CN112658736A - Automatic centering and positioning device for semiconductor - Google Patents
Automatic centering and positioning device for semiconductor Download PDFInfo
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- CN112658736A CN112658736A CN202011621662.2A CN202011621662A CN112658736A CN 112658736 A CN112658736 A CN 112658736A CN 202011621662 A CN202011621662 A CN 202011621662A CN 112658736 A CN112658736 A CN 112658736A
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Abstract
The invention relates to an automatic centering and positioning device for a semiconductor, which comprises a carrying platform for bearing a workpiece, centering positioning blocks, at least two centering positioning strips, at least two elastic pieces and at least two clamping pieces for fixing the workpiece on the carrying platform, wherein the centering positioning blocks are arranged on the carrying platform; the centering positioning strip is positioned below the carrier, one end of each centering positioning strip is in contact with the centering positioning block, and the other end of each centering positioning strip is connected with the clamping piece; the elastic piece is positioned between the positioning strip and the carrying platform in each branch; the branch centering locating piece is used for driving the horizontal movement of the locating strip in each branch connected through the movement of the vertical direction so that the clamping piece is far away from each other and compresses the elastic piece, thereby in the process of clamping the machined piece, the resilience force of the elastic piece drives the clamping piece to position and clamp the machined piece, the damage to some electronic product parts with lower hardness is avoided, the length and the number of the locating strips in the branch can be set as required, and the application range of the semiconductor automatic branch centering locating device is enlarged.
Description
Technical Field
The invention relates to the field of machinery, in particular to an automatic semiconductor centering and positioning device.
Background
When portable electronic products such as tablet computers and mobile phones are processed, an automatic positioning device is usually needed to fix the products such as the shells and the wafers.
However, in the automatic positioning device in the prior art, an air cylinder is usually adopted to connect an ejector rod, the ejector rod is connected with two clamping blocks, and when a piston of the air cylinder moves downwards, the ejector rod is driven to move downwards, so that the two clamping blocks are close to each other, and a product between the two clamping blocks is clamped. In this device, the downward movement of the cylinder piston generates a large pulling force, which results in excessive pressure applied to the product by the two clamping blocks, and may damage some semiconductor components with low hardness during clamping. Moreover, the general positioning device can only be positioned and clamped corresponding to fixed product specifications and cannot be applied to products of various specifications.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides an automatic center-dividing positioning device for a semiconductor, which comprises a carrying platform for bearing a workpiece, center-dividing positioning blocks, at least two center-dividing positioning strips, at least two elastic pieces and at least two clamping pieces for fixing the workpiece on the carrying platform;
the centering positioning strips are positioned below the carrier, one end of each centering positioning strip is in contact with the centering positioning block, and the other end of each centering positioning strip is connected with the clamping piece;
the elastic piece is positioned between each centering positioning strip and the carrier;
the center dividing positioning blocks are used for driving each center dividing positioning strip connected with each other to horizontally move through the movement in the vertical direction so as to enable the clamping pieces to be away from each other and compress the elastic pieces.
In one embodiment, each centering positioning strip and each centering positioning block respectively have a first inclined surface and a second inclined surface which are matched with each other.
In one embodiment, one end of the centering positioning block, which is in contact with the centering positioning strip, is in a cone frustum structure and has the same number of inclined surfaces as the centering positioning strips.
In one embodiment, each centering positioning strip is provided with a first groove, the bottom of the carrier is provided with a second groove at a position corresponding to the first groove, the elastic member is located in an accommodating space formed by the first groove and the second groove, and when the centering positioning strips move horizontally, the first grooves and the second grooves are staggered.
In one embodiment, the clamping member includes a clamping plate provided with an aperture and a roller disposed within the aperture.
In one embodiment, a notch portion is formed at a position of the edge of the carrier corresponding to each clamping member, and is used for limiting the displacement of the clamping member in the horizontal direction.
In one embodiment, the apparatus further comprises a seal ring disposed on the carrier; and the surface of the carrying platform is provided with a vacuum hole, and the vacuum hole is positioned in the area inside the sealing ring.
In one embodiment, a sliding table is arranged below each centering positioning strip, and is provided with a first through hole;
the centering positioning strip moves horizontally along the sliding table.
In one embodiment, the device further comprises a support plate arranged below the sliding table and used for fixing the sliding table, and the support plate is provided with a second through hole.
In one embodiment, the device further comprises a driving piece and a bottom plate;
the driving piece penetrates through the first through hole and the second through hole, is connected with the centering positioning block and is used for driving the centering positioning block to move in the vertical direction;
the bottom plate is arranged below the driving piece; vertical plates are arranged around the bottom plate and connected with the supporting plate.
According to the automatic centering positioning device for the semiconductor, the vertical displacement of the centering positioning block drives the horizontal displacement of the centering positioning strip before the workpiece is placed on the carrying platform, so that the elastic piece is compressed, and in the process of clamping the workpiece, the clamping piece is driven by the resilience force of the elastic piece to position and clamp the workpiece.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of an exemplary automatic centering and positioning apparatus for a semiconductor device;
FIG. 2 is an overall view of the automatic centering and positioning device for semiconductor in one embodiment;
FIG. 3 is a perspective view of an automatic centering and positioning device for a semiconductor in one embodiment;
FIG. 4 is an enlarged partial cross-sectional view of the semiconductor automatic centering device in one embodiment;
FIG. 5 is a schematic view of a first bevel and a second bevel in one embodiment;
FIG. 6 is an enlarged view of the layout of the centering bars in one embodiment;
FIG. 7 is a schematic view of a clamp in one embodiment;
fig. 8 is a top view of a semiconductor automatic centering device in one embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 to 3, the present invention provides an automatic centering and positioning device for a semiconductor, which includes a carrier 1 for carrying a workpiece, centering and positioning blocks 2, at least two centering and positioning strips 3, at least two elastic members 4, and at least two clamping members 5 for fixing the workpiece on the carrier;
the centering positioning strips 3 are positioned below the carrier 1, one end of each centering positioning strip 3 is in contact with the centering positioning block 2, and the other end of each centering positioning strip is connected with the clamping piece 5;
the elastic piece 4 is positioned between the positioning strip 3 and the carrier 1 in each minute;
the centering positioning block 2 is used for driving each centering positioning strip 3 connected with the centering positioning block to horizontally move through the movement in the vertical direction so as to enable the clamping pieces 5 to be away from each other and compress the elastic pieces 4.
Fig. 2 is a partially enlarged view of the automatic semiconductor centering device, which is provided with the carrier 1 transparent and shows the upper and lower structures of the carrier 1, and the centering bar 3 and the centering block 2 are both located below the carrier 1. The center-dividing positioning blocks 2 are positioned among all the center-dividing positioning strips 3, the centers of the center-dividing positioning blocks 2 are overlapped with the center of the carrier 1, and the number of the center-dividing positioning strips 3 is 4. In the actual production process, can set for the quantity of dividing the well location strip 3 as required, divide well location block 2 to change corresponding shape this moment to can be applicable to the machined part of multiple shape, for example, treat that the machined part can adopt 4 to divide well location strips including the cuboid, can adopt 3 to divide well location strips during the centrum.
When the workpiece needs to be positioned in the center, the workpiece is placed on the carrying platform 1. One end of the centering positioning strip 3 is in contact with the centering positioning block 2, so that when the centering positioning block moves in the vertical direction, a horizontal thrust is transmitted to the centering positioning strip 3, and the centering positioning strip 3 is pushed to move horizontally. In order to facilitate clamping of the workpiece, the other ends of the centering positioning strips 3, which are far away from the centering positioning blocks, are connected with clamping members 5, as shown in fig. 1, the clamping members are arranged upwards 5 and distributed around the carrier 1, and elastic members 4 are arranged between the centering positioning strips 3 and the carrier 1.
According to the automatic semiconductor centering positioning device, before a workpiece is placed on the carrying platform 1, the centering positioning block moves in the vertical direction, the centering positioning strip 3 is driven to horizontally move in the direction away from the centering positioning block 2, the clamping pieces 5 at the other ends of the centering positioning strip 3 are further driven to be away from each other, the distance between the clamping pieces 5 is increased, and therefore the workpiece can be conveniently placed on the carrying platform 1. During the horizontal movement of the centering bar 3, the elastic member 4 is compressed, thereby generating a compression force to the elastic member 4. After the machined part is placed on the carrying platform 1, the elastic part 4 releases compression force to drive the centering positioning strip 3 to perform reverse horizontal displacement, so that the clamping part 5 is driven to be close to each other, the machined part is positioned and clamped, and centering positioning of the machined part is completed. According to the automatic centering and positioning device for the semiconductor, the vertical displacement of the centering positioning block 2 drives the horizontal displacement of the centering positioning strip 3 before the workpiece is placed on the carrying platform 1, so that the elastic piece is compressed, and in the process of clamping the workpiece, the clamping piece 5 is driven by the resilience force of the elastic piece 4 to position and clamp the workpiece.
In one embodiment, as shown in fig. 5, each centering bar 3 and the centering block 2 have a first inclined surface and a second inclined surface which are matched with each other.
In the present embodiment, the centering bar 3 and the centering block 2 are in contact with each other through the first inclined surface 21 and the second inclined surface 31, the inclined angles of the first inclined surface 21 and the second inclined surface 31 are α and β, respectively, compared with the same horizontal line, and α and β are not both 90 ° in order that the centering block 2 can generate an outward pushing force. If alpha is smaller than 90 degrees and beta is larger than 90 degrees, the centering positioning strip 3 moves towards the direction far away from the centering positioning block 2 in the downward moving process of the centering positioning strip 3; if α is greater than 90 ° and β is smaller than 90 °, the centering positioning bar 3 moves away from the centering positioning block 2 during the upward movement of the centering positioning bar 3. The sizes of alpha and beta can be set according to needs, and the sum of alpha and beta is more than or equal to 180 degrees. The length of the projection of the first inclined surface 21 in the horizontal direction is d1, and then the maximum distance moved by the centering bar is d 1.
In the automatic semiconductor centering positioning device in the embodiment, before the workpiece is placed on the carrier 1, the centering positioning 3 blocks move in the vertical direction, and a thrust force acting on the first inclined surface 21 is generated through the second inclined surface 31, so that the centering positioning strips 3 are pushed to move in the direction away from the centering positioning block 2, the size of the workpiece to be clamped can be changed by changing the length of the centering positioning strips 3 and the size of the included angle alpha between the first inclined surface and the horizontal direction, the automatic semiconductor centering positioning device can adapt to workpieces of various sizes, and the application range of the automatic semiconductor centering positioning device is enlarged.
In one embodiment, the end of the centering block 2 contacting the centering bar 3 is in a cone frustum structure and has the same number of inclined surfaces as the centering bars 3.
In the present embodiment, one end of the centering block is configured as a frustum structure, and the frustum structure has a plurality of second inclined surfaces 31, and the number of the second inclined surfaces 31 is the same as that of the centering positioning strips 3, that is, each second inclined surface 31 corresponds to one centering positioning strip 3.
In the invention, the elastic piece 4 is positioned between the centering positioning strip 3 and the carrier 1, the elastic piece 4 can be fixed on the centering positioning strip 3, a groove is formed in the bottom of the carrier 1 and can be used for accommodating the elastic piece 4, the elastic piece 4 can also be fixed on the bottom of the carrier 1, a groove is formed in the centering positioning strip 3 and can be used for accommodating the elastic piece 4, grooves are formed in the centering positioning strip 3 and the bottom of the carrier 1 respectively, and the elastic piece can be compressed as long as the centering positioning strip 3 moves away from the centering positioning block 2. The elastic piece can select the spring for use, can adopt one or more springs in an accommodation space, and the quantity of spring can set up as required.
In an embodiment, in fig. 6, each centering bar 3 is provided with a first groove 31, a second groove (not shown) is provided at a corresponding position of the first groove 31 at the bottom of the carrier 1, the elastic member 4 is located in the accommodating space formed by the first groove 31 and the second groove, and when the centering bar 3 moves horizontally, the first groove 31 and the second groove are staggered.
In this embodiment, the elastic member 4 is located in the accommodating space formed by the first groove 31 and the second groove, the first groove 31 and the second groove are arranged correspondingly, when the centering positioning strip 3 moves horizontally, the first groove 31 and the second groove are staggered, so that the elastic member is compressed, and when the centering positioning strip 3 moves horizontally reversely, because the carrier 1 is heavy in practice, the thrust generated by the elastic member 4 in the process of releasing the compression force on the carrier 1 cannot enable the carrier 1 to move horizontally, and the centering positioning strip 3 is much lighter than the carrier 1, so that the elastic member 4 can push the centering positioning strip 3 to move towards the middle, and because the clamping member 5 is fixed at one end of the centering positioning strip 3 in each minute, the clamping members can be driven to approach each other, so that centering positioning of the workpiece is completed.
In one embodiment, as shown in fig. 7, the clamping member 5 includes a clamping plate 51 provided with an opening, and a roller 52, the roller 52 being disposed in the opening.
In the present embodiment, the clamping member 5 includes a clamping plate 51 and a roller 52. The roller 52 may be fixed on the clamping plate 51 by a positioning pin or a top thread, but other fixing methods may be adopted as long as the roller can be detachably fixed on the clamping plate, which is not limited herein. For square workpieces such as a cuboid, a cube and the like, such as a shell of a mobile phone and the like, the workpiece is generally in contact with the clamping piece on one surface, so that the shell can be conveniently moved in the positioning process through the rollers and then clamped through the clamping plate; for round workpieces such as spheres, most of which are round products in the semiconductor field are wafers (silicon carbide wafers), such as 2-12 inch wafers, the contact point of the workpiece and the clamping part is usually a point, the roller can be taken out, and the movement and clamping of the wafer in the positioning process are facilitated through the clamping plate.
According to the invention, through the arrangement of the clamping plate 51 and the roller 52 in the clamping part 5, workpieces in different shapes can be positioned in different centers, and different processing requirements are met.
In an embodiment, further referring to fig. 5, a notch is formed at a position of the edge of the carrier 1 corresponding to each clamping member 3 for limiting the displacement of the clamping member 5 in the horizontal direction.
Normally, the size of the workpiece is smaller than the size of the stage, and therefore, in order to clamp the workpiece, a notched portion is provided at the edge of the stage 1, the number of which is the same as the number of the clamping members 5 and the number of the centering bars 3. The notch portion is used to limit the displacement of the clip 5 in the horizontal direction, and can limit the moving direction of the clip 5 and the moving distance of the clip 5. The width of the notch is d2, the length of the projection of the first inclined surface 21 in the horizontal direction is d1, and d2 is usually equal to or greater than d 1.
In one embodiment, the semiconductor automatic centering and positioning device is further provided with a sealing ring 7 on the carrier 1, a plurality of vacuum holes 6 are formed on the surface of the carrier, and the vacuum holes 6 are positioned in the area inside the sealing ring 7.
In this embodiment, a seal ring 7 is provided on the stage 1, and a plurality of vacuum holes 6 are provided in the stage inside the seal ring 7. The sealing ring 7 can be surrounded into a circle or a square, the vacuum hole is located in the region inside the sealing ring, normally, the region inside the sealing ring is smaller than the contact area between the workpiece and the surface of the carrier 1, and after the workpiece is placed on the carrier 1, the region between the workpiece and the carrier 1 and the sealing ring is vacuumized through the vacuum hole 6, so that the workpiece is further fixed on the carrier 1.
As shown in fig. 8, the vacuum holes 6 are symmetrically arranged on the stage 1 with respect to the center of the stage. The sealing rings 7 are square and the vacuum holes 6 are located at the corners of the sealing rings 7, wherein each vacuum hole is controlled by a separate solenoid valve. The quantity of the sealing rings 7 and the vacuum holes 6 can be set as required, more than two sealing rings with different sizes can be arranged for a machined part with a larger size, the smaller sealing ring is positioned in the larger sealing ring, and the machined part with the larger size can be fixed after being placed on the carrying platform.
Furthermore, each vacuum hole in the vacuum adsorption is controlled by a single electromagnetic valve, so that air leakage alarm and insufficient vacuum suction force cannot exist, and the maximum vacuum adsorption range can be adjusted according to the size of a product to adsorb the product.
In one embodiment, further referring to fig. 1 to 3, a sliding table 8 is provided below each centering positioning bar 3, and the sliding table is provided with a first through hole; the centering positioning bar 3 moves horizontally along the sliding table 8.
In the embodiment, a sliding table 8 is arranged below each centering positioning strip 3, and the centering positioning strip 3 moves horizontally along the sliding table 8. In order to facilitate the movement of the centering positioning strip 3 in the horizontal direction, a sliding table 8 is arranged below each centering positioning strip 3, a sliding groove is formed in each sliding table 8, and the centering positioning strips 3 can move horizontally along the sliding grooves. The sliding table 8 also plays a role in supporting the centering positioning strip 2, the carrier 1 and the workpiece.
Further, a first through hole is formed in the middle of the sliding table 8 corresponding to the position of the centering positioning block.
In an embodiment, further referring to fig. 1 to 3, the automatic semiconductor centering and positioning device of the present invention further includes a supporting plate 9 disposed below the sliding table 8 for fixing the sliding table 8, wherein the supporting plate 9 is provided with a second through hole.
In this embodiment, a support plate 9 is disposed below the sliding table 8 for fixing the sliding table 8, the driving member is disposed below the support plate 9, and a second through hole is disposed on the support plate at a position corresponding to the first through hole.
In one embodiment, the semiconductor automatic centering and positioning device further comprises a driving member 10 and a base plate 11; the driving piece 10 penetrates through the first through hole and the second through hole, is connected with the centering positioning block 2 and is used for driving the centering positioning block 2 to move in the vertical direction; a base plate 11 disposed below the driving member 10; a vertical plate 12 is arranged around the bottom plate 11, and the vertical plate 12 is connected with the supporting plate 9.
The automatic semiconductor centering and positioning device in the embodiment further comprises a driving piece 10 and a bottom plate 11, wherein the driving piece passes through the first through hole and the second through hole to be connected with the centering and positioning block 2, so that the centering and positioning block 2 can be driven; the lower part of the driving part 10 is provided with a bottom plate 11, and a vertical plate 12 is arranged around the bottom plate 11, and the vertical plate 12 is connected with the supporting plate 9 and plays a supporting role for the whole device.
In one embodiment, referring again to fig. 1-3, the driving member 10 is used to drive the centering block 2 to perform axial displacement.
In the embodiment, the driving member 10 is provided to drive the centering positioning block 2 to move, as shown in fig. 1, an included angle α between the first inclined surface 21 of the centering positioning strip 3 and the horizontal direction is less than 90 °, so that before a workpiece is placed on the stage 1, the driving member 10 drives the centering positioning block 2 to move upwards, so as to push the centering positioning strip 3 to move away from the centering positioning block 2, and the elastic member 4 is compressed. After placing the machined part at microscope carrier 1, driving piece 10 drives and divides the locating piece to remove downwards, and at this moment, elastic component 4 begins the release compressive force to the location strip 3 removes to the centre in the promotion branch, and at this moment, the clamping piece that is located 3 one ends of location strip in the branch is close to each other, thereby fixes a position the machined part in the centre, and then presss from both sides tightly, accomplishes the process of dividing the well location. In the embodiment, the larger pulling force of the driving part 10 acting on the centering positioning block 2 is converted into the compression force of the elastic part 4 in the moving process of the centering strip 2, so that when a workpiece is clamped, the clamping part 5 is driven to clamp the workpiece mainly by the compression force released by the elastic part, the workpiece is prevented from being damaged by the action of the larger acting force generated by the driving part, and the workpiece with smaller hardness is prevented from being damaged.
In one embodiment, the driving member 10 further includes a connecting member, the driving member 10 and the connecting member may take various forms, and the connection between the centering block 2 and the driving member 10 may also take various forms, for example, the driving member 10 is a cylinder and is connected to the centering block 2 by a spring; the driving piece 10 is a motor and can be connected with the centering positioning block 2 in a gear and screw rod mode; the driving piece 10 is a rotary oil cylinder and can be connected with the centering positioning block 2 in a rack/gear mode.
The invention also provides an automatic centering positioning method, which is applied to the automatic positioning device and comprises the following steps:
before a workpiece is placed on a carrier 1, a sub-centering positioning block 2 below the carrier 1 moves in the vertical direction to drive at least two sub-centering positioning strips 3 distributed around the sub-centering positioning block 2 to horizontally move in the direction away from the sub-centering positioning block 2, at least one elastic piece 4 positioned between each sub-centering positioning strip 3 and the carrier 1 is compressed, and at least two clamping pieces 5 positioned at the other end of each sub-centering positioning strip 3 are further driven to be away from each other;
after the machined part is placed on the carrying platform 1, the elastic part 4 releases compression force to drive the centering positioning strip 3 to perform reverse horizontal displacement, so that the clamping part 5 is driven to be close to each other, the machined part is positioned and clamped, and centering positioning of the machined part is completed.
According to the automatic centering and positioning device for the semiconductor, the vertical displacement of the centering positioning block 2 drives the horizontal displacement of the centering positioning strip 3 before the workpiece is placed on the carrying platform 1, so that the elastic piece is compressed, and in the process of clamping the workpiece, the clamping piece 5 is driven by the resilience force of the elastic piece 4 to position and clamp the workpiece.
In one embodiment, a driving member 10 is connected below the centering positioning block 2, after the workpiece is placed on the carrier 1, the driving member 10 drives the centering positioning block to move in the vertical direction, at this time, the elastic member 4 starts to release the compression force, so as to push the centering positioning strip 3 to move towards the middle, and drive the clamping members located at one end of the centering positioning strip 3 to approach each other, so as to position the workpiece in the middle, and further clamp the workpiece.
In this embodiment, through with the great pulling force of driving piece effect on dividing well locating piece 2 convert into in dividing the compression force of strip 2 removal in-process to elastic component 4 to when pressing from both sides tight the machined part, mainly drive clamping piece 5 and press from both sides tight the machined part by the compressive force of elastic component release, avoided the great effort effect that the driving piece produced to treat on the machined part, thereby avoided the damage to the less machined part of hardness.
The automatic centering positioning method disclosed in the embodiment can realize the beneficial effect of the semiconductor automatic centering positioning device. For details of the semiconductor automatic centering and positioning device provided by the present invention, reference may be made to the technical details not described in detail in this embodiment.
Claims (10)
1. The automatic centering and positioning device for the semiconductor is characterized by comprising a carrying platform for bearing a workpiece, centering positioning blocks, at least two centering positioning strips, at least two elastic pieces and at least two clamping pieces for fixing the workpiece on the carrying platform;
the centering positioning strips are positioned below the carrier, one end of each centering positioning strip is in contact with the centering positioning block, and the other end of each centering positioning strip is connected with the clamping piece;
the elastic piece is positioned between each centering positioning strip and the carrier;
the center dividing positioning blocks are used for driving each center dividing positioning strip connected with each other to horizontally move through the movement in the vertical direction so as to enable the clamping pieces to be away from each other and compress the elastic pieces.
2. The device of claim 1, wherein each of the centering bars and the centering blocks has a first slope and a second slope which are matched with each other.
3. The automatic positioning device according to claim 1, wherein the end of the centering block contacting with the centering bar is in a cone structure with the same number of slopes as the centering bars.
4. The automatic positioning device according to any one of claims 1 to 3, wherein each centering bar is provided with a first groove, the bottom of the carrier is provided with a second groove at a position corresponding to the first groove, the elastic member is located in an accommodating space formed by the first groove and the second groove, and when the centering bar moves horizontally, the first groove and the second groove are staggered.
5. The automatic positioning device of claim 1, wherein the clamping member includes a clamping plate having an aperture and a roller disposed within the aperture.
6. The automatic positioning device according to claim 5, wherein a notch is formed at a position of the edge of the carrier corresponding to each clamping member for limiting the displacement of the clamping member in the horizontal direction.
7. The automatic positioning device of claim 1, further comprising a sealing ring disposed on the carrier; and the surface of the carrying platform is provided with a vacuum hole, and the vacuum hole is positioned in the area inside the sealing ring.
8. The automatic positioning device according to claim 2, wherein a sliding table is arranged below each centering positioning bar, and the sliding table is provided with a first through hole;
the centering positioning strip moves horizontally along the sliding table.
9. The automatic positioning device according to claim 8, further comprising a support plate disposed below the slide table for fixing the slide table, the support plate being provided with a second through hole.
10. The automatic positioning device of claim 9, further comprising a drive member and a base plate;
the driving piece penetrates through the first through hole and the second through hole, is connected with the centering positioning block and is used for driving the centering positioning block to move in the vertical direction;
the bottom plate is arranged below the driving piece; vertical plates are arranged around the bottom plate and connected with the supporting plate.
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| CN202011621662.2A CN112658736A (en) | 2020-12-31 | 2020-12-31 | Automatic centering and positioning device for semiconductor |
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| CN202011621662.2A CN112658736A (en) | 2020-12-31 | 2020-12-31 | Automatic centering and positioning device for semiconductor |
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Application publication date: 20210416 |