the area without the through hole 5, a heat conduction pipe is laid on the first guiding groove, the first guiding groove and the second guiding groove are overlapped to wrap the heat conduction pipe, the heat conduction pipe forms a guiding channel 2 for circulating the phase change heat exchange medium, and the heat conduction pipe is connected with the inlet 11 at the capillary guiding structure. The heat conductivity coefficient of the heat conduction pipe is larger than that of the substrate 1, so that the heat of the substrate 1 can be guided into the flow guide channel 2. It is understood that the phase change heat exchange medium is a non-conductive phase change heat exchange medium, optionally comprising chlorodifluoromethane. Alternatively, the substrate 1 may be formed of an organic resin such as an epoxy resin, a bisimide-triazine resin, a polyimide resin, a polyphenylene ether resin, or two or more kinds of organic resins may be mixed. Further, the substrate 1 includes a reinforcing material of glass fiber, glass nonwoven fabric, and aramid.
In the second step, the first wiring layer 3 and the second wiring layer 4 are provided on the top surface and the bottom surface of the substrate 1, respectively, and the first wiring layer 3 and the second wiring layer 4 form a conductor circuit via, for example, conductive resin or metal plating, but copper plating, copper plating being copper plating, may be electroless copper plating, is particularly preferable from the viewpoint of convenience of processing such as etching. Drilling a plurality of through holes 5 on the first circuit layer 3, wherein the through holes 5 sequentially penetrate through the first circuit layer 3, the substrate 1 and the second circuit layer 4, the through holes 5 are communicated with the flow guide channel 2, the sectional area of the flow guide channel 2 is larger than that of the through holes 5, and optionally, the sections of the flow guide channel 2 and the through holes 5 are circular, rectangular, rounded rectangular, oval or other geometric shapes. Alternatively, in drilling a plurality of through holes 5 on the first wiring layer 3, an insulating layer is pasted on the first wiring layer 3, a pulsed carbon dioxide laser ablates the insulating layer at the positions of the through holes 5 to be drilled to expose the copper foil of the first wiring layer 3, the copper foil is electroplated with a tin layer to form a tin-copper layer, similarly, an insulating layer is pasted on the second wiring layer 4, a pulsed carbon dioxide laser ablates the insulating layer at the positions of the through holes 5 to be drilled to expose the copper foil of the second wiring layer 4, then the tin-copper layer is electroplated to form a tin-copper layer, a pulsed carbon dioxide laser drills holes at the positions of the tin layer to sequentially penetrate through the first metal reinforcing layer 9 of the tin-copper layer, the first wiring layer 3, the substrate 1, the second wiring layer 4 and the second metal reinforcing layer 10 of the tin-copper layer, and finally the through holes 5 are cleaned by ethanol. The first metal enhancement layer 10 and the second metal enhancement layer 10 which form the copper-tin layer not only improve the sealing effect of the heat conduction column 6 and enhance the conductivity, but also are beneficial to the high-speed stability of the 5G high-frequency signal.
And thirdly, hermetically arranging a heat conduction column 6 in the through hole 5 to electrically connect the first circuit layer 3 and the second circuit layer 4, wherein the heat conduction column 6 is respectively sealed with the first circuit layer 3 and the first metal enhancement layer 9 thereof, the second circuit layer 4 and the second metal enhancement layer 10 thereof, the heat conduction coefficient of the heat conduction column 6 is greater than that of the first circuit layer 3 or the second circuit layer 4, and the heat conduction column 6 is in contact with the phase-change heat exchange medium in the flow guide channel 2. Optionally, to further increase the sealing performance, the inner wall of the through hole 5 is provided with an internal thread, and correspondingly, the outer surface of the heat conducting column 6 is provided with a corresponding external thread. Alternatively, the thermally conductive post 6 may or may not be in electrical communication with an electrically conductive trace or other component defining a printed circuit. Thus, the operation of the thermal post 6 with respect to the multilayer circuit board may be functional, non-functional, or any combination thereof.
And a fourth step of repeating the first step to the third step for a plurality of times to form a multilayer circuit board, wherein the multilayer circuit board has a plurality of substrates 1, a plurality of first circuit layers 3 and a plurality of second circuit layers 4, the flow guide channel 2 of each substrate 1 is connected with a condensing unit via an inlet 11 and an outlet 12 to form a cooling flow path for circulating a cooling medium, optionally, the same heat conduction column 6 penetrates from the upper surface to the lower surface of the multilayer circuit board, or the same heat conduction column 6 only penetrates through the substrate 1 where the same heat conduction column 6 is located, or a part of the heat conduction columns 6 penetrate through the upper surface to the lower surface of the multilayer circuit board, and the other part of the heat conduction columns 6 only penetrates through the substrate 1 where the same heat conduction column 6 is located. Further, the condensing unit 13 includes a serpentine coil, as shown in fig. 4.
And a fifth step of arranging a first electronic element 7 and bonding a first solder mask layer at least one first heat conduction column 6 on the top surface of the multilayer circuit board, arranging a second electronic element 8 and bonding a second solder mask layer at a second heat conduction column 6 on the bottom surface of the multilayer circuit board, wherein the second heat conduction column 6 is different from the first heat conduction column 6, the first electronic element 7 comprises a 5G mobile communication module for 5G communication, a SIM card slot and an Ethernet wiring interface, the second electronic element 8 comprises a power supply module, an MCU chip, a wireless baseband chip, a memory chip and an Ethernet wiring interface, and an antenna interface and a USB interface are arranged on the side surface of the multilayer circuit board.
The 5G network card comprises a multilayer circuit board, and is manufactured by the preparation method of the multilayer circuit board for the 5G terminal network card.
Industrial applicability
The preparation method of the multilayer circuit board for the 5G terminal network card and the 5G network card can be used in the field of 5G communication circuit boards.
Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments and application fields, and the above-described embodiments are illustrative, instructive, and not restrictive. Those skilled in the art, having the benefit of this disclosure, may effect numerous modifications thereto without departing from the scope of the invention as defined by the appended claims.
Claims (9)
1. A preparation method of a multilayer circuit board for a 5G terminal network card is characterized by comprising the following steps:
the method comprises the following steps of providing a substrate, forming a flow guide channel for circulating a phase-change heat exchange medium in the substrate, wherein an inlet and an outlet of the flow guide channel are respectively positioned on the side surface of the substrate, the side wall of the inlet is provided with a capillary flow guide structure, the phase-change heat exchange medium is heated and then converted from a liquid state to a gaseous state,
a second step of respectively providing a first line layer and a second line layer on the top surface and the bottom surface of the substrate, drilling a plurality of through holes on the first line layer, wherein the through holes sequentially penetrate through the first line layer, the substrate and the second line layer, the through holes are communicated with the diversion channels, the sectional areas of the diversion channels are larger than the sectional areas of the through holes, wherein an insulating layer is pasted on the first line layer, the insulating layer at the through holes to be drilled is burnt by pulse carbon dioxide laser to expose the copper foil of the first line layer, the copper foil is electroplated to form a first metal enhancement layer, similarly, the insulating layer is pasted on the second line layer, the insulating layer at the through holes to be drilled is burnt by the pulse carbon dioxide laser to expose the copper foil of the second line layer, and then a second metal enhancement layer is electroplated to form, and the pulse carbon dioxide laser drills at the positions of the second metal enhancement layer to sequentially penetrate through the first metal enhancement layer, The first circuit layer, the substrate, the second circuit layer and the second metal enhancement layer, and finally cleaning the through hole by ethanol,
a third step of hermetically arranging a heat conduction column in the through hole to electrically connect the first circuit layer and the second circuit layer, wherein the heat conduction coefficient of the heat conduction column is greater than that of the first circuit layer or the second circuit layer, the heat conduction column is in contact with the phase change heat exchange medium in the flow guide channel,
a fourth step of repeating the first to third steps several times to form a multilayer circuit board, the multilayer circuit board having at least two substrates, two first circuit layers and two second circuit layers, the flow guide channel of each substrate being connected to a condensing unit via an inlet and an outlet respectively to form a cooling flow path through which a phase change heat exchange medium flows, the cooling flow path being connected to a condensing unit for cooling the phase change heat exchange medium, the condensing unit being higher than the multilayer circuit board in a gravity direction,
and fifthly, arranging a first electronic element and a first solder mask layer at least one first heat conduction column on the top surface of the multilayer circuit board, arranging a second electronic element and a second solder mask layer at a second heat conduction column, different from the first heat conduction column, on the bottom surface of the multilayer circuit board, wherein the first electronic element comprises a 5G mobile communication module for 5G communication, a SIM card slot and an Ethernet wiring interface, the second electronic element comprises a power supply module, an MCU chip, a wireless baseband chip, a storage chip and an Ethernet wiring interface, and the side surface of the multilayer circuit board is provided with an antenna interface and a USB interface.
2. The method for preparing the multilayer circuit board for the 5G terminal network card according to claim 1, wherein the method comprises the following steps: in the first step, a lower half substrate is provided, a first diversion trench for circulating a phase-change heat exchange medium is formed on the upper surface of the lower half substrate, a capillary diversion structure is arranged on the inner wall of an inlet of the first diversion trench,
providing an upper half substrate, forming a second diversion trench for circulating a phase change heat exchange medium on the lower surface of the upper half substrate, arranging a capillary diversion structure on the inner wall of an inlet of the second diversion trench, laminating the first substrate and the second substrate, wherein the first diversion trench and the second diversion trench are overlapped to form a diversion channel.
3. The method for preparing the multilayer circuit board for the 5G terminal network card according to claim 2, wherein the method comprises the following steps: the heat conduction pipe is laid on the first diversion trench, the first diversion trench and the second diversion trench are overlapped to wrap the heat conduction pipe, the heat conduction pipe forms a diversion channel for circulating a phase change heat exchange medium, and the heat conduction pipe is connected with an inlet at the position of the capillary diversion structure.
4. The method for preparing a multilayer circuit board for a 5G terminal network card according to claim 1, wherein the method comprises the following steps: and thirdly, the heat conducting column is a solid silver column, the solid silver column is sealed in the through hole so as to be electrically connected with the first circuit layer and the second circuit layer, and the solid silver column is respectively sealed with the first circuit layer and the first metal enhancement layer thereof, the second circuit layer and the second metal enhancement layer thereof.
5. The method for preparing the multilayer circuit board for the 5G terminal network card according to claim 1, wherein the method comprises the following steps: the inlet of the flow guide channel of each substrate is connected with the condensation unit through a first header pipe, and the outlet of the flow guide channel of each substrate is connected with the condensation unit through a second header pipe.
6. The method for preparing the multilayer circuit board for the 5G terminal network card according to claim 1, wherein the method comprises the following steps: the condensing unit is snakelike condenser pipe, snakelike condenser pipe is equipped with radiating fin.
7. The method for preparing the multilayer circuit board for the 5G terminal network card according to claim 1, wherein the method comprises the following steps: in the multilayer circuit board, the even-numbered layer or the odd-numbered layer of the substrate is provided with a flow guide channel.
8. The method for preparing the multilayer circuit board for the 5G terminal network card according to claim 1, wherein the method comprises the following steps: the substrate comprises an organic insulating medium layer and a prepreg layer, and the flow guide channels are S-shaped channels formed by staggered groove walls uniformly distributed in the substrate.
9. A 5G network card, wherein the 5G network card comprises a multilayer circuit board, and the multilayer circuit board is manufactured by the method for manufacturing the multilayer circuit board for the 5G terminal network card according to any one of claims 1 to 8.
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| CA2456769A1 (en) * | 2001-08-24 | 2003-03-06 | 3M Innovative Properties Company | Interconnect module with reduced power distribution impedance |
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| JP3779721B1 (en) * | 2005-07-28 | 2006-05-31 | 新神戸電機株式会社 | Manufacturing method of laminated circuit board |
| CN101408302A (en) * | 2007-10-11 | 2009-04-15 | 富士迈半导体精密工业（上海）有限公司 | Light source module group with good heat radiating performance |
| US7738249B2 (en) * | 2007-10-25 | 2010-06-15 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with internal cooling structure and electrical assembly utilizing same |
| JP2010073767A (en) * | 2008-09-17 | 2010-04-02 | Jtekt Corp | Multilayer circuit board |
| JP5404261B2 (en) * | 2009-04-16 | 2014-01-29 | モレックス インコーポレイテド | Cooling device, electronic board, electronic equipment |
| JP4669567B1 (en) * | 2010-02-24 | 2011-04-13 | エンパイア テクノロジー ディベロップメント エルエルシー | Wiring board and manufacturing method thereof |
| US20120243147A1 (en) * | 2010-10-14 | 2012-09-27 | Endicott Interconnect Technologies, Inc. | Land grid array (lga) contact connector modification |
| CN107318235A (en) * | 2017-08-28 | 2017-11-03 | 吉安市满坤科技有限公司 | A kind of rigid/flexible combined printed circuit board preparation method |
| CN111385963A (en) * | 2018-12-29 | 2020-07-07 | 深南电路股份有限公司 | Multilayer circuit board and preparation method thereof |
| CN110678014A (en) * | 2019-08-23 | 2020-01-10 | 李龙凯 | Method for manufacturing multilayer flexible circuit board and product thereof |
| CN211128377U (en) * | 2019-10-29 | 2020-07-28 | 广东成德电子科技股份有限公司 | High-thermal-conductivity 5G mixed metal substrate |
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| CA2456769A1 (en) * | 2001-08-24 | 2003-03-06 | 3M Innovative Properties Company | Interconnect module with reduced power distribution impedance |
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