CN104640382B - Composite substrate and rigid substrates - Google Patents
Composite substrate and rigid substrates Download PDFInfo
- Publication number
- CN104640382B CN104640382B CN201410636928.9A CN201410636928A CN104640382B CN 104640382 B CN104640382 B CN 104640382B CN 201410636928 A CN201410636928 A CN 201410636928A CN 104640382 B CN104640382 B CN 104640382B
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- Prior art keywords
- layer
- composite substrate
- rigid substrates
- wiring layer
- connection terminal
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- 239000000758 substrate Substances 0.000 title claims abstract description 227
- 239000002131 composite material Substances 0.000 title claims abstract description 97
- 239000010410 layer Substances 0.000 claims description 341
- 239000011810 insulating material Substances 0.000 claims description 22
- 238000009413 insulation Methods 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 10
- 239000012792 core layer Substances 0.000 claims 9
- 238000010276 construction Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 46
- 229910000679 solder Inorganic materials 0.000 description 37
- 230000004907 flux Effects 0.000 description 36
- 239000011247 coating layer Substances 0.000 description 24
- 238000004519 manufacturing process Methods 0.000 description 22
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 239000010949 copper Substances 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 238000007747 plating Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 230000002708 enhancing effect Effects 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
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- 230000000052 comparative effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
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- 238000010438 heat treatment Methods 0.000 description 3
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- 239000007787 solid Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- -1 imide cyanate Chemical class 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
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- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention provides a kind of composite substrate and rigid substrates for being suitable for slimming and the construction for having productivity excellent.The composite substrate of the present invention includes rigid substrates and flexible base board.Rigid substrates are laminated with sandwich layer, insulating layer and wiring layer, have first thickness, have vacant position portion at least setting on one side, and the first connection terminal is from the exposing of vacancy portion.Flexible base board is engaged in vacancy portion, has second connection end being electrically connected with the first connection terminal, has second thickness smaller than first thickness and smaller than the depth in vacancy portion.
Description
Technical field
The present invention relates to the composite substrates for being bonded to rigid substrates and flexible base board.
Background technology
In electronic equipment of various, it will engage what is formed without flexible rigid substrates and flexible flexible base board
Composite substrate is widely used.For the engaged configuration of rigid substrates and flexible base board, various shapes have been had developed
State.
For example, in patent document 1, publicity has the rigid-flexible printed circuit that flexible base board is laminated in rigid substrates.
By setting vacancy portion in basal substrate, basal substrate is partly removed, caused by can preventing the residue of basal substrate
Pollution.
In addition, in patent document 2, the composite wiring board that the flexible substrate of publicity is clipped by rigid substrates.By
Rigid substrates set virtual through hole, apply impartial pressure to flexible base board, can prevent the deformation of flexible base board.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2012-134490 publications
Patent document 2：Japanese Unexamined Patent Publication 2005-011859 publications
The content of the invention
Problems to be solved by the invention
But in the composite substrate recorded in such as patent document 1 and 2, since flexible base board and rigid substrates are stacked, because
This has that composite substrate is difficult to be thinned.Due to the miniaturization of electronic equipment in recent years, it is desirable that composite substrate it is thin
Type.Although in addition, in general, composite substrate is singulated after the engagement of rigid substrates and flexible base board, at this moment just
Property substrate a part just waste, it is difficult to reduce manufacture cost.
Based on as previously discussed the problem of, it is an object of the invention to provide one kind have suitable for slimming and productivity it is excellent
The composite substrate and rigid substrates of different construction.
For solving the technological means of problem
To achieve the above object, the composite substrate of one embodiment of the present invention includes rigid substrates and flexible base board.
Above-mentioned rigid substrates are laminated with sandwich layer, insulating layer and wiring layer, have first thickness, at least while setting free
The portion of lacking, the first connection terminal expose from above-mentioned vacancy portion.
Above-mentioned flexible base board is engaged in above-mentioned vacancy portion, including with above-mentioned first connection terminal is electrically connected second is connected
Terminal, above-mentioned flexible base board have second thickness smaller than above-mentioned first thickness and smaller than the depth in above-mentioned vacancy portion.
To achieve the above object, the rigid substrates of a mode of the invention include：With first surface side opposite with its
The sandwich layer of second surface；It is made of the first insulating layer and the first wiring layer and is laminated in wiring in the first layer of above-mentioned first surface
Layer；It is made of second insulating layer and the second wiring layer and is laminated in wiring layer in the second layer of above-mentioned second surface, removed above-mentioned
Wiring layer and above-mentioned sandwich layer in first layer and form vacancy portion.
Description of the drawings
Fig. 1 is the stereogram of the composite substrate of first embodiment of the invention.
Fig. 2 is the exploded perspective view of the composite substrate.
Fig. 3 is the stereogram for the rigid substrates for forming the composite substrate.
Fig. 4 is the stereogram for the rigid substrates for forming the composite substrate.
Fig. 5 is the plan view for the rigid substrates for forming the composite substrate.
Fig. 6 is the plan view for the rigid substrates for forming the composite substrate.
Fig. 7 is the sectional view for the rigid substrates for forming the composite substrate.
Fig. 8 is the stereogram for the rigid substrates for forming the composite substrate.
Fig. 9 is the plan view for the rigid substrates for forming the composite substrate.
Figure 10 is the sectional view for the rigid substrates for forming the composite substrate.
Figure 11 is the stereogram for the flexible base board for forming the composite substrate.
Figure 12 is the sectional view for the flexible base board for forming the composite substrate.
Figure 13 is the sectional view of the composite substrate.
Figure 14 is the schematic diagram of the relation for the thickness for representing the composite substrate.
Figure 15 is the sectional view of the composite substrate of comparative example.
Figure 16 is the sectional view of the composite substrate of comparative example.
Figure 17 is the composite substrate of first embodiment of the invention, is the section for the composite substrate for being equipped with skin member
Figure.
Figure 18 is the schematic diagram for the manufacturing process for representing the composite substrate.
Figure 19 is the schematic diagram for the manufacturing process for representing the composite substrate.
Figure 20 is the schematic diagram for the manufacturing process for representing the composite substrate.
Figure 21 is the schematic diagram for the manufacturing process for representing the composite substrate.
Figure 22 is the schematic diagram for the manufacturing process for representing the composite substrate.
Figure 23 is the schematic diagram for the manufacturing process for representing the composite substrate.
Figure 24 is the schematic diagram for the manufacturing process for representing the composite substrate.
Figure 25 is the sectional view of the rigid substrates for the composite substrate for forming second embodiment of the present invention.
Figure 26 is the sectional view for the flexible base board for forming the composite substrate.
Figure 27 is the sectional view of the composite substrate.
Figure 28 is the schematic diagram for the manufacturing process for representing the composite substrate.
Figure 29 is the schematic diagram for the manufacturing process for representing the composite substrate.
Figure 30 is the sectional view of the composite substrate of the variation of the present invention.
Figure 31 is the sectional view of the composite substrate of the variation of the present invention.
Symbol description
100、1100：Composite substrate
200、700：Rigid substrates
201：Vacancy portion
202：Side wall
203、701：Connection terminal
204：Connect weld pad
205：Sandwich layer
206：Wiring layer in first layer
207：Wiring layer in the second layer
208：First solder flux resist layer
209：Second solder flux resist layer
210：Insulation division
211：Wiring layer
212：Insulating layer
300、800：Flexible base board
301：Connection terminal
302：Base material
303：Wiring layer
304：Coating
305：Layer of adhesive material
400、1200：Bonding layer
702：Conductive layer
900：Skin member
Specific embodiment
The composite substrate of one embodiment of the present invention includes rigid substrates and flexible base board.
Above-mentioned rigid substrates are laminated with sandwich layer, insulating layer and wiring layer, have first thickness, at least while setting free
The portion of lacking, the first connection terminal expose from above-mentioned vacancy portion.
Above-mentioned flexible base board is engaged in above-mentioned vacancy portion, including with above-mentioned first connection terminal is electrically connected second is connected
Terminal has second thickness smaller than above-mentioned first thickness and smaller than the depth in above-mentioned vacancy portion.
According to this constitution, the flexible base board engaged with rigid substrates is incorporated in the vacancy portion being arranged in rigid substrates
It is interior, it is not protruded from vacancy portion.Therefore, the maximum gauge of composite substrate terminates in the thickness of rigid substrates, can prevent flexible base board
Engagement caused by composite substrate thickness increase.
Above-mentioned first connection terminal can also be formed by above-mentioned wiring layer.
It according to this constitution, can be by the use of wiring layer as connection terminal, it is not necessary in addition connection terminal is set, therefore, it is possible to
Realize that the process number of manufacturing process is reduced.
Above-mentioned sandwich layer is made of metal,
Above-mentioned first connection terminal can also be formed by above-mentioned sandwich layer.
According to this constitution, due to can be by the use of sandwich layer as connection terminal, it is not necessary in addition connection terminal is set, therefore can
Realize that the process number of manufacturing process is reduced.
Above-mentioned first connection terminal can also be formed by above-mentioned wiring layer and the conductive layer being laminated on above-mentioned wiring layer.
According to this constitution, the insulating layer of connection terminal and surrounding can be formed in the same face or can be allowed to from week
The insulating layer enclosed protrudes.Thus, it is possible to rigid substrates and flexible base board are engaged using aftermentioned NCP or NCF.
Above-mentioned composite substrate is also equipped with bonding layer, is configured between above-mentioned rigid substrates and above-mentioned flexible base board, will be upper
The first connection terminal and the son electrical connection of above-mentioned second connection end are stated, includes conductive material.
According to this constitution, can be engaged rigid substrates and flexible base board by bonding layer, and can be by rigid substrates and flexibility
Substrate is electrically connected.
Above-mentioned conductive material can also be ACP (Anisotropic Conductive Paste：Anisotropic conductive
Paste) or ACF (Anisotropic Conductive Film：Anisotropic conductive film).
ACP and ACF is to contain conductive particle in insulating material, and when being heated, being squeezed, insulating material is squeezed
Go out, be electrically connected by remaining conductive particle.Therefore, even if the first connection terminal and second connection end leave, lead to
The bonding layer that configuration is made of ACP or ACF between the first connection terminal and second connection end is crossed, two-terminal can also be carried out
Electrical connection.
Above-mentioned conductive material can also be NCP (Non-anisotropic Conductive Paste：It is non-respectively to different
Property conductive paste) or NCF (Non-anisotropic Conductive Film：Non- anisotropic conductive film).
NCP and NCF is that conductive particle is not contained in insulating material, by contacting the two-terminal of coalesced object
In the state of be fixed, two-terminal is electrically connected.According to the above configuration, being formed makes the thickness of the first connection terminal is increased to lead
Electric layer can contact the first connection terminal and second connection end muon physics, therefore, can utilize NCP or NCF as engaging
Layer.
Above-mentioned rigid substrates can also include：The sandwich layer of second surface with first surface side opposite with its；By first
Insulating layer and the first wiring layer form and are laminated in wiring layer in the first layer of above-mentioned first surface；By second insulating layer and second
Wiring layer forms and is laminated in wiring layer in the second layer of above-mentioned second surface, and above-mentioned vacancy portion is by removing above-mentioned first insulation
Layer and above-mentioned sandwich layer and formed.
The rigid substrates of one embodiment of the present invention include：The core of second surface with first surface side opposite with its
Layer is made of the first insulating layer and the first wiring layer and is laminated in wiring layer in the first layer of above-mentioned first surface；By second absolutely
Edge layer and the second wiring layer form and are laminated in wiring layer in the second layer of above-mentioned second surface, remove above-mentioned first insulating layer and
Above-mentioned sandwich layer and form vacancy portion.
(first embodiment)
The composite substrate of first embodiment of the invention is illustrated.
Fig. 1 is the stereogram of the composite substrate 100 of first embodiment of the invention, and Fig. 2 is that the decomposition of composite substrate 100 is stood
Body figure.As depicted in figs. 1 and 2, composite substrate 100 is engaged and formed for rigid substrates 200 and flexible base board 300.
[on rigid substrates]
Rigid substrates 200 are without flexible substrate, are for installing the substrate of aftermentioned skin member (IC etc.).With
Under, in rigid substrates 200, the face of one side of flexible base board 300 will be engaged as lower surface, using the face of its opposite side as upper
Surface.Fig. 3 is the stereogram of the rigid substrates 200 in terms of lower face side, and Fig. 4 is the solid of the rigid substrates 200 in terms of upper surface side
Figure.In addition, Fig. 5 is the plan view for the lower surface for representing rigid substrates 200, Fig. 6 be represent rigid substrates 200 upper surface it is flat
Face figure.Fig. 7 is the sectional view of rigid substrates 200, is the sectional view of the line A in Fig. 3 to Fig. 6.
The size of rigid substrates 200 is not particularly limited, but can be formed as such as long side 16mm, short side 10mm.Its shape
Shape also not shall be limited only to the extent rectangle, can suitably be changed according to layout of the component in 200 actual installation of rigid substrates etc..
As shown in Figure 3 and Figure 7, the portion 201 that has vacant position is formed in rigid substrates 200.Vacancy portion 201 is formed at rigid substrates
200 at least one side, is the step-like concave part of rigid substrates 200.On the forming method in vacancy portion 201, chat later
It states.The size in vacancy portion 201 is not particularly limited, but can be formed as such as vacancy portion width (long side) 8.24mm.
As shown in figure 3, the both sides in vacancy portion 201 are provided with side wall 202.Side wall 202 is the shape in rigid substrates 200
The part in vacancy portion 201 is not provided with into the one side in the portion of having vacant position 201.Side wall 202 can not also must be set, and pass through side wall
202 maintain the intensity of rigid substrates 200.
As shown in Figure 3 and Figure 5, connection terminal 203 is formed in vacancy portion 201.Connection terminal 203 can be formed in sky
Lack the surface in portion 201.Connection terminal 203 can include multiple terminals for separating of insulated body, and the size of connection terminal 203 can be with
Be formed as such as terminal length 0.7mm, termination width 0.1mm, terminal intervals 0.1mm.
The shape and quantity of connection terminal 203 do not limit.Fig. 8 and Fig. 9 is represent connection terminal 203 other shapes of
Stereogram and sectional view.As shown in these figures, connection terminal 203 can also be arranged by multiple row.Connection terminal in this case
203 may be sized to for example：Terminal length 0.4mm, termination width 0.1mm, terminal intervals 0.1mm.
As shown in Figure 5 and Figure 6, the upper and lower surface of rigid substrates 200 is provided with connection weld pad 204.Connection weldering
Pad 204 is the part of (aftermentioned) electrical connection of the skin member for will be installed in the upper and lower surface of rigid substrates 200.Even
The configuration and quantity for connecing weld pad 204 are not particularly limited, and are set according to the layout of skin member.In addition, connection weld pad 204
Any surface that can be provided only in the upper and lower surface of rigid substrates 200.
Figure 10 is the enlarged drawing of Fig. 7, is the figure represented near the vacancy portion 201 of rigid substrates 200.As shown in the drawing,
Rigid substrates 200 are configured to sandwich layer 205, wiring layer 206 in first layer, wiring layer 207, the first solder flux are against corrosion in the second layer
The substrate that 208 and second solder flux resist layer 209 of oxidant layer is laminated.
Sandwich layer 205 is made of metal materials such as copper or copper alloys, the lit-par-lit structure of supporting rigid substrate 200.Rigid substrates
200 be the substrate that can be formed by implementing processing, film forming etc. to sandwich layer 205.In addition, sandwich layer 205 can be used as rigid base
The ground connection (ground, ground wire) of plate 200 plays a role.In addition, through hole 205a can be set in sandwich layer 205.
The insulation division 210 being made of insulating material is provided in 201 side end of vacancy portion of sandwich layer 205.In addition, insulation
Portion 210 can be formed around through hole 205a.The insulating material can using epoxy resin, polyimides, span come
Acid imide cyanate resin etc..Alternatively, it is also possible to utilize in these resins containing the enhancing filler being made of silica etc.
Material.
Wiring layer 206 is laminated in the lower face side of sandwich layer 205 in first layer, is stacked wiring layer 211 and insulating layer 212 and structure
Into.Wiring layer 211 is made of conductive materials such as copper, local to be separated by insulating layer 212.A part for wiring layer 211 is from first
Solder flux resist layer 208 exposes, and forms connection weld pad 204.Wiring layer 211 is as the skin member with being connected the engagement of weld pad 204
Signal wire play a role or as skin member and ground connection (sandwich layer 205) connecting line play a role.
On the surface for the wiring layer 211 for forming connection weld pad 204, coating layer M can be formed.Coating layer M can by Au or
Cu is formed.The thickness of coating layer M can be set as such as less than 0.05 μm or more 1 μm.As shown in Figure 10, wiring layer 211 can be with
Multilayer is formed, one layer can also be formed.In addition, wiring layer 211 can also be electrically connected in interlayer as shown in the drawing.
Insulating layer 212 is made of insulating material.The insulating material can utilize epoxy resin, polyimides, span
Carry out acid imide cyanate resin etc..Alternatively, it is also possible to be filled using in these resins containing the enhancing being made of silica etc.
The material of object.The insulating material of insulating layer 212 and insulation division 210 may be the same or different.
Wiring layer 207 is laminated in the upper surface side of sandwich layer 205 in the second layer, similary with wiring layer in first layer 206, is stacked
Wiring layer 211 and insulating layer 212 and form.A part for wiring layer 211 is exposed from the second solder flux resist layer 209, the company of composition
Connect weld pad 204.Wiring layer 211 plays a role or as the signal wire of the skin member with being connected the engagement of weld pad 204 as surface layer
Component and the connecting line of ground connection (sandwich layer 205) play a role.
The wiring layer 206 out of sandwich layer 205 and first layer of wiring layer 207 is protrudedly formed in the second layer, forms vacancy portion 201
Surface.A part for the wiring layer 211 of wiring layer 207 is exposed to the surface in the second layer, forms above-mentioned connection terminal
203.On the surface for the wiring layer 211 for forming connection terminal 203, coating layer M could be formed with.The material of coating layer M can basis
The joint method of aftermentioned rigid substrates 200 and flexible base board 300 makes choice, such as can be Au or Cu.
The wiring layer 211 of wiring layer 207 can also be configured to what is be connected with each other in wiring layer 206 and the second layer in first layer
Structure.As shown in Figure 10, by setting through hole wiring 211a in through hole 205a, wiring layer 206 and second in first layer
The wiring layer 211 of wiring layer 207 can be electrically connected to each other via through hole wiring 211a in layer.
First solder flux resist layer 208 is made of insulating material, is laminated in wiring layer 206 in first layer.Insulating properties material
Material can utilize epoxy resin, acrylic resin, polyimides, bismaleimide-triazine resin etc..Alternatively, it is also possible to utilize
Contain the material for the enhancing filler being made of silica etc. in these resins.The thickness of first solder flux resist layer 208
It can be formed as such as less than 5 μm or more 70 μm.Opening is partly set in the first solder flux resist layer 208, from the opening
The wiring layer 211 of exposing forms connection weld pad 204.First solder flux resist layer 208 is installed in connection weld pad in skin member
When 204, the solder flux resist as the scolding tin to being used to engage skin member with being connected weld pad 204 plays a role.
Second solder flux resist layer 209 is made of insulating material, is laminated in wiring layer 207 in the second layer.Insulating properties material
Material can utilize and 208 same material of the first solder flux resist layer.The thickness of second solder flux resist layer 209 can be formed as
Such as less than 5 μm or more 70 μm.Opening is partly set in the second solder flux resist layer 209, the wiring exposed from the opening
Layer 211 forms connection weld pad 204.Second solder flux resist layer 209 skin member be installed in connection weld pad 204 when, as
The solder flux resist of scolding tin to being used to engage skin member with being connected weld pad 204 plays a role.
Rigid substrates 200 have as described above form.On the thickness of rigid substrates 200, it is described below.
[on flexible base board]
Flexible base board 300 is flexible substrate, is built-in with wiring etc., is by rigid substrates 200 and other ministrys of electronics industry
The substrate of part (display etc.) electrical connection.Figure 11 is the stereogram for the part for representing flexible base board 300, expression and rigid substrates
The face of the one side of 200 engagements.
The size of flexible base board 300 is not particularly limited, but as shown in Fig. 2, the width of flexible base board 300 can be formed as
The width being contained in vacancy portion 201.As shown in figure 11, flexible base board 300 is provided with connection terminal 301.Connection terminal 301
When flexible base board 300 is engaged with rigid substrates 200, in order to which the connection terminal 203 with rigid substrates 200 is electrically connected, according to even
The shape of connecting terminal 203, quantity configure.
Figure 12 is the sectional view of flexible base board 300, is the sectional view of the line B-B in Figure 11.As shown in the drawing, flexible base
Plate 300 includes base material 302, wiring layer 303, coating 304 and layer of adhesive material 305.
Base material 302 is the base material of flexible base board 300, is made of insulating materials such as polyimides.Base material 302 is formed as having
There is the thickness for possessing flexible degree.Through hole 302a can be set in base material 302.
Wiring layer 303 is made of conductive materials such as copper, and base material 302 is laminated in via layer of adhesive material 305.Wiring layer
303 part is exposed from coating 304, forms connection terminal 301.Coating layer can also be formed on the surface of wiring layer 303
(diagram is omited).The material of coating layer can be selected according to the joint method of aftermentioned rigid substrates 200 and flexible base board 300
It selects, can be such as Au.Wiring layer 303 is electrically connected via through hole 302a.
Coating 304 is made of insulating material, and wiring layer 303 is covered.Coating 304 is via layer of adhesive material 305
It is laminated in wiring layer 303.
Layer of adhesive material 305 is the layer that forms of adhesives curing, will be between base material 302 and wiring layer 303 and wiring
It is bonded between layer 303 and coating 304.
Flexible base board 300 has structure as described above.On the thickness of flexible base board 300, in describe hereinafter.
[engagement on rigid substrates and flexible base board]
As described above, rigid substrates 200 and flexible base board 300 engage, composite substrate 100 is formed.Figure 13 is composite substrate
100 enlarged cross-sectional view.
As shown in the drawing, flexible base board 300 and rigid substrates 200 are engaged by bonding layer 400.Bonding layer 400 will be firm
Property substrate 200 and flexible base board 300 are fixed, and by the connecting pin of the connection terminal 203 of rigid substrates 200 and flexible base board 300
Son 301 is electrically connected.
Specifically, bonding layer 400 can be by ACP (Anisotropic Conductive Paste：Anisotropic conductive
Property paste) form.ACP is the paste that conductive particle is dispersed in insulative resin, and ACP is connected terminal 203 and flexible base board
During 300 extruding, the resin between connection terminal 203 and connection terminal 301 is extruded between terminal, conductive particle residual.At this
Under state, when rigid substrates 200 and flexible base board 300 are mutually squeezed, conductive particle is crushed, and is electrically connected between two-terminal.
The resin of extrusion is filled between adjacent terminal, will be insulated between adjacent terminal.
In addition, bonding layer 400 can also be by ACF (Anisotropic Conductive Film：Anisotropic conductive
Film) it forms.ACF is formed as membranaceous material for ACP, similary with ACP to be electrically connected connection terminal 203 and connection terminal 301.
In the case where bonding layer 400 is ACP or ACF, connected terminal is required for Au surfaces.It therefore, can shape
Coating layer M as connection terminal 203 is Au.In addition, can also it implement Au plating to connection terminal 301.In addition it is also possible to generation
Cu plating is implemented to connection terminal 203 for Au.
As described above, rigid substrates 200 and flexible base board 300 are engaged by bonding layer 400, composite substrate 100 is formed.
[on rigid substrates and the thickness of flexible base board]
The thickness of rigid substrates 200 and flexible base board 300 is illustrated.Figure 14 is rigid substrates 200 and flexible base board
300 schematical sectional view.As shown in the drawing, the thickness of rigid substrates 200 is formed as into first thickness D1, by flexible base board
300 thickness is formed as second thickness D2.In addition, the depth in vacancy portion 201 is formed as into vacancy portion depth D3.
Here, second thickness D2 is the thickness smaller than first thickness D1, and second thickness D2 is than vacancy portion depth D3
Small thickness.Flexible base board 300 is not protruded from vacancy portion 201 as a result, and the maximum thickness of composite substrate 100 terminates in rigid base
The thickness of plate 200.
Figure 15 and Figure 16 is the sectional view of the construction for the composite substrate for representing comparative example.Composite substrate 500 shown in Figure 15
It engages to form by bonding layer 530 for rigid substrates 510 and flexible base board 520 with the composite substrate 600 shown in Figure 16.Rigidity
Substrate 510 includes connection terminal 511, connection weld pad 512, sandwich layer 513, wiring layer 514, insulating layer 515 and solder flux resist layer
516.Flexible base board 520 includes connection terminal 521, base material 522, wiring layer 523, coating 524 and layer of adhesive material 525.
Construction shown in Figure 15 and Figure 16 is the engagement by rigid substrates 510 and flexible base board 520, the thickness of two substrates
The maximum thickness for adding up to composite substrate of degree.Unlike this, in the composite substrate 100 of present embodiment, as described above,
Maximum thickness is the thickness of rigid substrates 200, will not be generated caused by engaging rigid substrates 200 and flexible base board 300
The increase of the thickness of composite substrate 100.That is, composite substrate 100 and the composite substrate phase with the construction shown in Figure 15 and Figure 16
Compare, its thickness can be reduced.
[installation on skin member]
Skin member is installed in composite substrate 100.Figure 17 is to represent to be equipped with the composite substrate 100 of skin member 900
Sectional view.Shown in the figure, skin member 900 is engaged by scolding tin H with being connected weld pad 204, is electrically connected with being connected weld pad 204.
First solder flux resist layer 208 and the second solder flux resist layer 209 prevent the scolding tin H of melting from being flowed out from connection weld pad 204.
[manufacturing method on composite substrate]
The manufacturing method of composite substrate 100 is illustrated.Figure 18~Figure 25 is the manufacturing process for representing composite substrate 100
Schematic diagram.
Prepare sandwich layer 205 as shown in Figure 18 (a), form through hole 205b in sandwich layer 205 as shown in Figure 18 (b).Perforation
Hole 205b be with etching mask by the region overlay beyond the region that form through hole 205b of sandwich layer 205, by etch and
It is formed.
Then, as shown in Figure 18 (c), the insulation division 210 being made of insulating material is formed in through hole 205b.It is first
First, it is fixed temporarily film 221 in a surface mount of sandwich layer 205.Then, before the curing of through hole 205b filling insulating materials
Agent (semi-solid preparation material, prepreg) cures agent before curing by heating, and thus, it is possible to form insulation division 210.Insulating properties material
Material can use epoxy resin, polyimides, bismaleimide-triazine resin etc..Alternatively, it is also possible to use in these resins
In contain by silica etc. form enhancing filler material.The thickness of insulation division 210 can be formed as such as 30 μm~
200 μm of degree.
Then, as shown in Figure 19 (a), removing is fixed temporarily film 221.
Then, as shown in Figure 19 (b), the upper and lower surface of sandwich layer 205 formed be made of insulating material it is exhausted
Edge layer 212.Insulating material can use epoxy resin, polyimides, bismaleimide-triazine resin etc..In addition, also may be used
So as to contain the material for the enhancing filler being made of silica etc. in these resins.In addition, insulating material with absolutely
The insulating material of edge 210 may be the same or different.The thickness of insulating layer 212 can be formed as such as 10 μm~30 μ
M degree.Insulating layer 212 can pass through agent (the semi-solid preparation material before the upper and lower surface of sandwich layer 205 is pasted by the curing of insulating material
Material) form sheet material, by heat be allowed to be solidified to form.
Then, as shown in Figure 19 (c), wiring layer 211 is formed in the upper and lower surface of sandwich layer 205.Wiring layer 211 can
To be made of conductive materials such as copper or copper alloys.Specifically, wiring layer 211 can be by laser machining insulating layer etc.
Electrolysis plating is carried out using sandwich layer 205 as base material after 212 perforation, its coating layer is patterned and is formed.Patterning can
It is carried out, such as can be carried out by using the photoetching of the etchant (iron chloride etc.) to copper or copper alloy by etching.It is this
Etchant does not react with insulating layer 212, and therefore, in photoetching, rotten or roughening etc. will not occur for insulating layer 212.Match somebody with somebody
The wiring being connected in line layer 211 with sandwich layer 205 plays a role as ground connection wiring, and the wiring not being connected with sandwich layer 205 is as letter
Number line plays a role.
Then, as shown in Figure 20 (a), insulating layer 212 is further formed on wiring layer 211.Insulating layer 212 is as described above
It can be by pasting the sheet material being made of insulating material and being heated to be formed.In addition, it is as shown in the drawing, in insulating layer
Wiring layer 211 is formed on 212.Wiring layer 211 can carry out electrolysis plating after insulating layer 212 is perforated, to its coating layer
It is patterned and is formed.Hereinafter, similarly, wiring layer 211 and insulating layer 212 are alternately laminated, it can be by 211 He of wiring layer
Insulating layer 212 is stacked the arbitrary number of plies.The layer that most surface layer side is laminated in wiring layer 211 forms connection weld pad 204.
Then, as shown in Figure 20 (b), the first solder flux resist layer 208 is formed on insulating layer 212 and connection weld pad 204
With the second solder flux resist layer 209.First solder flux resist layer 208 and the second solder flux resist layer 209 can use asphalt mixtures modified by epoxy resin
Fat, acrylic resin, polyimides, bismaleimide-triazine resin etc..Contain alternatively, it is also possible to use in these resins
By the material for the enhancing filler that silica etc. is formed.
The thickness of first solder flux resist layer 208 and the second solder flux resist layer 209 is formed as such as 5 μm or more 70 μm
Below.First solder flux resist layer 208 and the second solder flux resist layer 209 can be by insulating layers 212 and connection weld pad 204
Stacking material, and patterned and formed in a manner of generating opening on connection weld pad 204.The stacking of material can pass through
Such as vacuum lamination processing carries out, patterning can be carried out for example, by photoetching.
Then, as shown in Figure 21 (a), formed and protected on the first solder flux resist layer 208 and the second solder flux resist layer 209
Protect resist layer 222.Protect resist layer 222 can be by epoxy resin, acrylic resin, polyimides, bismaleimide
The compositions such as cyanate resin.Contain the enhancing filler being made of silica etc. in these resins alternatively, it is also possible to use
Material.The thickness of protection resist layer 222 is formed as such as less than 5 μm or more 75 μm.
Protect resist layer 222 can be by being stacked on the first solder flux resist layer 208 and the second solder flux resist layer 209
Material is simultaneously patterned and formed.The stacking of material can be processed for example, by vacuum lamination and carried out, and patterning can be for example, by
Photoetching and carry out.
Then, as shown in Figure 21 (b), insulating layer 212 is partially removed in, exposes sandwich layer 205.Insulating layer 212 can pass through
The machining carried out using router (router, cutting element) is removed.As shown in the drawing, preferably to be cut to sandwich layer
The depth of the degree of 205 skin section cuts insulating layer 212.
Then, as shown in Figure 22 (a), vacancy portion 201 is formed.Vacancy portion 201 can by using etching remove sandwich layer 205 and
It is formed.The etchant of ferric trichloride (ferric chloride) etc. not with insulation division 210, insulating layer 212 and protection resist layer
222 react.In addition, connection weld pad 204 is protected by protection resist layer 222 without being etched agent corrosion.Thereby, it is possible to only
Remove the sandwich layer 205 between insulation division 210.
Then, as shown in Figure 22 (b), except deprotection resist layer 222.Protection resist layer 222 can use resist
Stripper removes.Such as sodium hydroxide, amine solution can be used in anticorrosive additive stripping liquid controlling.
Then, it as shown in Figure 23 (a), will be removed positioned at the insulating layer 212 of the bottom surface in vacancy portion 201, make to be located at its lower floor
Wiring layer 211 expose.Insulating layer 212 can be removed by irradiating laser to insulating layer 212.Match somebody with somebody from what insulating layer 212 exposed
Line layer 211 forms connection terminal 203.
Then, as shown in Figure 23 (b), in the surface shape for the wiring layer 211 for forming connection weld pad 204 and connection terminal 203
Into coating layer M.Coating layer M can be made of Au.
Then, as shown in Figure 24 (a), between insulation division 210 and connection terminal 203, by insulating layer 212 and the second solder flux
Resist layer 209 is cut off.The cut-out can be carried out by slicer (Dicer).Rigid substrates 200 shown in Fig. 10 are formed as a result,.
Then, as shown in Figure 24 (b), bonding layer 400 is configured on connection terminal 203 and surrounding insulating layer 212.It connects
ACP can be applied by using distributor or be configured by loading ACF by closing layer 400.
Then, flexible base board 300 is configured on bonding layer 400, by heating rigid substrates 200 and flexible base board 300
Engagement, connection terminal 203 and connection terminal 301 are electrically connected.The composite substrate 100 shown in Figure 13 is formed as a result,.
Composite substrate 100 can be manufactured according to above operation.
(second embodiment)
The composite substrate of second embodiment of the invention is illustrated.In addition, to implementing in present embodiment with first
The identical composition of mode marks symbol identical with first embodiment, and the description thereof will be omitted.
The composite substrate of present embodiment is identical with first embodiment, engages rigid substrates and flexible base board and forms.
[on composite substrate]
Figure 25 is the enlarged cross-sectional view of the rigid substrates 700 of present embodiment.Rigid substrates 700 and first embodiment
Rigid substrates 200 are similarly without flexible substrate, are for installing the substrate of skin member.It is formed in rigid substrates 700
Have vacant position portion 201, and the shape and depth in vacancy portion 201 are identical with first embodiment.
Rigid substrates 700 are similary with first embodiment, for wiring layer 206, the second layer in stacking sandwich layer 205, first layer
Interior wiring layer 207, the first solder flux resist layer 208 and the second solder flux resist layer 209 and form.Wiring layer 206 in first layer
It is formed with wiring layer in the second layer 207 to be stacked wiring layer 211 and insulating layer 212.In addition, the part by wiring layer 211
Form connection weld pad 204.
Rigid substrates 700 have connection terminal 701.Connection terminal 701 is by wiring layer 211 and is laminated on wiring layer 211
Conductive layer 702 form.Conductive layer 702 is made of conductive material, such as is formed as Ni coating.In addition, conductive layer 702 removes
It can also be made of outside Ni coating metal or electroconductive resin.The thickness of conductive layer 702 is formed as such as 3 μm or more 30
Below μm.
Coating layer M is could be formed on the surface of conductive layer 702.The material of coating layer M can be according to aftermentioned rigid substrates
200 and the joint method of flexible base board 300 make choice, such as Au or Cu may be employed.The thickness of conductive layer 702 is preferred
It is that the aggregate thickness of conductive layer 702 and coating layer M are to be protruded with insulating layer 212 in the same face or coating layer M from insulating layer 212
Several μm of thickness.
Rigid substrates 700 have composition as described above.The shape and thickness and first embodiment of rigid substrates 700
Rigid substrates 200 it is identical.That is, rigid substrates 700 have first thickness D1, and vacancy portion 201 has depth D3 (with reference to Figure 14).
[on flexible base board]
Figure 26 is the enlarged cross-sectional view of the flexible base board 800 of present embodiment.Flexible base board 800 is flexible base
Plate is built-in with wiring etc., is the substrate by rigid substrates 200 and other electronic units (display etc.) electrical connection.
The flexible base board 300 of flexible base board 800 and first embodiment is again it is laminated substrate 302, wiring layer 303, cover
Cap rock 304 and layer of adhesive material 305 and form.In flexible base board 800, the part of wiring layer 303 is from layer of adhesive material 305
It is prominent, form connection terminal 301.
Flexible base board 800 has composition as described above.The shape and thickness and first embodiment of flexible base board 800
Flexible base board 300 it is identical.That is, flexible base board 300 has second thickness D2 (with reference to Figure 14).
[engagement on rigid substrates and flexible base board]
As described above, flexible base board 800 is engaged with rigid substrates 700, composite substrate 1100 is formed.Figure 27 is composite substrate
1100 enlarged cross-sectional view.
As shown in the drawing, flexible base board 800 and rigid substrates 700 are engaged by bonding layer 1200.Bonding layer 1200 will be firm
Property substrate 700 and flexible base board 800 are fixed, and by the connecting pin of the connection terminal 701 of rigid substrates 700 and flexible base board 800
Son 301 is electrically connected.
Bonding layer 1200 is by NCP (Non-anisotropic Conductive Paste：Non- anisotropic conductive paste)
It forms.NCP is made of insulative resin, by fixing, making connection terminal 701 and connecting by flexible base board 800 and rigid substrates 700
Connecting terminal 301 contacts, and the two is electrically connected.In rigid substrates 700, conductive layer 702 is laminated in connection terminal 701, therefore,
Connection terminal 701 is physically contacted with connection terminal 301.Therefore, NCP can be used as bonding layer 1200.
In addition, bonding layer 1200 can also be by NCF (Non-anisotropic Conductive Film：It is non-respectively to different
Property conductive film) form.NCF is formed as membranaceous material for NCP, similary with NCP by connection terminal 701 and connection terminal 301
Electrical connection.
In addition it is also possible to using ACP or ACF as bonding layer 1200.In this case, the electric conductivity contained in ACP or ACF
The two is electrically connected by particle residue between connection terminal 701 and connection terminal 301.
In the case where bonding layer 1200 is NCP or NCF, the terminal of electrical connection is required for Cu surfaces.Therefore, connect
The coating layer M of terminal 701 can be Cu.Connection terminal 301 can be the terminal being made of copper, accordingly it is also possible to not form plating
Coating.In the case where bonding layer 1200 is ACP or ACF, the coating layer M of connection terminal 701 can be Au coating layers, connect
The surface of terminal 301 can implement Au plating.
As described above, rigid substrates 700 and flexible base board 800 are engaged by bonding layer 1200, composite substrate 1100 is formed.
On the connection weld pad 204 of composite substrate 1100, skin member can be installed in the same manner as first embodiment.
[manufacturing method on composite substrate]
The manufacturing method of composite substrate 1100 is illustrated.Figure 28 and Figure 29 is the manufacture step for representing composite substrate 1100
Rapid schematic diagram.In addition, after vacancy portion 201 is formed, until removing the insulating layer (Figure 23 contacted with the bottom surface in vacancy portion 201
(a)) manufacturing step is identical with first embodiment, and and the description is omitted.
As shown in Figure 28 (a), conductive layer 702 is formed on the wiring layer 211 of exposing.Conductive layer 702 can by with
Implement Ni plating on line layer 211 and formed.In addition, conductive layer 702 can also by wiring layer 211 fill conductive paste and
It is formed, it can also be by filling conductive paste on wiring layer 211, and implement Ni plating on it and formed.In addition, conductive layer
702 can also be by implementing Cu plating on wiring layer 211, and implements Ni plating on it and formed.
Then, as shown in Figure 28 (b), in the surface shape for the wiring layer 211 for forming connection weld pad 204 and connection terminal 701
Into coating layer M.In the case where using ACP or ACF as bonding layer 1200, coating layer M can be formed as Au or Cu coating layers,
In the case where using NCP or NCF as bonding layer 1200, Cu coating layers can be formed as.But NCP or NCF is being used to make
In the case of bonding layer 1200, the surface of connection terminal 701 can also replace coating layer M and be applied using scolding tin (solder)
Layer.
Then, as shown in Figure 29 (a), between insulation division 210 and connection terminal 701, by insulating layer 212 and the second solder flux
Resist layer 209 is cut off.The cut-out can be carried out by slicer.The rigid substrates 700 shown in Figure 25 are formed as a result,.
Then, as shown in Figure 29 (b), bonding layer 1200 is configured on connection terminal 701 and surrounding insulating layer 212.
Bonding layer 1200 can apply ACP or NCP or mounting ACF or NCF by using distributor and configure.
Then, flexible base board 800 is configured on bonding layer 1200, by heating rigid substrates 700 and flexible base board 800
Engagement, connection terminal 701 and connection terminal 301 are electrically connected.The composite substrate 1100 shown in Figure 27 is formed as a result,.
(variation)
The variation of the composite substrate of the present invention is illustrated.Figure 30 is the sectional view of the composite substrate 100 of variation.
As shown in the drawing, connection terminal 203 may not be is made of wiring layer 211, but is made of a part for sandwich layer 205.It should
When composite substrate 100 removes sandwich layer 205 in above-mentioned manufacturing process and forms vacancy portion 201, it is not using etchant but makes
Digging is carried out to sandwich layer 205 with router, is manufactured by defined thickness residue sandwich layer 205.
In addition, Figure 31 is the sectional view of the composite substrate 100 of other variations.Sandwich layer 205 can not be metal material and
It is to be made of synthetic resin.Such as glass epoxy resin can be used in synthetic resin.The composite substrate 100 is in above-mentioned manufacturing step
In, when removing sandwich layer 205 and forming vacancy portion 201, it is not using etchant but sandwich layer 205 is dug using router
It cuts, removes sandwich layer 205 and manufacture.
Claims (9)
1. a kind of composite substrate, which is characterized in that including：
Rigid substrates are laminated with metal core layer, insulating layer and wiring layer, have first thickness, at least while passing through removing
The insulating layer and the metal core layer and the vacancy portion formed, are provided in the vacancy portion side end of the metal core layer
The insulation division being made of insulating material, the first connection terminal expose from the vacancy portion；With
Flexible base board is engaged in the vacancy portion, and the second connection end including being electrically connected with first connection terminal is sub,
With second thickness smaller than the first thickness and smaller than the depth in the vacancy portion.
2. composite substrate as described in claim 1, it is characterised in that：
First connection terminal is formed by the wiring layer.
3. composite substrate as described in claim 1, it is characterised in that：
First connection terminal is formed by the metal core layer.
4. composite substrate as described in claim 1, it is characterised in that：
First connection terminal is formed by the wiring layer and the conductive layer being laminated on the wiring layer.
5. the composite substrate as any one of claim 2~4, it is characterised in that：
The bonding layer for including conductive material is further included, is configured between the rigid substrates and the flexible base board, by institute
State the first connection terminal and second connection end son electrical connection.
6. composite substrate as claimed in claim 5, it is characterised in that：
The conductive material is pasted for anisotropic conductive or anisotropic conductive film.
7. composite substrate as claimed in claim 5, it is characterised in that：
The conductive material is pasted for non-anisotropic conductive or non-anisotropic conductive film.
8. composite substrate as described in claim 1, it is characterised in that：
The rigid substrates include：The metal core layer of second surface with first surface side opposite with its；By the first insulating layer
It is formed with the first wiring layer and is laminated in wiring layer in the first layer of the first surface；With by second insulating layer and the second wiring
Layer forms and is laminated in wiring layer in the second layer of the second surface, the vacancy portion by remove first insulating layer and
The metal core layer and formed.
9. a kind of rigid substrates, which is characterized in that including：
The metal core layer of second surface with first surface side opposite with its；Be made of the first insulating layer and the first wiring layer and
It is laminated in wiring layer in the first layer of the first surface；It is described with being made of and being laminated in second insulating layer and the second wiring layer
Wiring layer in the second layer of second surface removes first insulating layer and the metal core layer and forms vacancy portion, described
The vacancy portion side end of metal core layer is provided with the insulation division being made of insulating material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-230463 | 2013-11-06 | ||
| JP2013230463A JP6387226B2 (en) | 2013-11-06 | 2013-11-06 | Composite board |
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| Publication Number | Publication Date |
|---|---|
| CN104640382A CN104640382A (en) | 2015-05-20 |
| CN104640382B true CN104640382B (en) | 2018-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410636928.9A Expired - Fee Related CN104640382B (en) | 2013-11-06 | 2014-11-06 | Composite substrate and rigid substrates |
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| JP (1) | JP6387226B2 (en) |
| CN (1) | CN104640382B (en) |
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|---|---|---|---|---|
| JP2020120106A (en) * | 2019-01-23 | 2020-08-06 | キヤノン株式会社 | Electronic module, electronic device, imaging sensor module, imaging device, and display device |
| WO2020186516A1 (en) * | 2019-03-21 | 2020-09-24 | 深圳市柔宇科技有限公司 | Electrical connection assembly, electronic device and preparation method for electrical connection assembly |
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| JPWO2010140214A1 (en) * | 2009-06-02 | 2012-11-15 | ソニーケミカル＆インフォメーションデバイス株式会社 | Manufacturing method of multilayer printed wiring board |
| JP2011159855A (en) * | 2010-02-02 | 2011-08-18 | Panasonic Corp | Partially multilayer printed circuit board, and method of manufacturing the same |
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| CN1939104A (en) * | 2004-04-09 | 2007-03-28 | 大日本印刷株式会社 | Rigid-flexible board and manufacturing method thereof |
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| CN102771200A (en) * | 2010-02-22 | 2012-11-07 | 三洋电机株式会社 | Multilayer printed circuit board and manufacturing method therefor |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6387226B2 (en) | 2018-09-05 |
| JP2015090931A (en) | 2015-05-11 |
| CN104640382A (en) | 2015-05-20 |
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