CN112614862A - 新型cmos图像传感器像素结构 - Google Patents

新型cmos图像传感器像素结构 Download PDF

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CN112614862A
CN112614862A CN202011608526.XA CN202011608526A CN112614862A CN 112614862 A CN112614862 A CN 112614862A CN 202011608526 A CN202011608526 A CN 202011608526A CN 112614862 A CN112614862 A CN 112614862A
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photodiode
floating diffusion
diffusion node
transfer transistor
transistor
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CN112614862B (zh
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王欣洋
李扬
马成
刘洋
辛国松
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Changchun Changguangchenxin Optoelectronics Technology Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
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    • H01L27/14607Geometry of the photosensitive area
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    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14609Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/1461Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
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    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14609Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/14612Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
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    • H01ELECTRIC ELEMENTS
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    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
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    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
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Abstract

本发明提供一种新型CMOS图像传感器像素结构,包括:包括:光电二极管、浮置扩散节点、复位晶体管和转移晶体管;其中,光电二极管为中空的环形结构,浮置扩散节点设置在光电二极管的中空区域内,转移晶体管为环形结构,其内边缘与浮置扩散节点接触,其外边缘与光电二极管接触,复位晶体管设置在浮置扩散节点的正下方,通过转移晶体管将光电二极管累积的电荷从不同方向转移至浮置扩散节点,通过复位晶体管提供竖直方向电场,对浮置扩散节点进行复位。本发明能够在不影响转移晶体管电荷转移速度的情况下,增大光电二极管感光区域的面积。

Description

新型CMOS图像传感器像素结构
技术领域
本发明涉及CMOS图像传感器技术领域,特别涉及一种基于环形感光元件的CMOS图像传感器像素结构。
背景技术
CMOS图像传感器凭借其低功耗,低成本和高集成能力,在科学和商业应用中变得越来越流行。随着CMOS图像传感器应用范围的不断扩大,人们对其性能也有了更高的要求,朝着更高的分辨率,更广的动态范围,更快的速度不断发展。一般情况下,对于相同分辨率的图像传感器,如果感光面积越大,其成像质量也会越好。对于摄像头的optical format属性,2/3”的成像质量大部分条件下要优于1/2”的成像质量,尤其是在低照度环境下的成像。因此,如何增大图像传感器感光单元的面积就成了业界亟需解决的问题。
图1示出了传统CMOS图像传感器的像素结构。如图1所示,有源区域是由点划线限定的区域,像素100包括光电二极管110、转移晶体管120、复位晶体管130、驱动晶体管140、选择晶体管150和浮置扩散节点160,转移晶体管120的栅极121、复位晶体管130的栅极131、驱动晶体管140栅极141和选择晶体管150的栅极151分别被设置为横跨有源区域的上部。
光电二极管110通常为矩形,即感光区域为矩形,转移晶体管120、浮置扩散节点160位于光电二极管110感光区域的一侧。如果直接增大光电二极管110感光区域的面积,会导致感光区域中距离浮置扩散节点160最远端的电荷难以在短时间内迅速转移至浮置扩散节点160,导致图像出现拖影等现象。
发明内容
本发明旨在解决传统的CMOS图像传感器直接增大感光区域面积会导致图像出现拖影的问题,提供一种新型CMOS图像传感器像素结构,在不影响转移晶体管电荷转移速度的情况下,增大光电二极管感光区域的面积。
为实现上述目的,本发明采用以下具体技术方案:
本发明提供的新型CMOS图像传感器像素结构,包括:光电二极管、浮置扩散节点、复位晶体管和转移晶体管;其中,光电二极管为中空的环形结构,浮置扩散节点设置在光电二极管的中空区域内,转移晶体管为环形结构,其内边缘与浮置扩散节点接触,其外边缘与光电二极管接触,复位晶体管设置在浮置扩散节点的正下方,通过转移晶体管将光电二极管累积的电荷从不同方向转移至浮置扩散节点,通过复位晶体管提供竖直方向电场,对浮置扩散节点进行复位。
优选地,在光电二极管的外围设置有一圈隔离沟槽。
优选地,光电二极管为钳位光电二极管。
本发明能够取得以下技术效果:
1、将光电二极管由传统的矩形结构改为环形结构,在保证电荷距浮置扩散节点最远距离相同的情况下,增加了光电二极管感光区域的面积,以获得更好的成像质量。
2、将复位晶体管设置在浮置扩散节点的正下方,以提供竖直方向的电场,对浮置扩散节点进行复位,使浮置扩散节点内残留的电荷从正下方排出。
附图说明
图1是传统CMOS图像传感器的像素结构图;
图2是根据本发明一个实施例的新型CMOS图像传感器像素结构的俯视图;
图3是根据本发明一个实施例的新型CMOS图像传感器像素结构的主视图;
图4是根据本发明一个实施例的新型CMOS图像传感器的工作时序图。
其中的附图标记包括:像素100、光电二极管110、转移晶体管120、栅极121、复位晶体管130、栅极131、驱动晶体管140、栅极141、选择晶体管150、栅极151、浮置扩散节点160、隔离沟槽170。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及具体实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅用以解释本发明,而不构成对本发明的限制。
下面将对本发明实施例提供的新型CMOS图像传感器像素结构进行详细说明。
如图2和图3所示,本发明提供的新型CMOS图像传感器像素结构,包括光电二极管110、转移晶体管120、复位晶体管130和浮置扩散节点160;其中,光电二极管110为环形结构,中间形成中空区域,浮置扩散节点160设置在光电二极管110的中空区域内,转移晶体管120为环形结构,其内边缘与浮置扩散节点160接触,其外边缘与光电二极管110接触,复位晶体管130设置在浮置扩散节点160的正下方。
本发明将光电二极管110由传统的矩形结构改为环形结构,从而使光电二极管110形成一个中空区域,将浮置扩散节点160设置在光电二极管110的中空区域内,能够保证光电二极管110累积的电荷相距浮置扩散节点160的最远距离相同。
在光电二极管110感光区域具有相同面积的情况下,环形结构的光电二极管110累积的电荷相距浮置扩散节点160的最远距离仅为矩形结构的光电二极管110累积的电荷相距浮置扩散节点160的最远距离的一半。因此可以保证距离浮置扩散节点160最远端的电荷通过转移晶体管120迅速转移至浮置扩散节点160。
为了适配光电二极管110的环形结构,将转移晶体管120也改为环形结构,在关断转移晶体管120的栅极时,可以防止光电二极管110各个方向积累的电荷转移至浮置扩散节点160,在打开转移晶体管120的栅极时,使光电二极管110累积的电荷能够从各个方向转移至浮置扩散节点160。
由于光电二极管110为环形结构,在扩大感光区域面积时并不会导致感光区域边缘的电荷距离浮置扩散节点160越来越远,因此可以使用感光区域面积更大的光电二极管110,从而实现在扩大光电二极管110感光区域面积的同时,保证电荷的转移速度。
由于浮置扩散节点160在水平方向被光电二极管110完全包裹,导致原有位置的复位晶体管130无法对浮置扩散节点160进行复位。为解决这一问题,本发明采用垂直方向对浮置扩散节点160进行复位。具体做法为:将复位晶体管130设置在浮置扩散节点160的正下方。在复位阶段,复位晶体管130接高电压,从而在浮置扩散节点160的正下方提供竖直方向的电场,让浮置扩散节点160内残留的电荷从正下方排出,从而达到复位的目的。对于复位晶体管130的制作,可以采用绝缘体上硅(SOI)技术中在衬底中绝缘体添加电极的方法,也可以采用背照式CMOS图像传感器中减薄,键合等工艺在浮置扩散节点160下方添加传统栅极,无论采用哪种实现方式,都与现在通用的技术兼容,并不会造成成本的明显增加。
在本发明的一个示例中,光电二极管110为钳位光电二极管。
在本发明的一个具体示例中,在光电二极管110的外围设置有一圈隔离沟槽170(STI)。
本发明提供的新型CMOS图像传感器的具体控制方法,包括如下步骤:
S1、将转移晶体管120关闭,复位晶体管130接0V,光电二极管110开始曝光,光电二极管110内部耗尽区开始积累电荷。
S3、在曝光结束后,将复位晶体管130接正电,对浮置扩散节点160进行复位,将采样信号Sample1拉高,对浮置扩散节点160进行第一次采样,作为参考电平,读取完毕后拉低采样信号。
S3、将复位晶体管130接0V,打开转移晶体管120,将转移晶体管120的栅极接到高电平,将电荷转移至浮置扩散节点160。
S4、待电荷转移结束后,将转移晶体管120的栅极接到低电平,从而关闭传输通道,将采样信号Sample2拉高,对浮置扩散节点160进行第二次采样。读取完毕后拉低采样信号。
S5、重复步骤S1,开始下一次曝光。
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本发明的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本发明的限制,本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。
以上本发明的具体实施方式,并不构成对本发明保护范围的限定。任何根据本发明的技术构思所作出的各种其他相应的改变与变形,均应包含在本发明权利要求的保护范围内。

Claims (3)

1.一种新型CMOS图像传感器像素结构,其特征在于,包括:光电二极管、浮置扩散节点、复位晶体管和转移晶体管;其中,所述光电二极管为中空的环形结构,所述浮置扩散节点设置在所述光电二极管的中空区域内,所述转移晶体管为环形结构,其内边缘与所述浮置扩散节点接触,其外边缘与所述光电二极管接触,复位晶体管设置在所述浮置扩散节点的正下方,通过所述转移晶体管将所述光电二极管累积的电荷从不同方向转移至所述浮置扩散节点,通过所述复位晶体管提供竖直方向电场,对所述浮置扩散节点进行复位。
2.根据权利要求1所述的新型CMOS图像传感器像素结构,其特征在于,在所述光电二极管的外围设置有一圈隔离沟槽。
3.根据权利要求1所述的新型CMOS图像传感器像素结构,其特征在于,所述光电二极管为钳位光电二极管。
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