CN112638028A - Antioxidant mixture, circuit board and display panel - Google Patents
Antioxidant mixture, circuit board and display panel Download PDFInfo
- Publication number
- CN112638028A CN112638028A CN202011401442.9A CN202011401442A CN112638028A CN 112638028 A CN112638028 A CN 112638028A CN 202011401442 A CN202011401442 A CN 202011401442A CN 112638028 A CN112638028 A CN 112638028A
- Authority
- CN
- China
- Prior art keywords
- scavenger
- layer
- circuit board
- ion
- zirconium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Abstract
The application discloses anti-oxidant mixture, circuit board and display panel, wherein, anti-oxidant mixture is used for the circuit board, including the active ingredient and the ion trapping agent of misce bene, active ingredient can with the metal wiring layer surface formation film of circuit board, the ion trapping agent can with follow the ion combination that metal wiring layer surface migrated out. Through the design mode, the problem of ion migration of the metal circuit layer on the circuit board can be improved.
Description
Technical Field
The application belongs to the technical field of circuit boards, and particularly relates to an antioxidant mixture, a circuit board and a display panel.
Background
With the development of light and thin display panels, circuit boards (e.g., Flexible Printed Circuit (FPC) boards) are becoming increasingly more precise and denser as important components of display panels. Due to the difference of the use environment, the circuit board needs to meet various requirements for tolerance.
However, when the circuit is operated in a high-temperature, high-humidity and charged environment, high-voltage and low-voltage difference metal lines are easy to generate, and the product fails due to the micro short circuit phenomenon caused by ion migration. Therefore, in order to prolong the service life of the circuit board and the display panel, certain measures are required to reduce the probability of the occurrence of the ion migration phenomenon.
Disclosure of Invention
The application provides an anti-oxidation mixture, a circuit board and a display panel, so that the probability of occurrence of an ion migration phenomenon in the circuit board is reduced.
In order to solve the technical problem, the application adopts a technical scheme that: an antioxidant mixture is provided for use in a circuit board, comprising: the active component and the ion scavenger are mixed uniformly, wherein the active component can form a film with the surface of the metal circuit layer of the circuit board, and the ion scavenger can be combined with ions migrated from the surface of the metal circuit layer.
Wherein the ion scavenger comprises an anion scavenger and/or a cation scavenger.
Wherein the ratio of the volume of the ion scavenger to the total volume of the antioxidant mixture is less than or equal to 0.3%.
Wherein the ratio of the volume of the ion scavenger to the volume of the active component is greater than or equal to 0.2% and less than or equal to 0.5%.
Wherein the ion scavenger comprises an anion scavenger and a cation scavenger, and a difference between a volume of the anion scavenger and a volume of the cation scavenger is less than a threshold value; preferably, the volume of the anion scavenger is the same as the volume of the cation scavenger.
The anion scavenger is at least one of magnesium aluminum oxide, bismuth oxide hydrate or hydrotalcite anion scavenger, and the cation scavenger is at least one of zirconium phosphate, zirconium tungstate, zirconium molybdate, zirconium antimonate, zirconium selenate, zirconium tellurate, zirconium silicate, zirconium phosphosilicate and zirconium polyphosphate.
In order to solve the above technical problem, another technical solution adopted by the present application is: provided is a circuit board including: a base layer; the metal circuit layer is positioned on at least one side surface of the base layer; the anti-oxidation layer covers the surface of one side, far away from the base layer, of the metal circuit layer; the anti-oxidation layer comprises a main body film layer and an ion capture agent positioned in the main body film layer, the main body film layer is formed by active components capable of forming a film with the surface of the metal circuit layer, and the ion capture agent can be combined with ions migrated from the surface of the metal circuit layer.
Wherein the ion scavenger comprises an anion scavenger and a cation scavenger; the oxidation resistant layer close to the anode of the circuit board contains a cation trapping agent, and the oxidation resistant layer close to the cathode of the circuit board contains an anion trapping agent.
Wherein the anion scavenger and the cation scavenger are uniformly distributed in the antioxidation layer.
Wherein, still include: the covering film is positioned on one side surface, away from the base layer, of the oxidation resistant layer, and the oxidation resistant layer is provided with a bonding area exposed out of the covering film.
In order to solve the above technical problem, another technical solution adopted by the present application is: a display panel is provided, comprising the circuit board described in any of the above embodiments.
Being different from the prior art situation, the beneficial effect of this application is: the utility model provides an anti-oxidant mixture for circuit board includes the active ingredient and the ion trapping agent of misce bene, wherein, active ingredient can take place chemical reaction and form compact film with metal wiring layer surface, and then reduces the probability that metal wiring layer was oxidized, improves the oxidation resistance and the moisture resistance on metal wiring layer, and can reduce the probability of migrating out the ion from metal wiring layer surface. In addition, the anti-oxidation mixture contains an ion capture agent, and the ion capture agent can further capture cations or anions migrated from the anode or the cathode, so that an electrochemical reaction is prevented, the phenomena of forming a conductive channel between metal lines and generating short circuit are reduced, namely the probability of the occurrence of the ion migration phenomenon is further reduced, and the service lives of the circuit board and the display panel are prolonged.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic diagram of a circuit board structure according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In order to solve the problem of ion migration of the circuit board, the application provides an antioxidant mixture (OSP) for the circuit board, which specifically comprises an active component and an ion capture agent which are uniformly mixed, wherein the active component can form a thin film with the surface of a metal circuit layer of the circuit board, specifically can form a thin film by chemical reaction with the surface of the metal circuit layer of the circuit board, so that the probability of oxidation of the metal circuit layer is reduced, the oxidation resistance and the moisture resistance of the metal circuit layer are improved, and the probability of ion migration from the surface of the metal circuit layer can be reduced. In addition, even if ions migrate out of the surface of the metal circuit layer, the anti-oxidation mixture contains the ion capture agent, so that the ion capture agent can further capture cations and/or anions migrating out of the anode and/or the cathode, prevent electrochemical reaction, reduce the phenomenon that a conductive channel is formed between metal circuits and a short circuit occurs, namely reduce the probability of occurrence of the ion migration phenomenon, and prolong the service life of the circuit board and the display panel.
In this embodiment, the active ingredient may be rosins, active resins, azoles, with azoles being the most widely used at present. Taking the material of the metal circuit layer as copper as an example, the active component of azole can form a compact complex film with electrolyzed divalent copper ions on the copper surface under a certain condition, and the complex film can serve as an anti-oxidation barrier layer between the copper surface and air. Of course, in other embodiments, the above effects can be achieved when the metal circuit layer is made of other metals. In one embodiment, the active component may include any one of an alkyl benzimidazole, a benzotriazole, and an imidazole.
Of course, in other embodiments, other components, such as low molecular weight organic acids (e.g., acetic acid, formic acid, etc.), solvents (e.g., water, etc.), other adjuvants, etc., may also be included in the antioxidant mixture. Wherein, the low molecular organic acid can increase the solubility of the active component in the solvent and promote the formation of the complex film.
The ion scavenger may contain an anion scavenger, or the ion scavenger may contain a cation scavenger, or the ion scavenger may contain both an anion scavenger and a cation scavenger.
Taking the metal circuit layer as copper as an example, the following reaction occurs at the position of the anode of the circuit board under the condition of power-on and moisture: cu → Cu2++2e-；H2O→1/2O2↑+2H++2e-(ii) a The following reactions occur at the cathode location of the circuit board: cu2++2e-→Cu；H2O+2e-→1/2H2↑+2OH-. Namely, divalent copper ions can be ionized by the anode of the circuit board, and the dissociated divalent copper ions are reduced to copper at the cathode of the circuit board, so that the phenomenon of dendritic growth of copper wires can occur, and further short circuit can be caused; the cation trapping agent doped in the antioxidant mixture can trap divalent copper ions and inhibit the migration phenomenon of the divalent copper ions; similarly, anions in water can be captured by the anion capture agent doped in the antioxidant mixture, so that the ion content and the conductivity in the water are reduced, and the migration of divalent copper ions is hindered.
Preferably, in this embodiment, the anion scavenger is at least one of magnesium aluminum oxide, bismuth oxide hydrate, and hydrotalcite anion scavenger, and the cation scavenger is at least one of zirconium phosphate, zirconium tungstate, zirconium molybdate, zirconium antimonate, zirconium selenate, zirconium tellurate, zirconium silicate, zirconium phosphosilicate, zirconium polyphosphate, or a high molecular heavy metal ion scavenger. In order to make the mixing of the cation and anion scavengers with the active component or other components more uniform, the particle size of the cation and anion scavengers may be between 200-500 nm. In addition, in order to mix the anion scavenger and the cation scavenger in the antioxidant mixture uniformly, the anion scavenger and the cation scavenger may be selected from materials having high solubility in the antioxidant mixture; of course, some co-solvents that can increase the solubility of the cation and anion traps can also be added to the antioxidant mixture.
In addition, in the present embodiment, the ratio of the volume of the ion scavenger to the total volume of the antioxidant mixture is greater than 0 and less than or equal to 0.3%, for example, the ratio of the volume of the ion scavenger to the total volume of the antioxidant mixture is 0.1%, 0.2%, or the like. The design mode of the ratio can ensure that the added ion trapping agent does not influence the normal film forming process of the original active component on the metal circuit layer so as to ensure that the film formed by the active component on the metal circuit layer is compact. Of course, if the content of the ion scavenger is too low, the ion trapping effect is not good, so that it is preferable that the ratio of the volume of the whole ion scavenger to the total volume of the antioxidant mixture is 0.1% or more and 0.3% or less.
Further, the ratio of the volume of the ion scavenger to the volume of the active component (e.g., azole species, etc.) in the antioxidant mixture is greater than or equal to 0.2 and less than or equal to 0.5%, e.g., the ratio of the volume of the ion scavenger to the total volume of the active component is 0.3%, 0.4%, etc. The design mode of the ratio can ensure that the added ion trapping agent does not influence the normal film forming process of the original active component on the metal circuit layer so as to ensure that the film formed by the active component on the metal circuit layer is compact. Of course, if the content of the ion scavenger is too low, the ion trapping effect is not good, so that it is preferable that the ratio of the volume of the entire ion scavenger to the volume of the active component is 0.3% or more and 0.5% or less.
When the ion scavenger contains an anion scavenger and a cation scavenger, the absolute value of the difference between the volume of the anion scavenger and the volume of the cation scavenger is less than or equal to a threshold value; for example, the ratio of the volume of the anion scavenger to the volume of the cation scavenger is 0.95 to 1.05 (e.g., 0.98, 1, 1.02, etc.). The design mode can lead the efficiency of the ion trapping agent to be higher when the ion trapping agent traps ions, and can effectively improve the condition of ion migration. Alternatively, the volume of the anion scavenger is the same as the volume of the cation scavenger. The design mode can reduce the process difficulty in preparation and effectively improve the condition of ion migration.
In one application scenario, the process of forming the antioxidant mixture may be: firstly, providing a first mixture formed by an active component, a first solvent, a low-molecular organic acid and other auxiliary agents; then providing a second mixture containing an ion scavenger and a second solvent; finally, uniformly mixing the first mixture and the second mixture; preferably, the first solvent and the second solvent are the same. The design mode can enable the ion trapping agent to be uniformly distributed in the anti-oxidation mixture. Of course, in other application scenarios, the process of forming the antioxidant mixture may be: directly and uniformly mixing the ion trapping agent, the active component, the solvent, the low-molecular organic acid and other cosolvents.
Referring to fig. 1, fig. 1 is a schematic diagram of a circuit board structure according to an embodiment of the present disclosure. The circuit board may be a flexible circuit board FPC or the like, which specifically includes a base layer 10, a metal wiring layer 12, and an oxidation resistant layer 14. The material of the base layer 10 may be polyimide PI, which may be formed by laminating one or more layers. The metal circuit layer 12 is located on at least one side surface of the base layer 10, and the material of the metal circuit layer 12 may be copper, etc., that is, it may be a patterned copper layer; the metal wiring layer 12 is shown on only one side surface of the base layer 10 in fig. 1, and it is understood that the metal wiring layer 12 may be disposed on the other side surface of the base layer 10 in fig. 1. An anti-oxidation layer 14 covers the surface of the metal wiring layer 12 on the side away from the base layer 10, and the anti-oxidation layer 14 contains an ion scavenger. The anti-oxidation layer 14 may include a main film layer 140 and an ion scavenger 142 mixed in the main film layer 140, and the main film layer 140 may be formed by curing an active component such as rosin, active resin, or azole with the surface of the metal wiring layer 12 to form a film. The oxidation resistant layer 14 can reduce the probability of oxidation of the metal circuit layer 12, and improve the oxidation resistance and moisture resistance of the metal circuit layer 12. In addition, because the anti-oxidation layer 14 contains the ion scavenger 142, the ion scavenger 142 can scavenge cations and/or anions migrating from the anode and/or the cathode, that is, the probability of ion migration is reduced, electrochemical reaction is prevented, the phenomena of forming conductive channels between the wires of the metal wire layer 12 and short circuit are reduced, and the service life of the circuit board is prolonged.
Preferably, in the present embodiment, the ion scavenger 142 may comprise an anion scavenger and/or a cation scavenger. The anion scavenger is at least one of magnesium aluminum oxide, bismuth oxide hydrate or hydrotalcite anion scavenger, and the cation scavenger is at least one of zirconium phosphate, zirconium tungstate, zirconium molybdate, zirconium antimonate, zirconium selenate, zirconium tellurate, zirconium silicate, zirconium phosphosilicate, zirconium polyphosphate or high molecular heavy metal ion scavenger. In order to make the mixing of the cation and anion scavengers with the active component or other components more uniform, the particle size of the cation and anion scavengers may be between 200-500 nm.
In addition, in general, the positions of the anode and the cathode of the circuit board are fixed in advance, and when the ion scavenger 142 includes an anion scavenger and a cation scavenger, the cation scavenger is included in the antioxidation layer 14 near the anode of the circuit board, and the anion scavenger is included in the antioxidation layer 14 near the cathode of the circuit board. The design mode can lead the ions at the anode and the cathode of the circuit board to be captured rapidly so as to improve the ion capture efficiency.
In one application scenario, the concentration of the cation scavenger within the anti-oxidation layer 14 near or at the anode of the circuit board is greater than the concentration of the cation scavenger contained within the anti-oxidation layer 14 near or at the cathode of the circuit board, and the concentration of the anion scavenger within the anti-oxidation layer 14 near or at the cathode of the circuit board is greater than the concentration of the anion scavenger contained within the anti-oxidation layer 14 near or at the anode of the circuit board. Generally speaking, the cation concentration at the anode of the circuit board is high, and the anion concentration at the cathode of the circuit board is high, so that the ion capture efficiency can be improved by the design mode.
In yet another application scenario, the cation scavenger and the anion scavenger may also be uniformly distributed in the antioxidation layer 14; the design mode can reduce the difficulty of process preparation.
In addition, referring to fig. 1 again, the circuit board provided in the present application may further include a cover film 16 located on a side surface of the anti-oxidation layer 14 away from the base layer 10, the anti-oxidation layer 14 has a bonding area exposed from the cover film 16, and the bonding area may be formed with a plurality of bonding pins for bonding connection with other electronic devices such as a display panel. That is, the surface of the metal circuit layer 12 at the bonding pin is covered by the oxidation resistant layer 14 to form a compact film, the metal pin is placed to be corroded, and the ion capture agent is mixed in the oxidation resistant layer 14, so that ions at the position where the metal circuit layer migrates from the metal circuit layer can be captured, and the risk of short circuit of the metal pin which is not covered by the covering film is reduced. The cover film 16 may be made of a curable resin such as an imide oligomer, and the cover film 16 has good mechanical strength and heat resistance at high temperature and can protect the metal wiring layer 12.
Of course, in other embodiments, an adhesive layer may also be introduced between the cover film 16 and the oxidation resistant layer 14, through which the cover film 16 and the oxidation resistant layer 14 are secured.
The specific process of forming the circuit board is described in detail below:
A. providing a base layer;
B. forming a copper layer on one side surface or two oppositely arranged surfaces of the base layer;
C. forming a photoresist layer on the surface of the copper layer, and carrying out exposure and development treatment on the photoresist layer to form a patterned opening structure on the photoresist layer;
D. etching the copper layer at the position of the opening to form a metal circuit layer;
E. removing the photoresist layer;
F. and E, cleaning the whole body after the step E, wherein the specific cleaning process can be as follows: removing oxides, fingerprints and the like on the surface by using an oil removing agent, wherein the oil removing agent can contain a plurality of acidic substances such as acetic acid, sulfuric acid and the like; washing and spraying the whole body after oil removal; drying;
G. and F, carrying out microetching on the whole body after the step F, wherein the specific process can be as follows: the cleaned whole body is placed in hydrogen peroxide, and the stability of the hydrogen peroxide is poor, so that a stabilizing agent sodium silicate is added to prevent decomposition, and the stabilizing agent sodium silicate can be used for controlling the micro-etching rate; the copper surface treated by the working procedure is in a mirror surface shape;
H. spraying the prepared antioxidant mixture on the surface of the metal circuit layer, wherein the spraying temperature can be controlled to be about 42 ℃, and the spraying time is controlled to be about 55 seconds;
I. carrying out air drying, water washing and drying treatment on the whole body obtained in the step H to form an anti-oxidation layer;
J. pasting a covering film on the surface of the anti-oxidation layer, and performing pressing treatment on the covering film;
K. and D, baking the whole body after the step J.
Referring to fig. 2, fig. 2 is a schematic view of a display panel structure according to an embodiment of the present disclosure, and the display panel 20 may be applied to a mobile phone, a television, a tablet computer, and the like. The display panel 20 may include the circuit board 200 in any of the above embodiments. Optionally, taking the display panel 20 as an overall display screen as an example, the circuit board 200 is located on the back of the display screen, one end of the circuit board is bonded to a terminal of the display screen through a metal pin, and the other end of the circuit board is connected to a main board of a terminal device such as a mobile phone, a television, a tablet computer, and the like, so as to input an electrical signal to the display screen.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.
Claims (10)
1. An antioxidant mixture for use in a circuit board, comprising:
the active component and the ion scavenger are mixed uniformly, wherein the active component can form a film with the surface of the metal circuit layer of the circuit board, and the ion scavenger can be combined with ions migrated from the surface of the metal circuit layer.
2. The antioxidant mixture of claim 1,
the ion scavenger comprises an anion scavenger and/or a cation scavenger.
3. The antioxidant mixture of claim 2,
the ratio of the volume of the ion capture agent to the total volume of the antioxidant mixture is greater than 0 and less than or equal to 0.3%;
preferably, the ratio of the volume of the ion scavenger to the volume of the active component is greater than or equal to 0.2% and less than or equal to 0.5%.
4. The antioxidant mixture of claim 2,
the ion scavenger comprises an anion scavenger and a cation scavenger, and an absolute value of a difference between a volume of the anion scavenger and a volume of the cation scavenger is less than or equal to a threshold value;
preferably, the volume of the anion scavenger is the same as the volume of the cation scavenger.
5. The antioxidant mixture of claim 2,
the anion scavenger is at least one of magnesium aluminum oxide, bismuth oxide hydrate or hydrotalcite anion scavenger, and the cation scavenger is at least one of zirconium phosphate, zirconium tungstate, zirconium molybdate, zirconium antimonate, zirconium selenate, zirconium tellurate, zirconium silicate, zirconium phosphosilicate and zirconium polyphosphate.
6. A circuit board, comprising:
a base layer;
the metal circuit layer is positioned on at least one side surface of the base layer;
the anti-oxidation layer covers the surface of one side, far away from the base layer, of the metal circuit layer; the anti-oxidation layer comprises a main body film layer and an ion capture agent positioned in the main body film layer, the main body film layer is formed by active components capable of forming a film with the surface of the metal circuit layer, and the ion capture agent can be combined with ions migrated from the surface of the metal circuit layer.
7. The circuit board of claim 6,
the ion scavenger comprises an anion scavenger and a cation scavenger; the oxidation resistant layer close to the anode of the circuit board contains a cation trapping agent, and the oxidation resistant layer close to the cathode of the circuit board contains an anion trapping agent.
8. The circuit board of claim 7,
the anion scavenger and the cation scavenger are uniformly distributed in the antioxidation layer.
9. The circuit board of claim 6, further comprising:
the covering film is positioned on one side surface, away from the base layer, of the oxidation resistant layer, and the oxidation resistant layer is provided with a bonding area exposed out of the covering film.
10. A display panel comprising the circuit board according to any one of claims 6 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011401442.9A CN112638028A (en) | 2020-12-02 | 2020-12-02 | Antioxidant mixture, circuit board and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011401442.9A CN112638028A (en) | 2020-12-02 | 2020-12-02 | Antioxidant mixture, circuit board and display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112638028A true CN112638028A (en) | 2021-04-09 |
Family
ID=75307689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011401442.9A Pending CN112638028A (en) | 2020-12-02 | 2020-12-02 | Antioxidant mixture, circuit board and display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112638028A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110129360A (en) * | 2010-05-25 | 2011-12-01 | 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 | Fabrication of catalyzed ion transport membrane systems |
| CN104423165A (en) * | 2013-09-02 | 2015-03-18 | 株式会社Kcc | Photosensitive Resin Composition Of Excellent Reliability And Method For Manufacturing Same |
| CN108137791A (en) * | 2015-09-30 | 2018-06-08 | 太阳油墨制造株式会社 | Hardening resin composition, dry film and use its printed circuit board |
| CN108463774A (en) * | 2016-01-12 | 2018-08-28 | 日立化成株式会社 | Photosensitive polymer combination uses the manufacturing method of its dry film, printing distributing board and printing distributing board |
| CN110607052A (en) * | 2019-09-23 | 2019-12-24 | 广东生益科技股份有限公司 | Prepreg, laminated board and printed circuit board |
-
2020
- 2020-12-02 CN CN202011401442.9A patent/CN112638028A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110129360A (en) * | 2010-05-25 | 2011-12-01 | 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 | Fabrication of catalyzed ion transport membrane systems |
| CN104423165A (en) * | 2013-09-02 | 2015-03-18 | 株式会社Kcc | Photosensitive Resin Composition Of Excellent Reliability And Method For Manufacturing Same |
| CN108137791A (en) * | 2015-09-30 | 2018-06-08 | 太阳油墨制造株式会社 | Hardening resin composition, dry film and use its printed circuit board |
| CN108463774A (en) * | 2016-01-12 | 2018-08-28 | 日立化成株式会社 | Photosensitive polymer combination uses the manufacturing method of its dry film, printing distributing board and printing distributing board |
| CN110607052A (en) * | 2019-09-23 | 2019-12-24 | 广东生益科技股份有限公司 | Prepreg, laminated board and printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3264402A (en) | Multilayer printed-wiring boards | |
| JP5339232B2 (en) | Electrical component connection method and connection device | |
| KR101167427B1 (en) | Anodized heat-radiating substrate and method for manufacturing the same | |
| US9113562B2 (en) | Manufacturing method for printed wiring board | |
| US9226406B2 (en) | Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device | |
| CN112638028A (en) | Antioxidant mixture, circuit board and display panel | |
| US20190037701A1 (en) | Base board and mobile terminal | |
| CN103898498B (en) | The making method of melanism liquid medicine and transparent printed circuit board (PCB) | |
| US20110250395A1 (en) | Electrode connection structure, conductive adhesive used therefor, and electronic device | |
| US20050229388A1 (en) | Multi-layer ceramic chip varistor device surface insulation method | |
| TW201627420A (en) | Conductive ink, circuit board and method for manufacturing the same | |
| JPH0554202B2 (en) | ||
| JP2008235046A (en) | Electronic device and electronic component | |
| KR101164596B1 (en) | Electrolyic etching device | |
| KR20210002454A (en) | Etching solution for copper foil and manufacturing method of printed wiring board using the same, and etching solution for electrolytic copper layer and manufacturing method of copper filler using the same | |
| Ambat et al. | PCBA cleanliness as a means to improve humidity robustness of electronics | |
| JP2008060413A (en) | Printed wiring board with built-in component, and electronic apparatus | |
| CN104640382B (en) | Composite substrate and rigid substrates | |
| JP2001345538A (en) | Method of manufacturing printed wiring board | |
| CN113677099A (en) | Method for preventing ion migration of solder mask | |
| CN110117791A (en) | A kind of binding force promotor for holes on high density interconnected printed circuit board brownification liquid | |
| KR20230140716A (en) | Circuit board, semiconductor package, and method of manufacturing the same | |
| JPH07142828A (en) | Electronic circuit board | |
| JP6069893B2 (en) | Electronic circuit equipment | |
| JPH0637455A (en) | Manufacture of multilayer printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210409 |
|
| RJ01 | Rejection of invention patent application after publication |