CN112647135A - Automatic positioning type sensor monocrystalline silicon etching device - Google Patents
Automatic positioning type sensor monocrystalline silicon etching device Download PDFInfo
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- CN112647135A CN112647135A CN202010978877.3A CN202010978877A CN112647135A CN 112647135 A CN112647135 A CN 112647135A CN 202010978877 A CN202010978877 A CN 202010978877A CN 112647135 A CN112647135 A CN 112647135A
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- reaction chamber
- chamber body
- monocrystalline silicon
- sheet frame
- automatic positioning
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/08—Etching
- C30B33/12—Etching in gas atmosphere or plasma
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- Crystallography & Structural Chemistry (AREA)
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- Organic Chemistry (AREA)
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- Plasma & Fusion (AREA)
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Abstract
The invention discloses an automatic positioning type sensor monocrystalline silicon etching device which comprises a reaction chamber body, wherein a sheet frame is arranged in the reaction chamber body, a sheet frame rotating mechanism is fixedly arranged on the reaction chamber body, a power output shaft of the sheet frame rotating mechanism is fixedly connected with the sheet frame, the axis of the sheet frame and the axis of the power output shaft of the sheet frame rotating mechanism are coincided with the axis of the reaction chamber body, a plurality of independent positioning assemblies are fixedly arranged on the inner wall of the reaction chamber body, and the independent positioning assemblies are telescopic and can be contacted with the sheet frame. The invention can realize real-time automatic positioning of the wafer rack through the independently controlled positioning component and the real-time verification component, can automatically adapt to the wafer racks with different specifications in a certain range, can greatly improve the positioning accuracy, ensures that the wafer rack is positioned at the axis position of the reaction chamber body, has strong universality and can greatly improve the etching processing precision of a plurality of monocrystalline silicon in the wafer rack.
Description
Technical Field
The invention belongs to the technical field of sensors, and particularly relates to an automatic positioning type sensor monocrystalline silicon etching device.
Background
In the processing process of the monocrystalline silicon for the sensor, the monocrystalline silicon is required to be etched; in the existing etching process, a plurality of monocrystalline silicon are stacked on a wafer rack, and reaction gas is led into the position of the wafer rack and generates plasma in an electric field environment so as to etch the monocrystalline silicon; the wafer frame generally needs to rotate during the etching process to increase the contact uniformity of the monocrystalline silicon and the plasma, however, the rotation of the wafer frame may cause the deviation of the wafer frame, so that the contact uniformity between the monocrystalline silicon and the plasma is caused, and the etching effect is further affected.
In order to solve the above problems, chinese patent publication No. CN104975350A discloses a wafer rack positioning device in a sensor single crystal silicon etching process, which describes that positioning processing is performed on a wafer rack through a plurality of support rods so that the wafer rack is always located at an axial position of a reaction chamber, thereby improving the precision of etching processing of a plurality of single crystal silicon in the wafer rack.
However, the above technical solutions still have the following drawbacks: one is that in the actual use process, the matching of the support rod and other structures has errors, and a verification mechanism is lacked, so that whether the sheet frame is positioned at the axis position of the reaction chamber cannot be accurately known, and even if errors occur, the correction is not easy to be carried out; secondly, the assembly and the debugging are inconvenient, the universality is poor, and the adjustment can not be carried out according to different sheet racks.
Therefore, in order to solve the above technical problems, it is necessary to provide a single crystal silicon etching apparatus with an automatic positioning sensor.
Disclosure of Invention
The invention aims to provide a monocrystalline silicon etching device with an automatic positioning type sensor, which is used for solving the problems.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
an automatic positioning type sensor monocrystalline silicon etching device comprises a reaction chamber body, wherein a wafer frame is arranged in the reaction chamber body, a wafer frame rotating mechanism is fixedly arranged on the reaction chamber body, a power output shaft of the wafer frame rotating mechanism is fixedly connected with the wafer frame, and the axis of the wafer frame and the axis of the power output shaft of the wafer frame rotating mechanism are coincided with the axis of the reaction chamber body;
the reaction chamber comprises a reaction chamber body and is characterized in that a plurality of independent positioning assemblies are fixedly mounted on the inner wall of the reaction chamber body, the independent positioning assemblies are telescopic and can be in contact with a sheet frame, a real-time verification assembly is further mounted on the reaction chamber body, and the real-time verification assembly is used for verifying the position of the sheet frame in real time.
Furthermore, the independent positioning assembly comprises an independent control seat fixedly arranged on the inner wall of the reaction chamber body and a telescopic rod fixedly arranged on the independent control seat.
Furthermore, a ball is installed at one end, far away from the independent control seat, of the telescopic rod, and a polishing layer is arranged on the surface of the ball.
Furthermore, the real-time verification assembly comprises an active detection ring and a reflection assembly matched with the active detection ring, a plurality of active light-emitting points are arranged on the active detection ring, and the density of the active light-emitting points is more than 2 millimeters per plane.
Further, the type of the light emitted by the active light emitting point is infrared light or common light.
Further, the reaction chamber body comprises a top plate and a bottom plate, the reflection assembly is fixedly connected to the top plate, and the active detection ring is fixedly connected to the bottom plate.
Furthermore, an annular through hole is formed in the bottom plate and is matched with the active detection ring, and a transparent ring is fixedly mounted on the annular through hole.
Further, the lower extreme fixed mounting of initiative detection ring has master control equipment, master control equipment and initiative detection ring and the equal electric connection of a plurality of independent locating component.
Further, a state display screen is arranged on the main control device, and the screen type of the state display screen is an IPS.
Further, an air supply pipeline is arranged at the upper end of the reaction chamber body, and an air exhaust pipeline is arranged at the lower end of the reaction chamber body.
Compared with the prior art, the invention has the following advantages:
the invention can realize real-time automatic positioning of the wafer rack through the independently controlled positioning component and the real-time verification component, can automatically adapt to the wafer racks with different specifications in a certain range, can greatly improve the positioning accuracy, ensures that the wafer rack is positioned at the axis position of the reaction chamber body, has strong universality and can greatly improve the etching processing precision of a plurality of monocrystalline silicon in the wafer rack.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a front view of an apparatus for etching single crystal silicon with an automatic positioning sensor according to an embodiment of the present invention;
FIG. 2 is a partial cross-sectional view of an apparatus for etching single crystal silicon with an automatic positioning sensor in accordance with an embodiment of the present invention;
FIG. 3 is a schematic bottom structure diagram of an automatic positioning sensor silicon single crystal etching apparatus according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view of a positioning status of an automatic positioning sensor apparatus for etching single crystal silicon according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a retractable rod of an automatic positioning sensor device for etching monocrystalline silicon according to an embodiment of the invention in a retracted state;
FIG. 6 is a flowchart illustrating a positioning process of an apparatus for etching single crystal silicon with an automatic positioning sensor according to an embodiment of the present invention.
In the figure: 1. the device comprises a reaction chamber body, a top plate 101, a top plate 102, a bottom plate 2, an air supply pipeline 3, an air exhaust pipeline 4, a sheet frame 5, a sheet frame rotating mechanism 6, an independent control seat 7, an expansion link 7, a ball 8, a transparent ring 9, an active detection ring 10, a reflection assembly 11, a main control device 12 and a state display screen 13.
Detailed Description
The present invention will be described in detail below with reference to embodiments shown in the drawings. The embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to the embodiments are included in the scope of the present invention.
The invention discloses an automatic positioning type sensor monocrystalline silicon etching device, which is shown in figures 1-5 and comprises a reaction chamber body 1, wherein the reaction chamber body 1 further comprises a plurality of groups of electromagnetic coils arranged on the outer side of the reaction chamber body 1, an air supply pipeline 2 is arranged at the upper end of the reaction chamber body 1, an air exhaust pipeline 3 is arranged at the lower end of the reaction chamber body 1, the air supply pipeline 2 is communicated with an air source chamber, and the air exhaust pipeline 3 is connected with a vacuum pump, so that the function of monocrystalline silicon etching can be met.
Referring to fig. 2-5, a rack 4 is disposed in the reaction chamber body 1, a rack rotating mechanism 5 is fixedly mounted on the reaction chamber body 1, a power output shaft of the rack rotating mechanism 5 is fixedly connected with the rack 4, and the rack rotating mechanism 5 is used for driving the rack 4 to rotate, so as to improve the precision, the axes of the rack 4 and the power output shaft of the rack rotating mechanism 5 are ensured to coincide with the axis of the reaction chamber body 1, that is, the rack 4 is located at the center of the reaction chamber body 1.
Referring to fig. 2-5, a plurality of independent positioning assemblies are fixedly mounted on the inner wall of the reaction chamber body 1, the independent positioning assemblies are telescopic and can be in contact with the sheet frame 4, each independent positioning assembly comprises an independent control seat 6 fixedly mounted on the inner wall of the reaction chamber body 1 and a telescopic rod 7 fixedly mounted on the independent control seat 6, the telescopic rod 7 can be an electric telescopic rod, one end, far away from the independent control seat 6, of the telescopic rod 7 is provided with a ball 8, and the surface of the ball 8 is provided with a polishing layer.
Specifically, telescopic link 7 has certain clearance between flexible and the sheet frame 4 when reaching the shortest distance, and ball 8 can be direct and the contact of sheet frame 4, and ball 8 can rotate at telescopic link 7's tip, and ball 8's surface is provided with the polishing layer simultaneously, and when ball 8 and the contact of sheet frame 4, can reduce the friction by a wide margin, the normal rotation of difficult influence sheet frame 4.
In addition, the number of the plurality of telescopic rods 7 on the same circumferential plane is more than 4, preferably more than 6, and the telescopic rods are uniformly distributed at equal angles, so that the centering precision is ensured.
Referring to fig. 3-5, the reaction chamber body 1 is further provided with a real-time verification component for verifying the position of the holder 4 in real time, the real-time verification component comprises an active detection ring 10 and a reflection component 11 matched with the active detection ring 10, the active detection ring 10 is provided with a plurality of active light-emitting points, the active detection ring 10 is provided with light receiving points corresponding to the active light-emitting points, when the light emitted by the active light-emitting points is reflected by the reflection component 11, it can be determined that the point is not blocked by the sheet frame 4, and when the light emitted from the active light-emitting point is not reflected by the reflection component 11, it can be determined that the spot is blocked by the frame 4, and thus the corresponding position information can be generated, and the position information can be compared with the template information preset by the skilled person in the art, and it can be determined whether the position of the frame 4 is at the center of the chamber body 1.
Specifically, the density of the active light-emitting points is more than 2 millimeters per plane, the higher the density of the light-emitting points is, the higher the accuracy is, and the type of the light emitted by the active light-emitting points is infrared light or common light, preferably infrared light.
Referring to fig. 3-5, the reaction chamber body 1 includes a top plate 101 and a bottom plate 102, the reflection assembly 11 is fixedly connected to the top plate 101, the active detection ring 10 is fixedly connected to the bottom plate 102, the bottom plate 102 is provided with an annular through hole, the annular through hole is matched with the active detection ring 10, the transparent ring 9 is fixedly installed on the annular through hole, the transparent ring 9 facilitates smooth passing of light, and meanwhile, the active detection ring 10 can realize comprehensive shielding of the transparent ring 9.
Referring to fig. 1-4, a main control device 12 is fixedly installed at the lower end of the active detection ring 10, the main control device 12 is electrically connected with the active detection ring 10 and a plurality of independent positioning components, and a related template and a software system are preset in the main control device 12, so that the position of the rack 4 can be judged and analyzed according to related algorithms in the field, and the telescopic rod 7 can be independently controlled.
Referring to fig. 1 and fig. 3, a status display screen 13 is disposed on the main control device 12, the status display screen 13 can display position information of the rack 4, wherein the content of the position information includes whether the position of the rack 4 is normal or not and whether the telescopic rod 7 is in a moving state or not, the screen type of the status display screen 13 is IPS, a visible angle can be greatly increased, a touch operation function can also be set, specifically, a wireless control function is disposed in the main control device 12, and remote control and management of the main control device 12 can be achieved.
When the device is used, as shown in fig. 6, the active detection ring 10 and the reflection assembly 11 are matched to perform reflection detection on the rack 4 first, detect the position of the rack 4, and then perform processing and analysis through the main control device 12, when the position of the rack 4 is judged to be normal, no operation is performed, the reflection detection is continued, when the position of the rack 4 is judged to be abnormal, the main control device 12 can independently control the telescopic rod 7 to perform telescopic motion according to abnormal specific data, and then the reflection detection is continued until the position of the rack 4 is normal, the rack 4 is continuously detected in real time in the actual use process, the detection interval is 1-5 seconds each time, and the adjustment can be performed according to the actual situation.
According to the technical scheme, the invention has the following beneficial effects:
the invention can realize real-time automatic positioning of the wafer rack through the independently controlled positioning component and the real-time verification component, can automatically adapt to the wafer racks with different specifications in a certain range, can greatly improve the positioning accuracy, ensures that the wafer rack is positioned at the axis position of the reaction chamber body, has strong universality and can greatly improve the etching processing precision of a plurality of monocrystalline silicon in the wafer rack.
Claims (10)
1. An automatic positioning type sensor monocrystalline silicon etching device comprises a reaction chamber body (1), wherein a sheet frame (4) is arranged in the reaction chamber body (1), and the device is characterized in that a sheet frame rotating mechanism (5) is fixedly installed on the reaction chamber body (1), a power output shaft of the sheet frame rotating mechanism (5) is fixedly connected with the sheet frame (4), and the axis of the sheet frame (4) and the axis of the power output shaft of the sheet frame rotating mechanism (5) are coincided with the axis of the reaction chamber body (1);
fixed mounting has a plurality of independent locating component on the inner wall of reaction chamber body (1), and is a plurality of independent locating component is scalable and can contact with film frame (4), still install the real-time verification subassembly on reaction chamber body (1), the real-time verification subassembly is used for verifying the position that film frame (4) located in real time.
2. The monocrystalline silicon etching device with the automatic positioning sensor as claimed in claim 1, wherein the independent positioning component comprises an independent control seat (6) fixedly arranged on the inner wall of the reaction chamber body (1) and a telescopic rod (7) fixedly arranged on the independent control seat (6).
3. The monocrystalline silicon etching device with the automatic positioning sensor as claimed in claim 2, wherein a ball (8) is mounted at one end of the telescopic rod (7) far away from the independent control seat (6), and a polishing layer is arranged on the surface of the ball (8).
4. The monocrystalline silicon etching device of claim 1, wherein the real-time verification component comprises an active detection ring (10) and a reflection component (11) matched with the active detection ring (10), the active detection ring (10) is provided with a plurality of active light-emitting points, and the density of the active light-emitting points is more than 2 millimeters per plane.
5. The device for etching monocrystalline silicon by using the automatic positioning sensor as claimed in claim 4, wherein the type of the light emitted by the active light-emitting point is infrared light or common light.
6. The etching device for monocrystalline silicon with the automatic positioning sensor as recited in claim 1 or 4, characterized in that the reaction chamber body (1) comprises a top plate (101) and a bottom plate (102), the reflection assembly (11) is fixedly connected to the top plate (101), and the active detection ring (10) is fixedly connected to the bottom plate (102).
7. The monocrystalline silicon etching device of claim 6, wherein the bottom plate (102) is provided with an annular through hole, the annular through hole is matched with the active detection ring (10), and the annular through hole is fixedly provided with a transparent ring (9).
8. The monocrystalline silicon etching device of claim 4, wherein a main control device (12) is fixedly mounted at the lower end of the active detection ring (10), and the main control device (12) is electrically connected with the active detection ring (10) and the independent positioning components.
9. The monocrystalline silicon etching device of the automatic positioning type sensor according to claim 1, wherein a state display screen (13) is arranged on the main control device (12), and the screen type of the state display screen (13) is IPS.
10. The monocrystalline silicon etching device with the automatic positioning sensor as claimed in claim 1, wherein an air supply pipeline (2) is arranged at the upper end of the reaction chamber body (1), and an air exhaust pipeline (3) is arranged at the lower end of the reaction chamber body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010978877.3A CN112647135A (en) | 2020-09-17 | 2020-09-17 | Automatic positioning type sensor monocrystalline silicon etching device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010978877.3A CN112647135A (en) | 2020-09-17 | 2020-09-17 | Automatic positioning type sensor monocrystalline silicon etching device |
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| CN112647135A true CN112647135A (en) | 2021-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010978877.3A Withdrawn CN112647135A (en) | 2020-09-17 | 2020-09-17 | Automatic positioning type sensor monocrystalline silicon etching device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102744524A (en) * | 2012-07-26 | 2012-10-24 | 中国电子科技集团公司第二十六研究所 | Vibratory gyroscope exciting cover electrode etching balance adjusting device and method |
| CN104975350A (en) * | 2015-07-09 | 2015-10-14 | 江苏德尔森传感器科技有限公司 | Sheet holder positioning apparatus during sensor single crystal silicon etching process |
| CN207966916U (en) * | 2018-01-09 | 2018-10-12 | 蚌埠市龙子湖区金力传感器厂 | A kind of horse positioning device in sensor monocrystalline silicon etching |
| CN208309005U (en) * | 2018-04-25 | 2019-01-01 | 浙江树人学院 | A kind of horse positioning device in sensor monocrystalline silicon etching process |
-
2020
- 2020-09-17 CN CN202010978877.3A patent/CN112647135A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102744524A (en) * | 2012-07-26 | 2012-10-24 | 中国电子科技集团公司第二十六研究所 | Vibratory gyroscope exciting cover electrode etching balance adjusting device and method |
| CN104975350A (en) * | 2015-07-09 | 2015-10-14 | 江苏德尔森传感器科技有限公司 | Sheet holder positioning apparatus during sensor single crystal silicon etching process |
| CN207966916U (en) * | 2018-01-09 | 2018-10-12 | 蚌埠市龙子湖区金力传感器厂 | A kind of horse positioning device in sensor monocrystalline silicon etching |
| CN208309005U (en) * | 2018-04-25 | 2019-01-01 | 浙江树人学院 | A kind of horse positioning device in sensor monocrystalline silicon etching process |
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Application publication date: 20210413 |